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 2017 Microchip Technology Inc. DS20005836A-page 1

MIC862

Features

• 8-Pin SOT-23 Package

• 3 MHz Gain-Bandwidth Product

• 5 MHz, –3 dB Bandwidth

• 31 µA Supply Current

• Rail-to-Rail Output

• Ground Sensing at Input

(Common-Mode-to-GND)

• Drives Large Capacitive Loads

• Unity Gain Stable

Applications

• Portable Equipment

• Medical Instruments

•PDAs

• Pagers

• Cordless Phones

• Consumer Electronics

General Description

The MIC862 is a dual low-power operational amplifier

in an SOT23-8 package. It is designed to operate in the

2V to 5V range, rail-to-rail output, with input

common-mode to ground. The MIC862 provides

3 MHz gain-bandwidth product while consuming only

31 µA supply current per channel.

With low supply voltage and 8-lead SOT-23 packaging,

MIC862 provides two channels as general-purpose

amplifiers for portable and battery-powered

applications. Its package provides the maximum

performance available while maintaining an extremely

slim form factor. The minimal power consumption of

this IC maximizes the battery life potential.

Package Type

MIC862

8-Pin SOT-23 (M8)

1OUTA

INA–

INA+

V–

8V+

OUTB

INB–

INB+

Dual Ultra-Low Power Op Amp in SOT-23-8

MIC862

DS20005836A-page 2  2017 Microchip Technology Inc.

Typical Application Schematic



0.1μF10μF

100pF



MIC862

MIC862 V

OUT

V+

PEAK DETECTOR CIRCUIT FOR AM RADIO

 2017 Microchip Technology Inc. DS20005836A-page 3

MIC862

1.0 ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings †

Supply Voltage (VV+ to VV–).....................................................................................................................................+6.0V

Differential Input Voltage (VIN+ to VIN–) (Note 1)......................................................................................................+6.0V

Input Voltage (VIN+ to VIN–)...........................................................................................................VV+ + 0.3V, VV– – 0.3V

Output Short-Circuit Current Duration.................................................................................................................Indefinite

ESD Rating (Note 2) .................................................................................................................................. ESD Sensitive

Operating Ratings ‡

Supply Voltage (V+ to V-)........................................................................................................................ +2.0V to +5.25V

† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.

This is a stress rating only and functional operation of the device at those or any other conditions above those indicated

in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended

periods may affect device reliability.

‡ Notice: The device is not guaranteed to function outside the operating ratings.

Note 1: Exceeding the maximum differential input voltage will damage the input stage and degrade performance (in

particular, input bias current is likely to increase).

2: Devices are ESD sensitive. Handling precautions are recommended. Human body model, 1.5 k in series

with 100 pF.

OS RL VOUT VPP RL VOUT VPP RL CL Av RL CL Av

MIC862

DS20005836A-page 4  2017 Microchip Technology Inc.

TABLE 1-1: ELECTRICAL CHARACTERISTICS

Electrical Characteristics: V+ = +2V, V– = 0V, VCM = V+/2; RL = 500 k to V+/2; –40°C  TA  +85°C unless

otherwise noted.

Parameters Symbol Min. Typ. Max. Units Conditions

Input Offset Voltage

VOS

–6 0.1 6 mV —

–5 0.1 5 TA = +25°C

Differential Offset

Voltage —0.5 — mV—

Input Offset Voltage

Temperature

Coefficient

—6 —µV/°C—

Input Bias Current IB—10 — pA—

Input Offset Current IOS —5 — pA—

Input Voltage

Range (from V–) VCM 0.5 1 — V CMRR > 50 dB

Common-Mode

Rejection Ratio CMRR 45 75 — dB 0V < VCM < 1V

Power Supply

Rejection Ratio PSRR 50 78 — dB Supply voltage change of 2V to

2.7V.

