Fiche technique pour MPX2010, MPXV2010G Series de NXP USA Inc.

:"fre%§mggls‘"
MPX2010
Rev 13, 10/2008
Freescale Semiconductor
© Freescale Semiconductor, Inc., 2005-2008. All rights reserved.
Pressure
+10 kPa On-Chip Temperature
Compensated and Calibrated
Silicon Pressure Sensors
The MPX2010 series silicon piezoresistive pressure sensors provide a very
accurate and linear voltage output directly proportional to the applied pressure.
These sensors house a single monolithic silicon die with the strain gauge and
thin film resistor network integrated. The sensor is laser trimmed for precise
span, offset calibration and temperature compensation.
Features
Temperature Compensated over 0°C to +85°C
Ratiometric to Supply Voltage
Differential and Gauge Options
Available in Easy-to-Use Tape & Reel
ORDERING INFORMATION
Device Name Package
Options Case
No. # of Ports Pressure Type Device Marking
None Single Dual Gauge Differential Absolute
Small Outline Package (MPXV2010 Series)
MPXV2010GP Tray 1369 • • MPXV2010GP
MPXV2010DP Tray 1351 MPXV2010DP
Unibody Package (MPX2010 Series)
MPX2010D Tray 344 MPX2010D
MPX2010DP Tray 344C MPX2010DP
MPX2010GP Tray 344B • • MPX2010GP
MPX2010GS Tray 344E • • MPX2010D
MPX2010GSX Tray 344F • • MPX2010D
MPAK Package (MPXM2010 Series)
MPXM2010D Rail 1320 MPXM2010D
MPXM2010DT1 Tape and Reel 1320 MPXM2010D
MPXM2010GS Rail 1320A • • MPXM2010GS
MPXM2010GST1 Tape and Reel 1320A • • MPXM2010GS
MPX2010
Series
0 to 10 kPa (0 to 1.45 psi)
25 mV Full Scale
(Typical)
Application Examples
Respiratory Diagnostics
Air Movement Control
• Controllers
Pressure Switching
UNIBODY PACKAGES
SMALL OUTLINE PACKAGES
MPXV2010GP
CASE 1369-01 MPXV2010DP
CASE 1351-01
MPX2010D
CASE 344-15 MPX2010GP
CASE 344B-01 MPX2010DP
CASE 344C-01 MPX2010GS
CASE 344E-01 MPX2010GSX
CASE 344F-01
MPXM2010D/DT1
CASE 1320-02 MPXM2010GS/GST1
CASE 1320A-02
MPAK PACKAGES
MPX2010
Sensors
2Freescale Semiconductor
Pressure
Operating Characteristics
Table 1. Operating Characteristics (VS = 10 VDC, TA = 25°C unless otherwise noted, P1 > P2)
Characteristic Symbol Min Typ Max Units
Pressure Range(1)
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
POP 0 10 kPa
Supply Voltage(2)
2. Device is ratiometric within this specified excitation range. Operating the device at a different range may induce additional error due to device
self-heating.
VS10 16 VDC
Supply Current IO6.0 mAdc
Full Scale Span(3)
3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
VFSS 24 25 26 mV
Offset(4)
4. Offset (VOFF) is defined as the output voltage at the minimum rated pressure.
VOFF –1.0 1.0 mV
Sensitivity ΔV/ΔΡ 2.5 mV/kPa
Linearity –1.0 1.0 %VFSS
Pressure Hysteresis (0 to 10 kPa) ±0.1 %VFSS
Temperature Hysteresis (–40°C to +125°C) ±0.5 %VFSS
Temperature Coefficient on Full Scale Span TCVFSS –1.0 1.0 %VFSS
Temperature Coefficient on Offset TCVOFF –1.0 1.0 mV
Input Impedance ZIN 1300 2550 Ω
Output Impedance ZOUT 1400 3000 Ω
Response Time(5) (10% to 90%)
5. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a
specified step change in pressure.
tR—1.0—ms
Warm-Up Time 20 ms
Offset Stability(6)
6. Offset stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
——±0.5 — %VFSS
MPX2010
Sensors
Freescale Semiconductor 3
Pressure
Maximum Ratings
Voltage Output versus Applied Differential Pressure
The output voltage of the differential or gauge sensor
increases with increasing pressure applied to the pressure
side (P1) relative to the vacuum side (P2). Similarly, output
voltage increases as increasing vacuum is applied to the
vacuum side (P2) relative to the pressure side (P1).
