Macromelt is the material used by Bergquist for overmolding. It consists of a thermoplastic compound used to overmold electronic assemblies. This process uses lower temperature and pressure than typical injection overmolding. It is a process of using the material as the case for electronics. Cycle times are typically shorter than other circuit board protection methods and could help reduce total procurement costs.
 
                 
                 
                 
 
 
 
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