HFC32 Style, AG Spec Datasheet

— KAMAYA OHM @ Mé‘éfifii’iéfii KAMAYA ELECTRIC C0., LTD.
Spec. No.: HFC
−
K
−
HTS
−
0001 /3
Date: 2017. 1. 10
Specification
Title: CHIP FUSE; RECTANGULAR TYPE
Style: HFC32
[
Optional code
:
AG
]
RoHS COMPLIANCE ITEM
Halogen and Antimony Free
Product specification contained in this specification
are subject to change at any time without notice
If you have any questions or a Purchasing Specification for any quality
Agreement is necessary, please contact our sales staff.
Hokkaido Research Center
Approval by: T. Sannomiya
Drawing by: M. Shibuya
Note: Stock conditions
Temperature: +5°C ∼ +35°C
Relative humidity: 25% ∼ 75%
The period of guarantee: Within 2 year from shipmen t by the company.
Solderability shall be satisfied.
KAMAYA OHM —K— s—
Drawing No:
HFC−K−HTS−0001 /3
Title: CHIP FUSES; RECTANGULAR TYPE
HFC32[Optional code: AG] Page:
1/7
Product specification contained in this specification are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2017.1.10
1. Scope
1.1 This specification covers the detail requirements for chip fuses; rectangular type, style of HFC32 [Optional code: AG].
1.2 Applicable documents
UL248−1−2000 Low−Voltage Fuses−Part1: General Requirements
UL248−14−2000 Low−Voltage Fuses−Part14: Supplemental Fuses
CSA C22.2 No.248.1−2000 Low−Voltage Fuses−Part1: General Requirements
CSA C22.2 No.248.14−2000 Low−Voltage Fuses−Part14: Supplemental Fuses
2. Classification
Type designation shall be the following form.
(Example) HFC
32
802
AG
TP
1
2
3
4
5
Style
1 Chip fuses; rectangular type
2 Size
3 Rated current
802 802--> 8.0 A
4 Optional code
5 Packaging form
B Bulk (loose package)
TP Paper taping
3. Safety standard approval
• UL248−1 and UL248−14
•
CSA C22.2, No.
248.1−00 and
CSA C22.2, No.
248.14−00
The file number to be designated by UL and C−UL shall be as follows: E176847
Symbol Optional code
AG Standard
Style
KAMAYA OHM 4<_ s_="" table—="" table—="">
Drawing No:
HFC−K−HTS−0001 /3
Title: CHIP FUSES; RECTANGULAR TYPE
HFC32[Optional code: AG] Page:
2/7
Product specification contained in this specification are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2017.1.10
4. Rating
4.1 The ratings shall be in accordance with Table−1. Table−1
Style
Rated current Internal
resistance
value
(mΩ Max.)
Rated
voltage
(Vdc)
Breaking
capacity
(A)
Time / current characteristic
Symbol (A) Marking
symbol
Current Pre−arcing time
HFC32
102 1.0 102 180
76 50 200% 60s max
132 1.25
132 140
162 1.6 162 100
202 2.0 202 60
252 2.5 252 38
302 3.0 302 32
322 3.15
322 30
402 4.0 402 20
502 5.0 502 16
632 6.3 632 12
702 7.0 702 11
802 8.0 802 9
103 10.0
103 7
133 12.5
133 6
Style Working temperature range(
°
C)
HFC32
−
55 to
+
125
5. Packaging form
The standard packaging form shall be in accordance with Table−2.
Table−2
Symbol Packaging form Standard packaging
quantity / units
B Bulk (loose package) 1,000 pcs
.
TP Paper taping 8mm width, 4mm pitches 5,000 pcs.
6. Dimensions
6.1 The resistor shall be of the design and physical dimensions in accordance with Figure−1 and Table−3.
Figure
−1
Table−3 Unit: mm
Style L W H c d
HFC32
3.2±0.2 1.6±0.15 0.6±0.1 0.5±0.25 0.5±0.25
L
c
H
d
d
W
c
KAMAYA OHM —K— Table— JIS C 6006872721 Ue1 Duration: 10 s : JIS C 6006872758 Immerswon time: 2 s :
Drawing No:
HFC−K−HTS−0001 /3
Title: CHIP FUSES; RECTANGULAR TYPE
HFC32[Optional code: AG] Page:
3/7
Product specification contained in this specification are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2017.1.10
6.2 Net weight (Reference)
Style Net weight(mg)
HFC32
9
7. Marking
The Marking symbol of Sub− clause 4.1 shall be marked on over coat side.
