MP34DT05 Datasheet by STMicroelectronics

K 'I lncaugmenied HCLGA (4 x 3 x 1 mm) 4LD
November 2016 DocID029902 Rev 1 1/21
This is information on a product in full production. www.st.com
MP34DT05
MEMS audio sensor omnidirectional digital microphone
Datasheet - production data
Features
•Single supply voltage
•Low power consumption
•AOP = 122.5 dBSPL
•64 dB signal-to-noise ratio
•Omnidirectional sensitivity
•–26 dBFS ± 3 dB sensitivity
•PDM output
•HCLGA package
−Top-port design
−SMD-compliant
−EMI-shielded
−ECOPACK®, RoHS, and “Green”
compliant
Applications
•Mobile terminals
•Laptop and notebook computers
•Portable media players
•VoIP
•Speech recognition
•A/V eLearning devices
•Gaming and virtual reality input devices
•Digital still and video cameras
•Antitheft systems
Description
The MP34DT05 is an ultra-compact, low-power,
omnidirectional, digital MEMS microphone built
with a capacitive sensing element and an IC
interface.
The sensing element, capable of detecting
acoustic waves, is manufactured using a
specialized silicon micromachining process
dedicated to produce audio sensors.
The IC interface is manufactured using a CMOS
process that allows designing a dedicated circuit
able to provide a digital signal externally in PDM
format.
The MP34DT05 is a low-distortion digital
microphone with a 64 dB signal-to-noise ratio and
–26 dBFS ± 3 dB sensitivity.
The MP34DT05 is available in a top-port, SMD-
compliant, EMI-shielded package and is
guaranteed to operate over an extended
temperature range from -40 °C to +85 °C.
Table 1: Device summary
Order codes Temp.
range [°C] Package Packing
MP34DT05 -40 to +85
HCLGA
(3 x 4 x 1 mm)
4LD
Tray
MP34DT05TR -40 to +85
HCLGA
(3 x 4 x 1 mm)
4LD
Tape and
reel
Contents MP34DT05
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Contents
1 Pin description ................................................................................5
2 Acoustic and electrical specifications...........................................6
2.1 Acoustic and electrical characteristics............................................... 6
2.2 Timing characteristics .......................................................................7
2.3 Frequency response .........................................................................8
3 Application recommendations .......................................................9
4 Carrier tape mechanical specifications .......................................11
5 Process recommendations...........................................................12
6 Sensing element............................................................................14
7 Absolute maximum ratings...........................................................15
8 Functionality..................................................................................16
8.1 L/R channel selection......................................................................16
9 Package information .....................................................................17
9.1 Soldering information ......................................................................17
9.2 HCLGA package information........................................................... 18
10 Revision history ............................................................................20
MP34DT05 List of tables
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List of tables
Table 1: Device summary ...........................................................................................................................1
Table 2: Pin description ..............................................................................................................................5
Table 3: Acoustic and electrical characteristics ..........................................................................................6
Table 4: Distortion specifications @ 1 kHz .................................................................................................6
Table 5: Timing characteristics ...................................................................................................................7
Table 6: Absolute maximum ratings .........................................................................................................15
Table 7: L/R channel selection .................................................................................................................16
Table 8: Recommended soldering profile limits........................................................................................17
Table 9: Document revision history ..........................................................................................................20
List of figures MP34DT05
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List of figures
Figure 1: Pin connections ...........................................................................................................................5
Figure 2: Timing waveforms .......................................................................................................................7
Figure 3: Typical frequency response normalized to 1 kHz........................................................................8
Figure 4: MP34DT05 electrical connections (top view) ..............................................................................9
Figure 5: MP34DT05 electrical connections for stereo configuration (top view) ......................................10
Figure 6: Carrier tape without microphone (top view)...............................................................................11
Figure 7: Carrier tape with microphone (top view)....................................................................................11
Figure 8: Recommended picking area......................................................................................................12
Figure 9: Recommended picker design ....................................................................................................13
Figure 10: Recommended soldering profile limits ....................................................................................17
Figure 11: HCLGA (3 x 4 x 1 mm) 4-lead package outline and mechanical data ....................................18
Figure 12: Land pattern.............................................................................................................................19
MP34DT05 Pin description
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1 Pin description
Figure 1: Pin connections
Table 2: Pin description
Pin # Pin name Function
1 Vdd Power supply
2 LR Left/Right channel selection
3 CLK Synchronization input clock
4 DOUT Left/Right PDM data output
5 (ground ring) GND 0 V supply
(BOT TOM VIEW)
1
23
4
LR
Vdd
CLK
DOU T
5
GND
Acoustic and electrical specifications MP34DT05
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2 Acoustic and electrical specifications
2.1 Acoustic and electrical characteristics
The values listed in the table below are specified for Vdd = 1.8 V, Clock = 2.4 MHz,
T = 25 °C, unless otherwise noted.