Figure 1. shows a block diagram of the internal circuitry on
the stand-alone pressure sensor chip.
Figure 1. Temperature Compensated and Calibrated
Pressure Sensor Schematic
Table 2. Maximum Ratings(1)
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Rating Symbol Value Unit
Maximum Pressure (P1 > P2) PMAX 75 kPa
Burst Pressure (P1 > P2) PBURST 100 kPa
Storage Temperature TSTG –40 to +125 °C
Operating Temperature TA40 to +125 °C
+VOUT
–VOUT
4
2
VS
3
Sensing
Element
GND
1
Thin Film
Temperature
Compensation
and Calibration
Circuitry
rame
MPX2010
Sensors
4Freescale Semiconductor
Pressure
On-Chip Temperature Compensation and Calibration
Figure 2. shows the output characteristics of the MPX2010
series at 25°C. The output is directly proportional to the
differential pressure and is essentially a straight line.
The effects of temperature on full scale span and offset are
very small and are shown under Operating Characteristics.
This performance over temperature is achieved by having
both the shear stress strain gauge and the thin-film resistor
circuitry on the same silicon diaphragm. Each chip is
dynamically laser trimmed for precise span and offset
calibration and temperature compensation.
Figure 3. illustrates the differential/gauge die in the basic
chip carrier (Case 344). A silicone gel isolates the die surface
and wire bonds from the environment, while allowing the
pressure signal to be transmitted to the silicon diaphragm.
The MPX2010 series pressure sensor operating
characteristics and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media
other than dry air may have adverse effects on sensor
performance and long term reliability. Contact the factory for
information regarding media compatibility in your application.
LINEARITY
Linearity refers to how well a transducer's output follows
the equation: Vout = Voff + sensitivity x P over the operating
pressure range. There are two basic methods for calculating
nonlinearity: (1) end point straight line fit (see Figure 4.) or
(2) a least squares best line fit. While a least squares fit gives
the “best case” linearity error (lower numerical value), the
calculations required are burdensome.
Conversely, an end point fit will give the “worst case” error
(often more desirable in error budget calculations) and the
calculations are more straightforward for the user.
Freescale’s specified pressure sensor linearities are based
on the end point straight line method measured at the
midrange pressure.
Figure 2. Output vs. Pressure Differential
Figure 3. Unibody Package: Cross Sectional Diagram
(not to scale) Figure 4. Linearity Specification Comparison
Offset
(Typical)
Output (mVdc)
kPa
PSI 2.5
0.362 5
0.725 7.5
1.09 10
1.45
Span
Range
(Typical)
VS = 10 Vdc
TA = 25°C
P1 > P2
30
25
20
15
10
5
0
5
TYP
aMAX
MIN
Silicone
Die Coat Die P1
P2
Wire Bond
Lead Frame RTV Die
Bond
Epoxy
Case
Stainless Steel
Metal Cover
Least
Square
Deviation
Relative Voltage Output
Pressure (% Full Scale)
050 100
End Point Straight
Line Fit
Exaggerated
Performance
Curve
Least Squares Fit
Offset
Straight Line
Deviation
MPX2010
Sensors
Freescale Semiconductor 5
Pressure
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing silicone gel which
isolates the die from the environment. The pressure sensor is
designed to operate with positive differential pressure
applied, P1 > P2.
The Pressure (P1) side may be identified by using the
following table.