(Example) ″802″ → Content: HFC32 802 AG
8. Performance
8.1 Unless otherwise specified, the standard range of atmospheric conditions for tests is as follows;
Ambient temperature: 5 °C to 35 °C, Relative humidity: 45 % to 85 %, Air presser: 86 kPa to 106 kPa
If there is any doubt the results, measurements shall be made within the following:
Ambient temperature: 20 °C ± 2 °C, Relative humidity: 60 % to 70 %, Air presser: 86 kPa to 106 kPa
8.2 The performance shall be satisfied in Table−4. Table−4(1)
No. Test items Condition of test Performance requirements
1 Temperature rise The fuse shall be mounted on the test substrate as
shown in Figure−2.
Measurement temp.: 10 °C to 30 °C
Test current: Rated current
The temperature at the hottest point on the surface of the
fuse shall be measured after temperature equilibrium has
been attained.
75
°
C max.
2 Time / current characteristic
The fuse shall be mounted on the test substrate as
shown in Figure−2.
Test current shall be applied for continuously.
Current
Pre
−
arcing time
200%
60s max
3 Terminal bond strength of
the face plating ＪＩＳ C 60068-2-21 Ue1
The fuse shall be mounted on the test substrate as
shown in Figure−2.
Bending value: 3 mm(Among the fulcrums: 90 mm)
Duration: 10 s ± 1 s
Change of internal resistance:
±10%
No evidence of mechanical
damage.
4 Resistance to soldering
heat Test by a piece.
Temp. of solder bath: 260 °C ± 5 °C
Immersion time: 10 s ± 1 s
After immersion into solder, leaving the room temp. for 1h
or more, and then measure the internal resistance.
Change of internal resistance:
±10%
No evidence of appearance
damage
•
Reflow soldering
Pre−heating: 150 °C ∼ 180 °C, 120 s max.
Peak: 260 °C ± 5 °C, 10 s max.
Reflow cycle: 2 times
After immersion into solder, leaving the room temp. for 1h
or more, and then measure the internal resistance.
5 Solderability ＪＩＳ C 60068-2-58
Test by a piece
Flux: Rosin−Methanol
Temp. of solder: bath: 235 °C ± 5 °C
Immersion time: 2 s ± 0.5 s
The surface of terminal immersed
shall be min. of 95 % covered with
a new coating of solder.
—K— 8- KAMAYA OHM W 90 100
Drawing No:
HFC−K−HTS−0001 /3
Title: CHIP FUSES; RECTANGULAR TYPE
HFC32[Optional code: AG] Page:
4/7
Product specification contained in this specification are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2017.1.10
0.5
φ
3
φ
4.2
10
90
100
33
20
W
Table
−
4(2)
No. Test items Condition of test Performance requirements
6 Rapid change temperature
ＪＩＳ C 60068-2-14 Na
The fuse shall be mounted on the test substrate as
shown in Figure−2.
Lower temperature: −55 °C
Upper temperature: +125 °C
Duration of exposure at each temperature: 30 min.
Number of cycles: 5 cycles
Change of internal resistance:
±10%
No evidence of appearance
damage
9. Test substrate
Unit: mm
Style Rated current a b c W Thickness of copper clad
HFC32 252
∼
502 1.8 2.2 0.85 5 0.035
632
∼
103 7.5 0.07
133 10
Figure−2 HFC TEST SUBSTRATE
Remark 1). Material: Epoxide woven glass
Thickness: 1. 6mm
:
Copper clad
:
Solder resist
c
b
a
c
KAMAYA OHM 4<_ s_="" 410.1="" 210.05="" |__|="" t="" 4101="" 3.510="" 05="" tab‘e—="" \="" wanmao"="" %="" s»="" 1="">
Drawing No:
HFC−K−HTS−0001 /3
Title: CHIP FUSES; RECTANGULAR TYPE
HFC32[Optional code: AG] Page:
5/7
Product specification contained in this specification are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2017.1.10
10. Taping
10.1 Applicable documents JIS C 0806−3:2014, EIAJ ET−7200C: 2010
10.2 Taping dimensions
Paper taping (8mm width, 4mm pitches)
Taping dimensions shall be in accordance with Figure−3 and Table−5.