Table 3: Acoustic and electrical characteristics
Symbol Parameter Test condition Min. Typ.
(1)
Max. Unit
Vdd Supply voltage 1.6 1.8 3.6 V
Idd Current consumption in normal mode Mean value 650 μA
IddPdn Current consumption in power-down mode
(2)
5μA
Scc Short-circuit current 1 10 mA
AOP Acoustic overload point 122.5 dBSPL
So Sensitivity -29 -26 -23 dBFS
SNR Signal-to-noise ratio A-weighted @1 kHz,
94 dB SPL 64 dB(A)
PSR Power supply rejection 100 mVpp sine 1 kHz -72 dBFS
f
CLK
Input clock frequency
(3)
1.2 2.4 3.25 MHz
Ton Turn-on time
(4)
Guaranteed by design 10 ms
Top Operating temperature range -40 +85 °C
V
IOL
Low-level logic input/output voltage I
out
= 1 mA -0.3 0.35xVdd V
V
IOH
High-level logic input/output voltage I
out
= 1 mA 0.65xVdd Vdd+0.3 V
C
LOAD
Capacitive load 100 pF
Notes:
(1)
Typical specifications are not guaranteed.
(2)
Input clock in static mode.
(3)
Duty cycle: min = 40% max = 60%.
(4)
Time from the first clock edge to valid output data.
Table 4: Distortion specifications @ 1 kHz
Parameter Test condition Typical value (1)
Distortion 94 dBSPL 0.2% THD + N
Distortion 110 dBSPL 0.7% THD + N
Distortion 120 dBSP 6% THD + N
Notes:
(1)Typical specifications are not guaranteed.
MP34DT05 Acoustic and electrical specifications
DocID029902 Rev 1 7/21
2.2 Timing characteristics
Table 5: Timing characteristics
Parameter Description Min. Max. Unit
fCLK Clock frequency for normal mode 1.2 3.25 MHz
fPD Clock frequency for power-down mode 0.23 MHz
TCLK Clock period for normal mode 308 1000 ns
TR,EN Data enabled on DATA line, L/R pin = 1 70 90 ns
TR,DIS Data disabled on DATA line, L/R pin = 1 4.3 5.3 ns
TL,EN Data enabled on DATA line, L/R pin = 0 64 87 ns
TL,DIS Data disabled on DATA line, L/R pin = 0 3.5 4.3 ns
Figure 2: Timing waveforms
High Z High Z
High Z High Z
T
L,EN
R,DIS
R,EN
T
L,DIS
T
T
T
CLK
CLK
PDM R
PDM L
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Acoustic and electrical specifications MP34DT05
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2.3 Frequency response
Figure 3: Typical frequency response normalized to 1 kHz
Vdd 1uF TOP VIEW UI 100nF Dout 5 Ground ring CLK CODEC
MP34DT05 Application recommendations
DocID029902 Rev 1 9/21
3 Application recommendations
Figure 4: MP34DT05 electrical connections (top view)
TOP VIEW {fl Dom _.L Ground ring CLK CODEC
Application recommendations MP34DT05
10/21 DocID029902 Rev 1
Figure 5: MP34DT05 electrical connections for stereo configuration (top view)
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near as possible to pin 1 of the device (common design practice).
The L/R pin must be connected to Vdd or GND (refer to Table 7: "L/R channel selection").
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MP34DT05 Carrier tape mechanical specifications
DocID029902 Rev 1 11/21
4 Carrier tape mechanical specifications
Figure 6: Carrier tape without microphone (top view)
Figure 7: Carrier tape with microphone (top view)
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Process recommendations MP34DT05
12/21 DocID029902 Rev 1
5 Process recommendations
To ensure a consistent manufacturing process it is strongly advised to comply with
following recommendations:
•The recommended pick-up area for the MP34DT05 package must be defined using
the worst case (ie. no device alignment during picking process). This area has been
defined considering all the tolerances of the components involved (reel, package,
sound inlet). Picker tolerance shall be considered as well.
•To prevent damage to the MEMS membrane or incorrect pick-up and placement, do
not pick up the component on the inlet area
•For the package outline please refer to Figure 7: "Carrier tape with microphone (top
view)". Nozzle shape, size, and placement accuracy are the other key factors to
consider when deciding on the coordinates for the picking.
•Device alignment before picking is highly recommended.
•A vacuum force greater than 7 psi must be avoided
•1 kPa = 0.145 psi (lb/in²) = 0.0102 kgf/cm² = 0.0098 atm
•MSL (moisture sensitivity level) Class 3
•Maximum of 3 reflow cycles is recommended
•All recommended dimensions (device safe-picking area) do not include the pick-and-
place equipment tolerances
Figure 8: Recommended picking area
To have a safe pick-up "by design", ST strongly advises an ad hoc nozzle.
