Fiche technique pour TPD4E05U06-Q1 de Texas Instruments

V'.‘ 1!. I TEXAS INSTRUMENTS
1
2
4
5
38
1
2
4
5
3 8
Connector
HDMI Controller
TPD4E05U06-Q1
TPD4E05U06-Q1
D0-
D1+
D1-
D2+
D2-
CLK+
CLK-
D0+
GND
GND
GND
GND
Copyright © 2016, Texas Instruments Incorporated
D1+ D1- D2+ D2-
GND
Product
Folder
Order
Now
Technical
Documents
Tools &
Software
Support &
Community
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPD4E05U06-Q1
,
TPD1E05U06-Q1
SLVSCO7C –AUGUST 2014–REVISED SEPTEMBER 2017
TPDxE05U06-Q1 1 and 4 Channel ESD Protection Diodes for SuperSpeed (Up to 6 Gbps)
Interface
1
1 Features
1• AEC-Q101 Qualified
– Device HBM Classification Level H3B
– Device CDM Classification Level C5
– Device Temperature Range: –40°C to +125°C
• IEC 61000-4-2 Level 4 ESD Protection
(See the ESD Ratings—IEC Specification Table)
– ±12-kV Contact Discharge
– ±15-kV Air Gap Discharge
• IEC 61000-4-4 EFT Protection
– 80 A (5/50 ns)
• IEC 61000-4-5 Surge Protection
– 2.5 A (8/20 µs)
• I/O Capacitance 0.42 pF to 0.5 pF (Typical)
• DC Breakdown Voltage 6.4 V (Minimum)
• Ultra Low Leakage Current 10 nA (Maximum)
• Low ESD Clamping Voltage (14 V at 5-A TLP)
• Easy Flow-Through Routing Packages
2 Applications
• End Equipment
– Head Unit
– Rear Seat Entertainment
– Telematics
– USB Hub
– Navigation Module
– Media Interface
• Interfaces
– USB 2.0
– USB 3.0
– HDMI 1.4/2.0
– LVDS
– DisplayPort
– SIM Card
3 Description
The TPDxE05U06-Q1 is a family of unidirectional
Transient Voltage Suppressor (TVS) Electrostatic
Discharge (ESD) protection diodes with ultra-low
capacitance. They are rated to dissipate ESD strikes
above the maximum level specified in the IEC 61000-
4-2 level 4 international standard. The ultra-low
loading capacitance makes these devices ideal for
protecting any high-speed signal applications up to 6
Gbps.
These devices are also available without automotive
qualification: TPDxE05U06.
Device Information(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
TPD4E05U06-Q1 USON (10) 2.50 mm × 1.00 mm
TPD1E05U06-Q1 X1SON (2) 0.60 mm x 1.00 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
TPD4E05U06-Q1 Simplified Schematic TPD4E05U06-Q1 Block Diagram
l TEXAS INSTRUMENTS
2
TPD4E05U06-Q1
,
TPD1E05U06-Q1
SLVSCO7C –AUGUST 2014–REVISED SEPTEMBER 2017
www.ti.com
Product Folder Links: TPD4E05U06-Q1 TPD1E05U06-Q1
Submit Documentation Feedback Copyright © 2014–2017, Texas Instruments Incorporated
Table of Contents
1 Features.................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions......................... 3
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings—AEC Specification............................. 4
6.3 ESD Ratings—IEC Specification .............................. 4
6.4 Recommended Operating Conditions....................... 4
6.5 Thermal Information.................................................. 4
6.6 Electrical Characteristics........................................... 5
6.7 Typical Characteristics.............................................. 6
7 Detailed Description.............................................. 8
7.1 Overview ................................................................... 8
7.2 Functional Block Diagram......................................... 8
7.3 Feature Description................................................... 8
7.4 Device Functional Modes.......................................... 9
8 Application and Implementation ........................ 10
8.1 Application Information............................................ 10
8.2 Typical Application .................................................. 10
9 Layout ................................................................... 12
9.1 Layout Guidelines ................................................... 12
