Fiche technique pour LQH2MPNyyyyGRL Series Spec de Murata Electronics

Spec No.: JELF243A D142F701 Refe re n Ce 0 n ly n and e n Omer
Spec No.: JELF243A_0142F-01 P1/9
MURATA MFG CO., LTD
CHIP COILS (CHIP INDUCTORS) LQH2MPN□□□□GR□ REFERENCE SPECIFICATION
1. Scope
This reference specification applies to chip coils (chip inductors) LQH2MPN_GR series for general electronic equipment.
2. Part Numbering
(Ex.)
LQ H 2M P N 100 M G R L
Product ID Structure Dimension
(L × W)
Application and
characteristic
Category Inductance To l e r a nc e Dimension
(T)
Other Packaging
L: ø180 taping
3. Part Number and Rating
Operating temperature range (ambient temperature not including self-temperature rise) -40°C to +105°C
(product temperature including self-temperature rise) -40°C to +125°C
Storage temperature range -40°C to +105°C
Customer
Part number
Murata
Part number
Inductance
DC
resistance
(Ω)
Self-resonant
frequency
(MHz min.)
Rated current
(mA)*3
Nominal
value
(μH)
Toler ance
(%)
Based on
inductance
change*1
Based on temperature
rise*2
Ambient
temperature
85°C
Ambient
temperature
105°C
LQH2MPNR33NGRL 0.33 N: ±30 0.15±20% 130 2200 1130 670
LQH2MPNR47NGRL 0.47 N: ±30 0.18±20% 120 1950 1060 630
LQH2MPN1R0NGRL 1.0 N: ±30 0.25±20% 100 1550 900 540
LQH2MPN1R5NGRL 1.5 N: ±30 0.32±20% 60 1330 790 470
LQH2MPN2R2MGRL 2.2 M: ±20 0.39±20% 50 1180 680 400
LQH2MPN3R3MGRL 3.3 M: ±20 0.47±20% 45 1020 640 380
LQH2MPN4R7MGRL 4.7 M: ±20 0.60±20% 40 870 580 340
LQH2MPN6R8MGRL 6.8 M: ±20 0.72±20% 35 730 530 310
LQH2MPN100MGRL 10 M: ±20 0.88±20% 30 610 480 280
LQH2MPN150MGRL 15 M: ±20 1.7±20% 25 490 340 200
LQH2MPN220MGRL 22 M: ±20 2.1±20% 20 410 290 170
LQH2MPN330MGRL 33 M: ±20 4.3±20% 15 310 200 120
LQH2MPN470MGRL 47 M: ±20 5.3±20% 10 270 180 110
LQH2MPN680MGRL 68 M: ±20 6.7±20% 7 230 160 100
LQH2MPN820MGRL 82 M: ±20 7.3±20% 5 210 150 90
*1 When rated current is applied to the products, inductance will be within ±30% of initial inductance value range.
*2 When rated current is applied to the products, temperature rise caused by self-generated heat shall be limited to 40°C max
(ambient temperature 85°C max).
When rated current is applied to the products, temperature rise caused by self-generated heat shall be limited to 20°C max
(ambient temperature 85°C to 105°C).
*3 Keep the temperature (ambient temperature plus self-generation of heat) under 125°C.
4. Testing Conditions
Unless otherwise specified Temperature: ordinary temperature (15°C to 35°C)
Humidity: ordinary humidity [25% to 85% (RH)]
In case of doubt Temperature: 20°C±2°C
Humidity: 60% to 70% (RH)
Atmospheric pressure: 86 kPa to 106 kPa
Spec No.: JELF243A 0142F701 Refe re n ce 0 n ly 0.9020 05 1 620.1 E,, E i L_J -\ /- 1.0102 0.65202 0.65202 (In mm) cm, cm! _L
Spec No.: JELF243A_0142F-01 P2/9
MURATA MFG CO., LTD
5. Appearance and Dimensions
Unit mass (typical value): 0.010 g
6. Marking
No marking.
7. Electrical Performance
No. Item Specification Test method
7.1 Inductance Meet chapter 3 ratings. Measuring equipment: Keysight 4192A or the
equivalent
Measuring frequency: 1 MHz
7.2 DC resistance Meet chapter 3 ratings. Measuring equipment: digital multimeter
7.3 Self-resonant
frequency
Meet chapter 3 ratings. Measuring equipment: Keysight E4991A or the
equivalent
8. Mechanical Performance
No. Item Specification Test method
8.1 Shear test No significant mechanical damage or no
sign of electrode peeling off shall be
observed.
