W2L,W3L,W4L Series Datasheet by AVX Corporation

View All Related Products | Download PDF Datasheet
\ \ \ K \ . \ . H \ ,, / ’1/x /. //" fl 9" \ \ /§:::' , 1 6 D 225 M A B _3_ A T T T T T T T um I a c I In ka k /;.\V/)I(
82
IDC Low Inductance Capacitors (SnPb)
GENERAL DESCRIPTION
Inter-Digitated Capacitors (IDCs) are used for both semiconductor package
and board level decoupling. The equivalent series inductance (ESL) of a single
capacitor or an array of capacitors in parallel determines the response time of
a Power Delivery Network (PDN). The lower the ESL of a PDN, the faster the
response time. A designer can use many standard MLCCs in parallel to reduce
ESL or a low ESL Inter-Digitated Capacitor (IDC) device. These IDC devices are
available in versions with a maximum height of 0.95mm or 0.55mm.
IDCs are typically used on packages of semiconductor products with power
levels of 15 watts or greater. Inter-Digitated Capacitors are used on CPU, GPU,
ASIC, and ASSP devices produced on 0.13μ, 90nm, 65nm, and 45nm processes.
IDC devices are used on both ceramic and organic package substrates. These
low ESL surface mount capacitors can be placed on the bottom side or the top
side of a package substrate. The low profile 0.55mm maximum height IDCs
can easily be used on the bottom side of BGA packages or on the die side of
packages under a heat spreader.
IDCs are used for board level decoupling of systems with speeds of 300MHz
or greater. Low ESL IDCs free up valuable board space by reducing the number
of capacitors required versus standard MLCCs. There are additional benefits to
reducing the number of capacitors beyond saving board space including higher
reliability from a reduction in the number of components and lower placement
costs based on the need for fewer capacitors.
The Inter-Digitated Capacitor (IDC) technology was developed by AVX. This is
the second family of Low Inductance MLCC products created by AVX. IDCs are
a cost effective alternative to AVX’s first generation low ESL family for high-
reliability applications known as LICA (Low Inductance Chip Array).
AVX IDC products are available with a lead termination for high reliability military
and aerospace applications that must avoid tin whisker reliability issues.
0612
0508
0306
+ – + –
+ – + –
TYPICAL IMPEDANCE
0.001
0001001011
Frequency (MHz)
Impedance (Ohms)
0.01
0.1
1
10
LICC_0612
IDC_0612
MLCC_1206
Capacitance Tolerance ±20% Preferred
Operation
Temperature Range
X7R = -5C to +125°C
X5R = -55°C to +85°C
X7S = -55°C to +125°C
Temperature
Coefficient ±15% (0VDC), ±22% (X7S)
Voltage Ratings 4, 6.3, 10, 16, 25 VDC
Dissipation Factor
≤ 6.3V = 6.5% max;
10V = 5.0% max;
≥ 16V = 3.5% max
Insulation Resistance
(@+25°C, RVDC)
100,000MΩ min, or 1,000MΩ per μF
min.,whichever is less
PERFORMANCE CHARACTERISTICS
HOW TO ORDER
W L D3 1 6 M A 3 AB225
Dielectric
C = X7R
D = X5R
Z = X7S
IDC
Case
Size
2 = 0508
3 = 0612
4 = 0306
Number
of
Terminals
1 = 8 Terminals
Voltage
4 = 4V
6 = 6.3V
Z = 10V
Y = 16V
3 = 25V
Capacitance
Tolerance
M = ±20%
Failure
Rate
A = N/A
Packaging
Available
1=7" Reel
3=13" Reel
Thickness
Max. Thickness
mm (in)
A=Standard
S=0.55 (0.022)
Termination
B = 5% min.
Lead
Capacitance
Code (In pF)
2 Sig. Digits +
Number of
Zeros
Style Low
Inductance
NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.
Dissipation Factor No problems observed after 2.5 x RVDC for
5 seconds at 50mA max current
CTE (ppm/C) 12.0
Thermal Conductivity 4-5W/M K
Terminations
Available Plated Nickel and Solder
0306/0612/0508IDC (InterDigitated Capacitors)
/A\V/)I(“’ Il||i|lIlI|j :51 §I§§~ $ N w T’ a 1 3 EL L§§§H 7, 7 x 7? L /.‘.\V/)I(
83
IDC Low Inductance Capacitors (SnPb)
SIZE W4 = 0306 W2 = Thin 0508 W2 = 0508 W3= Thin 0612 W3 = 0612 W3 = THICK 0612
Max.
Thickness
mm 0.55 0.55. 0.95 0.55 0.95 1.22
(in.) (0.022) (0.022) (0.037) (0.022) (0.037) (0.048)
WVDC 4 6.3 46.3 10 16 25 46.3 10 16 25 4 6.3 10 16 4 6.3 10 16 25 4 6.3 10 16
Cap
(μF) 0.010
0.022
0.033
0.047
0.068
0.10
0.22
0.33
0.47
0.68
1.0
1.5
2.2
3.3
PHYSICAL DIMENSIONS AND PAD LAYOUT Consult factory for
additional requirements
= X7R
= X5R
= X7S
PHYSICAL CHIP DIMENSIONS MILLIMETERS (INCHES)
PAD LAYOUT
DIMENSIONS
SIZE W L BW BL P
0306 1.60 ± 0.20 0.82 ± 0.10 0.25 ± 0.10 0.20 ± 0.10 0.40 ± 0.05
(0.063 ± 0.008) (0.032 ± 0.006 (0.010 ± 0.004) (0.008± 0.004) (0.015 ± 0.002)
0508 2.03 ± 0.20 1.27 ± 0.20 0.30 ± 0.10 0.25 ± 0.15 0.50 ± 0.05
(0.080 ± 0.008) (0.050 ± 0.008) (0.012 ± 0.004) (0.010± 0.006) (0.020 ± 0.002)
0612 3.20 ± 0.20 1.60 ± 0.20 0.50 ± 0.10 0.25 ± 0.15 0.80 ± 0.10
(0.126 ± 0.008) (0.063 ± 0.008) (0.020 ± 0.004) (0.010 ± 0.006) (0.031 ± 0.004)
SIZE A B C D E
0306 0.38
(0.015)
0.89
(0.035)
1.27
(0.050)
0.20
(0.008)
0.40
(0.015)
0508 0.64
(0.025)
1.27
(0.050)
1.91
(0.075)
0.28
(0.011)
0.50
(0.020)
0612 0.89
(0.035)
1.65
(0.065)
2.54
(0.010)
0.45
(0.018)
0.80
(0.031)
0306/0612/0508IDC (InterDigitated Capacitors) with Sn/Pb Termination