9.2 Layout Example ...................................................... 12
10 Device and Documentation Support ................. 13
10.1 Documentation Support ........................................ 13
10.2 Receiving Notification of Documentation Updates 13
10.3 Related Links ........................................................ 13
10.4 Community Resources.......................................... 13
10.5 Trademarks........................................................... 13
10.6 Electrostatic Discharge Caution............................ 13
10.7 Glossary................................................................ 13
11 Mechanical, Packaging, and Orderable
Information ........................................................... 14
4 Revision History
Changes from Revision A (August 2014) to Revision B Page
• Added 1-channel (TPD1E05U06-Q1) package ...................................................................................................................... 1
• Added DPY package information in Thermal Information table ............................................................................................. 4
• Added DPY package Dynamic resistance in Electrical Characteristics table ........................................................................ 5
• Added DPY package Line capacitance in Electrical Characteristics table............................................................................. 5
Changes from Revision B (August 2016) to Revision C Page
• Changed DPY Package pin configuration in the Pin Configuration and Functions section ................................................... 1
Changes from Original (August 2014) to Revision A Page
• Added (See the ESD Ratings—IEC Specification Table) to Feature: IEC 61000-4-2 Level 4 ESD Protection..................... 1
l TEXAS INSTRUMENTS
1
2
3
4
6
7
8
9
10
5
D1+
D1–
GND
D2+
D2–
N.C.
N.C.
GND
N.C.
N.C.
1
2
I/O
GND
3
TPD4E05U06-Q1
,
TPD1E05U06-Q1
www.ti.com
SLVSCO7C –AUGUST 2014–REVISED SEPTEMBER 2017
Product Folder Links: TPD4E05U06-Q1 TPD1E05U06-Q1
Submit Documentation FeedbackCopyright © 2014–2017, Texas Instruments Incorporated
(1) Place as close to the connector as possible.
5 Pin Configuration and Functions
DPY Package
2-Pin X1SON
Top View
DQA Package
10-Pin USON
Top View
Pin Functions TPD1E05U06-Q1 DPY
PIN TYPE DESCRIPTION
NO. NAME
1 I/O I/O ESD Protected Channel(1)
2 GND Ground Ground; Connect to ground
(1) Place as close to the connector as possible.
Pin Functions TPD4E05U06-Q1 DQA
PIN TYPE DESCRIPTION
NO. NAME
1 D1+ I/O ESD Protected Channel(1)
2 D1– I/O ESD Protected Channel(1)
4 D2+ I/O ESD Protected Channel(1)
5 D2– I/O ESD Protected Channel(1)
6, 7, 9, 10 NC NC Not Connected; Used for optional straight-through routing. Can be left floating or
grounded
3, 8 GND Ground Ground; Connect to ground
l TEXAS INSTRUMENTS
4
TPD4E05U06-Q1
,
TPD1E05U06-Q1
SLVSCO7C –AUGUST 2014–REVISED SEPTEMBER 2017
www.ti.com
Product Folder Links: TPD4E05U06-Q1 TPD1E05U06-Q1
Submit Documentation Feedback Copyright © 2014–2017, Texas Instruments Incorporated
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Voltages are with respect to GND unless otherwise noted.
(3) Measured at 25°C
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)(2)
MIN MAX UNIT
Electrical fast transient IEC 61000-4-4 (5/50 ns) 80 A
Peak pulse
IEC 61000-4-5 Current (tp – 8/20 µs) 2.5 A
IEC 61000-4-5 Power (tp – 8/20 µs) - TPD4E05U06-Q1(3) 40 W
IEC 61000-4-5 Power (tp – 8/20 µs) - TPD1E05U06-Q1(3) 30 W
TAOperating temperature –40 125 °C
Tstg Storage temperature –65 150 °C
(1) Electrostatic discharge (ESD) to measure device sensitivity and immunity to damage caused by assembly line electrostatic discharges
into the device.
