PI3B3257 Datasheet by Diodes Incorporated

m5 UPPER/COM" ufluu UUUUO flflflfl flflflfl Truth Table Nule: Pin Descri tian E n (QSOP, SOIC, TSSOP)
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Diodes Incorporated
PI3B3257
Document Number DS40430 Rev 2-2
Pin Description
Pin Name Description
IAN-IDNData Inputs
S Select Inputs
E Enable
YA-YDData Outputs
GND Ground (1)
VCC Power
NC No Connect
Description
The PI3B3257 is a 3.3 Volt, Quad 2:1 multiplexer/demultiplexer
with three-state outputs that is pinout and function compatible
with the PI74FCT257T, 74F257, and 74ALS/AS/LS257. Inputs can
be connected to outputs with low On-Resistance (5Ω) with no
additional ground bounce noise or propagation delay.
Block Diagram
Features
¼Near-Zero propagation delay
¼5Ω switches connect inputs to outputs
¼Fast Switching Speed: 4.8ns max.
¼Ultra-Low Quiescent Power: 0.1µA typical
– Ideally suited for notebook applications
¼Pin compatible with 74 series 257 logic devices
¼Packaging (Pb-free & Green avaliable):
– 16-pin, QSOP (Q)
– 16-pin, SOIC (W)
– 16-pin, TSSOP (L)
– 16-pin, UQFN (ZHD)
Pin Configuration (QSOP, SOIC, TSSOP)
Note:
1. H = High Voltage Level
L = Low Voltage Level
E
I
A
0I
A
1 I
B
0 I
B
1 I
C
0 I
C
1 I
D
0 I
D
1
S
Y
A
Y
B
Y
C
Y
D
IY
E
SW
SW
SW
SW
SW
SW
SW
SW
SW
Truth Table(1)
E S YAYBYCYDFunction
H X Hi-Z Hi-Z Hi-Z Hi-Z Disable
L L IA0 IB0 IC0 ID0S = 0
L H IA1 IB1 IC1 ID1S = 1
VCC
S1
E
IA02
ID0
IA13
ID1
YA4
YD
IB05
16
IC0
IB16
15
IC1
YB7
14
YC
8
13
12
GND
11
10
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PI3B3257
1
2
3
4
5 6 7 8
12
11
10
9
16 15 14 13
S
I 0
A
I 1
A
A
Y
I 0
B
I 1
B
B
Y
GND
C
Y
I 1
C
I 0
C
D
Y
I 0
I 1
D
E
VCC
D
Pin Configuration (UQFN)
3.3V, Quad 2:1 Mux/DeMux NanoSwitch™
Transparent top view
Note 1: UQFN16 package die supply ground is connected to both GND pin and
exposed center pad. GND pin must be connected to supply ground for proper de-
vice operation. For enhanced thermal, electrical, and board level performance, the
exposed pad needs to be soldered to the board using a corresponding thermal pad
on the board and for proper heat conduction through the board, thermal vias need
to be incorporated in the PCB in the thermal pad region.
S. UPPER/COME DC Electrical Characteristics (Over the Operating Range, TA , AOCC to +85%, Vcc , 3.3V 110%) Capacitance (TA , 25°C, P 1 MHz) Power Supply Characteristics
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Document Number DS40430 Rev 2-2
Notes:
1. This parameter is determined by device characterization but is not production tested.
Storage Temperature ..................................................................... –65°C to +150°C
Ambient Temperature with Power Applied .................................... –40°C to +85°C
Supply Voltage to Ground Potential .................................................–0.5V to +4.6V
DC Input Voltage .............................................................................–0.5V to +4.6V
DC Output Current ........................................................................................ 120mA
Power Dissipation ............................................................................................ 0.5W
Note:
Stresses greater than those listed under MAXIMUM
RATINGS may cause permanent damage to the device.
This is a stress rating only and functional operation of
the device at these or any other conditions above those
indicated in the operational sections of this specification
is not mplied. Exposure to absolute maximum rating
conditions for extended periods may affect reliability.
Maximum Ratings
(Above which the useful life may be impaired. For user guidelines, not tested.)
DC Electrical Characteristics (Over the Operating Range, TA = –40°C to +85°C, VCC = 3.3V ±10%)
Parameters Description Test Conditions(1) Min. Typ.(2) Max. Units
VIH Input HIGH Voltage Guaranteed Logic HIGH Level 2 V
VIL Input LOW Voltage Guaranteed Logic LOW Level –0.5 0.8
IIH Input HIGH Current VCC = Max., VIN = VCC ±1
µAIIL Input LOW Current VCC = Max., VIN = GND ±1
IOZH High Impedance Output Current 0 ≤ In, Yn ≤ VCC ±1
VIK Clamp Diode Voltage VCC = Min., IIN = –18mA –1.2 V
RON Switch On-Resistance(3)
VCC = Min., VIN = 0.0V,
Ion = 48mA or 64mA 5 8 Ω
VCC = Min., VIN = 2.4V, ION = 15mA 8 17
Capacitance (TA = 25°C, f = 1 MHz)
Parameters(1) Description Test Conditions Typ. Units
CIN Input Capacitance
VIN = 0V
3.0
pF
COFFYN YN Capacitance, Switch OFF 17.0
COFFIN IN Capacitance, Switch OFF 8.5
CON IN/YN Capacitance, Switch ON 25
Notes:
1. For Max. or Min. conditions, use appropriate value specified under Electrical Characteristics for the applicable device type.