Large-Signal

Voltage Gain AVOL

66 74 —

RL = 5 k, VOUT = 1.4 VPP

75 89 — RL = 100 k, VOUT = 1.4 VPP

85 100 — RL = 500 k, VOUT = 1.4 VPP

Maximum Output

Voltage Swing

VOUT

V+ – 80 mV V+ –

55 mV —

RL = 5 k

V+ – 3 mV V+ –

1.4 mV —R

L = 500 k

Minimum Output

Voltage Swing

—V– +

14 mV V– + 20 mV

RL = 5 k

—V– +

0.85 mV V– + 3 mV RL = 500 k

Gain-Bandwidth

Product GBW — 2.1 — MHz RL = 20 k, CL = 2 pF, AV = 11

Phase Margin PM — 57 — ° RL = 20 k, CL = 2 pF, AV = 11

–3 dB Bandwidth BW — 4.2 — MHz RL = 1 M, CL = 2 pF, AV = 1

Slew Rate SR — 2 — V/µs RL = 1 M, CL = 2 pF, AV = 1,

Positive Slew Rate = 1.5 V/µs

Short-Circuit Output

Current ISC

1.8 2.6 — mA Source

1.5 2.2 — Sink

Supply Current (per

Op Amp) IS— 27 43 µA No Load

Channel-to-

Channel Crosstalk — — –100 — dB Note 1

Note 1: DC signal referenced to input. Refer to the Typical Performance Curves section’s AC performance graphs.

V VOUT PP V P VOUT P

 2017 Microchip Technology Inc. DS20005836A-page 5

MIC862

TABLE 1-2: ELECTRICAL CHARACTERISTICS

Electrical Characteristics: V+ = +2.7V, V– = 0V, VCM = V+/2; RL = 500 k to V+/2; –40°C  TA  +85°C unless

otherwise noted.

Parameters Symbol Min. Typ. Max. Units Conditions

Input Offset Voltage

VOS

–6 0.1 6 mV —

–5 0.1 5 TA = +25°C

Differential Offset

Voltage —0.5 — mV—

Input Offset Voltage

Temperature

Coefficient

—6 —µV/°C—

Input Bias Current IB—10 — pA—

Input Offset Current IOS —5 — pA—

Input Voltage

Range (from V–) VCM 1 1.8 — V CMRR > 60 dB

Common-Mode

Rejection Ratio CMRR 65 83 — dB 0V < VCM < 1.35V

Power Supply

Rejection Ratio PSRR 60 85 — dB Supply voltage change of 2.7V to

Large-Signal

Voltage Gain AVOL

65 77 —

RL = 5 k, VOUT = 2 VPP

80 90 — RL = 100 k, VOUT = 2 VPP

90 101 — RL = 500 k, VOUT = 2 VPP

Gain-Bandwidth

Product GBW — 2.3 — MHz RL = 20 k, CL = 2 pF, AV = 11

Phase Margin PM — 50 — ° RL = 20 k, CL = 2 pF, AV = 11

–3 dB Bandwidth BW — 4.2 — MHz RL = 1 M, CL = 2 pF, AV = 1

Slew Rate SR — 3 — V/µs RL = 1 M, CL = 2 pF, AV = 1,

Positive Slew Rate = 1.5 V/µs

Short-Circuit Output

Current ISC

4.5 6.3 — mA Source

4.5 6.2 — Sink

Supply Current (per

Op Amp) IS— 28 45 µA No Load

Channel-to-

Channel Crosstalk — — –120 — dB Note 1

Note 1: DC signal referenced to input. Refer to the Typical Performance Curves section’s AC performance graphs.

MIC862

DS20005836A-page 6  2017 Microchip Technology Inc.

TABLE 1-3: ELECTRICAL CHARACTERISTICS

Electrical Characteristics: V+ = +5V, V– = 0V, VCM = V+/2; RL = 500 k to V+/2; –40°C  TA  +85°C unless

otherwise noted.

