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FTDI VDrive3 Datasheet Chip htt : www.ftdichi .com Products 1C5 NC2.htm httg:[[www.ftdic p.com[Android.htm.

Use of FTDI devices in life support and/or safety applications is entirely at the user’s risk, and the user agrees

to defend, indemnify and hold harmless FTDI from any and all damages, claims, suits or expense resulting

from such use.

VDrive3 Datasheet

Version 1.3

Document Reference No.: FT_000699 Clearance No.: FTDI# 335

Future Technology

Devices

International Ltd

Datasheet

VDrive3 Vinculum-II

Application Module

VDrive3 is a USB host/microcontroller application module with an enclosure. The default

firmware of the VDrive3 supports UART/SPI communications with the embedded USB host

controller and USB host port. This product provides an attractive solution for quick and

easy integration of applications with a USB flash disk or other USB client devices.

1 Introduction

VDrive3 is designed to support quick and

easy integration of a UART/SPI application

with a USB client device. The VDrive3

comes in a neat enclosure displaying a bi-

colour LED, making it suitable for

incorporating into finished product designs.

In addition, a product option, VDrive3-LD, is

available that offers a lid to cover the USB

port to provide protection in harsh

environments.

The VDrive3 utilises FTDI’s Vinculum-II

(VNC2-48L1B) dual USB host controller IC.

This IC is a microcontroller and USB host

controller; it is reprogrammable using the

UART interface or the Vinculum-II debugger

module connecter. The default firmware is

V2DAP; this firmware establishes the

UART/SPI to USB host interface and can be

modified or replaced with other firmware.

V2DAP is firmware that supports Vinculum-

II to Vinculum backward compatibility*. The

Vinculum-II IDE and FTDI’s expanding

range of drivers allow for additional design

flexibility (including Android interfacing).

For details on the Vinculum-II collateral,

please click

http://www.ftdichip.com/Products/ICs/VNC2.htm

For details on FTDI Android support updates

please click

http://www.ftdichip.com/Android.htm.

1.1 Features

 Vinculum-II microcontroller/USB host

controller IC.

 Pre-programmed with V2DAP firmware.

(Flash Drives up to 8GByte have been tested.)

 Product available as shown or with a lid

covering the USB port.

 USB “A” type socket to connect to USB

client devices.

 2mm (0.08”) pitch 8 pin header used for the

UART/SPI interface.

 Connects directly and communicates with a

FTDI TTL-232R-3V3-2mm USB-UART cable.

 Jumper selectable UART and SPI interfaces,

both operating at 3.3V TTL/CMOS.

 Vinculum-II debugger module port under

neat enclosure, for changing the firmware.

 UART programming mode control signals

PROG# and RESET# are accessible via an

internal header.

 The VDrive3 and all components used are

Pb-free (RoHS compliant).

*See section 5

7.," FTDI VDriveB Datasheet ‘3‘. Chip

VDrive3 Datasheet

Version 1.3

Document Reference No.: FT_000699 Clearance No.: FTDI# 335

Table of Contents

1 Introduction ................................................................................... 1

1.1 Features ........................................................................................................ 1

2 Ordering Information ..................................................................... 3

3 VDrive3 Signals and Configurations ................................................ 3

3.1 VDrive3 Pin-Out ............................................................................................ 3

3.2 VDrive3 Jumper Configuration ...................................................................... 4

3.3 LED Functions ............................................................................................... 4

3.4 Interface Description .................................................................................... 4

4 VDrive2 and VDrive3 Comparison ................................................... 5

5 VDrive3 Application Example .......................................................... 6

5.1 UART Interface to PIC Example ..................................................................... 6

6 VDrive3 Electrical Details ............................................................... 7

6.1 SPI Interface Timing ..................................................................................... 7

7 VDrive3 Max-Ratings ...................................................................... 9

8 VDrive3 Mechanical Details .......................................................... 10

9 VDrive3-LD Mechanical Details ..................................................... 11

10 VDrive3 Schematic ....................................................................... 12

11 Contact Information ..................................................................... 13

Appendix A - List of Figures and Tables ................................................................. 17

Appendix B – Revision History .............................................................................. 18

FTDI VDrive3 Datasheet Module Code utilised IC Code Description VDRIVE3 VNC2-48LlB USB host application module with enclosure lid over USB connector. —sRm mm mm mm” mmmr LED — s cm 5 TXD ll RXD 3 Eva 2 RTSR _ 1 GND — GND — uARr/sw — amour use Flash Drive Interface

VDrive3 Datasheet

Version 1.3

Document Reference No.: FT_000699 Clearance No.: FTDI# 335

2 Ordering Information

Module Code

Utilised IC Code

Description

VDRIVE3

VNC2-48L1B

USB host application module with enclosure.

