Fiche technique pour STBC08 de MikroElektronika

DFN6 (3 x 3 mm)
Features
• Programmable charge current up to 800 mA
• No external MOSFET, sense resistors or blocking diode are required
• Complete linear charger for single-cell Li-Ion batteries
• Constant current/constant voltage operation with thermal regulation to maximize
charge rate without risk of overheating
• Two charge status output pins
• Charge single-cell Li-Ion batteries directly from USB port
• Preset 4.2 V charge voltage with 1% accuracy
• Charge current monitor for gas gauge
• Automatic recharge
• Undervoltage lockout
• C/10 charge termination
• 25 µA supply current in shutdown mode
• Low battery voltage detection for pre-charge setting
• Soft-start feature limits inrush current
• DFN6 (3 x 3 mm) package (to improve power dissipation)
Applications
• Cellular phones
• PDAs
• Bluetooth® applications
• Battery-powered devices
Description
The STBC08 is a constant current/constant voltage charger for single-cell Li-Ion
batteries.
Neither external sense resistor nor blocking diode are required. The STBC08 is
designed to work within USB power specifications. An internal block regulates the
current when the junction temperature increases, to protect the device when it
operates in high power or high ambient temperature conditions. The charge voltage
is fixed at 4.2 V, and current limitation can be programmed using a single resistor
connected between PROG pin and GND. The charge cycle is automatically
terminated when the current, which flows to the battery, is 1/10 of the programmed
value. If the external adapter is removed, the STBC08 turns off and a 2 μA current
can flow from the battery to the device.
The device can be in shutdown mode, reducing the supply current to 25 μA.
The device also has a charge current monitor, undervoltage lockout, automatic
recharge. The charge termination and input voltage presence are indicated by two
separated status pins.
Maturity status link
STBC08
Device summary
Order code STBC08PMR
Package DFN6 (3 x 3 mm)
Packaging 4500 pieces/reel
800 mA standalone linear Li-Ion battery charger with thermal regulation
STBC08
Datasheet
DS4901 - Rev 4 - November 2018
For further information contact your local STMicroelectronics sales office.
www.st.com
1Application diagram
Figure 1. Block diagram
1 µA
STBC08
Application diagram
DS4901 - Rev 4 page 2/20
BAT 3 E Vcc POWER ON 3 E PROG CHRG E G GND v‘ : A15 vo e.5v fvcc EAT 4.2V WP —— LHon I l EuHery PROS § § POWER ON RWOG CHRG GND J.
2Pin configuration
Figure 2. Pin connection (top view)
Table 1. Pin description
Pin Symbol Notes
1 BAT This pin provides an accurate output voltage of 4.2 V and the charge current to the
battery. Only 2 µA reverse current can flow to the device when it is in shutdown mode.
2 POWER ON
Open drain. When the STBC08 detects an undervoltage lockout condition or when the
external adapter provides an input voltage higher than 7.2 V or less than the battery
voltage, POWER ON goes to high impedance state.
3 CHRG Open drain. This pin goes to low impedance when the STBC08 is in pre-charge or
charge mode.
4 GND Ground pin.
5 PROG Charge current program, charge current monitor and shutdown pin. The current
limitation is programmed using RPROG tolerance of 1% between PROG pin and GND.
6VCC
Input supply voltage. The input range goes from 4.25 to 6.5 V.
If VCC < VBAT + 30 mV the device enters shutdown mode and the sinked IBAT is less
than 2 µA.
