TPA2029D1 Datasheet by Texas Instruments

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IN-
IN+
PGND
OUT+
OUT-
10 Fm
ToBattery
AGC2
AGC1
EN
GPIO
MasterEnable
TPA2029D1
Digital
BaseBand
Analog
Baseband
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CODEC
PVdd
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IN m
TPA2029D1
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SLOS661A –DECEMBER 2011–REVISED APRIL 2012
3-W Mono Class-D Audio Amplifier With SmartGain™ AGC/DRC
Check for Samples: TPA2029D1
1FEATURES DESCRIPTION
The TPA2029D1 is a mono, filter-free Class-D audio
2• Filter-Free Class-D Architecture power amplifier with dynamic range compression
• 3 W Into 4 Ωat 5 V (10% THD+N) (DRC) and automatic gain control (AGC). It is
• 880 mW Into 8 Ωat 3.6 V (10% THD+N) available in a 1.63 mm x 1.63 mm WCSP package.
• Power Supply Range: 2.5 V to 5.5 V The DRC/AGC function in the TPA2029D1 can be
• 3 Selectable AGC functions enabled and disabled. The DRC/AGC function is
configured to automatically prevent distortion of the
• Low Supply Current: 1.8 mA audio signal and enhance quiet passages that are
• Low Shutdown Current: 0.2 μAnormally not heard. The DRC/AGC is also configured
• High PSRR: 80 dB to protect the speaker from damage at high power
levels and compress the dynamic range of music to fit
• Fast Start-up Time: 5 ms within the dynamic range of the speaker. The
• AGC Enable/Disable Function TPA2029D1 is capable of driving 3 W at 5 V into 4Ω
• Limiter Enable/Disable Function load or 880 mW at 3.6 V into 8Ωload. The device
features an enable pin and also provides thermal and
• Short-Circuit and Thermal Protection short circuit protection.
• Space-Saving Package In addition to these features, a fast start-up time and
– 1.63 mm × 1.63 mm WCSP (YZF) small package size make the TPA2029D1 an ideal
choice for Notebook PCs, PDAs and other portable
APPLICATIONS applications.
• Wireless or Cellular Handsets and PDAs TPA2029D1 is available with different default
• Portable Navigation Devices AGC/DRC settings for various system requirements.
• Portable DVD Player See Table 2 for more detail.
• Notebook PCs
• Portable Radio
• Portable Games
• Educational Toys
• USB Speakers
SIMPLIFIED APPLICATION DIAGRAM
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2SmartGain is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date. Copyright © 2011–2012, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
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ControlInterface
IN+
IN-
AGC1
OUT+
OUT-
EN
AGC2
Class-D
Modulator
Volume
Control
Differential
Input
CIN
1 Fm
GPIO
Interface
ICEnable
Power
Stage
AGC
Reference
PGND
Biasand
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PVDD
AGC
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PGND
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AGC1
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AGC2
C 1 C 2 C 3
B 1 B 3B 2
A 1 A 2 A 3
TPA2029D1
SLOS661A –DECEMBER 2011–REVISED APRIL 2012
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
FUNCTIONAL BLOCK DIAGRAM
DEVICE PINOUT
WCSP (YZF) PACKAGE
(TOP VIEW)
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SLOS661A –DECEMBER 2011–REVISED APRIL 2012
PIN FUNCTIONS
PIN I/O/P DESCRIPTION
NAME WCSP
IN+ B3 I Positive audio input
IN– C3 I Negative audio input
EN B2 I Enable terminal (active high)
AGC2 A3 I AGC select function pin 2
AGC1 A2 I AGC select function pin 1
OUT+ B1 O Positive differential output
OUT– C1 O Negative differential output
PVDD C2 P Power supply
PGND A1 P Power ground
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted).
VALUE / UNIT
VDD Supply voltage PVDD –0.3 V to 6 V
EN, INR+, INR–, INL+, INL– –0.3 V to VDD+0.3 V
Input voltage AGC1, AGC2 –0.3 V to 6 V
Continuous total power dissipation See Dissipation Ratings Table
TAOperating free-air temperature range –40°C to 85°C
TJOperating junction temperature range –40°C to 150°C
Tstg Storage temperature range –65°C to 150°C
Human Body Model (HBM) 2 KV
Electro-Static Discharge
ESD Tolerance, all pins Charged Device Model (CDM) 500 V
RLOAD Minimum load resistance 3.6 Ω
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
DISSIPATION RATINGS TABLE(1)
PACKAGE TA≤25°C DERATING FACTOR TA= 70°C TA= 85°C
9-ball WCSP 1.19 W 9.52 mW/°C 0.76 W 0.62 W
(1) Dissipations ratings are for a 2-side, 2-plane PCB.