2. Typical values are at VCC = 3.3V, TA = 25°C ambient and maximum loading.
3. Measured by the voltage drop between I and Y pin at indicated current through the switch. On-Resistance is determined by the lower of the voltages on the two
(I,Y) pins.
Notes:
1. For Max. or Min. conditions, use appropriate value specified under Electrical Characteristics for the applicable device.
2. Typical values are at VCC = 3.3V, +25°C ambient.
3. Per TTL driven input (control inputs only); I and Y pins do not contribute to ICC.
4. This current applies to the control inputs only and represent the current required to switch internal capacitance at the specified frequency. The I and Y inputs
generate no significant AC or DC currents as they transition. This parameter is not tested, but is guaranteed by design.
Power Supply Characteristics
Parameters Description Test Conditions(1) Min. Typ.(2) Max. Units
ICC Quiescent Power Supply Current VCC = Max. VIN = GND or VCC 0.1 3.0
µA
∆ICC Supply Current per Input @ TTL
HIGH(3, 4) VCC = Max. VIN = 3.0 750
\ (E PER/00M Switching Characteristics Over Operating Range
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Document Number DS40430 Rev 2-2
Notes:
1. This parameter is guaranteed but not tested on Propagation Delays.
2. The bus switch contributes no propagational delay other than the RC delay of the On-Resistance of the switch and the load capacitance. The switch’s time constant
alone is of the order of 0.25ns for 50pF load. Since this time constant is much smaller than the rise/fall times of typical driving signals, it adds very little propaga-
tional delay to the system. Propagational delay of the bus switch when used in a system is determined by the driving circuit on the driving side of the switch and
its interaction with the load on the driven side.
Switching Characteristics Over Operating Range
Parameters Description Conditions
PI3B3257
UnitsCom.
Min. Max.
tIY Propagation Delay In to Yn(1,2)
CL = 50pF
RL = 500Ω
0.25
ns
tSY Bus Select Time, Sn to Yn 1 4.5
tPZH
tPZL Bus Enable Time, E to Yn 1 4.5
tPHZ
tPLZ Bus Disable Time, E to Yn 1 4.8
Applications Information
Logic Inputs
The logic control inputs can be driven up to +3.6V regardless of the supply voltage. For example, given a + 3.3V supply, IN may be driven
low to 0V and high to 3.6V. Driving IN Rail-to-Rail® minimizes power consumption.
Power-Supply Sequencing and Hot-Plug Information
Proper power-supply sequencing is recommended for all CMOS devices. Always apply VCC and GND before applying signals to input/
output or control pins.
Rail-to-Rail is a registeredtrademark of Nippon Motorola, Ltd.
Part Marking
Q Package W Package L Package
PI3B
3257QE
YWXX
Y: Year
W: Workweek
1st X: Assembly Site Code
2nd X: Fab Site Code
PI3B
3257WE
YYWWXX
YY: Date Code (Year)
WW: Date Code (Workweek)
1st X: Assembly Site Code
2nd X: Fab Site Code
PI3B
3257LE
YYWWXX
YY: Year
WW: Workweek
1st X: Assembly Site Code
2nd X: Fab Site Code
wDZHDE
YWXX
Y: Year
W: Workweek
1st X: Assembly Site Code
2nd X: Fab Site Code
ZHD Package
m5 UPPER/COM" SYMBOLS MHN, NOM. MAX A 7 7 U 069 A4 0004 7 o 0098 H A2 0 049 7 7 b 0005 7 o 042 c o 004 7 0 mo 7 7 E m D O 189 0,193 0 197 {4 0,450 0,454 0158 / \ E 0 225 0,236 0 244 / D 050 L1 041 REF 6? , 0‘ H H H H H H H H7 \ /’ 3' D HmifimW H ‘ L 04016 \ <2 :hjljmljljlj="" 5.0004="" d="" 7="" 7="" 7="" 7="" 7="" seathnc="" plane="" 0‘="" gauge="" plane="" *="" e="" seathng="" plane="">< h="" o="" o="" l="" :5="" l1="" detahl="" a="" da'ie="" nuns/15="" (dpericam‘="" ramumsamwmv="" notes="" nascnwnou="" 16-fin,150milwhdegsof="" 4="" all="" mumsms="" w="" m="" angus="" w="" amass="" 2="" ma="" m07‘j7e="" package="" con:="" n="" 1mm="" 1="" shqweks?="" $13;="" hhs?="" mm="" “‘5’“="" documem="" comnou="" mum="" revision:="" n="">
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Document Number DS40430 Rev 2-2