7 Exposed pad Connected to GND or left floating.
Figure 3. Application circuit
STBC08
Pin configuration
DS4901 - Rev 4 page 3/20
3Maximum ratings
Table 2. Absolute maximum ratings
Symbol Parameter Value Unit
VCC Input supply voltage From - 0.3 to 10 V
VBAT Battery pin voltage From - 0.3 to 7 V
VPROG PROG pin voltage From - 0.3 to VCC+ 0.3 V
VCHRG CHRG pin voltage From - 0.3 to 7 V
VPOWER-ON POWER ON pin voltage From - 0.3 to 7 V
VLV TEMP, LED1, LED2, ISET From - 0.3 to VREF + 0.3 V
IBAT BAT pin current 800 mA
IPROG
PROG pin current 800 µA
BAT short-circuit duration Continuous
PDPower dissipation Internally limited mW
TJMaximum junction temperature 125 °C
TSTG Storage temperature range – 65 to 125 °C
TOP Operating junction temperature range – 40 to 85 °C
Table 3. Thermal data
Symbol Parameter Value Unit
Rth(JA) Thermal resistance junction-ambient 105.7 °C/W
STBC08
Maximum ratings
DS4901 - Rev 4 page 4/20
4Electrical characteristics
VCC = 5 V, CI = 1 µF, TJ = - 40 °C to 85 °C unless otherwise specified.
Table 4. Electrical characteristics
Symbol Parameter Test conditions Min. Typ. Max. Unit
VCC Supply voltage 4.25 6.5 V
ICC Supply current (1)
Charge mode, RPROG =10 kΩ 150 500
µA
Standby mode (charge ended) 150 300
Shutdown mode
RPROG not
connected 21 40
VCC < VBAT 17 50
VCC < VUV 17 40
VBAT Termination output
voltage VCC = 4.3 V to 6.5 V 4.158 4.2 4.242 V
IBAT BAT pin current
Current mode
RPROG = 10 kΩ 90 100 110 mA
Current mode
RPROG = 2 kΩ 465 500 535 mA
Standby mode
VBAT = 4.2 V 0 -2.5 -6
µA
Shutdown mode (RPROG =
not connected) TJ = 25 °C ±1 ±2
Sleep mode, VCC = 0 V,
TJ = 25 °C ±1 ±2
IPRE Pre-charge current
VBAT < 2.8 V
RPROG = 2 kΩ, TJ = 25 °C 20 45 70 mA
VPRE Pre-charge
threshold
RPROG = 10 kΩ, VBAT
falling 2.8 2.9 3.0 V
Hysteresis RPROG =10 kΩ 70 100 130 mV
VUV
VCC undervoltage
lockout
VCC low to high
RPROG = 10 kΩ 3.65 3.80 3.95 V
Hysteresis RPROG =10 kΩ 50 180 300 mV
VMSD Manual shutdown
threshold
PROG pin rising 1.15 1.21 1.30
V
PROG pin falling 0.85 0.95 1.05
VASD
VCC-VBAT lockout
threshold
VCC low to high
TJ = 25 °C
RPROG = 10 kΩ
50 85 120
mV
VCC high to low T = 25 °C
RPROG = 10 kΩ 5 30 50
ITERM
C/10 termination
current threshold
(IBAT/IBATC10) (2)
RPROG = 10 kΩ 10
µA
RPROG = 2 kΩ 10
STBC08
Electrical characteristics
DS4901 - Rev 4 page 5/20
Symbol Parameter Test conditions Min. Typ. Max. Unit
VPROG PROG pin voltage
Current mode
RPROG = 10 kΩ 0.93 1.0 1.07 V
VCHRG CHRG pinpull-
down voltage ICHRG = 5 mA 0.35 0.6 V
IPOWER_ON
POWER ON pin
leakage current Pull-up 1 µA
POWER ON pin
pull-down voltage IPOWER_ON = 5 mA 0.35 0.6 V
∆VRECHRG Recharge battery
threshold voltage
Battery voltage TJ = 25 °C
RPROG = 10 kΩ 200 mV
TLIM
Junction
temperature in
constant
temperature mode
120 °C
RON
PowerFET on-
resistance
(between VCC and
BAT)
600 mΩ
tSS Soft-start time IBAT = 0 to IBAT = 1000 V /
RPROG
100 µs
TRECHARGE
Recharge
comparator filter
time (3)
VBAT highto low 0.75 2 4.5 ms
tTERM
Termination
comparatorfilter
time (3)
IBAT fallingbelow ICHG/10 400 1000 2500 µs
IPROG PROG pin pull-up
current 1 µA
1. Supply current includes PROG pin current but it doesn’t include any current delivered to the battery through VBAT pin
2. ITERM is indicated as a fraction of measured full charge current with indicated PROG resistor.
3. Guaranteed by design.
Note: The STBC08 has been tested using a battery simulator and an output capacitor value of 4.7 µF.
