Heat Sinks

Results: 113,479
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113,479Results

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of 113,479
Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Package Cooled
Attachment Method
Shape
Length
Width
Diameter
Fin Height
Power Dissipation @ Temperature Rise
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Material
Material Finish
507302B00000G
507302B00000G
HEATSINK TO-220 2.5W LOW PROFILE
Boyd Laconia, LLC
34,091
In Stock
1 : Fr.0.27000
Bulk
-
Bulk
Active
Board Level
TO-220
Bolt On
Square, Fins
0.750" (19.05mm)
0.750" (19.05mm)
-
0.380" (9.65mm)
2.5W @ 60°C
10.00°C/W @ 200 LFM
24.00°C/W
Aluminum
Black Anodized
V7236B1
V7236B1
HEATSINK TO-220 19.05X13.21MM
Assmann WSW Components
23,920
In Stock
1 : Fr.0.29000
Bulk
-
Bulk
Active
Board Level
TO-220
Bolt On
Rectangular, Fins
0.750" (19.05mm)
0.520" (13.21mm)
-
0.500" (12.70mm)
-
-
24.00°C/W
Aluminum
Black Anodized
V8508A
V8508A
HEATSINK TO-220 19X12.80MM
Assmann WSW Components
7,773
In Stock
1 : Fr.0.35000
Bulk
-
Bulk
Active
Board Level
TO-220
Press Fit
Rectangular, Fins
0.748" (19.00mm)
0.504" (12.80mm)
-
0.500" (12.70mm)
3.0W @ 60°C
14.00°C/W @ 200 LFM
-
Aluminum
Black Anodized
574502B00000G
574502B00000G
HEATSINK TO-220 VERT MNT .75"
Boyd Laconia, LLC
28,047
In Stock
1 : Fr.0.36000
Bag
-
Bag
Active
Board Level
TO-220
Clip
Rectangular, Fins
0.750" (19.05mm)
0.860" (21.84mm)
-
0.395" (10.03mm)
3.0W @ 60°C
8.00°C/W @ 400 LFM
21.20°C/W
Aluminum
Black Anodized
12,973
In Stock
1 : Fr.0.39000
Bulk
-
Bulk
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Not Included)
Square, Pin Fins
0.335" (8.50mm)
0.335" (8.50mm)
-
0.315" (8.00mm)
-
-
32.00°C/W
Aluminum Alloy
Black Anodized
290-1AB
290-1AB
HEATSINK TO-220 VERT/HORZ BLK
Wakefield-Vette
22,529
In Stock
1 : Fr.0.42000
Bulk
Bulk
Active
Board Level
TO-218, TO-202, TO-220
Bolt On
Rectangular, Fins
1.180" (29.97mm)
1.000" (25.40mm)
-
0.500" (12.70mm)
2.0W @ 44°C
7.00°C/W @ 400 LFM
22.00°C/W
Aluminum
Black Anodized
V-1100-SMD/B-L
V-1100-SMD/B-L
HEAT SINK COPPER DPAK TO-252
Assmann WSW Components
21,463
In Stock
1 : Fr.0.46000
Bulk
-
Bulk
Active
Top Mount
TO-252 (DPak)
SMD Pad
Rectangular, Fins
0.320" (8.13mm)
0.790" (20.07mm)
-
0.390" (9.91mm)
-
-
25.00°C/W
Copper
Tin
V-1100-SMD/A-L
V-1100-SMD/A-L
HEATSINK TO-263 12.70X26.20MM
Assmann WSW Components
15,633
In Stock
1 : Fr.0.47000
Bulk
-
Bulk
Active
Top Mount
TO-263 (D²Pak)
SMD Pad
Rectangular, Fins
0.500" (12.70mm)
1.031" (26.20mm)
-
0.390" (9.91mm)
-
-
23.00°C/W
Copper
Tin
V2017B
V2017B
HEATSINK ANOD ALUM CPU
Assmann WSW Components
39,723
In Stock
1 : Fr.0.53000
Bulk
-
Bulk
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
-
Square, Pin Fins
0.394" (10.00mm)
0.394" (10.00mm)
-
0.275" (7.00mm)
-
-
31.00°C/W
Aluminum
Black Anodized
6,751
In Stock
1 : Fr.0.56000
Tray
-
Tray
Active
Board Level
TO-220
Bolt On and PC Pin
Rectangular, Fins
0.984" (25.00mm)
1.181" (30.00mm)
-
0.472" (12.00mm)
-
-
10.00°C/W
Aluminum
Black Anodized
V-1100-SMD/B
V-1100-SMD/B
HEAT SINK COPPER DPAK TO-252
Assmann WSW Components
85,782
In Stock
1 : Fr.0.63000
Cut Tape (CT)
400 : Fr.0.44865
Tape & Reel (TR)
-
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
Top Mount
TO-252 (DPak)
SMD Pad
Rectangular, Fins
0.320" (8.13mm)
0.790" (20.07mm)
-
0.390" (9.91mm)
-
-
25.00°C/W
Copper
Tin
573300D00010(G)
573300D00010G
HEATSINK D2PAK .4" HIGH SMD
Boyd Laconia, LLC
21,101
In Stock
1 : Fr.0.75000
Cut Tape (CT)
250 : Fr.0.56264
Tape & Reel (TR)
-
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
Top Mount
TO-263 (D²Pak)
SMD Pad
Rectangular, Fins
0.500" (12.70mm)
1.030" (26.16mm)
-
0.400" (10.16mm)
1.3W @ 30°C
10.00°C/W @ 200 LFM
18.00°C/W
Aluminum
Tin
576802B04000G
576802B04000G
HEAT SINK VERT PLUG-IN TO-220