Table 3. Pressure (P1) Side Delineation
Part Number Case
Type Pressure (P1) Side Identifier
MPX2010D 344 Stainless Steel Cap
MPX2010DP 344C Side with Part Marking
MPX2010GP 344B Side with Port Attached
MPX2010GS 344E Side with Port Attached
MPX2010GSX 344F Side with Port Attached
MPXV2010GP 1369 Side with Port Attached
MPXV2010DP 1351 Side with Part Marking
MPXM2010D/DTI 1320 Side with Part Marking
MPXM2010GS/GSTI 1320A Side with Port Attached
MIN MAX MIN MAX 0595 new ‘5“ man asu nu ma ass 01ml nzzu sna 559 ama nazu um um am nos» ‘22 I53 I] mass 2 508% am new n35 am 0595 was was m2 an mm in mm ans ms urn ‘257 azzrkmwuom>§ mu ma um ma MIN max MIN MAX ms ms 2m 2m uses ans non ma ms 0325 775 325 nms anzn um um um um ‘22 H3: nmasc zsoesc ma my oaz u: um um um um ms 0725 I755 m2 nzsn am 737 752 nazn awn mm mm ms: may 359 am ms: may 359 am nan azsn 550 535 :mxowzrxLzhnanmhg nsmBSE zauasc
MPX2010
Sensors
6Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
NOTES:
1.
2.
3.
DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
CONTROLLING DIMENSION: INCH.
DIMENSION -A- IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
M
A
M
0.136 (0.005) T
1234
PIN 1
R
N
L
G
F
D4 PL
SEATING
PLANE
-T-
C
M
J
B-A-
DAMBAR TRIM ZONE:
F
THIS IS INCLUDED
WITHIN DIM. "F" 8 PL
123
4
Y
Z
STYLE 1:
PIN 1. GROUND
2. + OUTPUT
3. + SUPPLY
4. - OUTPUT
STYLE 2:
PIN 1. VCC
2. - SUPPLY
3. + SUPPLY
4. GROUND
STYLE 3:
PIN 1. GND
2. -VOUT
3. VS
4. +VOUT
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.595 0.630 15.11 16.00
B0.514 0.534 13.06 13.56
C0.200 0.220 5.08 5.59
D0.016 0.020 0.41 0.51
F0.048 0.064 1.22 1.63
G0.100 BSC 2.54 BSC
J0.014 0.016 0.36 0.40
L0.695 0.725 17.65 18.42
M30˚ NOM 30˚ NOM
N0.475 0.495 12.07 12.57
R0.430 0.450 10.92 11.43
Y0.048 0.052 1.22 1.32
Z0.106 0.118 2.68 3.00
CASE 344-15
ISSUE AA
UNIBODY PACKAGE
NOTES:
1.
2.
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
CONTROLLING DIMENSION: INCH.
D4 PL
F
U
H
L
PORT #1
POSITIVE
PRESSURE
(P1)
PIN 1
-A-
-Q-
S
K
G
-P-
S
Q
M
0.25 (0.010) T
S
S
M
0.13 (0.005) QS
T
12 34
SEATING
PLANE
B
N
R
C
J
-T-
STYLE 1:
PIN 1. GROUND
2. + OUTPUT
3. + SUPPLY
4. - OUTPUT
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A1.145 1.175 29.08 29.85
B0.685 0.715 17.40 18.16
C0.305 0.325 7.75 8.26
D0.016 0.020 0.41 0.51
F0.048 0.064 1.22 1.63
G0.100 BSC 2.54 BSC
H0.182 0.194 4.62 4.93
J0.014 0.016 0.36 0.41
K0.695 0.725 17.65 18.42
L0.290 0.300 7.37 7.62
N0.420 0.440 10.67 11.18
P0.153 0.159 3.89 4.04
Q0.153 0.159 3.89 4.04
R0.230 0.250 5.84 6.35
S
U0.910 BSC 23.11 BSC
0.220 0.240 5.59 6.10
CASE 344B-01
ISSUE B
UNIBODY PACKAGE
# n... ..... m ...... m / A H“ H75 2905 2935 a m. mu ‘.. c was ms my ....5 /—|:| .. m. J “‘$ ; m 0064 .22 .5. r G nlnflBSE 250859 + 7+ + H DIEQ am $62 0?: l l i new my; n35 no“: .p. \ L am 0300 737 7.32 “ N Dan 0140 NET HM? . . em 0 o l ,, m. w. 359 w. “ H n m. 0.59 3.. w. T L f n mm mm .5. 2.. a e 7 s a“ .. amass 2...... V nm‘uzm sin \ ma w nzmhim 7E7 \ Ma harfi ‘ DWENSIWNS MI: WKEW N5 PER l‘lS‘ iEAVIIG _ _ PLANE mm ‘96: 2 COVWOLLIMG DIMEusm Inc-4 IICHES ILIIEI'ERS GROUND o SJP’L" I . 2 .mm a s -CLT‘PJT
PACKAGE DIMENSIONS
MPX2010
Sensors
Freescale Semiconductor 7
CASE 344C-01
ISSUE B
UNIBODY PACKAGE
CASE 344E-01
ISSUE B
UNIBODY PACKAGE
Pressure
NOTES:
1.