(2) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
6.2 ESD Ratings—AEC Specification
VALUE UNIT
V(ESD) Electrostatic discharge(1) Human-body model (HBM), per AEC Q100-002(2) ±8000 V
Charged-device model (CDM), per AEC Q100-011 ±1000
(1) Measured at 25°C, per IEC 61000.4.2 Ed. 2.0 Section 7.2.4.
6.3 ESD Ratings—IEC Specification
VALUE UNIT
V(ESD) Electrostatic Discharge
IEC 61000-4-2 contact discharge - TPD4E05U06-Q1 (1) ±12000
VIEC 61000-4-2 contact discharge - TPD1E05U06-Q1 ±12000
IEC 61000-4-2 air-gap discharge ±15000
6.4 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VIO Input pin voltage 0 5.5 V
TAOperating free-air temperature –40 125 °C
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.5 Thermal Information
THERMAL METRIC(1)
TPD1E05U06-Q1 TPD4E05U06-Q1
UNITDPY (X1SON) DQA (USON)
2 PINS 10 PINS
RθJA Junction-to-ambient thermal resistance 697.3 327 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 471 189.5 °C/W
RθJB Junction-to-board thermal resistance 575.9 257.7 °C/W
ψJT Junction-to-top characterization parameter 175.7 60.9 °C/W
ψJB Junction-to-board characterization parameter 575.1 257 °C/W
l TEXAS INSTRUMENTS
5
TPD4E05U06-Q1
,
TPD1E05U06-Q1
www.ti.com
SLVSCO7C –AUGUST 2014–REVISED SEPTEMBER 2017
Product Folder Links: TPD4E05U06-Q1 TPD1E05U06-Q1
Submit Documentation FeedbackCopyright © 2014–2017, Texas Instruments Incorporated
(1) Transition line pulse with 100 ns width, 200 ps rise time.
(2) Extraction of RDYN using least squares fit of TLP characteristics between I = 5 A and I = 10 A.
6.6 Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
INPUT – OUTPUT RESISTANCE
VRWM Reverse stand-off voltage IIO < 10 µA 5.5 V
VBR Break-down voltage IIO = 1 mA 6.4 8.7 V
VCLAMP Clamp voltage
IPP = 1 A, TLP, from I/O to GND(1) 10
V
IPP = 5 A, TLP, from I/O to GND(1) 14
IPP = 1 A, TLP, from GND to I/O(1) 3
IPP = 5 A, TLP, from GND to I/O(1) 7.5
ILEAK Leakage current VIO = 2.5 V 1 10 nA
RDYN Dynamic
resistance
DPY package I/O to GND(2) 0.8
Ω
GND to I/O(2) 0.7
DQA package I/O to GND(2) 0.96
GND to I/O(2) 0.9
CAPACITANCE
CLLine capacitance VIO = 2.5 V, f = 1 MHz, I/O to
GND
TPD1E05U06-Q1
DPY package 0.42
pF
TPD4E05U06-Q1
DQA package 0.5
ΔCIO-TO-GND Variation of input capacitance GND Pin = 0 V, f = 1 MHz, VBIAS = 2.5 V,
Channel x pin to GND – channel y pin to GND 0.05 0.08 pF
CCROSS Channel to channel input
capacitance GND Pin = 0 V, f = 1 MHz, VBIAS = 2.5 V, between
channel pins 0.04 0.08 pF
l TEXAS INSTRUMENTS 120
0
50
100
150
200
250
300
±40 ±20 0 20 40 60 80 100 120
Current (pA)
Temperature (ƒC)
C004
Voltage (V)
Current (A)
0 5 10 15 20 25 30 35 40
-5
0
5
10
15
20
25
30
35
D001
Voltage (V)
Current (A)