Parameters Symbol Min. Typ. Max. Units Conditions

Input Offset Voltage

VOS

–6 0.1 6 mV —

–5 0.1 5 TA = +25°C

Differential Offset

Voltage —0.5 — mV—

Input Offset Voltage

Temperature

Coefficient

—6 —µV/°C—

Input Bias Current IB—10 — pA—

Input Offset Current IOS —5 — pA—

Input Voltage

Range (from V–) VCM 3.5 4.1 — V CMRR > 60 dB

Common-Mode

Rejection Ratio CMRR 60 87 — dB 0V < VCM < 3.5V

Power Supply

Rejection Ratio PSRR 60 92 — dB Supply voltage change of

3V to 5V

Large-Signal

Voltage Range AVOL

65 73 —

RL = 5 k, VOUT = 4.8 VPP

80 86 — RL = 100 k, VOUT = 4.8 VPP

89 96 — RL = 500 k, VOUT = 4.8 VPP

Maximum Output

Voltage Swing

VOUT

V+ – 50 mV V+ –

37 mV —

RL = 5 k

V+ – 3 mV V+ –

1.3 mV —R

L = 500 k

Minimum Output

Voltage Swing

—V– +

24 mV V– + 40 mV RL = 5 k

—V– +

0.7 mV V– + 3 mV RL = 500 k

Gain-Bandwidth

Product GBW — 3 — MHz RL = 20 k, CL = 2 pF, AV = 11

Phase Margin PM — 45 — ° —

–3 dB Bandwidth BW — 5 — MHz RL = 1 M, CL = 2 pF, AV = 1

Slew Rate SR — 4 — V/µs RL = 1 M, CL = 2 pF, AV = 1,

Positive Slew Rate = 1.5 V/µs

Short-Circuit Output

Current ISC

17 23 — mA Source

18 27 — Sink

Supply Current (per

Op Amp) IS— 31 47 µA No Load

Channel-to-

Channel Crosstalk — — –120 — dB Note 1

Note 1: DC signal referenced to input. Refer to the Typical Performance Curves section’s AC performance graphs.

 2017 Microchip Technology Inc. DS20005836A-page 7

MIC862

TEMPERATURE SPECIFICATIONS (Note 1)

Parameters Sym. Min. Typ. Max. Units Conditions

Temperature Ranges

Operating Temperature Range — –40 — +125 °C —

Storage Temperature Range TS— — +150 °C —

Ambient Temperature Range TA–40 — +85 °C —

Package Thermal Resistance

Thermal Resistance SOT-23-8 JA — 100 — °C/W Using 4-Layer PCB

JC — 70 — °C/W Using 4-Layer PCB

Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable

junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the

maximum allowable power dissipation will cause the device operating junction temperature to exceed the

maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.

40”!) ‘ 55°C N a: q a 2 1.; GE (1V) «m V v // a? P NNéU / 8; 0741 29 3 0 33222111 3.5 hzmmmno CDUKGNEOIm Sourcmg 2345578910 OUTPUT CURRENT (MA) I 0 2. 7. 7... 0004414229.. cc 3459 SaSo OUTPUT CURRENT 1111A) 4 4 4 322211 3.5 hzmmmao PEUEUFKOIW 7 2 Sourcmg , 7 ,1, 2221111000 3 W259 Sago -18 -24 ~30 ~12 OUTPUT CURRENT 1mA) m o 85°C 2365678910 OUTPUT CURRENT (mA) 1 48.7. 9.06.0 0.1, 00mm m1 V 3453 Sago

MIC862

DS20005836A-page 8  2017 Microchip Technology Inc.

2.0 TYPICAL PERFORMANCE CURVES

FIGURE 2-1: Short-Circuit Current vs.

Supply Voltage.

FIGURE 2-2: Output Voltage vs. Output

Current.

FIGURE 2-3: Output Voltage vs. Output

Current.

FIGURE 2-4: Short-Circuit Current vs.

Supply Voltage.

FIGURE 2-5: Output Voltage vs. Output

Current.

FIGURE 2-6: Output Voltage vs. Output

Current.

Note: The graphs and tables provided following this note are a statistical summary based on a limited number of

samples and are provided for informational purposes only. The performance characteristics listed herein

are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified

operating range (e.g., outside specified power supply range) and therefore outside the warranted range.

w SUPPLY CURRENT/CHWN A A N m w w u b N, . .N 0," DF___F—NN SUPPLY VOLTAGE (:V) m. N OFFSET VOLTAGE (mV) 2.— 254 N 4 ”(40°C - 5 >1 >05 0 05 1 COMMON-MODE VOLTAGE (V) ooooooo OFFSET VOLTAGE [mV) 4710 -2o 0 20 4o 60 so 100 TEMPERATURE [”C) SHORT-CIRCLN CURRENT (mA) m N Soulcin \\ Q 25 \\ V: = :2 5v \ T v+ = +1 35v 40-20 0 20 40 so (1)100 TEMPERATURE (=0) capo 1 ’ 25°C OFFSET VOLTAGE 1mV) b 740:0 41.354.154.05 0 0511.5 2 COMMONVMODE VOLTAGE (V) SHORT-CIRCUIT CURRENT (mA) m Mum \ Sinkmg \ v: : :2 5V | 5 5 . v; : n.35v v 4040 0 21] 40 93 $100 TEMPERATUREPC)

 2017 Microchip Technology Inc. DS20005836A-page 9

MIC862

FIGURE 2-7: Supply Current vs. Supply

Voltage.