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AVAILABLE OPTIONS(1)
TAPACKAGED DEVICES(2) PART NUMBER SYMBOL
TPA2029D1YZFR QWI
–40°C to 85°C 9-pin, 1.63 mm × 1.63 mm WCSP TPA2029D1YZFT QWI
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com
(2) The YZF packages are only available taped and reeled. The suffix R indicates a reel of 3000; the suffix T indicates a reel of 250.
RECOMMENDED OPERATING CONDITIONS
MIN MAX UNIT
VDD Supply voltage PVDD 2.5 5.5 V
VIH High-level input voltage EN, AGC1, AGC2 1.3 V
VIL Low-level input voltage EN, AGC1, AGC2 0.6 V
TAOperating free-air temperature –40 85 °C
ELECTRICAL CHARACTERISTICS
at TA= 25°C, VDD = 3.6 V, EN = 1.3 V, and RL= 8 Ω+ 33 μH (unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VDD Supply voltage range 2.5 3.6 5.5 V
EN = 0.35 V, VDD = 2.5 V 0.1 1
ISDZ Shutdown quiescent current EN = 0.35 V, VDD = 3.6 V 0.2 1 µA
EN = 0.35 V, VDD = 5.5 V 0.3 1
VDD = 2.5 V 1.6 4.5
IDD Supply current VDD = 3.6 V 1.8 4.7 mA
VDD = 5.5 V 2.1 5.5
fSW Class D Switching Frequency 275 300 325 kHz
IIH High-level input current VDD = 5.5 V, EN = 5.8 V 1 µA
IIL Low-level input current VDD = 5.5 V, EN = –0.3 V –1 µA
tSTART Start-up time 2.5 V ≤VDD ≤5.5 V no pop, CIN ≤1μF 5 ms
Power on reset ON threshold 2 2.3 V
POR Power on reset hysteresis 0.2 V
RL= 8 Ω, Vicm = 0.5 V and Vicm = VDD – 0.8 V,
CMRR Input common mode rejection –75 dB
differential inputs shorted
Voo Output offset voltage VDD = 3.6 V, AV= 6 dB, RL= 8 Ω, inputs ac grounded 1.5 10 mV
ZOOutput Impedance in shutdown mode EN = 0.35 V 2 kΩ
Gain accuracy Compression and limiter disabled, Gain = 0 to 30 dB –0.5 0.5 dB
PSRR Power supply rejection ratio VDD = 2.5 V to 4.7 V –80 dB
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TPA2029D1
IN+
IN–
OUT+
OUT–
VDD
VDD
GND
CI
CI
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Output
+
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Load
30kHz
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Input
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1 Fm
TPA2029D1
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SLOS661A –DECEMBER 2011–REVISED APRIL 2012
OPERATING CHARACTERISTICS
at TA= 25°C, VDD = 3.6V, EN = 1.3 V, RL= 8 Ω+33 μH, and AV= 6 dB (unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
kSVR power-supply ripple rejection ratio VDD = 3.6 Vdc with ac of 200 mVPP at 217 Hz –70 dB
faud_in = 1 kHz; PO= 550 mW; VDD = 3.6 V 0.1%
faud_in = 1 kHz; PO= 1.25 W; VDD = 5 V 0.1%
THD+N Total harmonic distortion + noise faud_in = 1 kHz; PO= 710 mW; VDD = 3.6 V 1%
faud_in = 1 kHz; PO= 1.4 W; VDD = 5 V 1%
NrOutput integrated noise Av = 6 dB 42 μV
Av = 6 dB floor, A-weighted 30 μV
f Frequency response Av = 6 dB 20 20000 Hz
THD+N = 10%, VDD = 5 V, RL= 8 Ω1.72 W
THD+N = 10%, VDD = 3.6 V, RL= 8 Ω880 mW
PO(max) Maximum output power THD+N = 1%, VDD = 5 V, RL= 8 Ω1.4 W
THD+N = 1% , VDD = 3.6 V, RL= 8 Ω710 mW
THD+N = 10% , VDD = 5 V, RL= 4 Ω3 W
THD+N = 1%, VDD = 3.6 V, RL= 8 Ω, PO= 0.71 W 91%
ηEfficiency THD+N = 1%, VDD = 5 V, RL= 8 Ω, PO= 1.4 W 93%
Figure 1. TEST SET-UP FOR GRAPHS
(1) All measurements were taken with a 1-μF CI(unless otherwise noted.)
