Adhesives, Epoxies, Greases, Pastes

Showing

of 577

Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Type	Size / Dimension	Usable Temperature Range	Color	Thermal Conductivity	Features	Shelf Life	Storage/Refrigeration Temperature
TC3-1G HEAT SINK THERMAL COMPOUND Chip Quik Inc.	1,320 In Stock	1 : Fr.4.67000 Bulk	CHIPQUIK®	Bulk	Active	Silicone Compound	1 gram Syringe	-40°F ~ 302°F (-40°C ~ 150°C)	Gray	8.50W/m-K	-	24 Months	37°F ~ 77°F (3°C ~ 25°C)
TC1-10G HEAT SINK COMPOUND - HIGH DENSIT Chip Quik Inc.	440 In Stock	1 : Fr.7.03000 Bulk	-	Bulk	Active	Silicone Compound	10 gram Syringe	-40°F ~ 302°F (-40°C ~ 150°C)	White	0.67W/m-K	-	60 Months	37°F ~ 77°F (3°C ~ 25°C)
250G THERMALCOTE GREASE TUBE 2OZ Boyd Laconia, LLC	859 In Stock	1 : Fr.10.65000 Bulk	Thermalcote™	Bulk	Active	Silicone Compound	2 oz Tube	-40°F ~ 399°F (-40°C ~ 204°C)	White	0.76W/m-K	-	Indefinite (Unopened)	-
TG-N909-30 NON-SILICONE THERMAL GREASE 30G t-Global Technology	800 In Stock	1 : Fr.11.63000 Bulk	TG-N909	Bulk	Active	Non-Silicone Grease	30 gram Container	-40°F ~ 392°F (-40°C ~ 200°C)	Gray	9.00W/m-K	Low Outgassing (ASTM E595)	18 Months	77°F (25°C) or Below
CW7270 HEAT SINK GREASE SILICONE FREE Chemtronics	536 In Stock	1 : Fr.13.53000 Bulk	CircuitWorks®	Bulk	Active	Non-Silicone Grease	7 gram Syringe	-99.4°F ~ 392°F (-73°C ~ 200°C)	White	0.71W/m-K	-	60 Months	-
CW7250 HEAT SINK GREASE BORON NITRIDE Chemtronics	446 In Stock	1 : Fr.17.62000 Bulk	CircuitWorks®	Bulk	Active	Non-Silicone Grease	3.4 gram Syringe	-99.4°F ~ 392°F (-73°C ~ 200°C)	White	1.85W/m-K	-	60 Months	-
GF1000-00-15-50CC GF1000 50CC DUAL CARTRIDGE Bergquist	127 In Stock	1 : Fr.19.95000 Box	Gap Filler 1000	Box	Active	Liquid Gap Filler, 2 Part	50cc Cartridge	-76°F ~ 347°F (-60°C ~ 175°C)	Gray	1.00W/m-K	-	6 Months	77°F (25°C)
9460TC-3ML THERMALLY CONDUCTIVE 1-PART EPOX MG Chemicals	440 In Stock	1 : Fr.20.12000 Bulk	9460TC	Bulk	Active	Epoxy Adhesive	3 ml Syringe	-85°F ~ 302°F (-65°C ~ 150°C)	White	0.80W/m-K	-	14 Months	50°F ~ 86°F (10°C ~ 30°C)
65-00-GEL37-0010 THERM-A-GAP GEL 37 3.7 W/M-K DIS Parker Chomerics	105 In Stock	1 : Fr.23.09000 Bottle	THERM-A-GAP™ GEL 37	Bottle	Active	Silicone Gel	10cc Syringe	-67°F ~ 392°F (-55°C ~ 200°C)	Blue	3.70W/m-K	Low Outgassing (ASTM E595)	18 Months	-
120-8 SILICONE GREASE 8 OZ JAR Wakefield Thermal Solutions	204 In Stock	1 : Fr.24.28000 Bulk	120	Bulk	Active	Silicone Compound	8 oz Jar	-40°F ~ 392°F (-40°C ~ 200°C)	White	0.73W/m-K	-	60 Months	-
846-80G GREASE CARBON ELEC CONDUCT 2.8OZ MG Chemicals	113 In Stock	1 : Fr.25.81000 Bulk	-	Bulk	Active	Silicone Grease	2.8 oz Container	-58°F ~ 392°F (-50°C ~ 200°C)	Black	-	Odorless	60 Months	50°F ~ 86°F (10°C ~ 30°C)
GF1500-00-60-50CC GF1500 50CC DUAL CARTRIDGE Bergquist	831 In Stock	1 : Fr.27.27000 Box	Gap Filler 1500	Box	Active	Liquid Gap Filler, 2 Part	50cc Cartridge	-76°F ~ 392°F (-60°C ~ 200°C)	Yellow	1.80W/m-K	-	6 Months	77°F (25°C)
8329TCS-6ML ADHESIVE - THERMAL CONDUCTIVE EP MG Chemicals	640 In Stock	1 : Fr.27.65000 Bulk	8329TCS	Bulk	Active	Epoxy, 2 Part	6 ml Syringe	-40°F ~ 302°F (-40°C ~ 150°C)	Gray	1.40W/m-K	Low Outgassing (ASTM E595)	36 Months	50°F ~ 86°F (10°C ~ 30°C)