FIGURE 2-8: Offset Voltage vs.

Temperature.

FIGURE 2-9: Offset Voltage vs.

Common-Mode Voltage.

FIGURE 2-10: Offset Voltage vs.

Common-Mode Voltage.

FIGURE 2-11: Short-Circuit Current vs.

Temperature.

FIGURE 2-12: Short-Circuit Current. vs.

Temperature.

5 225 ..... .. . 130 4 ‘30 135 :1 135 2 a E a a a E 5 g 31 5 % E < z="" 5="" 7‘="" 5="" e="" 5="" 45="" g="" v="" +1="" 35v="" 90="" 90="" ~="" 5d,,="" _="" 135="" \="" 135="" rl="1MQ" ‘30="" 4*="" rl:1m.(2="" \="" 180="" 5="" 7225="" 75="" 225="" 100k="" 1m="" 10m="" 10k="" 100k="" 1m="" 10m="" frequencv(h1)="" frequencv(h1|="" 2="" 225="" 2="" ‘="" 25="" 20="" 180="" 2="" j="" 130="" 1="" 135="" 1="" 1="" 135="" 1="" d="" 1="" ‘="" 0="" e="" g="" 3="" 4="" e="" 3="" 5="" %="" e="" \="" 5="" a="" z="" \="" ,="" 4="" z="">< a="" 75="" \="" 5="" e="" 5="" \="" 45="" e="" ,10="" so="" .1="" \="" so="" ‘15="" 125="" .15="" 135="" 2="" 150="" 2="" rfsm="" 180="" '="" '2="" r,="2um" 225="" .2="" 22="" ,="" 0k="" 100k="" 1m="" 10m="" 5="" ink="" 100k="" 1m="" 10m="" frequency="" (hz)="" frequency="" 1h2)="" 150="" 180="" 1="" 135="" 1="" 135="" 1="" 1="" 5="" 5="" a="" r="" a="" g="" s="" m="" e="" w="" e="" '="" 5="" 2="" g="" -="" 5="" g="" g="" 4="" 90="" g="" g="" -1="" 90="" g="" -1="" 1135v="" 135="" -1="" 135="" ‘="" 25f="" 1am="" -="" 180="" '2="" rl="5kﬂ" '="" 225="" '2="" r‘="" :50="" '2="" '="" '="" 225="" 270="" -270="" ‘1x="" 10k="" 100k="" 1m="" 10m="" frequenchhi)="" wk="" 10k="" 100k="" 1m="" 10m="" frequency="" (hz)="">

MIC862

DS20005836A-page 10  2017 Microchip Technology Inc.

FIGURE 2-13: Gain Bandwidth and Phase

Margin.

FIGURE 2-14: Gain Frequency Response.

FIGURE 2-15: Unity Gain Frequency

Response.

FIGURE 2-16: Gain Bandwidth and Phase

Margin.

FIGURE 2-17: Gain Frequency Response.

FIGURE 2-18: Unity Gain Frequency

Response.

dNubUI a u GAIN (as) PHASE“) ,1 35 180 225 100k 1M 10M FREQUENCY (Hz) PSRR (dB) 1 10 100 1k 10kmok1M 10M FREQUENCY (Hz) Nmzn FSRR (as) -Nua 1 101001K 10k100k1M1DM FREQUENCYfHZ) CROSSTALK (dB) 5 {a mo FREQUENCY (kHz) Ioou

 2017 Microchip Technology Inc. DS20005836A-page 11

MIC862

FIGURE 2-19: Gain Bandwidth and Phase

Margin.

FIGURE 2-20: PSRR vs. Frequency.

FIGURE 2-21: Small Signal Response.

FIGURE 2-22: PSRR vs. Frequency.

FIGURE 2-23: Channel-to-Channel

Crosstalk.

FIGURE 2-24: Small Signal Response.