Boyd Laconia, LLC
17,427
In Stock
1 : Fr.0.76000
Bulk
-
Bulk
Active
Board Level, Vertical
TO-220, TO-262
Clip and PC Pin
Rectangular, Fins
0.750" (19.05mm)
0.500" (12.70mm)
-
0.500" (12.70mm)
1.0W @ 30°C
7.00°C/W @ 400 LFM
27.30°C/W
Aluminum
Black Anodized
576802B03900G
576802B03900G
HEATSINK TO220 CLIPON W/TAB.75"
Boyd Laconia, LLC
9,965
In Stock
1 : Fr.0.76000
Bulk
-
Bulk
Active
Board Level, Vertical
TO-220, TO-262
Clip and PC Pin
Rectangular, Fins
0.750" (19.05mm)
0.500" (12.70mm)
-
0.500" (12.70mm)
1.0W @ 30°C
7.00°C/W @ 400 LFM
27.30°C/W
Aluminum
Black Anodized
110991327
110991327
HEAT SINK KIT FOR RASPBERRY PI 4
Seeed Technology Co., Ltd
16,140
In Stock
1 : Fr.0.80000
Bulk
-
Bulk
Active
Top Mount Kit
Raspberry Pi 4B
Adhesive
-
-
-
-
-
-
-
-
Aluminum
-
577102B00000G
577102B00000G
HEAT SINK TO-220 .375" COMPACT
Boyd Laconia, LLC
8,661
In Stock
1 : Fr.0.81000
Bag
-
Bag
Active
Board Level
TO-220
Bolt On
Rectangular, Fins
0.750" (19.05mm)
0.520" (13.21mm)
-
0.375" (9.52mm)
3.0W @ 80°C
12.00°C/W @ 200 LFM
25.90°C/W
Aluminum
Black Anodized
HSS15-B20-P40
HSS15-B20-P40
HEAT SINK, STAMPING, TO-220, 23.
Same Sky (Formerly CUI Devices)
1,311
In Stock
1 : Fr.0.84000
Box
Box
Active
Board Level, Vertical
TO-220
Bolt On and PC Pin
Rectangular
1.500" (38.10mm)
0.921" (23.40mm)
-
0.500" (12.70mm)
5.0W @ 75°C
8.50°C/W @ 200 LFM
15.16°C/W
Aluminum Alloy
Black Anodized
577202B00000G
577202B00000G
HEAT SINK TO-220 .500" COMPACT
Boyd Laconia, LLC
24,412
In Stock
1 : Fr.0.85000
Bag
-
Bag
Active
Board Level
TO-220
Bolt On
Rectangular, Fins
0.750" (19.05mm)
0.520" (13.21mm)
-
0.500" (12.70mm)
1.5W @ 40°C
10.00°C/W @ 200 LFM
24.40°C/W
Aluminum
Black Anodized
573100D00010G
573100D00010G
HEATSINK SMT D-PAK/TO-252 TIN
Boyd Laconia, LLC
23,660
In Stock
1 : Fr.1.11000
Cut Tape (CT)
250 : Fr.0.83088
Tape & Reel (TR)
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
Top Mount
TO-252 (DPak)
SMD Pad
Rectangular, Fins
0.315" (8.00mm)
0.900" (22.86mm)
-
0.400" (10.16mm)
0.8W @ 30°C
12.50°C/W @ 600 LFM
26.00°C/W
Aluminum
Tin
574502B03300G
574502B03300G
HEATSINK TO-220 VERT MNT W/TAB
Boyd Laconia, LLC
4,699
In Stock
1 : Fr.1.11000
Bulk
-
Bulk
Active
Board Level, Vertical
TO-220
Clip and PC Pin
Rectangular, Fins
0.750" (19.05mm)
0.810" (20.57mm)
-
0.390" (9.91mm)
3.0W @ 60°C
6.00°C/W @ 600 LFM
21.20°C/W
Aluminum
Black Anodized
3083
3083
ALUM HEAT SINK FOR RASPBERRY PI
Adafruit Industries LLC
3,380
In Stock
1 : Fr.1.22000
Bulk
-
Bulk
Active
Top Mount
Raspberry Pi 3
Thermal Tape, Adhesive (Included)
Square, Fins
0.551" (14.00mm)
0.551" (14.00mm)
-
0.315" (8.00mm)
-
-
-
Aluminum
-
513102B02500(G)
513102B02500G
HEATSINK TO-220 W/PINS 1.5"TALL
Boyd Laconia, LLC
402
In Stock
1 : Fr.1.26000
Bulk
-
Bulk
Active
Board Level, Vertical
TO-220
Bolt On and PC Pin
Rectangular, Fins
1.500" (38.10mm)
1.375" (34.93mm)
-
0.500" (12.70mm)
8.0W @ 80°C
3.00°C/W @ 500 LFM
11.00°C/W
Aluminum
Black Anodized
V-1102-SMD/A-L
V-1102-SMD/A-L
HEATSINK TO-263 19.38X25.40MM
Assmann WSW Components
3,794
In Stock
1 : Fr.1.32000
Bulk
-
Bulk
Active
Top Mount
TO-263 (D²Pak)
SMD Pad
Rectangular, Fins
0.763" (19.38mm)
1.000" (25.40mm)
-
0.450" (11.43mm)
-
23.00°C/W @ 300 LFM
11.00°C/W
Copper
Tin
637-10ABPE
637-10ABPE
HEATSINK TO-220 VERT MT BLK 1"
Wakefield-Vette
2,011
In Stock
1 : Fr.1.32000
Box
Box
Active
Board Level, Vertical
TO-220
Bolt On and Board Mounts
Rectangular, Fins
1.000" (25.40mm)
1.375" (34.93mm)
-
0.500" (12.70mm)
6.0W @ 76°C
5.80°C/W @ 200 LFM
-
Aluminum
Black Anodized
10,042
In Stock
1 : Fr.1.38000
Cut Tape (CT)
250 : Fr.1.02752
Tape & Reel (TR)
-
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
Top Mount
TO-263 (D²Pak)
-
Rectangular, Fins
0.500" (12.70mm)
1.031" (26.20mm)
-
0.401" (10.20mm)
-
9.50°C/W @ 200 LFM
18.00°C/W
Copper
Tin
Showing
of 113,479