Test substrate: glass-epoxy substrate
Force application direction:
Applying force: 5 N
Holding time: 5 s±1 s
Spec No; JELF243A 0142F701 eference Only Pressuve jig stoJLF \ 'Q; 59?, fl f f , 6 EC Ion ‘V/ \g) 45 \“Pmdud (m mm)
Spec No.: JELF243A_0142F-01 P3/9
MURATA MFG CO., LTD
No. Item Specification Test method
8.2 Bending test No significant mechanical damage or no
sign of electrode peeling off shall be
observed.
Test substrate: glass-epoxy substrate (100 mm × 40
mm × 0.8 mm)
Pressurizing speed: 0.5 mm/s
Deflection: 2 mm
Holding time: 5 s
8.3 Vibration Appearance shall have no significant
mechanical damage.
Oscillation frequency: 10 Hz to 2000 Hz to 10 Hz, for
approx. 20 min
Total amplitude: total amplitude of 1.5 mm or
acceleration amplitude of 98 m/s
2
, whichever is smaller
Test time: 3 directions perpendicular to each other, 2 h
for each direction (6 h in total)
8.4 Solderability 90% or more of the outer electrode shall
be covered with new solder seamlessly.
Flux: immersed in ethanol solution with a rosin content
of 25(wt)% for 5 s to 10 s
Solder: Sn-3.0Ag-0.5Cu solder
Pre-heating: 150°C±10°C/60 s to 90 s
Solder temperature: 240°C±5°C
Immersion time: 3 s±1 s
8.5 Resistance to
soldering heat
Appearance: No significant mechanical
damage shall be observed.
Inductance change rate: within ±20%
Flux: immersed in ethanol solution with a rosin content
of 25(wt)% for 5 s to 10 s
Solder: Sn-3.0Ag-0.5Cu solder
Pre-heating: 150°C±10°C/60 s to 90 s
Solder temperature: 270°C±5°C
Immersion time: 10 s±1 s
Post-treatment: left at a room condition for 24 h±2 h
9. Environmental Performance
The product is soldered on a substrate for test.
No. Item Specification Test method
9.1 Heat resistance Appearance: No significant mechanical
damage shall be observed.
Inductance change rate: within ±10%
DC resistance change rate: within ±10%
Temperature: 105°C±2°C
Test time: 1000 h (+48 h, -0 h)
Post-treatment: left at a room condition for 24 h±2 h
9.2 Cold resistance Appearance: No significant mechanical
damage shall be observed.
Inductance change rate: within ±10%
DC resistance change rate: within ±10%
Temperature: -40°C±2°C
Test time: 1000 h (+48 h, -0 h)
Post-treatment: left at a room condition for 24 h±2 h
9.3 Humidity Appearance: No significant mechanical
damage shall be observed.
Inductance change rate: within ±10%
DC resistance change rate: within ±10%
Temperature: 85°C±2°C
Humidity: 80% (RH) to 85% (RH)
Test time: 1000 h (+48 h, -0 h)
Post-treatment: left at a room condition for 24 h±2 h
9.4 Temperature cycle Appearance: No significant mechanical
damage shall be observed.
Inductance change rate: within ±10%
DC resistance change rate: within ±10%
Single cycle conditions:
Step 1: -40°C±2°C/30 min±3 min
Step 2: ordinary temperature/10 min to 15 min
Step 3: +105°C±2°C/30 min±3 min
Step 4: ordinary temperature/10 min to 15 min
Number of testing: 100 cycles
Post-treatment: left at a room condition for 24 h±2 h
Spec No; JELF243A 0142F701 efe re n Ce 0 n ly 20:005 40:13.! «1.5 3“ 1,7530! r 3 M 3 d . m g a m =5 ‘ A 4mm ‘ Dwedlun 0! Feed lTop view LeadrIn/our wire \7‘ ‘U I /Cavny Direction of feed
Spec No.: JELF243A_0142F-01 P4/9
MURATA MFG CO., LTD
10. Specification of Packaging
10.1 Appearance and dimensions of tape (8 mm width/plastic tape)
A 1.9±0.1
B 2.3±0.1
t 1.05±0.1
t' (0.25)
(in mm)
* The dimensions of the cavity are measured at its bottom.
10.2 Taping specifications
Packing quantity
(Standard quantity)
3000 pcs/reel
Packing method The products are placed in embossed cavities of a plastic tape and sealed by a cover tape.
Feed hole position The feed holes on the plastic tape are on the right side when the cover tape is pulled toward the user.