1978-DP SILICONE FREE HEAT SINK COMP. Techspray	897 In Stock	1 : Fr.29.31000 Bulk	-	Bulk	Active	Non-Silicone Compound	4 oz Tube	-	Gray	-	-	60 Months	Ambient Temperature
TC3-10G HEAT SINK THERMAL COMPOUND Chip Quik Inc.	401 In Stock	1 : Fr.29.79000 Bulk	CHIPQUIK®	Bulk	Active	Silicone Compound	5cc Syringe	-40°F ~ 302°F (-40°C ~ 150°C)	Gray	8.50W/m-K	-	24 Months	37°F ~ 77°F (3°C ~ 25°C)
65-02-GEL35VT-0030 THERM-A-GAP GEL35VT 3.5W/MK 30CC Parker Chomerics	132 In Stock	1 : Fr.34.49000 Box	THERM-A-GAP™ GEL 35VT	Box	Active	Silicone Gel	30cc Syringe	-67°F ~ 392°F (-55°C ~ 200°C)	White	3.50W/m-K	Low Outgassing (ASTM E595)	24 Months	50°F ~ 90°F (10°C ~ 32.22°C)
8329TFS-25ML SLOW CURE THERM COND ADH FLOW MG Chemicals	195 In Stock	1 : Fr.39.27000 Bulk	8329TFS	Bulk	Active	Epoxy, 2 Part	25 ml Syringe	-40°F ~ 302°F (-40°C ~ 150°C)	Black	1.20W/m-K	-	36 Months	50°F ~ 86°F (10°C ~ 30°C)
GF3500S35-07-60-50CC LIQUID GAP FILLER THERMAL CONDU Bergquist	179 In Stock	1 : Fr.40.44000 Bulk	Gap Filler 3500S35	Bulk	Active	Liquid Gap Filler, 2 Part	50cc Cartridge	-76°F ~ 392°F (-60°C ~ 200°C)	Blue	3.60W/m-K	-	5 Months	77°F (25°C)
GF3500S35-00-60-50CC GF3500S35 50CC DUAL CARTRIDGE Bergquist	479 In Stock	1 : Fr.42.37000 Box	Gap Filler 3500S35	Box	Active	Liquid Gap Filler, 2 Part	50cc Cartridge	-76°F ~ 392°F (-60°C ~ 200°C)	Blue	3.60W/m-K	-	5 Months	77°F (25°C)
TC4-20G HEAT SINK THERMAL COMPOUND - DEE Chip Quik Inc.	153 In Stock	1 : Fr.43.46000 Bulk	CHIPQUIK®	Bulk	Active	Thermal Compound, Liquid Metal	20 gram Syringe	-40°F ~ 302°F (-40°C ~ 150°C)	Silver	79.00 W/m-K	-	60 Months	68°F ~ 77°F (20°C ~ 25°C)
65-00-GEL75-0010 THERM-A-GAP GEL 75 7.5 W/M-K DIS Parker Chomerics	1,006 In Stock	1 : Fr.47.89000 Bottle	THERM-A-GAP™ GEL 75	Bottle	Active	Silicone Gel	10cc Syringe	-67°F ~ 392°F (-55°C ~ 200°C)	White	7.50W/m-K	Low Outgassing (ASTM E595)	18 Months	50°F ~ 90°F (10°C ~ 32.22°C)
CW7100 CONDUCTIVE SILVER GREASE SYRINGE Chemtronics	615 In Stock	1 : Fr.54.37000 Bulk	CircuitWorks®	Bulk	Active	Silicone Grease	6.5 gram Syringe	-70°F ~ 485°F (-57°C ~ 252°C)	Silver	5.60W/m-K	-	120 Months	-
8329TFS-50ML SLOW CURE THERM COND ADH FLOW MG Chemicals	135 In Stock	1 : Fr.56.01000 Bulk	8329TFS	Bulk	Active	Epoxy, 2 Part	45 ml Cartridge	-40°F ~ 302°F (-40°C ~ 150°C)	Black	1.20W/m-K	-	36 Months	50°F ~ 86°F (10°C ~ 30°C)
8329TCS-50ML EPOXY MG Chemicals	60 In Stock	1 : Fr.58.25000 Bulk	8329TCS	Bulk	Active	Epoxy, 2 Part	50 ml Jar	-40°F ~ 302°F (-40°C ~ 150°C)	Gray	1.40W/m-K	Low Outgassing (ASTM E595)	36 Months	50°F ~ 86°F (10°C ~ 30°C)
65-02-GEL75-0030 THERM-A-GAP GEL 75 7.5 W/M-K DIS Parker Chomerics	2,255 In Stock	1 : Fr.64.06000 Bottle	THERM-A-GAP™ GEL 75	Bottle	Active	Silicone Gel	30cc Syringe	-67°F ~ 392°F (-55°C ~ 200°C)	White	7.50W/m-K	Low Outgassing (ASTM E595)	18 Months	50°F ~ 90°F (10°C ~ 32.22°C)

Showing

of 577

Products in this family are fluids, gels, or semi-solids used primarily to aid the heat transfer between objects such as a transistor and a heatsink or a printed circuit board assembly and a device enclosure. A variety of materials are included, some of which provide additional functions such as adhesive bonding, mechanical cushioning and shock absorption, or environmental sealing.