STBC08
Electrical characteristics
DS4901 - Rev 4 page 6/20
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5Typical performance characteristics
Figure 4. IBAT vs. supply voltage Figure 5. VBAT vs. VCC
Figure 6. IBAT vs. temperature Figure 7. VPROG vs. temperature
STBC08
Typical performance characteristics
DS4901 - Rev 4 page 7/20
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Figure 8. IBAT / IPROG vs. temperature Figure 9. Recharge battery threshold voltage vs.
temperature
Figure 10. IBAT / IPROG vs. VCC Figure 11. IBAT vs. VBAT
Figure 12. VCHRG vs. temperature (CHRG pin output low
voltage) Figure 13. IBAT vs. VPROG
STBC08
Typical performance characteristics
DS4901 - Rev 4 page 8/20
cszsuw RawN( m0) 900 sou 700 500 500 400 -75 -25 25 75 n (‘5)
Figure 14. Power FET on-resistance
STBC08
Typical performance characteristics
DS4901 - Rev 4 page 9/20
6Application information
The STBC08 uses an internal P-channel MOSFET to work in constant current and constant voltage method. It
provides up to 800 mA with a final regulated output voltage of 4.2 V ±1% in full temperature range. Neither
blocking diode nor sensing resistor are required. The USB port can be used as a power supply voltage.
6.1 Charge cycle
A charge cycle begins when the voltage at the VCC pin rises above UVLO threshold level, RPROG program
resistor of 1% is connected between PROG pin and GND pin and when a battery is connected to the charger
output. If the battery voltage is below 2.9 V, the charger enters trickle charge mode. In this condition, the device
supplies 1/10th of the programmed charge current to keep the battery voltage in a safe level otherwise the life of a
battery reduces. If BAT pin voltage is higher than 2.9 V the charger goes to constant current mode. When BAT pin
voltage is close to the final float voltage (4.2 V) the device goes to constant voltage mode and the charge current
begins decreasing. The charge cycle is over when the current drops 1/10th of the programmed value.
6.2 VCC pin
Input supply voltage is used to supply the device in the range from 4.25 V to 6.5 V voltage. A bypass capacitor of
1 µF is recommended. When VCC value drops below 30 mV of BAT pin voltage, the device goes to shutdown
mode, dropping IBAT less than 2 µA.
6.3 POWER ON pin
POWER ON pin is an open drain flag indicating VCC presence, VUVLO < VCC < 7.2 V and VCC > VBAT. While in
high impedance, it indicates that VCC < VUVLO, VCC > 7.2 V or VCC < VBAT. In high impedance status VCC does
not start the charge cycle.
6.4 CHRG pin
CHRG pin is an open drain flag indicating the status of the charge. When the pin is in low-state, the device
charges the battery. If the pin is in high impedance state the charge is over.
Table 5. Flag status values for CHRG pin
POWER ON CHRG Description
0 0 Pre-charge mode (trickle charge mode) or charge mode. VCC is higher than VUVLO and
RPROG is connected to PROG pin.
01 (1) Standby mode (charge completed) or shutdown mode (RPROG not connected).
1 (1) 1 (1) Supply is not sufficient.
1. Output pin in high impedance (external pull-up needed).
6.5 PROG pin
Charge current program, charge current monitor and shutdown pin. The charge current is programmed by
connecting a resistor of 1%, RPROG to ground. When the device charges in constant current, the voltage value of
this pin is 1.0 V. In other conditions, the voltage on this pin can measure the charge current thanks to the following
formula:
IBAT =
VPROG
RPROG
× 1000 (1)
PROG pin shuts down the device; disconnecting the program resistor from ground, the current of 1 µA flows to
pull PROG pin high.