Joint The plastic tape and the cover tape are seamless.
Number of missing
products
Number of missing products within 0.025% of the number per reel or 1 pc., whichever is greater, and
are not continuous. The specified quantity per reel is kept.
10.3 Break down force of tape
Break down force of plastic tape 10 N min.
Break down force of cover tape 10 N min.
10.4 Peeling off force of cover tape
Speed of peeling off 300 mm/min
Peeling off force 0.2 N to 0.7 N (The lower limit is for typical value.)
165 to 180 degree FCover tape
Plastic tape
Spec No; JELF243A 0142F701 Reference Only Trade! 10:05 160 mm 7 Leader 1‘ _ Lahe' .. I9omm. _ 2|0mm. _ Pioduzljmragepan EmmyTape CovelTape \ mIEOIOZ ‘ _ , i ‘ ‘ “Rom vaemcn ofFeed 10+“ 3 13mm : ' also? (mmmD 1) (mm) . ‘ b ( I) m ou er ox ree G W D H 186 186 93 5 ' Above ouler box swze IS lypwcal n depends on a
Spec No.: JELF243A_0142F-01 P5/9
MURATA MFG CO., LTD
10.5 Dimensions of leader section, trailer section and reel
A vacant section is provided in the leader (start) section and trailer (end) section of the tape for the product. The leader
section is further provided with an area consisting only of the cover tape. (See the diagram below.)
10.6 Marking for reel
Customer part number, Murata part number, inspection number (*1), RoHS marking (*2), quantity, etc.
*1 Expression of inspection No.:
□□ ○○○○ 
(1) (2) (3)
(1) Factory code
(2) Date
First digit: year/last digit of year
Second digit: month/Jan. to Sep.→1 to 9, Oct. to Dec.→O, N, D
Third, Fourth digit: day
(3) Serial No.
*2 Expression of RoHS marking:
ROHS- Y ()
(1) (2)
(1) RoHS regulation conformity
(2) Murata classification number
10.7 Marking on outer box (corrugated box)
Customer name, purchasing order number, customer part number, Murata part number, RoHS marking (*2), quantity, etc.
10.8 Specification of outer box
Dimensions of outer box
(mm) Standard reel quantity
in outer box (reel)
W D H
186 186 93 5
* Above outer box size is typical. It depends on a
quantity of an order.
11. Caution
Restricted
applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party's life, body or
property.
(1) Aircraft equipment (6) Transportation equipment (vehicles, trains, ships, etc.)
(2) Aerospace equipment (7) Traffic signal equipment
(3) Undersea equipment (8) Disaster/crime prevention equipment
(4) Power plant control equipment (9) Data-processing equipment
(5) Medical equipment (10) Applications of similar complexity and/or reliability requirements
to the applications listed in the above
12. Precautions for Use
This product is for use only with reflow soldering. It is designed to be mounted by soldering. If you want to use other mounting
method, for example, using a conductive adhesive, please consult us beforehand.
W
D
Label
H
Spec No; JELF243A 0142F701 Reference Only Land / 1.0 Chip Coir r """" / \ '/ Solder Resis1 /é' '/ —— / (\nmm)
Spec No.: JELF243A_0142F-01 P6/9
MURATA MFG CO., LTD
12.1 Land dimensions
The following diagram shows the recommended land dimensions for reflow soldering.
The land dimensions are designed in consideration of electrical characteristics and mountability. Use of other land
dimensions may preclude achievement of performance. In some cases, it may result in poor solderability, including positional
shift. If you use other land pattern, consider it adequately.
12.2 Flux and solder used
Flux • Use a rosin-based flux.
• Do not use a highly acidic flux with a halide content exceeding 0.2(wt)% (chlorine conversion value).
• Do not use a water-soluble flux.
Solder • Use Sn-3.0Ag-0.5Cu solder.
• Standard thickness of solder paste: 100 μm to 150 μm
If you want to use a flux other than the above, please consult our technical department.
12.3 Soldering conditions (reflow)
• Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 100°C
max.
Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.
• Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of product
quality.
Standard profile Limit profile
Pre-heating 150°C to 180°C/90 s±30 s 150°C to 180°C/90 s±30 s
Heating Above 220°C/30 s to 60 s Above 230°C/60 s max.
Peak temperature 245°C±3°C 260°C/10 s
Number of reflow cycles 2 times 2 times
Limit Profile
Standard Profile
90s±30s
230℃
260℃
245℃±3℃
220℃
30s～60s
60s max.
180
150
Temp.
(s)
(℃)
Time.
