Heat Sinks

Results: 113,698
Manufacturer
Adafruit Industries LLCAdvanced Thermal Solutions Inc.ARTESYN / Advanced EnergyAssmann WSW ComponentsBoyd Laconia, LLCBrainboxesComair RotronCTS ElectrocomponentsCTS Thermal Management ProductsDelta ElectronicsDFRobotEDATEC
Series
-*132133206208217218219230231232
Packaging
BagBoxBulkCut Tape (CT)Digi-Reel®Retail PackageStripTape & Reel (TR)TrayTube
Product Status
ActiveDiscontinued at Digi-KeyNot For New DesignsObsolete
Type
-Board LevelBoard Level with FanBoard Level, ExtrusionBoard Level, VerticalBoard Level, Vertical, ExtrusionHeat SpreaderHeat Spreader Kit, Top MountTop MountTop Mount KitTop Mount with FanTop Mount, ExtrusionTop Mount, SkivedTop Mount, Zipper Fin
Package Cooled
6-Dip and 8-Dip8-DIP12-SIP14-DIP and 16-DIP18-DIP20-DIP24-DIP28-DIP40-DIP-Allegro A4983Aluminum Housed Resistor
Attachment Method
2 Clips and PC Pin3 Clips and PC Pin-AdhesiveAdhesive (Not Included)Bolt OnBolt On and Board LocksBolt On and Board MountsBolt On and ClipBolt On and PC PinBolt On and Thermal Tape, Adhesive (Included)Bolt On, Thermal Material
Shape
-CylindricalCylindrical, Pin FinsRectangularRectangular, Angled FinsRectangular, FinsRectangular, Fins; Square, FinsRectangular, Pin FinsRhombusRoundSquareSquare, Angled FinsSquare, FinsSquare, Pin Fins
Length
0.113" (2.87mm)0.211" (5.35mm)0.250" (6.35mm)0.276" (7.00mm)0.279" (7.10mm)0.280" (7.11mm)0.295" (7.50mm)0.303" (7.70mm)0.310" (7.87mm)0.315" (8.00mm)0.320" (8.13mm)0.334" (8.50mm)
Width
0.054" (1.38mm)0.190" (4.83mm)0.220" (5.59mm)0.236" (6.00mm)0.250" (6.35mm)0.268" (6.81mm)0.270" (6.86mm)0.276" (7.00mm)0.295" (7.50mm)0.325" (8.26mm)0.335" (8.50mm)0.354" (9.00mm)
Diameter
0.180" (4.57mm) ID, 0.500" (12.70mm) OD0.220" (5.59mm) OD0.290" (7.37mm) ID0.300" (7.62mm) ID, 1.000" (25.40mm) OD0.300" (7.62mm) ID, 1.125" (28.57mm) OD0.305" (7.75mm) ID, 0.500" (12.70mm) OD0.315" (8.00mm) ID, 0.750" (19.05mm) OD0.315" (8.00mm) ID, 0.875" (22.23mm) OD0.315" (8.00mm) ID, 1.250" (31.75mm) OD0.316" (8.03mm) ID0.317" (8.05mm) ID, 0.375" (9.52mm) OD0.318" (8.07mm) ID, 0.500" (12.70mm) OD
Fin Height
0.002" (0.06mm)0.003" (0.07mm)0.008" (0.21mm)0.025" (0.64mm)0.032" (0.80mm)0.039" (1.00mm)0.041" (1.05mm)0.059" (1.50mm)0.079" (2.00mm)0.085" (2.15mm)0.089" (2.25mm)0.118" (3.00mm)
Power Dissipation @ Temperature Rise
0.3W @ 20°C0.4W @ 30°C0.5W @ 20°C0.5W @ 30°C0.5W @ 40°C0.5W @ 41°C0.6W @ 20°C0.6W @ 30°C0.6W @ 40°C0.6W @ 60°C0.8W @ 30°C1.0W @ 20°C
Thermal Resistance @ Forced Air Flow
0.08°C/W @ 500 LFM0.09°C/W @ 200 LFM0.09°C/W @ 500 LFM0.09°C/W @ 600 LFM0.10°C/W @ 100 LFM0.10°C/W @ 500 LFM0.11°C/W @ 500 LFM0.12°C/W @ 500 LFM0.13°C/W @ 500 LFM0.13°C/W @ 600 LFM0.15°C/W @ 250 LFM0.17°C/W @ 500 LFM
Thermal Resistance @ Natural
0.07°C/W0.08°C/W0.09°C/W0.10°C/W0.12°C/W0.13°C/W0.14°C/W0.15°C/W0.16°C/W0.17°C/W0.18°C/W0.19°C/W
Material
-AluminumAluminum AlloyAluminum, CopperAluminum, Copper, PlasticAluminum, PlasticBeryllium CopperBrassCeramicCompositeCopperCopper AlloyCopper TungstenSteel
Material Finish
-AavSHIELD 3CBlack AnodizedBlack CadmiumBlack CoatingBlack EbonolBlack PaintBlue AnodizedClean AnodizedClean FinishedDegreasedDull Nickel
Stocking Options
Environmental Options
Media
Marketplace Product
113,698Results
Showing
of 113,698
Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Package Cooled
Attachment Method
Shape
Length
Width
Diameter
Fin Height
Power Dissipation @ Temperature Rise
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Material
Material Finish
507302B00000G
507302B00000G
HEATSINK TO-220 2.5W LOW PROFILE
Boyd Laconia, LLC
36,389
In Stock
1 : Fr.0.29000
Bulk
-
Bulk
Active
Board Level
TO-220
Bolt On
Square, Fins
0.750" (19.05mm)
0.750" (19.05mm)
-
0.380" (9.65mm)
2.5W @ 60°C
10.00°C/W @ 200 LFM
24.00°C/W
Aluminum
Black Anodized
V8508A
V8508A
HEATSINK TO-220 19X12.80MM
Assmann WSW Components
3,621
In Stock
1 : Fr.0.38000
Bulk
-
Bulk
Active
Board Level
TO-220
Press Fit
Rectangular, Fins
0.748" (19.00mm)
0.504" (12.80mm)
-
0.500" (12.70mm)
3.0W @ 60°C
14.00°C/W @ 200 LFM
-
Aluminum
Black Anodized
290-1AB
290-1AB
HEATSINK TO-220 VERT/HORZ BLK
Wakefield-Vette
5,539
In Stock
1 : Fr.0.46000
Bulk
Bulk
Active
Board Level
TO-218, TO-202, TO-220
Bolt On
Rectangular, Fins
1.180" (29.97mm)
1.000" (25.40mm)
-
0.500" (12.70mm)
2.0W @ 44°C
7.00°C/W @ 400 LFM
22.00°C/W
Aluminum
Black Anodized
V2017B
V2017B
HEATSINK ANOD ALUM CPU
Assmann WSW Components
2,379
In Stock
1 : Fr.0.58000
Bulk
-
Bulk
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
-
Square, Pin Fins
0.394" (10.00mm)
0.394" (10.00mm)
-
0.275" (7.00mm)
-
-
31.00°C/W
Aluminum
Black Anodized
5,564
In Stock
1 : Fr.0.61000
Tray
-
Tray
Active
Board Level
TO-220
Bolt On and PC Pin
Rectangular, Fins
0.984" (25.00mm)
1.181" (30.00mm)
-
0.472" (12.00mm)
-
-
10.00°C/W
Aluminum
Black Anodized
577102B04000G
577102B04000G
HEATSINK TO-220 W/TAB .375"
Boyd Laconia, LLC
5,893
In Stock
1 : Fr.0.65000
Bulk
-
Bulk
Active
Board Level, Vertical
TO-220
Bolt On and PC Pin
Rectangular, Fins
0.750" (19.05mm)
0.520" (13.21mm)
-
0.375" (9.52mm)
1.0W @ 30°C
8.00°C/W @ 400 LFM
25.90°C/W
Aluminum
Black Anodized
287-1ABE
287-1ABE
HEATSINK FOR TO220
Wakefield-Vette
3,950
In Stock
1 : Fr.0.71000
Bulk
Bulk
Active
Board Level, Vertical
TO-220
Bolt On and PC Pin
Rectangular, Fins
1.180" (29.97mm)
1.000" (25.40mm)
-
0.500" (12.70mm)
4.0W @ 65°C
7.80°C/W @ 200 LFM
16.20°C/W
Aluminum
Black Anodized
577202B00000G
577202B00000G
HEAT SINK TO-220 .500" COMPACT
Boyd Laconia, LLC
11,837
In Stock
1 : Fr.0.74000
Bag
-
Bag
Active
Board Level
TO-220
Bolt On
Rectangular, Fins
0.750" (19.05mm)
0.520" (13.21mm)
-
0.500" (12.70mm)
1.5W @ 40°C
10.00°C/W @ 200 LFM
24.40°C/W
Aluminum
Black Anodized
576802B04000G
576802B04000G
HEAT SINK VERT PLUG-IN TO-220
Boyd Laconia, LLC
14,985
In Stock
1 : Fr.0.80000
Bulk
-
Bulk
Active
Board Level, Vertical
TO-220, TO-262
Clip and PC Pin
Rectangular, Fins
0.750" (19.05mm)
0.500" (12.70mm)
-
0.500" (12.70mm)
1.0W @ 30°C
7.00°C/W @ 400 LFM
27.30°C/W
Aluminum
Black Anodized
577102B00000G
577102B00000G
HEAT SINK TO-220 .375" COMPACT
Boyd Laconia, LLC
5,842
In Stock
1 : Fr.0.82000
Bag
-
Bag
Active
Board Level
TO-220
Bolt On
Rectangular, Fins
0.750" (19.05mm)
0.520" (13.21mm)
-
0.375" (9.52mm)
3.0W @ 80°C
12.00°C/W @ 200 LFM
25.90°C/W
Aluminum
Black Anodized
110991327
110991327
HEAT SINK KIT FOR RASPBERRY PI 4
Seeed Technology Co., Ltd
23,856
In Stock
1 : Fr.0.87000
Bulk
-
Bulk
Active
Top Mount Kit
Raspberry Pi 4B
Adhesive
-
-
-
-
-
-
-
-
Aluminum
-
573300D00010(G)
573300D00010G
HEATSINK D2PAK .4" HIGH SMD
Boyd Laconia, LLC
57,490
In Stock
1 : Fr.0.92000
Cut Tape (CT)
250 : Fr.0.68596
Tape & Reel (TR)
-
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
Top Mount
TO-263 (D²Pak)
SMD Pad
Rectangular, Fins
0.500" (12.70mm)
1.030" (26.16mm)
-
0.400" (10.16mm)
1.3W @ 30°C
10.00°C/W @ 200 LFM
18.00°C/W
Aluminum
Tin
658-25AB, T1, T2, T4
658-25AB
HEATSINK CPU 28MM SQ BLK
Wakefield-Vette
10,765
In Stock
1 : Fr.0.97000
Bulk
Bulk
Active
Top Mount
BGA
Thermal Tape, Adhesive (Not Included)
Square, Pin Fins
1.100" (27.94mm)
1.100" (27.94mm)
-
0.250" (6.35mm)
2.0W @ 40°C
5.00°C/W @ 500 LFM
-
Aluminum
Black Anodized
HSB05-171711
HSB05-171711
HEAT SINK, BGA, 17 X 17 X 11.5 M
Same Sky (Formerly CUI Devices)
6,371
In Stock
1 : Fr.1.01000
Box
Box
Active
Top Mount
BGA
Adhesive (Not Included)
Square, Pin Fins
0.669" (17.00mm)
0.669" (17.00mm)
-
0.453" (11.50mm)
3.1W @ 75°C
8.40°C/W @ 200 LFM
23.91°C/W
Aluminum Alloy
Black Anodized
574502B03300G
574502B03300G
HEATSINK TO-220 VERT MNT W/TAB
Boyd Laconia, LLC
9,421
In Stock
1 : Fr.1.06000
Bulk
-
Bulk
Active
Board Level, Vertical
TO-220
Clip and PC Pin
Rectangular, Fins
0.750" (19.05mm)
0.810" (20.57mm)
-
0.390" (9.91mm)
3.0W @ 60°C
6.00°C/W @ 600 LFM
21.20°C/W
Aluminum
Black Anodized
658-60AB, T1, T2, T3
658-60AB
HEATSINK CPU 28MM SQ BLK W/OTAPE
Wakefield-Vette
160
In Stock
1 : Fr.1.20000
Bulk
Bulk
Active
Top Mount
BGA
Thermal Tape, Adhesive (Not Included)
Square, Pin Fins
1.100" (27.94mm)
1.100" (27.94mm)
-
0.598" (15.20mm)
2.5W @ 30°C
2.00°C/W @ 500 LFM
-
Aluminum
Black Anodized
375424B00034G
375424B00034G
HEATSINK PIN-FIN W/TAPE
Boyd Laconia, LLC
3,150
In Stock
1 : Fr.1.22000
Bulk
-
Bulk
Active
Top Mount
BGA