Packaging Mechanical: 16-QSOP (Q)
16-0056
\ (E PER/COM" NOTES ‘ swwe PLANE m nwsms m mmunns ANGLES w mus JEDEE oumNE - 5570‘: A: DMENsmNs noEs Mar wcwnz MOLD msm PRmvSwoNs a» my: gums w: WA wwsm or A2 mo n m: cm 0; mm spzc 7' SYMBOLS MW NOM MAX A 7 ‘ 75 h A1 am 7 0.25 m i AZ 1.00 7 7 i ‘\ b mm 7 051 EL , c u w 7 u 25 7 f \_ ‘/ D 9 so 9 90 to 0 ‘H c E 5 so 6,00 6.20 U 3 50 3.90 4 00 e 1 27 asc L D 40 7 ‘ 27 r u ‘5 7 n 50 e“ o 7 a 2] 4 2 Gal PER ”UM , DAVE: DEMO/IE DESCRIPYION:1E-Fim150mi‘wm9 solc PACKAGE cons: w DOCUMENT conuL a Pmnm REV‘SION s
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Document Number DS40430 Rev 2-2
16-0145
Packaging Mechanical: 16-SOIC (W)
(EPER/caM‘ 16 9 Wflflflflwi' mii AZ A 59mm; PLAN? A! NOTES ‘ m quNsmNs w meUERs ANGLES w amass 2 JEDEC M0453 3 Wagon: DOES MDT wcLuDE MOLD msm PROTRusmNS on GATE ems, vaBoLs MW NOM MAX A , , ‘ 20 M n 05 , o ‘5 A2 0 an ‘ an 1 05 b u ‘9 7 a 30 c 0.09 7 0,20 D 4 90 5'00 5 10 E1 4 so 4 40 4 50 E s 20 s 40 a so El 0 65 ESC U ‘ no REF L n 45 0.50 o 75 s 0 2a 7 , u 0‘ , a s m N 4r“ O a \ , GAUGE PLANE 9mm F 7*} saw; PLANE L m (DPER/CDM' DATE: Dam/Is ammuMMM, DESCR‘PIIDN:167Pin,111miIW\de TSSOP PACKAGE com: L [L161 DOCUMENT CDNYROL v vn-mu REV‘SIOM. G
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Document Number DS40430 Rev 2-2
16-0061
Packaging Mechanical: 16-TSSOP (L)
\ (E PER/00M |:| : a: DDED7* MED a: T I: E: ummuig flflflfl :Ii I: j:
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For latest package info.
please check: http://www.diodes.com/design/support/packaging/pericom-packaging/packaging-mechanicals-and-thermal-characteristics/
Notes:
1. EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant. All applicable RoHS exemptions applied.
2. See http://www.diodes.com/quality/lead-free/ for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, “Green” and Lead-free.
Thermal characteristics can be found on the company web site at www.diodes.com/design/support/packaging/
3. E = Pb-free and Green
4. X suffix = Tape/Reel
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PI3B3257
Document Number DS40430 Rev 2-2
Ordering Information
Ordering Code Packaging Code Package Description
PI3B3257QEX Q 16-pin, 150 mil wide (QSOP)
PI3B3257WEX W 16-pin, 150-mil wide (SOIC)
PI3B3257LEX L 16-pin, 173 mil wide (TSSOP)
PI3B3257ZHDEX ZHD 16-pin, 3x3 (UQFN)
PKG. DIMENSIONS(MM)
SYMBOL Min Max
A1 0.00
A3
D2.90 3.10
D1
E1 1.60 1.90
b
e
0.05
A0.50 0.65
E2.90 3.10
0.50 BSC
1.60 1.90
0.15 REF
0.18 0.30
L0.25 0.55
PIN1
Index Area
D
E
A
A1
A3
D1
E1
e
L
b
DATE: 07/27/16
DESCRIPTION: 16-Pin, UQFN, 3X3
PACKAGE CODE: ZHD(ZHD16)
DOCUMENT CONTROL#: PD-2209 REVISION: --
Top View
16X0.27
0.50BSC
2.90
2.90
1.60
1.60
0.70x16
Bottom View
Side View
RECOMMENDED LAND PATTERN(unit:mm)
Note
:
1. Comply with MO-248E
,
except 'L' MIN and 'L' 'D1' 'E1' MAX
N1
N4
N5
N8
N9
N12
N13 N16
16-0092
Packaging Mechanical: 16-UQFN (ZHD)
\ (E PER/00M
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IMPORTANT NOTICE
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LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE
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This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determina-
tive format released by Diodes Incorporated.
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Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of
the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected
to result in significant injury to the user.
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failure of the life support device or to affect its safety or effectiveness.
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Copyright © 2016, Diodes Incorporated
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PI3B3257
Document Number DS40430 Rev 2-2