Fiche technique pour AFE4420 de Texas Instruments

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V'.‘ 1!. B X E I TEXAS INSTRUMENTS

SPI/

I2C Interface

INP1

INM1 ILED

TX_SUP

LED1

ADC

CLK

SPI

I2C

RESETZ

GPIO1

FIFO

Noise

reduction

filter (x4)

INP2

INM2

LED2 LED3

PD1

PD2

TX1 TX2 TX3

128 kHz

Oscillator

TIA

Offset

DAC

THR_DET_RDY

Timing Engine

RX_SUP

4 MHz

Oscillator

TX_SUP

ADC_RDY

1.8 V LDOs ALDO_1V8, DLDO_1V8

CONTROL1

INP3

INM3

PD3

Threshold

Detection

LED4

TX4

I2C_SPI_SEL

INP4

INM4

PD4

INPUT MUX

Automatic

Ambient

Cancellation

GPIO2

IO_SUP

Product

Folder

Order

Now

Technical

Documents

Tools &

Software

Support &

Community

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

AFE4420

SBAS910A –JUNE 2018–REVISED JULY 2019

AFE4420 Ultra-Small, Integrated AFE With FIFO for Multi-sensor Wearable,

Optical Heart-rate Monitoring and Bio-sensing

1 Features

1• Supports signal acquisition of up to 16 phases

• Flexible allocation of LEDs and PDs in each

phase

• Accurate, continuous heart-rate monitoring:

– Up to 100-dB dynamic range

– Low current for continuous operation on a

wearable device with a typical value

– 15 μA for an LED, 20 μA for the receiver

• Transmitter:

– Supports common anode LED configuration

– 8-Bit programmable LED current with range

adjustable from 50 mA to 200 mA

– Mode to fire two LEDs in parallel

– Programmable LED on-time

– Simultaneous support of 4 LEDs for optimized

SpO2, HRM, or multi-wavelength HRM

– Programmable control signals to extend

operation to 8 LEDs using external SPDT

switches

• Receiver:

– Supports 4 time-multiplexed photodiode inputs

– Individual DC offset subtraction DAC at TIA

input for each LED, ambient with 7-bit control

and range up to ±254 µA

– Transimpedance gain: 10 kΩto 2 MΩ

– Digital ambient subtraction at ADC output to

suppress ambient tones

– Noise filtering with programmable bandwidth

• Supports external clock and internal oscillator

modes

• Automatic ambient cancellation mode (AACM) to

increase receiver dynamic range

• Two programmable GPIO pins with flexible

interrupt generation

• FIFO with 128-sample depth

• I2C, SPI interfaces: selectable by pin

• Operating temperature range: –40°C to +85°C

• 2.6-mm × 2.1-mm DSBGA, 0.4-mm pitch

• Supplies:

– Rx:

– 1.7 V to 1.9 V (LDO bypass)

– 1.9 V to 3.6 V (LDO enabled)

– Tx: 3 V to 5.5 V

– IO: 1.7 V to RX_SUP

2 Applications

• Optical heart-rate monitoring (HRM) for

wearables, hearables

• Heart-rate variability (HRV)

• Pulse oximetry (SpO2) measurements

• Maximum oxygen consumption (VO2Max)

• Calorie expenditure

3 Description

The AFE4420 is an analog front-end for optical bio-

sensing applications, such as heart-rate monitoring

(HRM) and saturation of peripheral capillary oxygen

(SpO2). The device supports up to four switching

light-emitting diodes (LEDs) and up to four

photodiodes. Up to 16 signal phases can be defined

and the signal can be acquired from each phase in a

synchronized manner and stored in a 128-sample

First in, First out (FIFO) block. The FIFO can be read

out using either an I2C or a SPI interface. The AFE

also has a fully integrated LED driver with an 8-bit

current control. The device has a high dynamic range

transmit-and-receive circuitry that helps with the

sensing of very small signal levels.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)

AFE4420 DSBGA (30) 2.60 mm × 2.10 mm

(1) For all available packages, see the orderable addendum at

the end of the data sheet.

Simplified Schematic

l TEXAS INSTRUMENTS

AFE4420

SBAS910A –JUNE 2018–REVISED JULY 2019

www.ti.com

Product Folder Links: AFE4420

Table of Contents

1 Features.................................................................. 1

2 Applications ........................................................... 1

3 Description ............................................................. 1

4 Revision History..................................................... 2

5 Device and Documentation Support.................... 3

5.1 Receiving Notification of Documentation Updates.... 3

5.2 Community Resources.............................................. 3

5.3 Trademarks............................................................... 3

5.4 Electrostatic Discharge Caution................................ 3

5.5 Glossary.................................................................... 3

6 Mechanical, Packaging, and Orderable

Information ............................................................. 3

4 Revision History

Changes from Original (June 2018) to Revision A Page

• Changed the Mechanical Packaging images ......................................................................................................................... 4

l TEXAS INSTRUMENTS

AFE4420

www.ti.com

SBAS910A –JUNE 2018–REVISED JULY 2019

Product Folder Links: AFE4420

5 Device and Documentation Support

5.1 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper

right corner, click on Alert me to register and receive a weekly digest of any product information that has

changed. For change details, review the revision history included in any revised document.