TIME 500ns/div

TUPNI

vid/Vm05

TUPTUO

vid/Vm05

= 1

V± = ±1.35V

= 1.7pF

 0ȍ

TIME 500ns/div

TUPNI

vid/Vm05

TUPTUO

vid/Vm05

= 1

V± = ±2.5V

= 1.7pF

 0ȍ

MIC862

DS20005836A-page 12  2017 Microchip Technology Inc.

FIGURE 2-25: Small Signal Response.

FIGURE 2-26: Small Signal Response.

FIGURE 2-27: Small Signal Response.

FIGURE 2-28: Small Signal Response.

FIGURE 2-29: Small Signal Pulse

Response.

FIGURE 2-30: Large Signal Response.

TIME 1μs/div

TUPNI

vid/Vm05

TUPTUO

vid/Vm05

= 1

V± = ±1.35V

= 50pF

 ȍ

TIME 1μs/div

TUPNI

vid/Vm05

TUPTUO

vid/Vm05

= 1

V± = ±2.5V

= 50pF

= 500Ω

TIME 500ns/div

TUPNI

vid/Vm05

TUPTUO

vid/Vm05

= 1

V± = ±1.35V

= 1000pF

 ȍ

TIME 500ns/div

TUPNI

vid/Vm05

TUPTUO

vid/Vm05

= 1

V± = ±2.5V

= 1000pF

 ȍ

TIME 500ns/div

TUPTUO

vid/Vm05

TUPNI

vid/Vm05

= 1

V+ = +1.5V

V– = –0.5V

= 1.7pF

 0ȍ

TIME 5μs/div

AV = 1

V± = ±1.35V

CL = 1.7pF

RL = 1MΩ

TUPTUO

vid/Vm005

Positive Slew Rate = 1.5V/μs

Negative Slew Rate = 2.0V/μs

 2017 Microchip Technology Inc. DS20005836A-page 13

MIC862

FIGURE 2-31: Large Signal Response.

FIGURE 2-32: Large Signal Response.

FIGURE 2-33: Large Signal Response.

FIGURE 2-34: Large Signal Pulse

Response.

FIGURE 2-35: Large Signal Pulse

Response.

FIGURE 2-36: Large Signal Pulse

Response.

TIME 5μs/div

AV = 1

V± = ±2.5V

CL = 1.7pF

RL = 1MΩ

TUPTUO

vid/V1

Positive Slew Rate = 1.8V/μs

Negative Slew Rate = 4.1V/μs

TIME 5μs/div

AV= 1

V± = ±1.35V

CL = 50pF

RL = 500Ω

TUPTUO

vid/Vm005

Positive Slew Rate = 1.5V/μs

Negative Slew Rate = 2.8V/μs

TIME 5μs/div

TUPTUO

vid/V1

AV = 1

V± = ±2.5V

CL = 50pF

RL = 500Ω

Positive Slew Rate = 1.8V/μs

Negative Slew Rate = 4.7V/μs

TIME 5μs/div

TUPTUO

vid/Vm005

AV = 1

V± = ±1.35V

CL = 1000pF

RL = 500Ω

Positive Slew Rate = 1.3V/μs

Negative Slew Rate = 3.6V/μs

TIME 5μs/div

TUPTUO

vid/V1

AV = 1

V± = ±2.5V

CL = 1000pF

RL = 500Ω

Positive Slew Rate = 1.3V/μs

Negative Slew Rate = 3.6V/μs

TIME 5μs/div

TUPTUO

vid/Vm02

= 1

V+ = +1.5V

V– = –0.5V

= 1.7pF

= 1MΩ

Positive Slew Rate = 1.17V/μs

Negative Slew Rate = 2.0V/μs

MIC862

DS20005836A-page 14  2017 Microchip Technology Inc.

FIGURE 2-37: Rail-to-Rail Operation.

FIGURE 2-38: Rail-to-Rail Operation.

FIGURE 2-39: Rail-to-Rail Operation.

FIGURE 2-40: Rail-to-Rail Operation.