2.
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
CONTROLLING DIMENSION: INCH.
PORT #2
PORT #1
PORT #2
VACUUM
(P2) (P1)
SEATING
PLANE SEATING
PLANE
K
S
W
H
L
U
F
G
D4 PL
PORT #1
POSITIVE PRESSURE
-Q-
12 43
PIN 1
-P-
-T- -T- S
Q
M
0.25 (0.010) T
S
S
M
0.13 (0.005) Q S
T
B
N
J
C
V
R
-A-
STYLE 1:
PIN 1. GROUND
2. + OUTPUT
3. + SUPPLY
4. - OUTPUT
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A1.145 1.175 29.08 29.85
B0.685 0.715 17.40 18.16
C0.405 0.435 10.29 11.05
D0.016 0.020 0.41 0.51
F0.048 0.064 1.22 1.63
G0.100 BSC 2.54 BSC
H0.182 0.194 4.62 4.93
J0.014 0.016 0.36 0.41
K0.695 0.725 17.65 18.42
L0.290 0.300 7.37 7.62
N0.420 0.440 10.67 11.18
P0.153 0.159 3.89 4.04
Q0.153 0.159 3.89 4.04
R0.063 0.083 1.60 2.11
S
U0.910 BSC 23.11 BSC
V0.248 0.278 6.30 7.06
W0.310 0.330 7.87 8.38
0.220 0.240 5.59 6.10
um MIN MAX MIN mx A man ‘ ‘20 ms 25 as a one man m an w m c 0530 nssn mm mm 0 ms rmzn rm n51 E a mo n ma one m r mm mm m m a mom 254359 J now nms m rm K N nnm rman m 205 r n ‘50 n mo :31 005 n n ‘50 n mo :31 005 n cm was u m u as s 0695 ms was m2 u we mo 2‘ an 2‘ m v n ‘52 n m m m
MPX2010
Sensors
8Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
CASE 344F-01
ISSUE B
UNIBODY PACKAGE
NOTES:
1.
2.
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
CONTROLLING DIMENSION: INCH.