(2) A 33-μH inductor was placed in series with the load resistor to emulate a small speaker for efficiency measurements.
(3) The 30-kHz low-pass filter is required, even if the analyzer has an internal low-pass filter. An RC low-pass filter (1 kΩ
4.7 nF) is used on each output for the data sheet graphs.
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VDD − Supply Voltage − V
0
1
2
3
4
5
6
7
8
9
10
2.5 3.0 3.5 4.0 4.5 5.0 5.5
IDD − Quiescent Supply Current − mA
G001
RL = 8 Ω + 33 µH
EN = VDD
f − Frequency − Hz
THD+N − Total Harmonic Distortion + Noise − %
20 100 1k 20k
10
0.1
0.01
0.001
G008
Gain = 6 dB
RL = 8 Ω + 33 µH
VDD = 3.6 V
1
10k
PO = 0.05 W
PO = 0.5 W
PO = 0.25 W
TPA2029D1
SLOS661A –DECEMBER 2011–REVISED APRIL 2012
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TYPICAL CHARACTERISTICS
with C(DECOUPLE) = 1 μF, CI= 1 µF.
All THD + N graphs are taken with outputs out of phase (unless otherwise noted).
All data is taken on left channel.
Table of Graphs
FIGURE
Quiescent supply current vs Supply voltage Figure 2
Total harmonic distortion + noise vs Frequency Figure 3
Total harmonic distortion + noise vs Frequency Figure 4
Total harmonic distortion + noise vs Output power Figure 5
Supply ripple rejection ratio vs Frequency Figure 6
Efficiency vs Output power (per channel) Figure 7
Total power dissipation vs Total output power Figure 8
Total supply current vs Total output power Figure 9
Output power vs Supply voltage Figure 10 ,Figure 11
Shutdown time Figure 12
Startup time Figure 13
QUIESCENT SUPPLY CURRENT TOTAL HARMONIC DISTORTION + NOISE
vs vs
SUPPLY VOLTAGE FREQUENCY
Figure 2. Figure 3.
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f − Frequency − Hz
THD+N − Total Harmonic Distortion + Noise − %
20 100 1k 20k
10
0.1
0.01
0.001
G009
Gain = 6 dB
RL = 8 Ω + 33 µH
VDD = 5 V
1
10k
PO = 0.5 W
PO = 0.1 W
PO = 1 W
PO − Output Power − W
THD+N − Total Harmonic Distortion + Noise − %
0.01 0.1 1 3
100
1
0.1
0.01
G012
Gain = 6 dB
RL = 8 Ω + 33 µH
f = 1 kHz
10
VDD = 3.6 V
VDD = 5 V
−80
−70
−60
−50
−40
−30
−20
−10
0
f − Frequency − Hz
KSVR − Supply Ripple Rejection Ratio − dB
G014
Gain = 6 dB
RL = 8 Ω + 33 µH
20 100 1k 20k10k
VDD = 2.5 V
VDD = 5 V
VDD = 3.6 V
PO − Output Power − W
0
10
20
30
40
50
60
70
80
90
100
0.0 0.5 1.0 1.5 2.0
η − Efficiency − %
G015
Gain = 6 dB
RL = 8 Ω + 33 µH
f = 1 kHz
VDD = 2.5 V VDD = 3.6 V VDD = 5 V
PO − Output Power − W
0.00
0.02
0.04
0.06
0.08
0.10
0.12
0.14
0.0 0.5 1.0 1.5 2.0
PD − Power Dissipation − W
G016
Gain = 6 dB
RL = 8 Ω + 33 µH
f = 1 kHz
VDD = 5 V
VDD = 3.6 V
VDD = 2.5 V
PO − Output Power − W
0.00
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
0.45
0.50
0.0 0.5 1.0 1.5 2.0
IDD − Supply Current − A
G017
Gain = 6 dB
RL = 8 Ω + 33 µH
f = 1 kHz
VDD = 3.6 V
VDD = 2.5 V
VDD = 5 V
TPA2029D1
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SLOS661A –DECEMBER 2011–REVISED APRIL 2012
TOTAL HARMONIC DISTORTION + NOISE TOTAL HARMONIC DISTORTION + NOISE
vs vs
FREQUENCY OUTPUT POWER
Figure 4. Figure 5.