VDRIVE3-LD

VNC2-48L1B

USB host application module with enclosure and protective

lid over USB connector.

Table 2-1 – Ordering Information

3 VDrive3 Signals and Configurations

3.1 VDrive3 Pin-Out

Figure 3.1 – VDrive3 Pin Out (in UART mode)

The pin-out of the VDrive3 is illustrated in Figure 4.1.

FTDI VDriveB Datasheet Chip default. UART/SPI Interface Mode Pull-Down SPI 1 GND PWR Signal ground 2 RTS# Output Request To Send control output , Handshake signal 4 RXD Input Receive asynchronous data input 5 TXD Output Transmit asynchronous data output 6 CTS# Input Clear To Send control input - Handshake signal 7 NC - No Connect 8 RIWWU Input Ring Indicator control input / Wake Up Pin No. Name Type Description 5 SCLK Input SPI clock input Maximum frequenc : 24MHZ , 3.3V TTL 4 MOSI Input SPI slave serial data input , 3I3V TTL 2 MISO Output SPI slave serial data output , 3I3V TTL 6 SS# Input SPI slave select input , 3.3V TFL

VDrive3 Datasheet

Version 1.3

Document Reference No.: FT_000699 Clearance No.: FTDI# 335

3.2 VDrive3 Jumper Configuration

The interface modes of the VDrive3 running on a V2DAP firmware is given in Table 3-1. The VDrive3

comes preloaded with the V2DAP firmware and the jumper on the UART/SPI pin is set to UART mode by

default.

UART/SPI

Interface Mode

Pull-Up

UART

Pull-Down

SPI

Table 3-1 – VDrive3 Jumper Box

3.3 LED Functions

Operation

LED Behaviour

Power On

LED flashes Green/Red alternately for 2 seconds

Repeated until monitor connects

USB Disk Initialisation

LED Red

USB Disk Ready

LED Green

USB Disk Removed

LED off

Disk is connected to USB Port

LED flashes Green

Nothing is connected to USB Port

LED off

Table 3-2 – VDrive3 LED Functions

3.4 Interface Description

Pin No.

Name

Type

Description

GND

PWR

Signal ground

RTS#

Output

Request To Send control output – Handshake signal

5V0

PWR

5V supply input

RXD

Input

Receive asynchronous data input

TXD

Output

Transmit asynchronous data output

CTS#

Input

Clear To Send control input - Handshake signal

No Connect

RI#/WU

Input

Ring Indicator control input / Wake Up

Table 3-3 – 3.3V TTL/CMOS UART Interface Pin-Out

Pin No.

Name

Type

Description

SCLK

Input

SPI clock input. Maximum frequency: 24MHz – 3.3V TTL

MOSI

Input

SPI slave serial data input – 3.3V TTL

MISO

Output

SPI slave serial data output – 3.3V TTL

SS#

Input

SPI slave select input – 3.3V TTL

Table 3-4 – 3.3V TTL/CMOS SPI Interface Pin-Out

For further details see VNC2 datasheet.

FTDI VDriveB Datasheet Chip AN 176 - Vmcu‘um Comparwson of VDAP and VZDAP.

VDrive3 Datasheet

Version 1.3

Document Reference No.: FT_000699 Clearance No.: FTDI# 335

4 VDrive2 and VDrive3 Comparison

The VDrive3 is a drop in replacement for the VDrive2 for the majority of VDrive2 applications. However,

for a small number of applications that use SPI some changes to the application software may be

required, this is due to a discrepancy in the SPI interface used in the Vinculum-I and Vinculum-II. For

further details on these differences, please see AN_176 - Vinculum Comparison of VDAP and V2DAP.

Note: VDrive3’s default firmware includes a reflash function, allowing the firmware to be updated from a

flash drive. This reflash can be performed with the following steps:

1: Configure the VDrive3 into UART mode.

2: Open a communication terminal and connect to the VDrive3 via the UART interface.