0 5 10 15 20 25 30 35 40
0
5
10
15
20
25
30
D001
Time (µs)
Current (A)
Power (W)
-5 0 5 10 15 20 25 30 35 40 45 50
0 0
0.5 8
1 16
1.5 24
2 32
2.5 40
3 48
3.5 56
D002
Current
Power
±1.0
±0.8
±0.6
±0.4
±0.2
0.0
0.2
0.4
0.6
0.8
1.0
±2 ±1 0 1 2 3 4 5 6 7 8 9 10
Current (mA)
Voltage (V)
C001
6
TPD4E05U06-Q1
,
TPD1E05U06-Q1
SLVSCO7C –AUGUST 2014–REVISED SEPTEMBER 2017
www.ti.com
Product Folder Links: TPD4E05U06-Q1 TPD1E05U06-Q1
Submit Documentation Feedback Copyright © 2014–2017, Texas Instruments Incorporated
6.7 Typical Characteristics
Figure 1. Current vs Voltage
Current vs Voltage DC Voltage Sweep I-V Curve Figure 2. Current and Power vs Time
Surge Curve (tp = 8/20 µs), Pin I/O to GND
Figure 3. Current vs Voltage
Positive TLP Plot I/O to GND Figure 4. Current vs Voltage
Negative TLP Plot I/O to GND
Figure 5. Leakage Current vs Temperature Figure 6. Voltage vs Time 8-kV IEC Waveform
l TEXAS INSTRUMENTS
Time (ns)
Voltage (V)
0 25 50 75 100 125 150 175 200
-130
-120
-110
-100
-90
-80
-70
-60
-50
-40
-30
-20
-10
0
10
D006
±6
±5
±4
±3
±2
±1
0
100k 1M 10M 100M 1000M 10000M
Insertion Loss (dB)
Frequency (Hz)
C009
1G
10G
7
TPD4E05U06-Q1
,
TPD1E05U06-Q1
www.ti.com
SLVSCO7C –AUGUST 2014–REVISED SEPTEMBER 2017
Product Folder Links: TPD4E05U06-Q1 TPD1E05U06-Q1
Submit Documentation FeedbackCopyright © 2014–2017, Texas Instruments Incorporated
Typical Characteristics (continued)
Figure 7. Voltage vs Time –8-kV IEC Waveform Figure 8. Insertion Loss vs Frequency
hm"
I/O
GND
D1+ D1- D2+ D2-
GND
8
TPD4E05U06-Q1
,
TPD1E05U06-Q1
SLVSCO7C –AUGUST 2014–REVISED SEPTEMBER 2017
www.ti.com
Product Folder Links: TPD4E05U06-Q1 TPD1E05U06-Q1
Submit Documentation Feedback Copyright © 2014–2017, Texas Instruments Incorporated
7 Detailed Description
7.1 Overview
The TPDxE05U06-Q1 is a family of unidirectional TVS ESD protection diode arrays with ultra-low capacitance
between 0.42 pF and 0.5 pF. They are rated to dissipate ESD strikes above the maximum level specified in the
IEC 61000-4-2 level 4 international standard (12-kV contact, 15-kV air gap). The ultra-low loading capacitance
makes them ideal for protecting any high-speed signal applications up to 6 Gbps.
7.2 Functional Block Diagram
Figure 9. TPD4E05U06-Q1 Block Diagram
Figure 10. TPD1E05U06-Q1 Block Diagram
7.3 Feature Description
7.3.1 AEC-Q101 Qualification
These devices are qualified to AEC-Q101 standards. They pass HBM H3B (±8 kV) and CDM C5 (±1 kV) ESD
ratings and are qualified to operate from –40°C to +125°C.
7.3.2 IEC 61000-4-2 Level 4 ESD Protection
The I/O pins can withstand ESD events up to ±12-kV contact and ±15-kV air. An ESD-surge clamp diverts the
current to ground.