E
C
J
V
-T-
PORT #1
POSITIVE
PRESSURE
(P1)
PIN 1
4 PL
D
-P-
G
K
M
Q
M
0.25 (0.010) T
U
A
F
S
NB
S
P
M
0.13 (0.005) Q S
T
-Q-
R
4321
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A1.080 1.120 27.43 28.45
B0.740 0.760 18.80 19.30
C0.630 0.650 16.00 16.51
D0.016 0.020 0.41 0.51
E0.160 0.180 4.06 4.57
F0.048 0.064 1.22 1.63
G0.100 BSC 2.54 BSC
J0.014 0.016 0.36 0.41
K
N0.070 0.080 1.78 2.03
P0.150 0.160 3.81 4.06
Q0.150 0.160 3.81 4.06
R0.440 0.460 11.18 11.68
S0.695 0.725 17.65 18.42
U0.840 0.860 21.34 21.84
V0.182 0.194 4.62 4.92
0.220 0.240 5.59 6.10
STYLE 1:
PIN 1. GROUND
2. V (+) OUT
3. V SUPPLY
4. V (-) OUT
0 455 0.465 0.260 0.240 0.485 & 0.465 100 Q_IIE 2 PLACES 4 T‘PS 0. 100 0. 050 —£ 1 $Bx 0.042 0.038 mm DETAIL G —L GAGE PLANE I ‘ —\e 0.150 0,390 0.370 0 011 0.009 : DETA‘L 6 3x B— amoj 0.002 70.060 0.040 930.130 0.290 0.270 0.135 0.115 SEATING PLANE Dunn}? [No rrmvrn ‘ uzcummu. ouan: | PRINT VERSION NOT TO SCALE 8 LD SNSR, DUAL PORT DOCUMENT N0: SBASAQQZSSD REV: A CASE NUMBER21351—01 27 JUL 2005 STANDARD: NON—JEDEC CASE1351-O ISSUE A SMALL OUTLINE PA Sensors Freescale Semiconductor
MPX2010
Sensors
Freescale Semiconductor 9
Pressure
PACKAGE DIMENSIONS
CASE1351-01
ISSUE A
SMALL OUTLINE PACKAGE
PAGE 1 OF 2
NOTES: 1. CONTROLLING DIMENSION: INCH 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME YT4,5M*T§94, ADIMENSIONS Do NOT INCLUDE MOLD FLASH OR PPROTRUSTONS, MOLD FLASH AND PROTPUSIONS SHALL NOT EXCEED .006 PER SIDE. QDIMENSION DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE .008 MAXIMUM, STVLE 1' PIN PIN PIN PIN PIN PIN PIN PIN 211‘???wa GND +Vout Vs —Vout N/c N/C N/C N/C STYLE 2' PIN PIN PIN PIN PIN PIN PIN PIN WE‘H’SI‘fSt’Nt'.‘ N/C GND Vout N/c N/C N/C N/C orgasms ‘wENlchum, m?» w: ALL mm: mama ECHANICAL OUTLIIE PRINT VERSION NoT To SCALE TITLE: 8 LD SNSR, DUAL PORT DOCUMENT N0: QBASASQZSSD REV: A CASE NUMEIER:1351—Dl 27 JUL 2005 STANDARD: NON—JEDEC
MPX2010
Sensors
10 Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
CASE1351-01
ISSUE A
SMALL OUTLINE PACKAGE
PAGE 2 OF 2
["3 Q—IIE 2 PLACES 4 T‘PS 1E- E El— GAGE PLANE .014 (u. 35) _IIEI DETAIL G 1113111 , ‘M‘ IECHANICM. OUTLINE ‘ PRINT VERSION NOT To SCALE 8 LD SOP, S‘DE PORT DOCUMENT NO: 93ASA99303D CASE NUMBER: 136970] REV: E 24 MAY mos STANDARD: NDN—JEDEC CASE 136 ISSUE B SMALL OUTLINE Sensors Freescale Semiconductor
MPX2010
Sensors
Freescale Semiconductor 11
Pressure
PACKAGE DIMENSIONS
CASE 1369-01
ISSUE B
SMALL OUTLINE PACKAGE
PAGE 1 OF 2
NOTES: 1. CONTROLLING DIMENSTON: INCH 2. \NTERPRET DTMENSIONS AND TOLERANCES PER ASME YT4.5M71994. ADIMENS‘ONS DO NOT \NCLUDE MOLD FLASH OR PPRDTRUSIONS, MOLD FLASH AND PROTRUSTONS SHALL NOT EXCEED .006 (0,152) PER SIDE, ADIMENSTON DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE .003 (0,203) MAXTMUM. INCHES MILLIMETERS INCHES MILLIMETERS DIM MIN MAX MIN MAX DIM MIN MAX MIN MAX A .300 .330 7. 11 7. 62 9 0’ 7‘ 0' 7‘ M .002 010 0. 05 D. 25 7 777 777 777 777 5 . 038 . 042 0. 96 1. 07 - 7—7 -—— ——— —-— D . 465 . 485 11. 81 12. 32 - -7- --- --- --- E 717 ESC 15.21 350 2 ,2, 2,, 2,, ,2, E1 .465 .485 11. a1 12. 32 - 7—7 -—— ——- --7 e 100 ESC 2 54 ESC 7 777 777 777 777 F .245 .255 6. 22 6 47 — ——— —-— ——— ——— K . 120 . 130 3. 05 3. so 7 777 777 7 7 777 L .051 .071 1.55 1.30 7 M . 270 .290 6. 86 7. 35 — ——— —-— ——— N . 080 090 2. 03 2. 25 7 777 777 777 777 P . 009 . 011 0. 23 0. 23 7 777 777 777 777 T . 115 125 2. 92 3 T7 7 -—- 7-— ——7 —7- Omisfit;ffgfcg’sugfi’gfi ‘N‘ chHANchL ouTLflE PRINT VERSION NOT TO SCALE TITLE: DOCUMENT No 98ASA99303D REV a 8 LD SOP, STDE PORT CASE NUMBER 1369—01 24 MAY 2005 STANDARD. NON7JEDEC