EFFICIENCY
vs
SUPPLY RIPPLE REJECTION RATIO OUTPUT POWER (PER CHANNEL)
Figure 6. Figure 7.
TOTAL POWER DISSIPATION TOTAL SUPPLY CURRENT
vs vs
TOTAL OUTPUT POWER TOTAL OUTPUT POWER
Figure 8. Figure 9.
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VDD − Supply Voltage − V
0.0
0.5
1.0
1.5
2.0
2.5
2.5 3.0 3.5 4.0 4.5 5.0 5.5
PO − Output Power − W
G021
Gain = 6 dB
RL = 8 Ω + 33 µH
f = 1 kHz
THD = 1%
THD = 10%
VDD − Supply Voltage − V
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
2.5 3.0 3.5 4.0 4.5 5.0 5.5
PO − Output Power − W
G022
Gain = 6 dB
RL = 4 Ω + 33 µH
f = 1 kHz
THD = 1%
THD = 10%
140
130
120
110
100
90
80
70
60
50
40
30
20
10
0
0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30
Gain – dB
Z – Input Impedance – k
IW
TPA2029D1
SLOS661A –DECEMBER 2011–REVISED APRIL 2012
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OUTPUT POWER OUTPUT POWER
vs vs
SUPPLY VOLTAGE SUPPLY VOLTAGE
Figure 10. Figure 11.
VOLTAGE VOLTAGE
vs vs
SHUTDOWN TIME STARTUP TIME
Figure 12. Figure 13.
Nominal Input Impedance - Per Leg
Figure 14.
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APPLICATION INFORMATION
AUTOMATIC GAIN CONTROL
The Automatic Gain Control (AGC) feature provides continuous automatic gain adjustment to the amplifier
through an internal PGA. This feature enhances the perceived audio loudness and at the same time prevents
speaker damage from occurring (Limiter function).
The AGC works by detecting the audio input envelope. The gain changes depending on the amplitude, the limiter
level, the compression ratio, and the attack and release time. The gain changes constantly as the audio signal
increases and/or decreases to create the compression effect. The gain step size for the AGC is 0.5 dB. If the
audio signal has near-constant amplitude, the gain does not change. Figure 15 shows how the AGC works.
A. Gain decreases with no delay; attack time is reset. Release time and hold time are reset.
B. Signal amplitude above limiter level, but gain cannot change because attack time is not over.
C. Attack time ends; gain is allowed to decrease from this point forward by one step. Gain decreases because the
amplitude remains above limiter threshold. All times are reset
D. Gain increases after release time finishes and signal amplitude remains below desired level. All times are reset after
the gain increase.
E. Gain increases after release time is finished again because signal amplitude remains below desired level. All times
are reset after the gain increase.
Figure 15. Input and Output Audio Signal vs Time
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Gain-dB
V -dBV
IN
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Since the number of gain steps is limited the compression region is limited as well. The following figure shows
how the gain changes vs. the input signal amplitude in the compression region.
Figure 16. Input Signal Voltage vs Gain
Thus the AGC performs a mapping of the input signal vs. the output signal amplitude.
Pins AGC1 and AGC 2 are used to enable/disable the limiter, compression, and noise gate function. Table 1
shows each function.
Table 1. FUNCTION DEFINITION FOR AGC1 AND AGC2
AGC1 AGC2 Function
0 0 AGC Function disabled
0 1 AGC Limiter Function enabled
1 0 AGC, Limiter, and Compression Functions enabled
1 1 AGC, Limiter, Compression, and Noise Gate Functions enabled
The default values for the TPA2029D1 AGC function are given in Table 2. The default values can be changed at
the factory during production. Refer to the TI representative for assistance with different default value requests.