7.3.3 IEC 61000-4-4 EFT Protection
The I/O pins can withstand an electrical fast transient burst of up to 80 A (5/50 ns waveform, 4 kV with 50-Ω
impedance). An ESD-surge clamp diverts the current to ground.
l TEXAS INSTRUMENTS
9
TPD4E05U06-Q1
,
TPD1E05U06-Q1
www.ti.com
SLVSCO7C –AUGUST 2014–REVISED SEPTEMBER 2017
Product Folder Links: TPD4E05U06-Q1 TPD1E05U06-Q1
Submit Documentation FeedbackCopyright © 2014–2017, Texas Instruments Incorporated
Feature Description (continued)
7.3.4 IEC 61000-4-5 Surge Protection
The I/O pins can withstand surge events up to 2.5 A and 40 W (8/20 µs waveform). An ESD-surge clamp diverts
this current to ground.
7.3.5 I/O Capacitance
The capacitance between each I/O pin to ground is 0.5 pF. These capacitances support data rates up to 5 Gbps.
7.3.6 DC Breakdown Voltage
The DC breakdown voltage of each I/O pin is a minimum of 6.4 V. This ensures that sensitive equipment is
protected from surges above the reverse standoff voltage of 5 V.
7.3.7 Ultra-Low Leakage Current
The I/O pins feature an ultra-low leakage current of 10 nA (Maximum) with a bias of 2.5 V.
7.3.8 Low ESD Clamping Voltage
The I/O pins feature an ESD clamp that is capable of clamping the voltage to 10 V (IPP = 1 A).
7.3.9 Easy Flow-Through Routing
The layout of this device makes it simple and easy to add protection to an existing layout. The packages offers
flow-through routing, requiring minimal modification to an existing layout.
7.4 Device Functional Modes
The TPDxE05U06-Q1 are passive integrated circuits that triggers when voltages are above VBR or below the
lower diodes Vf(–0.6 V). During ESD events, voltages as high as ±15 kV (air) can be directed to ground via the
internal diode network. When the voltages on the protected line fall below the trigger levels of TPDxE05U06-Q1
(usually within 10s of nano-seconds) the devices reverts to passive.
l TEXAS INSTRUMENTS
HOT PLUG 1
UTILITY 2
TMDS D2+ 3
TMDS_GND 4
TMDS D2- 5
TMDS D1+ 6
TMDS_GND 7
TMDS D1- 8
TMDS D0+ 9
TMDS_GND 10
TMDS D0- 11
TMDS CLK+ 12
TMDS_GND 13
TMDS CLK- 14
CEC 15
DDC/CEC GND 16
SCL 17
SDA 18
P 5V0 19
GND 20
HDMI Connector
1
2
3
4
56
7
8
9
10
1
2
3
4
56
7
8
9
10
CEC_CON
SCL_CON
SDA_CON
EN
5V_CON
HPD_CON
UTI_CON GND
HPD_SYS
5V_SYS
VCCA
SDA_SYS
SCL_SYS
CEC_SYS
UTI_CON
D2+
D2-
D1+
D1-
D0+
D0-
CLK+
CLK-
0.1 µF 0.1 µF
UTI_CON
D2+
D2-
D1+
D1-
D0+
D0-
CLK+
CLK-
5-V Source
HDMI Controller
TPD4E05U06DQA-Q1
TPD4E05U06DQA-Q1
TPD5S116YFF
Copyright © 2016, Texas Instruments Incorporated
10
TPD4E05U06-Q1
,
TPD1E05U06-Q1
SLVSCO7C –AUGUST 2014–REVISED SEPTEMBER 2017
www.ti.com
Product Folder Links: TPD4E05U06-Q1 TPD1E05U06-Q1
Submit Documentation Feedback Copyright © 2014–2017, Texas Instruments Incorporated
8 Application and Implementation
8.1 Application Information
The TPD4E05U06-Q1 is a diode type TVS which is typically used to provide a path to ground for dissipating ESD
events on hi-speed signal lines between a human interface connector and a system. As the current from ESD
passes through the TVS, only a small voltage drop is present across the diode. This is the voltage presented to
the protected IC. The low RDYN of the triggered TVS holds this voltage, VCLAMP, to a safe level for the protected
IC.
