5. To av
glease
PCB BOTTOM VIEW
TC2070-IDC PLUG-OF-NAILS CABLE
C CORRECTED 225" [5.715mm] LEG SPACING TO 32518 255mm], 12/16/2017 B EASTMAN
Allow finger access from this side
2540mm
100”
400 " ID 160 mm
: <2) :="" 325"="" 8,255="" mm="" 050="" "="" l="" 270="" mm="" 050"="" 1,270="" mm="">>9—o
7 : Q) 1
14 s
{N m m m m f? * ax ’
/
wwwwww 769
1015 mm
635 mm
025' .
"KEEP OUT“ AREA
SEE NOTE 2 AND
SHEET 3FOR VIA EXCEPTIONS}
U40”
Allow finger access from this side
FOOTPRINT TO BE LABELED "TC2070-FP“ ON LAYOUT I BOM
PCB LAYOUT NOTES:
1. Allow clearance for finger
sqeeze access from the two
sides shown.
2. No tracks or vias in the
shaded "KEEP OUT" area.
3. No other track or signal within
0.020" of any contact pad.
4. Do not allow solder paste on
the contact pads. It is essential
to eliminate any hole in the
solder paste-mask (solder
stencil) layer. If this is not
possible make the contact pads
thru-hole with finished hole size
of 0.012" or less.
5. To avoid ordering confusion,
please
specify DNL in your
BOM.
6. Leg and alignment holes may
be plated and used as vias but
ensure minimum finished hole
size meets specified tolerances.
0.0935"
0.003 [
2.3749mm
0.0762]
NON-PLATED
THRU HOLES
LEG LATCH HOLES
0.0390"
0.003 [
0.9906 mm
0.0762]
NON-PLATED
THRU HOLES
ALIGNMENT PIN HOLES
0.0310"
0.003 [
.7874mm
0.0762]
CONDICTIVE
CONTACT PADS
NO SOLDER PASTE
ALLOW A 0.061 x 0.056
SQUARE AREA OF
CLEARANCE FOR
EACH FOOT
FOOTPRINT TO BE LABELED "TC2070-FP" ON LAYOUT / BOM
(SEE NOTE 2. AND
SHEET 3FOR VIA EXCEPTIONS)
***Use TC2070-FP (or TC2070-NL-FP) as the PCB “part” name – the cable must not
appear on your BOM! Ensure the “part” in the PCB BOM is labelled as “Nothing to
Purchase - Do Not Install” otherwise your CM’s will try to buy one cable per PCB
assembly!***
TC2070-IDC PLUG-OF-NAILS
(TM)
CABLE
REV
DESCRIPTION
DATE
REV BY
C
CORRECTED .225" [5.715mm] LEG SPACING TO .325"[8.255mm].
12/16/2017
B.EASTMAN
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SCALE
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SIZE
FSCM NO.
DWG NO.
A
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TC2070-IDC
C
eonnuuon
Donouaon
7 7.5 COMPRESSED LOCA‘HON
Tag-Connect Inserted
into F'CB for
programming (debugging
IPCB
‘050 "
1.27 mm |
.2935 "
77‘4559 mm,
‘Inn
@Efi
@@
@E_
fig
E-
@@
@@
[0.04"]
1.0mm
(MAX ALLOWABLE
COMPONENT HEIGHT
UNDER CONNECTOR)
0.1
3.3
mm
0.1
2.0
mm
0.2
6.0
mm
0.1
3.8
mm
7.5 COMPRESSED LOCATION
0.4
11.1
mm
0.7
16.5
mm
1
14 8
7
1
2
13
14
END VIEW
2x7 0.1" PITCH
IDC CONNECTOR
END VIEW
14 PIN
TAG-CONNECT
Note:
Dimmensions subject to change.
8"
[203.2 mm]
[0.04"]
1.0mm
(MAX ALLOWABLE
COMPONENT HEIGHT
UNDER CONNECTOR)
C
TC2070-IDC
REV
A
DWG NO.
FSCM NO.
SIZE
2:1
SCALE
www.TAG-CONNECT.com
SHEET 2 OF 3
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i (3&1
2/ C
Dela-I a
Vias between // Traces less than .02“
contact pads away from contact pad
or in "KEEP OUT" area
Do not deposit solder paste on I,"
contact pads. View Solder Paste 4/
Mask (Solder Stencil) layer in
pad-stack and eliminate any hole.
Layout Problems to Avoid
OKAY
NOT OKAY
Notes:
1) It IS OK to have a conductive via (not filled, not
soldermasked) in the center of any of the pads so long as
the finished hole is 0.012” or smaller.
2) It’s NOT OK to have a via between two pads without
0.02” between the via and a pad of a different signal.
3) It IS OK to have a small via centered between four pads.
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SCALE
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SIZE
FSCM NO.
DWG NO.
A
REV
TC2070-IDC
C
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