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Product Overview
Digi-Key Part Number BER169-ND
Quantity Available 22.687
Can ship immediately
Manufacturer

Manufacturer Part Number

HF115AC-0.0055-AC-90

Description THERM PAD TO-218 W/ADH HI-FLOW
Expanded Description Thermal Pad Gray 21.84mm x 18.79mm Rectangle Adhesive - One Side
Lead Free Status / RoHS Status Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Manufacturer Standard Lead Time 2 Weeks
Documents & Media
Datasheets Hi-Flow 115-AC
Other Related Documents Sil-Pad Metric Configurations
RoHS Information Hi-Flow 115-AC Material Report
PCN Packaging Henkel/Berquist Revised Brands 10/May/2016
Catalog Page 2401 (CH2011-EN PDF)
Product Attributes Select All
Categories
Manufacturer

Bergquist

Series Hi-Flow® 115-AC
Part Status Active
Usage TO-218, TO-220, TO-247
Shape Rectangle
Outline 21.84mm x 18.79mm
Thickness 0.0055" (0.140mm)
Material Phase Change Compound
Adhesive Adhesive - One Side
Backing, Carrier Fiberglass
Color Gray
Thermal Resistivity 0.35°C/W
Thermal Conductivity 0.8 W/m-K
 
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Additional Resources
Standard Package ? 100
Other Names BER169
BG428814
HF115AC-90
HF115AC00055AC90
HF115TAAC-90

19:51:21 1/19/2017

Price & Procurement
 

Quantity
All prices are in EUR.
Price Break Unit Price Extended Price
1 0,10000 0,10
10 0,08400 0,84
50 0,07480 3,74
100 0,06620 6,62
500 0,05758 28,79
1.000 0,04319 43,19
5.000 0,03743 187,16

Submit a request for quotation on quantities greater than those displayed.

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