3: Connect a USB flash disk with any firmware named “FTRFBV2.FTD”.

4: Wait for the new firmware to be loaded.

Additional features of the VDrive3:

 Vinculum-II can be configured by a user defined firmware

 VDrive3 hardware has an SPI master interface available. (not enabled by default in V2DAP

firmware)

 VDrive3’s SPI interface can be clocked up to 48MHz

 VDrive3 is programmable using the debugger-module port and the UART interface port.

 VDrive3 can utilise many of the Vinculum-II’s sample firmware available on the FTDI website.

FTDI VDrive3 Datasheet w __ M H Hum: : :3 x" z: m L; 2-”. m m. ‘ ”\‘J http: www.ftdichip.com Support/SoftwareExamples VinculumProject5.htm

VDrive3 Datasheet

Version 1.3

Document Reference No.: FT_000699 Clearance No.: FTDI# 335

5 VDrive3 Application Example

5.1 UART Interface to PIC Example

Figure 5.1 – VDrive3 UART example

The VDrive3 provides solutions for quick and easy integration of UART/SPI applications with USB slave

devices. An application is illustrated in Figure 5.1, in this example the VDrive3 is connected to a

microcontroller and peripheral components to form a flash disk based data logger. This application

example also illustrates an analogue signal connected to the 10-bit analogue to digital input of a

PIC18F1320, the analogue signal can be sourced from a wide variety of sensors.

The PIC code takes a pre-defined number of samples and then writes the corresponding ASCII values to a

Comma Separated Value (CSV) file on the USB flash disk attached to the VDrive3 module. Vinculum-II’s

DOS like ASCII commands simplify the task of file handling. An extended ASCII command set is designed

for use with a terminal whilst a shortened hexadecimal version is used with a microcontroller.

For details on this application please see “VNC1L-Data-Logging Example” on the following web page:

http://www.ftdichip.com/Support/SoftwareExamples/VinculumProjects.htm

,7," FTDI VDriveB Datasheet R/W ADD 7 .42. |_I l—IE ,—|8 ,—|3 l_| l_| l_| K)

VDrive3 Datasheet

Version 1.3

Document Reference No.: FT_000699 Clearance No.: FTDI# 335

6 VDrive3 Electrical Details

6.1 SPI Interface Timing

The following timing diagrams are for the VNC1L Legacy Interface mode of SPI slave.

SCLK

SS#

MOSI

MISO

Figure 6.1 – VDrive2 SPI example

To start the data transfer process SS# needs to be set to high, and remain high for the entire read cycle.

Once the read cycle is complete SS# needs to be set to low for at least one clock cycle to allow another

data transfer cycle to occur.

The first bit of MOSI is the R/W bit, receiving a logic high for this bit allows data to be read from the

VDrive3. The second bit is the address bit, ADD; this bit is used to select data read from the data register

when set to logic high, and read from the status register when set to logic low. During an SPI Read cycle,

a package of data is transmitted from the VDRIVE3 on the MISO line from the time of the first clock cycle

after the SPI ADD bit, with the MSB transmitted first.

After the data has been transferred the status of MISO can be checked to determine if the data read is

new data as indicated by a transmitted logic low. If old data is transmitted, as indicated by a transmitted

logic high, the read cycle needs to be repeated to get new data.

SCLK

SS#

MOSI

MISO

Figure 6.2 – VDrive3 SPI example

To start the data transfer process SS# needs to be set to high for the entire write cycle. Once the write

cycle is complete SS# needs to be set low for at least one clock cycle to allow another data transfer cycle

to occur.

FTDI VDrive3 Datasheet Chip T1 T2 T3 T5 9‘ T4 T5 Time Description Min Typical Max Unit T1 SCLK Period 83 » » ns T3 SCLK Low 20 » » ns T4 Input Setup Time 10 » » ns T6 Input Hold Time 2 » » ns T7 Output Valid Time » » 20 ns

VDrive3 Datasheet

Version 1.3

Document Reference No.: FT_000699 Clearance No.: FTDI# 335

The first bit of MOSI is the R/W bit, receiving a logic low for this bit allows data to be written to the

VDrive3. The second bit is the address bit, ADD, this bit is used to select a data write to the data register

when set to logic high, and to the status register when set to logic low. During an SPI Write cycle a

package of data is transmitted to the VDRIVE3 on the MOSI line from the time of the first clock cycle

after the SPI ADD bit, with the MSB transmitted first.

