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Self protected MOSFETs can be manufactured using chip-on-chip technology where an IC die is mounted on the power MOSFET, or by integrating the IC and power MOSFET on a single silicon die utilizing a unique process technology. The figure on this slide shows a self protected MOSFET silicon die based on Diodes Incorporated in a proprietary smart VMOS process. The image illustrates the protection circuits on the left hand side of the die and the power MOSFET on the right hand side.
PTM Published on: 2011-10-27
Switzerland