5.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective

contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of

Use.

TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration

among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help

solve problems with fellow engineers.

Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and

contact information for technical support.

5.3 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

5.4 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

5.5 Glossary

SLYZ022 —TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

6 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

l TEXAS INSTRUMENTS ¢/‘11w¢ —L.1_:I wwwjmom

www.ti.com

PACKAGE OUTLINE

0.5 MAX

0.19

0.13

TYP

1.6

TYP

0.4

TYP

0.4 TYP

30X 0.25

0.21

0.85

B2.095

2.035 A

2.595

2.535

4222550/D 07/2019

DSBGA - 0.5 mm max height

YZ0030-C01

DIE SIZE BALL GRID ARRAY

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

PKG

BALL A1

CORNER

SEATING PLANE

BALL TYP 0.05 C

123

0.015 C A B

SYMM

SCALE 5.000

AFE4420

SBAS910A –JUNE 2018–REVISED JULY 2019

www.ti.com

Product Folder Links: AFE4420

‘5‘ TEXAS INSTRUMENTS 541 000000 000000 of0000QL $00000 kﬁae0000 x a TL www,“ com

www.ti.com

EXAMPLE BOARD LAYOUT

30X ( 0.23)

(0.4) TYP

(0.85)

( 0.23)

METAL 0.05 MAX

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

( 0.23)

SOLDER MASK

OPENING

0.05 MIN

4222550/D 07/2019

DSBGA - 0.5 mm max height

YZ0030-C01

DIE SIZE BALL GRID ARRAY

NOTES: (continued)

3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.

See Texas Instruments Literature No. SNVA009 (www.ti.com/lit/snva009).

SOLDER MASK DETAILS

NOT TO SCALE

PKG

PKG SYMM

LAND PATTERN EXAMPLE

SCALE:30X

12345

NON-SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK

DEFINED

AFE4420

www.ti.com

SBAS910A –JUNE 2018–REVISED JULY 2019

Product Folder Links: AFE4420

l TEXAS INSTRUMENTS www,“ com

www.ti.com

EXAMPLE STENCIL DESIGN

(0.4) TYP

30X ( 0.25)

(R0.05) TYP

METAL

TYP

(0.85)

4222550/D 07/2019

DSBGA - 0.5 mm max height

YZ0030-C01

DIE SIZE BALL GRID ARRAY

NOTES: (continued)

4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.

PKG

PKG SYMM

SOLDER PASTE EXAMPLE

BASED ON 0.1 mm THICK STENCIL

SCALE:35X

1 2 3 4 5

AFE4420

SBAS910A –JUNE 2018–REVISED JULY 2019

www.ti.com

Product Folder Links: AFE4420

I TEXAS INSTRUMENTS Sample: Sample:

PACKAGE OPTION ADDENDUM

www.ti.com 10-Dec-2020

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead finish/

Ball material

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

AFE4420YZR ACTIVE DSBGA YZ 30 3000 RoHS & Green SAC396 Level-1-260C-UNLIM -40 to 85 AFE4420

AFE4420YZT ACTIVE DSBGA YZ 30 250 RoHS & Green SAC396 Level-1-260C-UNLIM -40 to 85 AFE4420

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

I TEXAS INSTRUMENTS

PACKAGE OPTION ADDENDUM

www.ti.com 10-Dec-2020

Addendum-Page 2

I TEXAS INSTRUMENTS REEL DIMENSIONS TAPE DIMENSIONS 7 “K0 '«m» Reel Diame|er AD Dimension deswgned to accommodate the componem wwdlh E0 Dimension desxgned to accommodate the componenl \ength KO Dimenslun deswgned to accommodate the componem thickness 7 w OveraH wwdm loe earner cape i p1 Pitch between successwe cavuy cemers f T Reel Width (W1) QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE O O O D O O D O Sprockemoles ,,,,,,,,,,, ‘ User Direcllon 0' Feed Pockel Quadrams

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

AFE4420YZR DSBGA YZ 30 3000 178.0 9.2 2.27 2.72 0.78 4.0 8.0 Q1

AFE4420YZT DSBGA YZ 30 250 178.0 9.2 2.27 2.72 0.78 4.0 8.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 18-Jan-2020

Pack Materials-Page 1

I TEXAS INSTRUMENTS TAPE AND REEL BOX DIMENSIONS

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

AFE4420YZR DSBGA YZ 30 3000 220.0 220.0 35.0

AFE4420YZT DSBGA YZ 30 250 220.0 220.0 35.0

PACKAGE MATERIALS INFORMATION

www.ti.com 18-Jan-2020

Pack Materials-Page 2

IMPORTANT NOTICE AND DISCLAIMER

TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE

DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”

AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY

IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD

PARTY INTELLECTUAL PROPERTY RIGHTS.

These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate

TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable

standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you

permission to use these resources only for development of an application that uses the TI products described in the resource. Other

reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third

party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims,

damages, costs, losses, and liabilities arising out of your use of these resources.

TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on

ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable

warranties or warranty disclaimers for TI products.

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

Fiche technique pour AFE4420 de Texas Instruments

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