Spec No; JELF243A 01421201 Reference only :- 00 0 (20000; ’ I
Spec No.: JELF243A_0142F-01 P7/9
MURATA MFG CO., LTD
12.4 Reworking with soldering iron
The following requirements must be met to rework a soldered product using a soldering iron.
Item Requirement
Pre-heating 150°C/approx. 1 min
Tip temperature of soldering iron 350°C max.
Power consumption of soldering iron 80 W max.
Tip diameter of soldering iron ø3 mm max.
Soldering time 3 s (+1 s, -0 s)
Number of reworking operations 1 time max.
* Avoid a direct contact of the tip of the soldering iron with the product. Such a
direction contact may cause cracks in the ceramic body due to thermal shock.
12.5 Solder volume
Solder shall be used not to increase the volume too much.
An increased solder volume increases mechanical stress on the product. Exceeding solder volume may cause the failure of
mechanical or electrical performance.
12.6 Product's location
The following shall be considered when designing and laying out PCBs.
(1) PCB shall be designed so that products are not subject to mechanical stress due to warping the board.
[Products direction]
Products shall be located in the sideways direction to the mechanical stress.
(2) Components location on PCB separation
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible to reduce
stress.
Contents of measures
Stress level
(1) Turn the mounting direction of the component parallel to the
board separation surface.
A > D
*1
(2) Add slits in the board separation part.
A > B
(3) Keep the mounting position of the component away from the
board separation surface.
A > C
*1 A > D is valid when stress is added vertically to the perforation as with hand separation.
If a cutting disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
(Poor example) (Good example)
Electrode
Electrode
Slit
Perforation
A
D
B C
Electrode
Electrode
Spec No; JELF243A 0142F701 Reference Only
Spec No.: JELF243A_0142F-01 P8/9
MURATA MFG CO., LTD
(3) Mounting components near screw holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the
tightening of the screw.
Mount the component in a position as far away from the screw holes as possible.
12.7 Handling of substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate
when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending Twisting
12.8 Cleaning
The product shall be cleaned under the following conditions.
(1) The cleaning temperature shall be 60°C max. If isopropyl alcohol (IPA) is used, the cleaning temperature shall be 40°C
max.
(2) Perform ultrasonic cleaning under the following conditions. Exercise caution to prevent resonance phenomenon in
mounted products and the PCB.
Item Requirement
Power 20 W/L max.
Time 5 min max.
Frequency 28 kHz to 40 kHz
(3) Cleaner
Alcohol-based cleaner: IPA
Aqueous agent: PINE ALPHA ST-100S
(4) There shall be no residual flux or residual cleaner. When using aqueous agent, rinse the product with deionized water
adequately and completely dry it so that no cleaner is left.
* For other cleaning, consult our technical department.
12.9 Storage and transportation
Storage period Use the product within 12 months after delivery.
If you do not use the product for more than 12 months, check solderability before using it.
Storage conditions • The products shall be stored in a room not subject to rapid changes in temperature and humidity.
The recommended temperature range is -10°C to +40°C. The recommended relative humidity
range is 15% to 85%.
Keeping the product in corrosive gases, such as sulfur, chlorine gas or acid, oxidizes the
electrode, resulting in poor solderability or corrosion of the coil wire of the product.
• Do not keep products in bulk packaging. Doing so may cause collision between the products or
between the products and other products, resulting in core chipping or wire breakage.
• Do not place the products directly on the floor; they should be placed on a palette so that they are
not affected by humidity or dust.
• Avoid keeping the products in a place exposed to direct sunlight, heat or vibration.
Transportation Excessive vibration and impact reduces the reliability of the products. Exercise caution when
handling the products.
Screw Hole Recommended
Spec No.: JELF243A 0142F701 Reference Only
Spec No.: JELF243A_0142F-01 P9/9
MURATA MFG CO., LTD
12.10 Resin coating
The inductance value may change due to high cure-stress of resin to be used for coating/molding products.
A wire breakage issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating
condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under some
operating condition may cause corrosion of wire of coil, leading to wire breakage.
So, please pay your careful attention when you select resin in case of coating/molding the products with the resin.
Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your
board.
12.11 Handling of product
• Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be touched to the
winding portion to prevent the breaking of wire.
• Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core.
12.12 Heat-resistant temperature of substrate and peripheral components
A rated current applied to the product (based on a rise in temperature) increases the product temperature up to 40°C. Pay
attention to the heat-resistant temperature of the substrate and peripheral components.
13. Note
(1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to
your product.
(2) You are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering.