MaxiGrip Flip Chip

maxiGRIP™ Flip-Chip

Advanced Thermal Solutions Inc

This tutorial will provide an overview of ATS’s maxiGRIP Flip-Chip including a component view, a TIM (thermal interface material) comparison, and a list of what makes the maxiGRIP unique.

Related Parts

ImageManufacturer Part NumberDescriptionAttachment MethodShapeAvailable QuantityPriceView Details
HEAT SINK 25.4MM X 25.4MM X 4MMATS-56002-C3-R0HEAT SINK 25.4MM X 25.4MM X 4MMThermal Tape, Adhesive (Included)Square, Angled Fins491 - Immediate$9.85View Details
HEAT SINK 23MM X 23MM X 14.5MMATS-53230K-C1-R0HEAT SINK 23MM X 23MM X 14.5MMClip, Thermal MaterialSquare, Fins920 - Immediate$11.54View Details
HEAT SINK 15MM X 15MM X 9MMATS-56003-C4-R0HEAT SINK 15MM X 15MM X 9MMThermal Tape, Adhesive (Not Included)Square, Angled Fins356 - Immediate$13.49View Details
HEAT SINK 31MM X 31MM X 9.5MMATS-53310D-C1-R0HEAT SINK 31MM X 31MM X 9.5MMClip, Thermal MaterialSquare, Fins87 - Immediate$11.28View Details
HEAT SINK 23MM X 23MM X 9.5MMATS-53230D-C1-R0HEAT SINK 23MM X 23MM X 9.5MMClip, Thermal MaterialSquare, Fins695 - Immediate$10.74View Details
HEAT SINK 25MM X 25MM X 9.5MMATS-53250D-C1-R0HEAT SINK 25MM X 25MM X 9.5MMClip, Thermal MaterialSquare, Fins35 - Immediate$10.85View Details
HEAT SINK 29MM X 29MM X 19.5MMATS-53290R-C1-R0HEAT SINK 29MM X 29MM X 19.5MMClip, Thermal MaterialSquare, Fins565 - Immediate$12.34View Details
HEAT SINK 17MM X 17MM X 9.5MMATS-53170D-C1-R0HEAT SINK 17MM X 17MM X 9.5MMClip, Thermal MaterialSquare, Fins0 - Immediate$10.44View Details
HEAT SINK 25MM X 25MM X 14.5MMATS-53250K-C1-R0HEAT SINK 25MM X 25MM X 14.5MMClip, Thermal MaterialSquare, Fins224 - Immediate$11.66View Details
HEAT SINK 19MM X 19MM X 9.5MMATS-53190D-C1-R0HEAT SINK 19MM X 19MM X 9.5MMClip, Thermal MaterialSquare, Fins89 - Immediate$10.54View Details
PTM Published on: 2011-10-13

Related Videos

ATS Explains - Thermal Interface Material
ATS Explains - Thermal Interface Material

Publish Date: 2018-01-26

Advanced Thermal Solutions - maxiGRIP
Advanced Thermal Solutions - maxiGRIP

Publish Date: 2012-10-15

Related Articles and Blogs

Feasibility Study of an LED-Based Lighting System Using Analytical Modeling A study of the heat loads for an outdoor LED-based lighting system using analytical modeling to determine the feasibility of the design with solar heat load.
Device Thermal Coupling on a PCB A look at how components on a printed circuit board thermally couple and the design considerations that help minimize heat dissipation problems.
Air Flow Measurement in Electronic Systems An analysis of circuit board air flow measurement techniques and the considerations required to obtain an accurate reading in this complex environment.

Related Product Training Modules

Introduction to Heat Sinks This module will review the use of heat sinks, including how a heat sink works, the factors that impact heat sink thermal performance, common heat sink materials, and thermal interface materials.
maxiGRIP™ and Board Rework Costs maxiGrip delivers enhanced cooling and enables the user to avoid any damage to the PCB and the BGA package itself.
maxiFLOW™ Heat Sinks maxiFLOW heat sinks feature a low profile spread fin array that maximizes surface area. Available in a wide variety of sizes and shapes.