Products related to this Datasheet

CAP CER 1UF 4V X7R 0508
CAP CER 0.1UF 4V X7S 0306
CAP CER 1UF 10V X7R 0612
CAP CER 2.2UF 4V X7S 0508
CAP CER 1UF 10V X7R 0612
CAP CER 3.3UF 4V X5R 0612
CAP CER 2.2UF 4V X7R 0612
CAP CER 0.047UF 6.3V X7R 0508
CAP CER 0.047UF 16V X7R 0508
CAP CER 0.33UF 4V X7R 0508
CAP CER 2.2UF 4V X5R 0508
CAP CER 1.5UF 4V X5R 0508
CAP CER 3.3UF 4V X5R 0612
CAP CER 1UF 6.3V X7R 0508
CAP CER 0.22UF 4V X7S 0306
CAP CER 0.47UF 4V X7S 0306
CAP CER 0.1UF 10V X7R 0508
CAP CER 0.1UF 4V X7S 0306
CAP CER 0.1UF 16V X7R 0508
CAP CER 0.22UF 4V X7S 0306
CAP CER 1UF 4V X7R 0508
CAP CER 1UF 6.3V X7R 0508
CAP CER 0.047UF 25V X7R 0508
CAP CER 1.5UF 4V X5R 0508
CAP CER 2.2UF 6.3V X7R 0612
CAP CER 0.047UF 6.3V X7R 0508
CAP CER 1UF 4V X7S 0508
CAP CER 1UF 10V X7R 0612
CAP CER 0.47UF 10V X7R 0508
CAP CER 2.2UF 4V X7R 0612