8.2 Typical Application
Figure 11. HDMI 1.4 Application
8.2.1 Design Requirements
For this design example, two TPD4E05U06-Q1 devices, and a TPD5S116 are being used in an HDMI 1.4
application. This provides a complete port protection scheme.
Given the HDMI 1.4 application, the parameters in Table 1 are known.
Table 1. Design Parameters
DESIGN PARAMETER VALUE
Signal range on pins 1, 2, 4, or 5 0 V to 5 V
Operating frequency 1.7 GHz
8.2.2 Detailed Design Procedure
To begin the design process, some parameters must be decided upon; the designer needs to know the following:
• Signal range on all the protected lines
• Operating frequency
l TEXAS INSTRUMENTS 51: Al- DHM WW .ms .zuup: Am u: was map: mp:
11
TPD4E05U06-Q1
,
TPD1E05U06-Q1
www.ti.com
SLVSCO7C –AUGUST 2014–REVISED SEPTEMBER 2017
Product Folder Links: TPD4E05U06-Q1 TPD1E05U06-Q1
Submit Documentation FeedbackCopyright © 2014–2017, Texas Instruments Incorporated
8.2.2.1 Signal Range on Pin 1, 2, 4, or 5
The TPD4E05U06-Q1 has 4 identical protection channels for signal lines. The symmetry of the device provides
flexibility when selecting which of the 4 I/O channels protect which signal lines. Any I/O will support a signal
range of 0 to 5.5 V.
8.2.2.2 Operating Frequency
The TPD4E05U06-Q1 has a capacitance of 0.5 pF (Typical), supporting HDMI 1.4 data rates.
8.2.3 Application Curve
Figure 12. 3.4 Gbps HDMI Eye Diagram
‘5‘ TEXAS INSTRUMENTS
VIA to GND Plane
D2+
D2-
D1+
D1-
D0+
D0-
Clk+
Clk-
D1-
D1+
D0+
D0-
NC
NC
NC
NC
GND GND
NC
NC
NC
NC
GND
NC
NC
NC
NC
D1-
D1+
D0+
D0-
GND
12
TPD4E05U06-Q1
,
TPD1E05U06-Q1
SLVSCO7C –AUGUST 2014–REVISED SEPTEMBER 2017
www.ti.com
Product Folder Links: TPD4E05U06-Q1 TPD1E05U06-Q1
Submit Documentation Feedback Copyright © 2014–2017, Texas Instruments Incorporated
9 Layout
9.1 Layout Guidelines
• The optimum placement is as close to the connector as possible.
– EMI during an ESD event can couple from the trace being struck to other nearby unprotected traces,
resulting in early system failures.
– The PCB designer needs to minimize the possibility of EMI coupling by keeping any unprotected traces
away from the protected traces which are between the TVS and the connector.
• Route the protected traces as straight as possible.
• Eliminate any sharp corners on the protected traces between the TVS and the connector by using rounded
corners with the largest radii possible.
– Electric fields tend to build up on corners, increasing EMI coupling.
9.2 Layout Example
This application is typical of an HDMI 1.4 layout.