The following picker ensures that the holes for the vacuum and the air stream are ALWAYS
away from the porthole of the device (4 vacuum ports located at each corner of the device).
The recommended nozzle also has a recess, in the form of a cross, which guarantees that
the porthole is always left at atmospheric pressure. By using the recommended nozzle, the
membrane will not suffer any sudden air disturbances during the picking or placing of the
devices in the tape and reel.
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MP34DT05 Process recommendations
DocID029902 Rev 1 13/21
Figure 9: Recommended picker design
Sensing element MP34DT05
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6 Sensing element
The sensing element shall mean the acoustic sensor consisting of a conductive movable
plate and a fixed plate placed in a tiny silicon chip. This sensor transduces the sound
pressure into the changes of coupled capacity between those two plates.
Omron Corporation supplies this element for STMicroelectronics.
This devlce ‘5 senswtlve to mechamca‘ shock, Improper handlmg can Cause permanent damage to the part. Thls devlce ‘5 sensmve to electrostatlc dlscharge (ESD), Improper handling can cause permanent damage to the part.
MP34DT05 Absolute maximum ratings
DocID029902 Rev 1 15/21
7 Absolute maximum ratings
Stresses above those listed as “absolute maximum ratings” may cause permanent damage
to the device. This is a stress rating only and functional operation of the device under these
conditions is not implied. Exposure to maximum rating conditions for extended periods may
affect device reliability.
Table 6: Absolute maximum ratings
Symbol Ratings Maximum value Unit
Vdd Supply voltage -0.3 to 5 V
Vin Input voltage on any control pin -0.3 to Vdd +0.3 V
TSTG Storage temperature range -40 to +125 °C
ESD Electrostatic discharge protection
±2000 (HBM)
V±200 (MM)
±750 (CBM)
ESD Product standard EN 55024:2010 - 3 air
discharge ±15000 V
Functionality MP34DT05
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8 Functionality
8.1 L/R channel selection
The L/R digital pad lets the user select the DOUT signal pattern as shown in Table 7: "L/R
channel selection". The L/R pin must be connected to Vdd or GND.
Table 7: L/R channel selection
L/R CLK low CLK high
GND Data valid High impedance
Vdd High impedance Data valid
Note: As the L/R pin is internally connected to GND via a 200 kohm pull/down resistor, it is
not mandatory to connect the pin itself to GND for the respective channel selection.
MP34DT05 Package information
DocID029902 Rev 1 17/21
9 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK®packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK®is an ST trademark.
9.1 Soldering information
The HCLGA (3 x 4) 4LD package is also compliant with the RoHS and “Green” standards
and is qualified for soldering heat resistance according to JEDEC J-STD-020.
Land pattern and soldering recommendations are available at www.st.com.
Figure 10: Recommended soldering profile limits
Table 8: Recommended soldering profile limits
Description Parameter Pb free
Average ramp rate TLto TP3 °C/sec max
Preheat
Minimum temperature
Maximum temperature
Time (TSMIN to TSMAX)
TSMIN
TSMAX
tS
150 °C
200 °C
60 sec to 120 sec
Ramp-up rate TSMAX to TL
Time maintained above liquids temperature
Liquids temperature
tL
TL
60 sec to 150 sec
217 °C
Peak temperature TP260 °C max
Time within 5 °C of actual peak temperature 20 sec to 40 sec
Ramp-down rate 6 °C/sec max
Time 25 °C (t25 °C) to peak temperature 8 minutes max
RAMP-DOWN
RAMP-UP
ts
PREHEAT
tL
tp
T
L
to T
P
TSMAX
TSMIN
TP
TL
30 60 90 120 150 180 210 240 270 300 330 360 390
T25° to PEAK
TEMPERATURE
CRITICAL ZONE
TIME
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Package information MP34DT05
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9.2 HCLGA package information
Figure 11: HCLGA (3 x 4 x 1 mm) 4-lead package outline and mechanical data
1. The MEMS microphone plastic cap can exhibit some level of variation in color when
the device is subjected to thermal processes. This variation does does not affect
acoustic or electrical performance.
2. Ring plating can be subject to change not affecting acoustic and electrical
performances.
Dimensions are in millimeter unless otherwise specified
General Tolerance is +/-0.15mm unless otherwise specified
OUTER DIMENSIONS
ITEM DIMENSION [mm] TOLERANCE [mm]
1.0±3]L[htgneL
1.0±4]W[htdiW
1.0±00.1]H[thgieH
1.0±52.0ØPA
DM00231908_1
MP34DT05 Package information
DocID029902 Rev 1 19/21
Figure 12: Land pattern
GND
GND
GND
GND
DOUT
Vdd
CLK
LR
1.30
2.30
0.35
0.40
0.95
0.35
Pad + solder paste
0.85
0.85
Revision history MP34DT05
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10 Revision history
Table 9: Document revision history
Date Revision Changes
04-Nov-2016 1 Initial release
MP34DT05
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