OPT8320 Data Short Datasheet by Texas Instruments

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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
OPT8320
SBAS921 –APRIL 2018
OPT8320 3D Time-of-Flight Sensor
1
1 Features
1• Imaging Array:
– 80 × 60 Array
– 1/6” Sensor Format
– Pixel Pitch: 30 µm
– Frame Rate: Scalable Up to 1000-FPS Depth
Output Rate with an Internal Raw Rate of
4000 FPS
• Optical Properties:
– Responsivity: 0.35 A/W at 850 nm
– Demodulation Contrast: 70% at 50 MHz
– Demodulation Frequency: 10 MHz to 100 MHz
• Output Interface:
– Digital Video Port (DVP): 8 Data Lanes,
HD and VD Pins, and Clock
– Synchronous Serial Interface (SSI):
1 Data Lane, Clock, and Chip Select
• Timing Generator:
– Sensor Addressing Engine
– Modulation Control
– De-Aliasing
– Master, Slave Sync Operation
– High Dynamic Range Operation
• Depth Engine:
– Pixel Binning
– De-Aliasing
– Histogram
– Calibration
• Power Supply:
– 3.3-V I/O, Analog
– 1.8-V Analog, Digital, I/O
– 1.8-V Demodulation (Typical)
• Optimized Optical Package (COG-56):
– 8.03 mm × 5.32 mm × 0.745 mm
– Integrated Optical Band-Pass Filter
(830 nm to 867 nm)
– Optical Fiducials for Easy Alignment
• Built-In Illumination Driver for Low-Power
Applications
• Operating Temperature: 0°C to 70°C
2 Applications
• Depth Sensing:
– Location and Proximity Sensing
– 3D Scanning
– 3D Machine Vision
– Security and Surveillance
– Gesture Controls
– Augmented and Virtual Reality
3 Description
The OPT8320 time-of-flight (ToF) sensor is part of
the TI 3D ToF image sensor family. The device is a
high-performance, highly-integrated, complete
system-on-chip (SoC) for array depth sensing,
consisting of a versatile timing generator (TG), an
optimally designed analog-to-digital converter (ADC),
a depth engine, and an illumination driver.
The programmability of the built-in TG offers the
flexibility to optimize for various depth-sensing
performance metrics [such as power, motion
robustness, signal-to-noise ratio (SNR), and ambient
cancellation]. The built-in depth engine computes the
depth data from the digitized sensor data. In addition
to the phase data, the depth engine provides auxiliary
information consisting of amplitude, ambient, and
flags for each pixel and the full-array statistical
information in the form of a histogram.
Device Information(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
OPT8320 COG (56) 8.03 mm x 5.32 mm x
0.745 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Application Block Diagram
l TEXAS INSTRUMENTS
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OPT8320
SBAS921 –APRIL 2018
www.ti.com
Product Folder Links: OPT8320
Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated
Table of Contents
1 Features.................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Device and Documentation Support.................... 3
5.1 Documentation Support ........................................... 3
5.2 Community Resources.............................................. 3
5.3 Trademarks............................................................... 3
5.4 Electrostatic Discharge Caution................................ 3
5.5 Glossary.................................................................... 3
6 Mechanical, Packaging, and Orderable
Information ............................................................. 3
4 Revision History
DATE REVISION NOTES
April 2018 * Initial release.
l TEXAS INSTRUMENTS
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OPT8320
www.ti.com
SBAS921 –APRIL 2018
Product Folder Links: OPT8320
Submit Documentation FeedbackCopyright © 2018, Texas Instruments Incorporated
5 Device and Documentation Support
5.1 Documentation Support
5.1.1 Related Documentation
Time-of-Flight Camera – An Introduction,SLOA190
Introduction to the Time-of-Flight (ToF) System Design,SBAU219
Illumination Driving for Time-of-Flight (ToF) Camera System,SBAA209
Lenses for 3D Time-of-Flight (ToF) Image Sensors,SBAA217
3D ToF System Estimator Tool
5.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
5.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
5.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
5.5 Glossary
SLYZ022 —TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
6 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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www.ti.com
PACKAGE OUTLINE
C
0.745 MAX
TYP
0.213
0.187
DIE
0.1 0.013
(0.04)
2X 7.645
2X
4.94
22X 0.4491
34X 0.4497
56X 0.285
0.235
A8.07
7.99 B
5.36
5.28
(0.5)
(0.06)
(0.19) TYP
(0.19) TYP
COG - 0.745 mm max heightNBP0056A
CHIP ON GLASS
4221683/A 11/2014
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Dimension is measured at the maximum solder ball diameter, parallel to primary datum C.