Thermal Tape, Adhesive (Included)
Square, Pin Fins
0.598" (15.19mm)
0.598" (15.19mm)
-
0.252" (6.40mm)
-
17.60°C/W @ 200 LFM
62.50°C/W
Aluminum
Black Anodized
573100D00010G
573100D00010G
HEATSINK SMT D-PAK/TO-252 TIN
Boyd Laconia, LLC
16,323
In Stock
1 : Fr.1.26000
Cut Tape (CT)
250 : Fr.0.93808
Tape & Reel (TR)
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
Top Mount
TO-252 (DPak)
SMD Pad
Rectangular, Fins
0.315" (8.00mm)
0.900" (22.86mm)
-
0.400" (10.16mm)
0.8W @ 30°C
12.50°C/W @ 600 LFM
26.00°C/W
Aluminum
Tin
513102B02500(G)
513102B02500G
HEATSINK TO-220 W/PINS 1.5"TALL
Boyd Laconia, LLC
8,754
In Stock
1 : Fr.1.30000
Bulk
-
Bulk
Active
Board Level, Vertical
TO-220
Bolt On and PC Pin
Rectangular, Fins
1.500" (38.10mm)
1.375" (34.93mm)
-
0.500" (12.70mm)
8.0W @ 80°C
3.00°C/W @ 500 LFM
11.00°C/W
Aluminum
Black Anodized
3083
3083
ALUM HEAT SINK FOR RASPBERRY PI
Adafruit Industries LLC
1,117
In Stock
1 : Fr.1.32000
Bulk
-
Bulk
Active
Top Mount
Raspberry Pi 3
Thermal Tape, Adhesive (Included)
Square, Fins
0.551" (14.00mm)
0.551" (14.00mm)
-
0.315" (8.00mm)
-
-
-
Aluminum
-
LTN20069-T5
LTN20069
HEAT SINK BGA/PGA 16.5X16.5X8.9
Wakefield-Vette
6,168
In Stock
1 : Fr.1.37000
Bulk
Bulk
Active
Board Level
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Included)
Square, Fins
0.650" (16.51mm)
0.653" (16.59mm)
-
0.350" (8.89mm)
-
8.00°C/W @ 500 LFM
-
Aluminum
Black Anodized
513201B02500(G)
513201B02500G
HEATSINK TO-218/TO-247 W/PINS 2"
Boyd Laconia, LLC
1,745
In Stock
1 : Fr.1.37000
Bulk
-
Bulk
Active
Board Level, Vertical
TO-218
Bolt On and PC Pin
Rectangular, Fins
2.000" (50.80mm)
1.375" (34.93mm)
-
0.500" (12.70mm)
2.0W @ 20°C
3.00°C/W @ 400 LFM
8.30°C/W
Aluminum
Black Anodized
637-10ABPE
637-10ABPE
HEATSINK TO-220 VERT MT BLK 1"
Wakefield-Vette
3,234
In Stock
1 : Fr.1.43000
Box
Box
Active
Board Level, Vertical
TO-220
Bolt On and Board Mounts
Rectangular, Fins
1.000" (25.40mm)
1.375" (34.93mm)
-
0.500" (12.70mm)
6.0W @ 76°C
5.80°C/W @ 200 LFM
-
Aluminum
Black Anodized
V-1102-SMD/A-L
V-1102-SMD/A-L
HEATSINK TO-263 19.38X25.40MM
Assmann WSW Components
2,248
In Stock
9,000
Factory
1 : Fr.1.43000
Bulk
-
Bulk
Active
Top Mount
TO-263 (D²Pak)
SMD Pad
Rectangular, Fins
0.763" (19.38mm)
1.000" (25.40mm)
-
0.450" (11.43mm)
-
23.00°C/W @ 300 LFM
11.00°C/W
Copper
Tin
DV-T263-201E-TR
DV-T263-201E-TR
HEATSINK FOR TO-263
Ohmite
12,987
In Stock
1 : Fr.1.46000
Cut Tape (CT)
200 : Fr.0.88665
Tape & Reel (TR)
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
Top Mount
TO-263 (D²Pak)
Solderable Feet
Rectangular, Fins
0.500" (12.70mm)
1.020" (25.91mm)
-
0.480" (12.19mm)
2.0W @ 30°C
8.00°C/W @ 500 LFM
-
Aluminum
Degreased
Showing
of 113,698

Heat Sinks

Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.