If the value of this pin is 1.21 V (shutdown threshold voltage), the device enters shutdown mode and the input
supply current drops to 25 µA. Driving this pin to voltage beyond 2.4 V, a current of 35 µA flows to the device from
PROG pin.
STBC08
Application information
DS4901 - Rev 4 page 10/20
6.6 Programming charge current
RPROG resistor sets the charge current value. The battery charge current is 1000 times the PROG pin current
value. The program resistor and the charge current are calculated according to the following equation:
RPROG = 1000 ×
VPROG
IBAT (2)
The charge current out of BAT pin can be monitored by PROG pin voltage as per below equation:
IBAT =
VPROG
RPROG
× 1000 (3)
6.7 BAT pin
The charge current output pin provides the battery with charge current and regulates the final float voltage to 4.2
V. An internal resistor is a feedback loop, which compares VO with the reference.
6.8 Charge termination
A charge cycle is terminated when the final float voltage is reached while the charge current falls 1/10th ofthe
programmed value. The charge is over when PROG pin voltage falls below 100 mV for a time longer than tTERM
(~1 ms). The charge current is latched off, the device is in standby mode and the input supply current drops to
200 µA.
6.9 Soft-start
When a charge cycle starts, an internal soft-start circuit minimizes the inrush current. At starting phase, the
charge current ramps from zero to full scale in 100 µs.
6.10 Thermal regulation
An internal thermal feedback loop reduces the output current if the die temperature rises above a present value of
approximately 120 °C. This feature protects the device from the excessive temperature and allows the user to
push the limits of the power handling the capability of a given circuit board without damaging the device.
6.11 Power dissipation
A good thermal PC board layout should be used to maximize the available output current. The thermal path for
the heat generated by IC is from the die to the copper lead frame through the package leads and exposed pad to
the PC board copper.
The PC board copper is the heat sink. Footprint copper pads should be as wider as possible and expand out to
larger copper areas to spread and dissipate the heat to the surrounding ambient. Feed-through vias to inner or
backside copper layers are also useful to improve the overall thermal performance of the device. Other heat
sources on the board, not related to the device, have to be considered when a PC board layout is designed
because they affect the overall temperature rise and the maximum output current.
6.12 Stability considerations
The STBC08 contains two control loops: the constant voltage and the constant current. The constant voltage loop
is stable without any compensation when a battery is connected with low impedance leads. Excessive lead
length, however, may add enough parasitic series inductance to require 1 µF bypass capacitor from BAT to GND.
Furthermore, a 4.7 µF capacitor with a series resistor (0.2 Ω to 1 Ω) from BAT to GND is required to keep ripple
voltage low when the battery is disconnected.
STBC08
Programming charge current
DS4901 - Rev 4 page 11/20
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7Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK®
packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions
and product status are available at: www.st.com. ECOPACK® is an ST trademark.
7.1 DFN6 (3 x 3 mm) package information
Figure 15. DFN6 (3 x 3 mm) package outline
STBC08
Package information
DS4901 - Rev 4 page 12/20
DIMENSJONS N MJLL 2,50 ‘77‘25fl 6 3.70 @v @ 7 7. 75 // 0%75 @ 2 \ 0.95 9 A o: \3
Table 6. DFN6 (3 x 3 mm) package mechanical data
Dim.
mm
Min. Typ. Max.
A 0.80 1
A1 0 0.02 0.05
A3 0.20
b 0.23 0.45
D 2.90 3 3.10
D2 2.23 2.50
E 2.90 3 3.10
E2 1.50 1.75
0.95
L 0.30 0.40 0.50
Figure 16. DFN6 (3 x 3 mm) recommended footprint
STBC08
DFN6 (3 x 3 mm) package information
DS4901 - Rev 4 page 13/20
COVER x: 7 10 SPROCKET HOLE PITCH CUMULATIVE TOLERANCE 1020
7.2 DFN6 (3 x 3 mm) packing information
Figure 17. DFN6 (3 x 3 mm) tape outline
7875978_N
STBC08
DFN6 (3 x 3 mm) packing information
DS4901 - Rev 4 page 14/20
M’ 10‘5 ‘ ‘ \ 700 + WWW
Figure 18. DFN6 (3 x 3 mm) reel outline
7875978_N
Table 7. DFN6 (3 x 3 mm) tape and reel mechanical data
Dim.
mm
Min. Typ. Max.