4. Primary datum C and seating plane are defined by the spherical crowns of the solder balls.
BALL 1 CORNER
INDEX AREA
SEATING PLANE
BALL TYP 0.05 C
SEE DETAIL A
1
2
3
SYMM
SYMM
4
5
6
7
8
9
10
11
12 13 14 15 16 17 18
DIE
19 20 21 22 23 24 25 26 27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
4748
49
50
51
52
53
54
55
56
SCALE 2.000
DETAILA
SCALE 15.000
DETAIL A
4
OPT8320
SBAS921 –APRIL 2018
www.ti.com
Product Folder Links: OPT8320
Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated
i TEXAS INSTRUMENTS igOOOOOO1OOOOOOOOéLri 1 1 v 1 41 ,it ,,,,,,,,,,,,,,,,,, + ,,,,,,,,,,,,,,,,,, 1 1 1 1 1 V1 1 ooognfigg oooom ooopo 1 OOOOOO 77777796000000000000000 12 m Wm www,“ cum
www.ti.com
EXAMPLE BOARD LAYOUT
56X ( )0.22
30X (0.4497)
18X (0.4491)
( )
METAL
0.22 0.05 MAX
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
( )
SOLDER MASK
OPENING
0.22
0.05 MIN
(3.3728) 4X (3.8437)
CORNER PAD
4X (2.4913)
CORNER PAD
(2.021)
20X (3.8725)
32X (2.5201)
COG - 0.745 mm max heightNBP0056A
CHIP ON GLASS
4221683/A 11/2014
NOTES: (continued)
5. PCB pads shift from original positions to prevent solder balls from touching sensor. X and Y direction: 0.05 mm. Corner pads: 0.03 mm.
6. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
For information, see Texas Instruments literature number SSYZ015 (www.ti.com/lit/ssyz015).
SYMM
SYMM
LAND PATTERN EXAMPLE
SCALE:12X
11
2
10
12 27 28
29
38
39
40
56
1
55
NON-SOLDER MASK
DEFINED
(PREFERRED)
NOT TO SCALE
SOLDER MASK DETAILS
SOLDER MASK
DEFINED
5
OPT8320
www.ti.com
SBAS921 –APRIL 2018
Product Folder Links: OPT8320
Submit Documentation FeedbackCopyright © 2018, Texas Instruments Incorporated
l TEXAS INSTRUMENTS V74» I u Ifiug Di -, D / f ‘ [3 77777 “ill-©8019. lD VL ‘nyms Ins‘rmmmrs wwwtmom
www.ti.com
EXAMPLE STENCIL DESIGN
18X
(0.4491)
30X (0.4497) TYP
METAL
TYP
56X ( 0.25)
(R ) TYP0.05
20X (3.8725)
4X (3.8437)
CORNER PAD
4X (2.4913)
CORNER
PAD
(3.3728)
(2.021)
32X
(2.5201)
COG - 0.745 mm max heightNBP0056A
CHIP ON GLASS
4221683/A 11/2014
NOTES: (continued)
7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
SYMM
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
SCALE:15X
11
2
10
12 27 28
29
38
39
40
56
1
55
6
OPT8320
SBAS921 –APRIL 2018
www.ti.com
Product Folder Links: OPT8320
Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated
I TEXAS INSTRUMENTS Sample: Sample:
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
OPT8320NBP ACTIVE COG NBP 56 300 RoHS & Green SNAGCU Level-3-260C-168 HR 0 to 70 OPT8320
OPT8320NBPL ACTIVE COG NBP 56 3000 RoHS & Green SNAGCU Level-3-260C-168 HR 0 to 70 OPT8320
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
I TEXAS INSTRUMENTS
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 2
l TEXAS INSTRUMENTS L - Outer tray length without tabs rt+++++ ++++++ ++++++ ++++++ ++++++ + + + +++++ +++++ +++++ +++++ ++++++ ++++++ +tTgr+ + + + ++++++ Outer tray width 1 P1 - Tray unit pocket pitch CW - Measurement tor tray edge (Y direction) to comer pocket center — CL - Measurement for tray edge (X direction) to corner pocket center {KU- Outer tray height
TRAY
Chamfer on Tray corner indicates Pin 1 orientation of packed units.