After the data has been transferred, the status of MISO can be checked to determine if the data written

has been accepted. If a logic low is given for the status bit, it can be determined that the data write was

successful. If a logic high is given for the status bit, the internal buffer of the device receiving data is full,

and the same write cycle should be repeated.

SCLK

MOSI

MISO

Figure 6.3 – VDrive3 SPI example

Time

Description

Min

Typical

Max

Unit

SCLK Period

SCLK High

SCLK Low

Input Setup Time

Input Hold Time

Output Valid Time

Table 6-1 – SPI Interface Pin-Out

FTDI Chip VDriveB Datasheet device. Storage Temperature 40°C to 85°C Degrees c atmg Temp Appued) vcc Supply Voltage -0.3 to +5.5 v DC Input Vo‘tage - USBDP and USBDM -0.5 to +3.53 v

VDrive3 Datasheet

Version 1.3

Document Reference No.: FT_000699 Clearance No.: FTDI# 335

7 VDrive3 Max-Ratings

The absolute maximum ratings for the VDrive3 devices are as follows. These are in accordance with the

Absolute Maximum Rating System (IEC 60134). Exceeding these may cause permanent damage to the

device.

Parameter

Value

Unit

Conditions

Storage Temperature

-40°C to 85°C

Degrees C

Ambient Operating Temperature (Power

Applied)

-30°C to 85°C

Degrees C

VCC Supply Voltage

-0.3 to +5.5

DC Input Voltage – USBDP and USBDM

-0.5 to +3.63

Table 7.1 – Absolute Maximum Ratings

VDrive3 Datasheet u m... I m- \ Front Side .“2’ 6 > Top um: 335ml 4.2mm mr Back 710mm! Mr

VDrive3 Datasheet

Version 1.3

Document Reference No.: FT_000699 Clearance No.: FTDI# 335

8 VDrive3 Mechanical Details

Figure 8.1 – VDrive3 Dimensions

Full detailed mechanical drawings for the VDrive3 enclosure are available on request from FTDI technical

support.

VDriveB Datasheet x- Chip ‘5 3°—’\— m an m V 1, ~ A 454 go ‘2' 7» ~1 27 _.g 05— J, [ d _ u: a g m N N I.) m T E 3 m o. '1: 4' l W l :5 “a —17 o—r #19) ~19 25* _ 7 »~ _ 0‘? ¢ 3' E J. u‘: REL] ~

VDrive3 Datasheet

Version 1.3

Document Reference No.: FT_000699 Clearance No.: FTDI# 335

9 VDrive3-LD Mechanical Details

LID INSIDE LID OUTSIDE

LID THICKNESS

ASSEMBLY SIDEVIEW

Figure 9.1 – VDrive3-LD Dimensions

Full detailed mechanical drawings for the VDrive3-LD enclosure are available on request from FTDI

technical support.

G: FTDI VDrive3 Datasheet \j“. Chlp

VDrive3 Datasheet

Version 1.3

Document Reference No.: FT_000699 Clearance No.: FTDI# 335

10 VDrive3 Schematic

Figure 10.1 – Module Circuit Schematic

FTDI Chip VDriveB Datasheet Fut TI—ICOC 2 Email (Sales) Email (Support) Email (General Enquines) Fut ZF, Tal Ta T F Email (Sales) Email (Support) Email (General Enquines) http [[ftdlchlp Com Salesl @ftdicthLom Supportl @ftdichlgLom admlnl thdichiQLOm tw.salesl@ftdlchlp.com tw.5u ortl ftdlchl .Com tw.admlrl1 ftdichl .com FI'DI Web Slte Fut 71 Tl U T F E-Mail (Sales) E-Mail (Support) E-Mail (General Enquirles) Futu R00 Sh C T F E-rnail (Sales) E-rnail (Support) E-rnail (General Enqulrles) us.sales thdlchiQLOm us.su ort ftdichi .Com us.admin @ftdlcthLom Cn.sale5 @ftdichIQLom Cn.su ort ftdlchl .Com Cn.admln thdichiQLOm

VDrive3 Datasheet

Version 1.3

Document Reference No.: FT_000699 Clearance No.: FTDI# 335

11 Contact Information

Head Office – Glasgow, UK

Future Technology Devices International Limited

Unit 1, 2 Seaward Place, Centurion Business Park

Glasgow G41 1HH

United Kingdom

Tel: +44 (0) 141 429 2777

Fax: +44 (0) 141 429 2758

E-mail (Sales)

sales1@ftdichip.com

E-mail (Support)

support1@ftdichip.com

E-mail (General Enquiries)

admin1@ftdichip.com

Branch Office – Taipei, Taiwan

Future Technology Devices International Limited (Taiwan)

2F, No. 516, Sec. 1, NeiHu Road

Taipei 114

Taiwan, R.O.C.