A0 3.20 3.30 3.40
B0 3.20 3.30 3.40
K0 1 1.10 1.20
STBC08
DFN6 (3 x 3 mm) packing information
DS4901 - Rev 4 page 15/20
Revision history
Table 8. Document revision history
Date Revision Changes
04-Sep-2006 1 Initial release.
29-May-2014 2
Added exposed pad pin to Table 2.
Updated ITERM parameter in Table 5.
Modified Table 6. Minortext changes.
17-Jul-2017 3 Updated Table 5.
28-Nov-2018 4 Updated VBAT value in Table 2. Absolute maximum ratings.
STBC08
DS4901 - Rev 4 page 16/20
Contents
1Application diagram ...............................................................2
2Pin configuration ..................................................................3
3Maximum ratings ..................................................................4
4Electrical characteristics...........................................................5
5Typical performance characteristics ...............................................7
6Application information...........................................................10
6.1 Charge cycle .................................................................10
6.2 VCC pin ......................................................................10
6.3 POWER ON pin...............................................................10
6.4 CHRG pin....................................................................10
6.5 PROG pin....................................................................10
6.6 Programming charge current ....................................................11
6.7 BAT pin ......................................................................11
6.8 Charge termination ............................................................11
6.9 Soft-start.....................................................................11
6.10 Thermal regulation ............................................................11
6.11 Power dissipation .............................................................11
6.12 Stability considerations.........................................................11
7Package information..............................................................12
7.1 TQFN 12 (2.00 x 1.70 mm) package information ...................................12
7.2 DFN6 (3 x 3 mm) packing information ............................................13
Revision history .......................................................................16
STBC08
Contents
DS4901 - Rev 4 page 17/20
List of tables
Table 1. Pin description......................................................................3
Table 2. Absolute maximum ratings .............................................................4
Table 3. Thermal data.......................................................................4
Table 4. Electrical characteristics ...............................................................5
Table 5. Flag status values for CHRG pin ........................................................ 10
Table 6. DFN6 (3 x 3 mm) package mechanical data ................................................ 13
Table 7. DFN6 (3 x 3 mm) tape and reel mechanical data ............................................. 15
Table 8. Document revision history ............................................................. 16
STBC08
List of tables
DS4901 - Rev 4 page 18/20
List of figures
Figure 1. Block diagram ....................................................................2
Figure 2. Pin connection (top view) .............................................................3
Figure 3. Application circuit ..................................................................3
Figure 4. IBAT vs. supply voltage...............................................................7
Figure 5. VBAT vs. VCC .....................................................................7
Figure 6. IBAT vs. temperature ................................................................7
Figure 7. VPROG vs. temperature ..............................................................7
Figure 8. IBAT / IPROG vs. temperature ...........................................................8
Figure 9. Recharge battery threshold voltage vs. temperature ..........................................8
Figure 10. IBAT / IPROG vs. VCC ................................................................8
Figure 11. IBAT vs. VBAT .....................................................................8
Figure 12. VCHRG vs. temperature (CHRG pin output low voltage) ........................................8
Figure 13. IBAT vs. VPROG ....................................................................8
Figure 14. Power FET on-resistance.............................................................9
Figure 15. DFN6 (3 x 3 mm) package outline ...................................................... 12
Figure 16. DFN6 (3 x 3 mm) recommended footprint................................................. 13
Figure 17. DFN6 (3 x 3 mm) tape outline......................................................... 14
Figure 18. DFN6 (3 x 3 mm) reel outline ......................................................... 15
STBC08
List of figures
DS4901 - Rev 4 page 19/20
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STBC08
DS4901 - Rev 4 page 20/20