*All dimensions are nominal
Device Package
Name Package
Type Pins SPQ Unit array
matrix Max
temperature
(°C)
L (mm) W
(mm) K0
(µm) P1
(mm) CL
(mm) CW
(mm)
OPT8320NBP NBP COG 56 300 10 x 30 150 315 135.9 7620 12.5 11.7 9.6
OPT8320NBPL NBP COG 56 3000 10 x 30 150 315 135.9 7620 12.5 11.7 9.6
PACKAGE MATERIALS INFORMATION
www.ti.com 5-Jan-2022
Pack Materials-Page 1
NBP0056A D—T——— Q: 94 ‘1213141518171818 2m 2122 2324 2525 @OOOOOOOO‘OOOOOOO 2.4 poooo \ ‘ ‘ ,,,,,,,,+,,7,7,7, ‘ ‘ Doooobodoo 2 OOOOOOOO‘OOOOOOOOO\ (b ‘5453 ‘ 409 ‘ X m. g E ‘ ‘4 44090000 VM fL D
www.ti.com
PACKAGE OUTLINE
C
0.745 MAX
TYP
0.213
0.187
DIE
0.1 0.013
(0.04)
2X 7.645
2X
4.94
22X 0.4491
34X 0.4497
56X 0.285
0.235
A8.07
7.99 B
5.36
5.28
(0.5)
(0.06)
(0.19) TYP
(0.19) TYP
COG - 0.745 mm max heightNBP0056A
CHIP ON GLASS
4221683/A 11/2014
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Dimension is measured at the maximum solder ball diameter, parallel to primary datum C.
4. Primary datum C and seating plane are defined by the spherical crowns of the solder balls.
BALL 1 CORNER
INDEX AREA
SEATING PLANE
BALL TYP 0.05 C
SEE DETAIL A
1
2
3
SYMM
SYMM
4
5
6
7
8
9
10
11
12 13 14 15 16 17 18
DIE
19 20 21 22 23 24 25 26 27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
4748
49
50
51
52
53
54
55
56
SCALE 2.000
DETAIL A
SCALE 15.000
DETAIL A
NBP0056A W:R fl 5 \ 40‘3 * *OOOOOOiOOOOOOOOiTDiiii \ , ¢ ‘ ‘ 97 ‘ o «59 w o O i O O i O V O O ,7¢_,,d 77777777777 I7,7,7,7,7,7b7,7, ‘ 0 3x «a 1 o O ‘ O O i O iifliaéioooooooiooooooooo 1‘2 Y
www.ti.com
EXAMPLE BOARD LAYOUT
56X ( )0.22
30X (0.4497)
18X (0.4491)
( )
METAL
0.22 0.05 MAX
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
( )
SOLDER MASK
OPENING
0.22
0.05 MIN
(3.3728) 4X (3.8437)
CORNER PAD
4X (2.4913)
CORNER PAD
(2.021)
20X (3.8725)
32X (2.5201)
COG - 0.745 mm max heightNBP0056A
CHIP ON GLASS
4221683/A 11/2014
NOTES: (continued)
5. PCB pads shift from original positions to prevent solder balls from touching sensor. X and Y direction: 0.05 mm. Corner pads: 0.03 mm.
6. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
For information, see Texas Instruments literature number SSYZ015 (www.ti.com/lit/ssyz015).
SYMM
SYMM
LAND PATTERN EXAMPLE
SCALE:12X
11
2
10
12 27 28
29
38
39
40
56
1
55
NON-SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
NOT TO SCALE
SOLDER MASK
DEFINED
NBP0056A JL 1,, 7 , 7” (a
www.ti.com
EXAMPLE STENCIL DESIGN
18X
(0.4491)
30X (0.4497) TYP
METAL
TYP
56X ( 0.25)
(R ) TYP0.05
20X (3.8725)
4X (3.8437)
CORNER PAD
4X (2.4913)
CORNER
PAD
(3.3728)
(2.021)
32X
(2.5201)
COG - 0.745 mm max heightNBP0056A
CHIP ON GLASS
4221683/A 11/2014
NOTES: (continued)
7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
SYMM
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
SCALE:15X
11
2
10
12 27 28
29
38
39
40
56
1
55
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