Figure 13. TPD4E05U06-Q1 Layout
l TEXAS INSTRUMENTS
13
TPD4E05U06-Q1
,
TPD1E05U06-Q1
www.ti.com
SLVSCO7C –AUGUST 2014–REVISED SEPTEMBER 2017
Product Folder Links: TPD4E05U06-Q1 TPD1E05U06-Q1
Submit Documentation FeedbackCopyright © 2014–2017, Texas Instruments Incorporated
10 Device and Documentation Support
10.1 Documentation Support
10.1.1 Related Documentation
For related documentation see the following:
•TPD1E05U06-Q1 Evaluation Module User's Guide
•Reading and Understanding an ESD Protection Datasheet
•ESD Layout Guide
•TPD4E05U06DQA EVM User's Guide
10.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
10.3 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 2. Related Links
PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL
DOCUMENTS TOOLS &
SOFTWARE SUPPORT &
COMMUNITY
TPD4E05U06-Q1 Click here Click here Click here Click here Click here
TPD1E05U06-Q1 Click here Click here Click here Click here Click here
10.4 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
10.5 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
10.6 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
10.7 Glossary
SLYZ022 —TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
l TEXAS INSTRUMENTS
14
TPD4E05U06-Q1
,
TPD1E05U06-Q1
SLVSCO7C –AUGUST 2014–REVISED SEPTEMBER 2017
www.ti.com
Product Folder Links: TPD4E05U06-Q1 TPD1E05U06-Q1
Submit Documentation Feedback Copyright © 2014–2017, Texas Instruments Incorporated
11 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
I TEXAS INSTRUMENTS Sample: Sample:
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
TPD1E05U06QDPYRQ1 ACTIVE X1SON DPY 2 10000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 4O
TPD4E05U06QDQARQ1 ACTIVE USON DQA 10 3000 RoHS & Green NIPDAU | NIPDAUAG Level-2-260C-1 YEAR -40 to 125 (BRH, CQ1)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
I TEXAS INSTRUMENTS
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 2
OTHER QUALIFIED VERSIONS OF TPD1E05U06-Q1, TPD4E05U06-Q1 :
•Catalog: TPD1E05U06, TPD4E05U06
NOTE: Qualified Version Definitions:
•Catalog - TI's standard catalog product
I TEXAS INSTRUMENTS REEL DIMENSIONS TAPE DIMENSIONS 7 “KO '«Pi» Reel Diameler AD Dimension designed to accommodate the componeni width ED Dimension deSigned to accommodaie me componeni iengm KO Dlmenslun designed to accommodate the eomponeni thickness 7 w OveraH Widlh loe earner cape i p1 Piich between successive cawiy ceniers f T Reel Width (W1) QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE O O O D O O D D SprockeiHules ,,,,,,,,,,, ‘ User Direcllon 0' Feed Pockel Quadrams
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TPD1E05U06QDPYRQ1 X1SON DPY 2 10000 180.0 9.5 0.73 1.13 0.5 2.0 8.0 Q1
TPD4E05U06QDQARQ1 USON DQA 10 3000 180.0 9.5 1.18 2.68 0.72 4.0 8.0 Q1
TPD4E05U06QDQARQ1 USON DQA 10 3000 180.0 8.4 1.3 2.83 0.65 4.0 8.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 8-Apr-2020
Pack Materials-Page 1
I TEXAS INSTRUMENTS TAPE AND REEL BOX DIMENSIONS
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TPD1E05U06QDPYRQ1 X1SON DPY 2 10000 189.0 185.0 36.0
TPD4E05U06QDQARQ1 USON DQA 10 3000 189.0 185.0 36.0
TPD4E05U06QDQARQ1 USON DQA 10 3000 213.0 191.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 8-Apr-2020
Pack Materials-Page 2
DPY (RiPX1SON7N2) MECHANICAL DATA PLAST‘C SMALL OUTLINE N07LEAD NOTES: ‘ m 090 ’b I L70 050 f w 0,30 i QODBC ' ' ‘ ‘ j M 0.00 m . 0,60 po 4>uu mu! 4211012/0 00/14 A. NI \inear dimens'mns are in mileelerS‘ a, This drawing 'xs subject In change mm name. 0, SON (SmuH Oumne No—Leud) package configuration. Dimensicning and Lo‘eruncing per ASME “45—19940 {I} TEXAS INSTRUMENTS wwwxi .com