Table 2. AGC DEFAULT VALUES
AGC Parameters TPA2029D1
Attack Time 14.084 ms / 6 dB step
Release Time 822 ms/ 6 dB step
Hold Time off
Fixed Gain 9 dB
NoiseGate Threshold 4 mV
Output Limiter Level 9 dBV
Max Gain 30 dB
Compression Ratio 2:1
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l TEXAS INSTRUMENTS A J JA DMAX
C
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1
f = (2 R C )p ´ ´
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JA
1 1
θ 105 C/W
Derating Factor 0.0095
= = =
A J JA DMAX
T Max = T Max - θ P = 150 - 105 (0.4) = 108 C°
TPA2029D1
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DECOUPLING CAPACITOR (CS)
The TPA2029D1 is a high-performance Class-D audio amplifier that requires adequate power supply decoupling
to ensure the efficiency is high and total harmonic distortion (THD) is low. For higher frequency transients,
spikes, or digital hash on the line, a good low equivalent-series-resistance (ESR) 1-μF ceramic capacitor
(typically) placed as close as possible to the device PVDD lead works best. Placing this decoupling capacitor
close to the TPA2029D1 is important for the efficiency of the Class-D amplifier, because any resistance or
inductance in the trace between the device and the capacitor can cause a loss in efficiency. For filtering lower-
frequency noise signals, a 4.7 μF or greater capacitor placed near the audio power amplifier would also help, but
it is not required in most applications because of the high PSRR of this device.
INPUT CAPACITORS (CI)
The input capacitors and input resistors form a high-pass filter with the corner frequency, fC, determined in
Equation 1.
(1)
The value of the input capacitor is important to consider as it directly affects the bass (low frequency)
performance of the circuit. Speakers in wireless phones cannot usually respond well to low frequencies, so the
corner frequency can be set to block low frequencies in this application. Not using input capacitors can increase
output offset. Equation 2 is used to solve for the input coupling capacitance. If the corner frequency is within the
audio band, the capacitors should have a tolerance of ±10% or better, because any mismatch in capacitance
causes an impedance mismatch at the corner frequency and below.
(2)
COMPONENT LOCATION
Place all the external components very close to the TPA2029D1. Placing the decoupling capacitor, CS, close to
the TPA2029D1 is important for the efficiency of the Class-D amplifier. Any resistance or inductance in the trace
between the device and the capacitor can cause a loss in efficiency.
EFFICIENCY AND THERMAL INFORMATION
The maximum ambient temperature depends on the heat-sinking ability of the PCB system. The derating factor
for the packages are shown in the dissipation rating table. Converting this to θJA for the WCSP package:
(3)
Given θJA of 100°C/W, the maximum allowable junction temperature of 150°C, and the maximum internal
dissipation of 0.4 W for 3 W output power into 4-Ωload, 5-V supply, from Figure 7, the maximum ambient
temperature can be calculated with the following equation.
(4)
Equation 4 shows that the calculated maximum ambient temperature is 108°C at maximum power dissipation
with a 5-V supply and 4-Ωa load. The TPA2029D1 is designed with thermal protection that turns the device off
when the junction temperature surpasses 150°C to prevent damage to the IC. Also, using speakers more
resistive than 8-Ωdramatically increases the thermal performance by reducing the output current and increasing
the efficiency of the amplifier.
OPERATION WITH DACS AND CODECS
In using Class-D amplifiers with CODECs and DACs, sometimes there is an increase in the output noise floor
from the audio amplifier. This occurs when mixing of the output frequencies of the CODEC/DAC mix with the
switching frequencies of the audio amplifier input stage. The noise increase can be solved by placing a low-pass
filter between the CODEC/DAC and audio amplifier. This filters off the high frequencies that cause the problem
and allow proper performance. See the functional block diagram.
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FILTER FREE OPERATION AND FERRITE BEAD FILTERS
A ferrite bead filter can often be used if the design is failing radiated emissions without an LC filter and the
frequency sensitive circuit is greater than 1 MHz. This filter functions well for circuits that just have to pass FCC
and CE because FCC and CE only test radiated emissions greater than 30 MHz. When choosing a ferrite bead,
choose one with high impedance at high frequencies, and low impedance at low frequencies. In addition, select a
ferrite bead with adequate current rating to prevent distortion of the output signal.