TIME 250μs/div

TUPNI

vid/Vm005

TUPTUO

vid/V1

= 2

V± = ±1.35V

= 2pF

= 1MΩ

= 20kΩΔV = 2.7V

TIME 250μs/div

TUPNI

vid/Vm005

TUPTUO

vid/V1

= 2

V± = ±2.5V

= 2pF

= 1MΩ

= 20kΩΔV = 5V

TIME 250μs/div

TUPNI

vid/Vm005

TUPTUO

vid/V1

= 2

V± = ±1.35V

= 2 pF

= 5kΩ

= 20kΩΔV = 2.7V

TIME 250μs/div

TUPNI

vid/V1

TUPTUO

vid/V2

= 2

V± = ±2.5V

= 2pF

= 5kΩ

= 20kΩΔV = 5V

 2017 Microchip Technology Inc. DS20005836A-page 15

MIC862

3.0 PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 3-1.

TABLE 3-1: PIN FUNCTION TABLE

Pin Number Symbol Description

1 OUTA Amplifier A Output.

2 INA– Amplifier A Inverting Input.

3 INA+ Amplifier A Non-Inverting Input

4 V– Negative Supply.

5 INB+ Amplifier B Non-Inverting Input.

6 INB– Amplifier B Inverting Input.

7 OUTB Amplifier B Output.

8 V+ Positive Supply.

MIC862

DS20005836A-page 16  2017 Microchip Technology Inc.

4.0 APPLICATION INFORMATION

4.1 Power Supply Bypassing

Regular supply bypassing techniques are

recommended. A 10 F capacitor in parallel with a

0.1 F capacitor on both the positive and negative

supplies are ideal. For best performance all bypassing

capacitors should be located as close to the op amp as

possible and all capacitors should be low ESL

(equivalent series inductance), ESR (equivalent series

resistance). Surface-mount ceramic capacitors are

ideal.

4.2 Supply and Loading Resistive

Considerations

The MIC862 is intended for single-supply applications

configured with a grounded load. It is not advisable to

operate the MIC862 under either of the following

conditions:

• A grounded load and split supplies (±V)

• A single supply where the load is terminated

above ground.

Under the above conditions, if the load is less than

20 k and the output swing is greater than 1V (peak),

there may be some instability when the output is

sinking current.

4.3 Capacitive Load

When driving a large capacitive load, a resistor of 500

is recommended to be connected between the op amp

output and the capacitive load to avoid oscillation.

ogx 0&4 NNN Pbrfree JEDEC designamr( )

 2017 Microchip Technology Inc. DS20005836A-page 17

MIC862

5.0 PACKAGING INFORMATION

5.1 Package Marking Information

Example

8-Pin SOT-23*

XXX

NNN

A34

943

Legend: XX...X Product code or customer-specific information

Y Year code (last digit of calendar year)

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week ‘01’)

NNN Alphanumeric traceability code

Pb-free JEDEC® designator for Matte Tin (Sn)

*This package is Pb-free. The Pb-free JEDEC designator ( )

can be found on the outer packaging for this package.

, , Pin one index is identified by a dot, delta up, or delta down (triangle

mark).

Note: In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available

characters for customer-specific information. Package may or may not include

the corporate logo.

Underbar (_) and/or Overbar () symbol may not be to scale.

TITLE 8 LEAD SOT23 PA ,AGE OUT:IKE & RECOMMENDED LAND PATTERN DRAWING # SOTEEiHLD’PL’i Lead Frame Copper Alloy Lead Finlsh HM; wk arm A cum: m :‘ﬁsamun mwz/ / UNIT MM Ma:te Tm vmmwm uwznsmus sum/N m w) swam mm. NUM MAX. A 7 7 us M man 7 «7 v3 AZ an MS ‘ w b uzz 7 m c m 7 m n m as: E m ms. g 150 5: e m 33/: a ma ssc. L am 0,05 m u n so as: u us 5ch w u m 7 7 m o w 7 m: 9 n' 4- a m 5- w ‘5- umz . ‘ mm: arm: un7‘7a m Dﬂﬂi' 2 59 095 Dﬂﬂi' ow maumnm um Pan-nu

MIC862

DS20005836A-page 18  2017 Microchip Technology Inc.

8-Lead SOT-23 Package Outline and Recommended Land Pattern

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging.

 2017 Microchip Technology Inc. DS20005836A-page 19

MIC862

APPENDIX A: REVISION HISTORY

Revision A (August 2017)

• Converted Micrel document MIC862 to Microchip

data sheet template DS20005836A.

• Minor text changes throughout.

• Corrected the Product Identification System sec-

tion by removing an errorneous letter T from the

part number.

MIC862

DS20005836A-page 20  2017 Microchip Technology Inc.