III 7,1:I777EL 7i D D \ IIIII IIIII
www.ti.com
PACKAGE OUTLINE
C
0.45
0.30
0.05
0.00
0.65
0.1 C A B
2X 0.55
0.45
2X 0.3
0.2
A1.1
0.9 B
0.7
0.5
4224561/B 03/2021
X1SON - 0.45 mm max heightDPY0002A
PLASTIC SMALL OUTLINE - NO LEAD
PIN 1 INDEX AREA
SEATING PLANE
0.08 C
12
0.05 C A B
SYMM
SYMM
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M
2. This drawing is subject to change without notice.
SCALE 11.000
www.ti.com
EXAMPLE BOARD LAYOUT
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
(R0.05) TYP (0.7)
2X (0.5)
2X (0.3)
4224561/B 03/2021
X1SON - 0.45 mm max heightDPY0002A
PLASTIC SMALL OUTLINE - NO LEAD
SYMM
12
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:60X
NOTES: (continued)
3. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271).
4. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view.
It is recommended that vias under paste be filled, plugged or tented.
SOLDER MASK DETAILS
METAL EDGE
SOLDER MASK
OPENING
EXPOSED
METAL
NON SOLDER MASK
DEFINED
METAL UNDER
SOLDER MASK
SOLDER MASK
OPENING
EXPOSED
METAL
SOLDER MASK
DEFINED
(PREFERRED)
www.ti.com
EXAMPLE STENCIL DESIGN
(R0.05) TYP
(0.7)
2X (0.5)
2X (0.3) (0)
4224561/B 03/2021
X1SON - 0.45 mm max heightDPY0002A
PLASTIC SMALL OUTLINE - NO LEAD
NOTES: (continued)
5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
SCALE:60X
SYMM
12
SYMM
PCB PAD METAL
UNDER SOLDER PASTE
DQA0010A % 0.45 0.35 1@ A@ SEQ 5®
www.ti.com
PACKAGE OUTLINE
C
8X 0.25
0.15
10X 0.43
0.30
2X
2
4X 0.5
0.55 MAX
0.05
0.00
2X 0.45
0.35
B1.1
0.9
A
2.6
2.4
(0.13) TYP
(R )0.125
USON - 0.55 mm max heightDQA0010A
PLASTIC SMALL OUTLINE - NO LEAD
4220328/A 12/2015
PIN 1 INDEX AREA
SEATING PLANE
0.08 C
1
56
10
(OPTIONAL)
PIN 1 ID
0.1 C A B
0.05 C
0.1 C A B
0.05
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
SCALE 6.000
DQA0010A
www.ti.com
EXAMPLE BOARD LAYOUT
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
4X (0.5)
(0.835)
8X (0.2)
10X (0.565)
(R ) TYP0.05
2X (0.4)
USON - 0.55 mm max heightDQA0010A
PLASTIC SMALL OUTLINE - NO LEAD
4220328/A 12/2015
SYMM
1
56
10
SYMM
LAND PATTERN EXAMPLE
SCALE:30X
NOTES: (continued)
3. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271).
SOLDER MASK
OPENING
SOLDER MASK
METAL UNDER
SOLDER MASK
DEFINED
METAL
SOLDER MASK
OPENING
SOLDER MASK DETAILS
NON SOLDER MASK
DEFINED
(PREFERRED)
DQA0010A
www.ti.com
EXAMPLE STENCIL DESIGN
8X (0.2)
10X (0.565)
4X (0.5)
2X (0.36)
(0.835)
(R ) TYP0.05
USON - 0.55 mm max heightDQA0010A
PLASTIC SMALL OUTLINE - NO LEAD
4220328/A 12/2015
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
EXPOSED PADS 3 & 8:
90% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
SCALE:40X
SYMM
1
56
10
SYMM
METAL
TYP
38
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you
permission to use these resources only for development of an application that uses the TI products described in the resource. Other
reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party
intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages,
costs, losses, and liabilities arising out of your use of these resources.
TI’s products are provided subject to TI’s Terms of Sale (https:www.ti.com/legal/termsofsale.html) or other applicable terms available either
on ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s
applicable warranties or warranty disclaimers for TI products.IMPORTANT NOTICE
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2021, Texas Instruments Incorporated