Unit: mm
Figure−3
Table−5 Unit: mm
Style A B t
1
t
2
HFC32
2.0±0.15 3.6±0.2 0.8±0.1 1.0max.
1). The cover tapes shall not cover the sprocket holes.
2). Tapes in adjacent layers shall not stick together in the packing.
3). Components shall not stick to the carrier tape or to the cover tape.
4). Pitch tolerance over any 10 pitches ±0.2mm.
5). The peel strength of the top cover tape shall be with in 0.1N to 0.5N on the test method as shown in the following Figure−4.
6). When the tape is bent with the minimum radius for 25 mm, the tape shall not be damaged and the components shall
maintain their position and orientation in the tape.
7). In no case shall there be two or more consecutive components missing.
The maximum number of missing components shall be one or 0.1%, whichever is greater.
8). The fuses shall be faced to upward at the over coating side in the carrier cavity.
Figure–4
t
1
t
2
+
0.1
φ1.5
0
4
±
0.1
2
±
0.05
1.75±0.1
8
±
0.2
4
±
0.1
3.5
±
0.05
A
B
Sprocket hole
Carrier cavity
Direction of unreeling
165
°
to 180
°
Carrier tape
Top cover tape
Peel−off
(About 300mm/min)
Direction of unreeling
KAMAYA OHM —K— s— 210.5 Tab‘e— V60mm mm.
Drawing No:
HFC−K−HTS−0001 /3
Title: CHIP FUSES; RECTANGULAR TYPE
HFC32[Optional code: AG] Page:
6/7
Product specification contained in this specification are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2017.1.10
10.3 Reel dimension
Reel dimensions shall be in accordance with the following Figure−5 and Table−6.
Plastic reel (Based on EIAJ ET−7200C)
Unit: mm
Figure−5
Table−6 Unit: mm
Style A B Note
HFC32
+1.0
9
0
11.4±1.0 Injection molding
13±1.0 Vacuum forming
Note: Marking label shall be marked on a place of Marking A or two place of marking A and B.
10.4 Leader and trailer tape.
Figure−6
11. Marking on package
The label of a minimum package shall be legibly marked with follows.
11.1 Marking A
(1) Classification (Style, Rated current, Optional code, Packaging form) (2) Quantity (3) Lot number
(4) Manufacturer’s name or trade mark (5) UL and /or C−UL recognized component mark (6) Others
11.2 Marking B (KAMAYA Control label)
φ
21
±
0.8
2
±
0.5
Marking A
0
φ180
　
−1.5
　　　　
+
1
φ
60
　　　　　
0
φ
13±0.2
B
A
Marking B
160mm min
.
100mm min
.
400mm min
.
End
Trailer
Direction of unreeling
Leader
Start
KAMAYA OHM —K— s— Deraling curve
Drawing No:
HFC−K−HTS−0001 /3
Title: CHIP FUSES; RECTANGULAR TYPE
HFC32[Optional code: AG] Page:
7/7
Product specification contained in this specification are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2017.1.10
12. Recommended Derating for Rated Current
This fuse will recommend use by the current reduction value according to the following derating curve.
• Nominal Derating
Nominal Derating ≤ 75% of Rated Current
• Temperature Derating
Please refer to the following graph regarding the current derating value for ambient temperature.
Ex.) If HFC32 801 (Rated Current 8.0A) is used under ambient temperature 70°C,
Kamaya recommends, less than the current value derated as below,
Rated Current : 8.0A × (Nominal Derating : 75% × Temperature Derating : 80%) = 4.8A
Derating curve
0
10
20
30
40
50
60
70
80
90
100
110
120
130
-60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 130
Ambient temperature (℃）
Percentage of rated current(%)