MPX2010
Sensors
12 Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
CASE 1369-01
ISSUE B
SMALL OUTLINE PACKAGE
PAGE 2 OF 2
2X Small: “35 DETAIL E GAGE PLANE 7 0.0m W PIN I 0.04: ‘ 4x 0.015 0 002 o 038’ ° 0,0” fimIIE 0335 0.2515A 0325 0.245 . 4 0.155 0.55 DETAIL E .9 SEE! ISEATING PLANE mg E E m u an, 1 c 0 YMMV: :Eg’fim “ IECHANICAL OUTLINE PRINT VERSIEIN NUT TEI SCALE TITLE: DDEUMENT NEI: 98ARH99088A REV: a 5 LD M—PAC CASE NUMBER‘ 1320—02 22 JUL 2005 STANDARD: NEIN—JEDEC CASE 1320-02 ISSUE B MPAK Sensors Freescale Semiconductor
MPX2010
Sensors
Freescale Semiconductor 13
Pressure
PACKAGE DIMENSIONS
CASE 1320-02
ISSUE B
MPAK
NOTES: 1. DIMENSIONS ARE IN INCHES. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14,5M—1994. @DIMENSION DOES NOT INCLUDE MOLD FLASH OR PROTRUSION. MOLD FLASH OR PROTRUSION SHALL NOT EXCEED I006" PER SIDE 4 ALL VERTICAL SURFACES To BE 5' MAXIMUMV @DIMENSION DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMEAR PROTRUSION SHALL BE ,008 MAXIMUM PIN 1: GND PIN 2: +Vout PIN 3; Vs PIN 4: iVOu! O“ESTELLE?[SGEPZ/Y’SCCRNEEEIEfngRU ’M’ MECHANICAL OUTLIIE PRINT VERSION NOT To SCALE TITLE: DOCUMENT N0: QBARHQSOESA REV: a 5 LD MiPAC CASE NUMBER: 1320702 22 JUL 2005 STANDARD: NON—JEDEC
MPX2010
Sensors
14 Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
CASE 1320-02
ISSUE A
MPAK
DETAIL E .014 GAGE PLANE ’ 4x 0.015 0.010 W 0014 0.37: 0.0234] L ‘ 0.363 _IEE (mm 0 013 0 mm _. ._ mm I n 202 mgz o 397 0.377 If \/ flromu E E... 0.335 = mi. EI—<~8§i§j 55mm;="" plane="" a="" a="" @freesca="" e="" se="" [cdvducydk="" nc="" .lmem;="" re‘se?ved="" mechanical="" outlnt="" print="" version="" not="" to="" scale="" title:="" document="" n0.="" saarh99057a="" rev.="" a="" case="" number:="" 1320a—02="" 22="" jul="" 2005="" 5="" ld="" m—pac,="" ported="" standard:="" ndn—jedec="">
MPX2010
Sensors
Freescale Semiconductor 15
Pressure
PACKAGE DIMENSIONS
CASE 1320A-02
ISSUE A
MPAK
PIN 4
PIN 1
NOTES: 1. DIMENS‘ONS ARE IN \NCHESV 2. INTERPRET D‘MENSIONS AND TOLERANCES PER ASME Y14.5M71994. ADIMENS‘ONS DOES NOT INCLUDE MOLD FLASH OR PROTRUSION. MOLD FLASH OR PROTRUSWN SHALL NOT EXCEED .006" PER S‘DE. 4. ALL VERT‘CAL SURFACES TO BE 5" MAXIMUM. ADIMENS‘ON DOES NOT INCLUDE DAMBAR PROTRUS‘ON. ALLOWABLE DAMBAR PROTRUSION SHALL BE .005 MAXIMUM. WEEKharm-"'95“ ‘ ‘ ”‘5 IAECHANICAL OUTLIIE PRINT VERSION NOT TO SCALE TITLE: DOCUMENT No: 98ARH99087A REV: A 5 LD M—PAC, PORTED CASE NUMBER: 1320A702 22 JUL 2005 STANDARD: NONrJEDEC
MPX2010
Sensors
16 Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
CASE 1320-02
ISSUE A
MPAK
MPX2010
Rev. 13
10/2008
How to Reach Us:
Home Page:
www.freescale.com
Web Support:
http://www.freescale.com/support
USA/Europe or Locations Not Listed:
Freescale Semiconductor, Inc.