NOTES:

PART NO.

 2017 Microchip Technology Inc. DS20005836A-page 21

MIC862

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.

Examples:

a) MIC862YM8-TR: Dual Ultra-Low Power Op

Amp, –40°C to +85°C

Junction Temperature

Range, 8-Lead SOT-23

Package, 3,000/Reel

PART NO. XX

Package

Device

Device: MIC862: Dual Ultra-Low Power Op Amp

Temperature: Y = –40°C to +85°C

Package: M8 = 8-Lead SOT-23

Media Type: TR = 3,000/Reel

Temperature

-XX

Media Type

Note 1: Tape and Reel identifier only appears in the

catalog part number description. This identifier is

used for ordering purposes and is not printed on

the device package. Check with your Microchip

Sales Office for package availability with the

Tape and Reel option.

MIC862

DS20005836A-page 22  2017 Microchip Technology Inc.

NOTES:

YSTEM

 2017 Microchip Technology Inc. DS20005836A-page 23

Information contained in this publication regarding device

applications and the like is provided only for your convenience

and may be superseded by updates. It is your responsibility to

ensure that your application meets with your specifications.

MICROCHIP MAKES NO REPRESENTATIONS OR

WARRANTIES OF ANY KIND WHETHER EXPRESS OR

IMPLIED, WRITTEN OR ORAL, STATUTORY OR

OTHERWISE, RELATED TO THE INFORMATION,

INCLUDING BUT NOT LIMITED TO ITS CONDITION,

QUALITY, PERFORMANCE, MERCHANTABILITY OR

FITNESS FOR PURPOSE. Microchip disclaims all liability

arising from this information and its use. Use of Microchip

devices in life support and/or safety applications is entirely at

the buyer’s risk, and the buyer agrees to defend, indemnify and

hold harmless Microchip from any and all damages, claims,

suits, or expenses resulting from such use. No licenses are

conveyed, implicitly or otherwise, under any Microchip

intellectual property rights unless otherwise stated.

Trademarks

The Microchip name and logo, the Microchip logo, AnyRate, AVR,

AVR logo, AVR Freaks, BeaconThings, BitCloud, CryptoMemory,

CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KEELOQ,

KEELOQ logo, Kleer, LANCheck, LINK MD, maXStylus,

maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB,

OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip

Designer, QTouch, RightTouch, SAM-BA, SpyNIC, SST, SST

Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered

trademarks of Microchip Technology Incorporated in the U.S.A.

and other countries.

ClockWorks, The Embedded Control Solutions Company,

EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS,

mTouch, Precision Edge, and Quiet-Wire are registered

trademarks of Microchip Technology Incorporated in the U.S.A.

Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any

Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo,

CodeGuard, CryptoAuthentication, CryptoCompanion,

CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average

Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial

Programming, ICSP, Inter-Chip Connectivity, JitterBlocker,

KleerNet, KleerNet logo, Mindi, MiWi, motorBench, MPASM, MPF,

MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,

Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,

PICtail, PureSilicon, QMatrix, RightTouch logo, REAL ICE, Ripple

Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI,

SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC,

USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and

ZENA are trademarks of Microchip Technology Incorporated in the

U.S.A. and other countries.

SQTP is a service mark of Microchip Technology Incorporated in

the U.S.A.

Silicon Storage Technology is a registered trademark of Microchip

Technology Inc. in other countries.

GestIC is a registered trademark of Microchip Technology

Germany II GmbH & Co. KG, a subsidiary of Microchip Technology

Inc., in other countries.

All other trademarks mentioned herein are property of their

respective companies.

ISBN: 978-1-5224-2084-2

Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the

intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data

Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our

products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts

allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Microchip received ISO/TS-16949:2009 certification for its worldwide

headquarters, design and wafer fabrication facilities in Chandler and

Tempe, Arizona; Gresham, Oregon and design centers in California

and India. The Company’s quality system processes and procedures

are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping

devices, Serial EEPROMs, microperipherals, nonvolatile memory and

analog products. In addition, Microchip’s quality system for the design

and manufacture of development systems is ISO 9001:2000 certified.

QUALITYMANAGEMENTS

YSTEM

CERTIFIEDBYDNV

== ISO/TS16949==

6‘ ‘MICRDCHIP

DS20005836A-page 24  2017 Microchip Technology Inc.

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