molexa
250~255’C
150~200“C
Freiheat
90~1ZOSeC
Peak lemperature \
x
230T NHN
20~40586
REVISION. ECR/ECN \NFORMATION. TITLE. SHEET N0.
EC No.
DATE.
DOCUMENT NUMBER. CREATED / REVISED EV. CHECKED EV. APPROVED BY.
PS-560123-002
DURACLIK™ ISL W/B CONN.
PRODUCT SPECIFICATION
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.2).DOC
7.0 INFRARED REFLOW CONDITION
8.0 INSTRUCTION UPON USAGE
1) Positive lock should be released when unmating connectors.
2) Connectors should be mated straightly. Angled mating operation has possibility of deforming
pins
9.0 NOTES
1) Mounting performance doesn't contain the influence of the warp of PCB.
2) Repairing with soldering iron should be done in specified condition.
3) It is necessary to consult separately when mount product on a special PCB or FPC.
4) There is no influence in the product performance though the twist might be generated in the
terminal plating part according to the reflow condition.
5) There is no influence in the product performance though discoloration might be generated in
the resin according to the reflow condition.
6) There is no influence in the product performance though black spots are seen on the surface
of the resin of this product.
7) There is no influence in the product performance though scratches are seen on the surface
of the resin of this product.
8) Coplanarity is assured only before mounting.
9) Changing recommended pattern causes problems.
10) Thickness 0.15mm, aperture ratio 100% metal mask is used in thin specification.