Tel: +886 (0) 2 8797 1330

Fax: +886 (0) 2 8751 9737

E-mail (Sales)

tw.sales1@ftdichip.com

E-mail (Support)

tw.support1@ftdichip.com

E-mail (General Enquiries)

tw.admin1@ftdichip.com

Branch Office – Tigard, Oregon, USA

Future Technology Devices International Limited (USA)

7130 SW Fir Loop

Tigard, OR 97223-8160

USA

Tel: +1 (503) 547 0988

Fax: +1 (503) 547 0987

E-Mail (Sales)

us.sales@ftdichip.com

E-Mail (Support)

us.support@ftdichip.com

E-Mail (General Enquiries)

us.admin@ftdichip.com

Branch Office – Shanghai, China

Future Technology Devices International Limited (China)

Room 408, 317 Xianxia Road,

Shanghai, 200051

China

Tel: +86 21 62351596

Fax: +86 21 62351595

E-mail (Sales)

cn.sales@ftdichip.com

E-mail (Support)

cn.support@ftdichip.com

E-mail (General Enquiries)

cn.admin@ftdichip.com

Web Site

http://ftdichip.com

Distributor and Sales Representatives

Please visit the Sales Network page of the FTDI Web site for the contact details of our distributor(s) and sales

representative(s) in your country.

System and equipment manufacturers and designers are responsible to ensure that their systems, and any Future Technology Devices International Ltd

(FTDI) devices incorporated in their systems, meet all applicable safety, regulatory and system-level performance requirements. All application-related

information in this document (including application descriptions, suggested FTDI devices and other materials) is provided for reference only. While FTDI

has taken care to assure it is accurate, this information is subject to customer confirmation, and FTDI disclaims all liability for system designs and for any

applications assistance provided by FTDI. Use of FTDI devices in life support and/or safety applications is entirely at the user’s risk, and the user agrees to

defend, indemnify and hold harmless FTDI from any and all damages, claims, suits or expense resulting from such use. This document is subject to change

without notice. No freedom to use patents or other intellectual property rights is implied by the publication of this document. Neither the whole nor any part

of the information contained in, or the product described in this document, may be adapted or reproduced in any material or electronic form without the prior

written consent of the copyright holder. Future Technology Devices International Ltd, Unit 1, 2 Seaward Place, Centurion Business Park, Glasgow G41

1HH, United Kingdom. Scotland Registered Company Number: SC136640

7;" FTDI ‘3‘. Chip

VDrive3 Datasheet

Version 1.3

Document Reference No.: FT_000699 Clearance No.: FTDI# 335

Appendix A - List of Figures and Tables

List of Figures

Figure 3.1 – VDrive3 Pin Out (in UART mode) .............................................................................................. 3

Figure 5.1 – VDrive3 UART example .............................................................................................................. 6

Figure 6.1 – VDrive2 SPI example .................................................................................................................. 7

Figure 6.2 – VDrive3 SPI example .................................................................................................................. 7

Figure 6.3 – VDrive3 SPI example .................................................................................................................. 8

Figure 8.1 – VDrive3 Dimensions ................................................................................................................. 10

Figure 9.1 – VDrive3-LD Dimensions ........................................................................................................... 11

Figure 10.1 – Module Circuit Schematic...................................................................................................... 12

List of Tables

Table 2-1 – Ordering Information ................................................................................................................... 3

Table 3-1 – VDrive3 Jumper Box .................................................................................................................... 4

Table 3-3 – 3.3V TTL/CMOS UART Interface Pin-Out ................................................................................... 4

Table 6-1 – SPI Interface Pin-Out ................................................................................................................... 8

Table 7.1 – Absolute Maximum Ratings ........................................................................................................ 9