Nouveau produit

Les remplacements instantanés de la série SC d'Everspin Technologies, pour les mémoires sur support héritées, permettent des mises à niveau transparentes tout en améliorant les performances et la fiabilité du système.

EverSpin's 24-ball BGA MRAM packages.

The EMxxLXB is the industry’s first xSPI serial interface persistent memory based on Everspin’s unique industrial STT MRAM technology.

The Highest Performing Persistent Memory in the Industry.

Le module Click Board™ MIKROE-2914 MRAM de MikroElektronika utilise le MR25H256, un module de mémoire MRAM SPI série de 256 kilobits d'Everspin Technologies.

Five Amazon Echo Dots will be given away at Embedded World 2018 to qualified customers

EverSpin's alternative format for trace codes.

Replacing the Cypress CY14B104NA-BA/ZS45XI nvSRAM with Everspin’s MR2A16Axxx35 MRAM.

Everspin's 48-ball BGA MRAM packages.

Comparing technologies: MRAM vs. FRAM from EverSpin.

EverSpin's TSOP2 MRAM package guide.

EverSpin's MRAM DFN package guide.

EverSpin's SOIC MRAM package guide.

A look at combining FPGA technology with embedded processors including monolithic approaches, SoC solutions, tack-ups, and modules.

Designers working with microcontrollers (MCUs) have come to rely heavily on flash memory for code storage because IC makers have scaled the manufacturing processes for the nonvolatile memory and are producing quite large flash arrays on MCU ICs.

Everspin Technologies est un leader mondial en matière de développement et de fabrication de capteurs et de mémoires magnétiques (MRAM).

Replacing the Cypress CY14B104LA-ZS/BA45xxx nvSRAM with Everspin’s MR2A08AxYS/MA35xxx MRAM.

To increase production capacity and improve flexibility in manufacturing Everspin will qualify nine additional products for assembly in TSOP-44 packages at ASE group.

EverSpin’s 2mm exposed pad DFN package meets both SOIC-8 and DFN8 PCB layouts.

Toggle and spin-torque MRAM status and outlook from EverSpin.