Heat Sinks


Heat sinks are thermal management components designed to dissipate heat from high-power electronic devices and prevent overheating. Their core function is based on the principles of conduction, and convection, transferring heat from a heat source—such as a CPU, power transistor, or BGA package—to the surrounding air or a coolant. By increasing the surface area in contact with cooling media, heat sinks help maintain safe temperature levels and protect component reliability and performance.

Most heat sinks are made of aluminum or copper, materials known for their high thermal conductivity. Aluminum heat sinks are lightweight and cost-effective, ideal for general-purpose cooling solutions, while copper heat sinks offer better conductivity for high-performance or space-constrained applications. Finned and extrusion-style heat sinks use strategically shaped surfaces to maximize exposure to air, enhancing natural or forced convection. Cross-cut designs further improve airflow and thermal dispersion. In advanced applications, heat pipes, liquid cooling, or graphite spreaders may be used to rapidly move heat away from the source. For compact or passive systems, passive heat exchangers rely entirely on natural airflow without the use of fans.

Proper thermal contact between the heat sink and device is critical—thermal interface materials (TIMs) such as thermal paste, pads, or solder are used to fill microscopic gaps and reduce thermal resistance. When selecting a heat sink, consider the thermal output of the component, available space, airflow conditions, and the thermal resistance of the system.