Technical Information Center, EL516
2100 East Elliot Road
Tempe, Arizona 85284
1-800-521-6274 or +1-480-768-2130
www.freescale.com/support
Europe, Middle East, and Africa:
Freescale Halbleiter Deutschland GmbH
Technical Information Center
Schatzbogen 7
81829 Muenchen, Germany
+44 1296 380 456 (English)
+46 8 52200080 (English)
+49 89 92103 559 (German)
+33 1 69 35 48 48 (French)
www.freescale.com/support
Japan:
Freescale Semiconductor Japan Ltd.
Headquarters
ARCO Tower 15F
1-8-1, Shimo-Meguro, Meguro-ku,
Tokyo 153-0064
Japan
0120 191014 or +81 3 5437 9125
support.japan@freescale.com
Asia/Pacific:
Freescale Semiconductor China Ltd.
Exchange Building 23F
No. 118 Jianguo Road
Chaoyang District
Beijing 100022
China
+86 010 5879 8000
support.asia@freescale.com
For Literature Requests Only:
Freescale Semiconductor Literature Distribution Center
P.O. Box 5405
Denver, Colorado 80217
1-800-441-2447 or +1-303-675-2140
Fax: +1-303-675-2150
LDCForFreescaleSemiconductor@hibbertgroup.com
Information in this document is provided solely to enable system and software
implementers to use Freescale Semiconductor products. There are no express or
implied copyright licenses granted hereunder to design or fabricate any integrated
circuits or integrated circuits based on the information in this document.
Freescale Semiconductor reserves the right to make changes without further notice to
any products herein. Freescale Semiconductor makes no warranty, representation or
guarantee regarding the suitability of its products for any particular purpose, nor does
Freescale Semiconductor assume any liability arising out of the application or use of any
product or circuit, and specifically disclaims any and all liability, including without
limitation consequential or incidental damages. “Typical” parameters that may be
provided in Freescale Semiconductor data sheets and/or specifications can and do vary
in different applications and actual performance may vary over time. All operating
parameters, including “Typicals”, must be validated for each customer application by
customer’s technical experts. Freescale Semiconductor does not convey any license
under its patent rights nor the rights of others. Freescale Semiconductor products are
not designed, intended, or authorized for use as components in systems intended for
surgical implant into the body, or other applications intended to support or sustain life,
or for any other application in which the failure of the Freescale Semiconductor product
could create a situation where personal injury or death may occur. Should Buyer
purchase or use Freescale Semiconductor products for any such unintended or
unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and
its officers, employees, subsidiaries, affiliates, and distributors harmless against all
claims, costs, damages, and expenses, and reasonable attorney fees arising out of,
directly or indirectly, any claim of personal injury or death associated with such
unintended or unauthorized use, even if such claim alleges that Freescale
Semiconductor was negligent regarding the design or manufacture of the part.
Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc.
All other product or service names are the property of their respective owners.
© Freescale Semiconductor, Inc. 2008. All rights reserved.