Use an LC output filter if there are low frequency (< 1 MHz) EMI sensitive circuits and/or there are long leads
from amplifier to speaker. Figure 17 shows typical ferrite bead and LC output filters.
Figure 17. Typical Ferrite Bead Filter (Chip bead example: TDK: MPZ1608S221A)
PACKAGE INFORMATION
Package Dimensions
The package dimensions for this YZF package are shown in the table below. See the package drawing at the
end of this data sheet for more details.
Table 3. YZF Package Dimensions
Packaged Devices D E
Min = 1594μm Min = 1594μm
TPA2029D1YZF Max = 1654μm Max = 1654μm
REVISION HISTORY
Changes from Revision December 2011 (*) to Revision A Page
• Added Figure 14 ................................................................................................................................................................... 8
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PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
TPA2029D1YZFR ACTIVE DSBGA YZF 9 3000 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 85 QWI
TPA2029D1YZFT ACTIVE DSBGA YZF 9 250 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 85 QWI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
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I TEXAS INSTRUMENTS
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 2
I TEXAS INSTRUMENTS REEL DIMENSIONS TAPE DIMENSIONS 7 “K0 '«m» Reel Diame|er AD Dimension deswgned to accommodate the componem wwdlh E0 Dimension desxgned to accommodate the componenl \ength KO Dimenslun deswgned to accommodate the componem thickness 7 w OveraH wwdm loe earner cape i p1 Pitch between successwe cavuy cemers f T Reel Width (W1) QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE O O O D O O D O Sprockemoles ,,,,,,,,,,, ‘ User Direcllon 0' Feed Pockel Quadrams
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TPA2029D1YZFR DSBGA YZF 9 3000 180.0 8.4 1.71 1.71 0.81 4.0 8.0 Q1
TPA2029D1YZFT DSBGA YZF 9 250 180.0 8.4 1.71 1.71 0.81 4.0 8.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 18-Jun-2020
Pack Materials-Page 1
I TEXAS INSTRUMENTS TAPE AND REEL BOX DIMENSIONS
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TPA2029D1YZFR DSBGA YZF 9 3000 182.0 182.0 20.0
TPA2029D1YZFT DSBGA YZF 9 250 182.0 182.0 20.0
PACKAGE MATERIALS INFORMATION
www.ti.com 18-Jun-2020
Pack Materials-Page 2
f @5594. 363% 3,, { E{ @4 + O
www.ti.com
PACKAGE OUTLINE
C
0.625 MAX
0.35
0.15
1
TYP
1 TYP
0.5
TYP
0.5 TYP
9X 0.35
0.25
B E A
D
4219558/A 10/2018
DSBGA - 0.625 mm max heightYZF0009
DIE SIZE BALL GRID ARRAY
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
BALL A1
CORNER
SEATING PLANE
BALL TYP 0.05 C
A
123
0.015 C A B
SYMM
SYMM
B
C
SCALE 8.000
D: Max =
E: Max =
1.655 mm, Min =
1.655 mm, Min =
1.594 mm
1.594 mm
www.ti.com
EXAMPLE BOARD LAYOUT
0.05 MIN
0.05 MAX
9X ( 0.245)
(0.5) TYP
(0.5) TYP
( 0.245)
SOLDER MASK
OPENING
( 0.245)
METAL
4219558/A 10/2018
DSBGA - 0.625 mm max heightYZF0009
DIE SIZE BALL GRID ARRAY
NOTES: (continued)
3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
See Texas Instruments Literature No. SNVA009 (www.ti.com/lit/snva009).
SOLDER MASK DETAILS
NOT TO SCALE
SYMM
SYMM
C
1 2 3
A
B
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 40X
NON-SOLDER MASK
DEFINED
(PREFERRED)
EXPOSED
METAL
SOLDER MASK
OPENING
SOLDER MASK
DEFINED
METAL UNDER
SOLDER MASK
EXPOSED
METAL
www.ti.com
EXAMPLE STENCIL DESIGN
(0.5) TYP
(0.5) TYP
9X ( 0.25) (R0.05) TYP
4219558/A 10/2018
DSBGA - 0.625 mm max heightYZF0009
DIE SIZE BALL GRID ARRAY
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
SYMM
SYMM
123
C
A
B
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
SCALE: 40X
METAL
TYP
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