Datenblatt für STPS3L60 von STMicroelectronics

KyIW, K -—H—- A I A K K 3MB Flat 5MB Flat NOICh A K E 5MB A K I K ~‘ A D07201AD D0715
Features
• Negligible switching losses
• Low forward voltage drop
• Avalanche rated
•ECOPACK2 component
Applications
• Switching diode
• SMPS
• DC/DC converter
• LED lighting
Description
Axial and surface mount power Schottky rectifier suited for switch mode power
supplies and high frequency dc to dc converters.
Packaged in DO-201AD, DO-15, SMB, SMBflat and SMBflat Notch, this device is
intended for use in low voltage, high frequency inverters and small battery chargers
and for applications where there are space constraints, for example telecom battery
charger.
Product status
STPS3L60
Product summary
Symbol Value
IF(AV) 3 A
VRRM 60 V
T j(max.) 150 °C
VF(typ.) 0.53 V
60 V, 3 A low drop Schottky rectifier
STPS3L60
Datasheet
DS2134 - Rev 7 - January 2020
For further information contact your local STMicroelectronics sales office.
www.st.com
1Characteristics
Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified)
Symbol Parameter Value Unit
VRRM Repetitive peak reverse voltage 60 V
IF(RMS) Forward rms current 10 A
IF(AV) Average forward current, δ = 0.5, square
wave
SMB Flat Notch, SMB Flat TL = 115 °C
3 A
SMB, DO-201AD TL = 105 °C
DO-15 TL = 72 °C
IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 100 A
PARM Repetitive peak avalanche power tp = 10 µs, Tj = 125 °C 144 W
Tstg Storage temperature range -65 to +150 °C
TjMaximum operating junction temperature(1) +150 °C
1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink.
Table 2. Thermal resistance parameter
Symbol Parameter Max. value Unit
Rth(j-l)
Junction to leads
SMB Flat Notch, SMB Flat 15
°C/W
SMB 20
Junction to leads, lead length = 10 mm
DO-201AD 20
DO-15 35
For more information, please refer to the following application note :
• AN5088 : Rectifiers thermal management, handling and mounting recommendations
Table 3. Static electrical characteristics
Symbol Parameter Test conditions Min. Typ. Max. Unit
IR(1) Reverse leakage current
Tj = 25 °C
VR = VRRM
- 150 µA
Tj = 100 °C 4 15
mA
Tj = 125 °C - 14 30
VF(1) Forward voltage drop
Tj = 25 °C
IF = 3 A
- 0.62
V
Tj = 100 °C 0.53 0.61
Tj = 125 °C - 0.51 0.59
Tj = 25 °C
IF = 6 A
- 0.79
Tj = 100 °C 0.62 0.71
Tj = 125 °C - 0.6 0.69
1. Pulse test: tp = 380 µs, δ < 2%
STPS3L60
Characteristics
DS2134 - Rev 7 page 2/17
To evaluate the conduction losses, use the following equation:
P = 0.44 x IF(AV) + 0.05 x IF2(RMS)
For more information, please refer to the following application notes related to the power losses :
• AN604: Calculation of conduction losses in a power rectifier
• AN4021: Calculation of reverse losses on a power diode
STPS3L60
Characteristics
DS2134 - Rev 7 page 3/17
1.1 Characteristics (curves)
Figure 1. Average forward power dissipation versus
average forward current
P (W)
F(AV)
0.00
0.25
0.50
0.75
1.00
1.25
1.50
1.75
2.00
2.25
2.50
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
T
δ=tp/T tp
I (A)
F(AV)
δ = 0.05
δ = 0.1 δ = 0.2 δ = 0.5
δ = 1
Figure 2. Average forward current versus ambient
temperature (δ = 0.5) (SMB Flat, SMB Flat Notch)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0 2 5 5 0 75 100 125 150
Rth(j-a)=Rth(j-l)
Rth(j-a)=100°C/W
I (A)
F(AV)
T (°C)
amb
Figure 3. Average forward current versus ambient
temperature (δ = 0.5) (DO-201AD, SMB)
I (A)
F(AV)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0 2 5 5 0 75 100 125 150
R =80°C/W
th(j-a)
R = R
th(j-a) th(j-I)
T (°C)
amb
Figure 4. Average forward current versus ambient
temperature (δ = 0.5) (DO-15)
I (A)
F(AV)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0 2 5 5 0 75 100 125 150
Rth(j-a)=Rth(j-l)
Rth(j-a)=100°C/W
T (°C)
amb
Figure 5. Normalized avalanche power derating versus
pulse duration (Tj = 125 °C)
P (tp)
P (10 µs)
ARM
ARM
0.001
0.01
0.1
1
1 10 100 1000
t (µs)
p
Figure 6. Relative variation of thermal impedance junction
to lead versus pulse duration (SMB Flat, SMB Flat Notch)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-03 1.E-02 1.E-01 1.E+00
Single pulse
Z /R
th(j-l) th(j-l)
t (s)
p
STPS3L60
Characteristics (curves)
DS2134 - Rev 7 page 4/17
Figure 7. Relative variation of thermal impedance junction
to ambient versus pulse duration (SMB)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Single pulse
Z /R
th(j-a) th(j-a)
t (s)
p
Figure 8. Relative variation of thermal impedance junction
to ambient versus pulse duration (DO-201AD)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Single pulse
Z /R
th(j-a) th(j-a)
t (s)
p
Figure 9. Relative variation of thermal impedance junction
to ambient versus pulse duration (DO-15)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Single pulse
Z /R
th(j-a) th(j-a)
t (s)
p
Figure 10. Reverse leakage current versus reverse
voltage applied (typical values)
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
0 5 10 15 20 25 30 35 40 45 50 55 60
Tj=125°C
Tj=25°C
Tj=100°C
V (V)
R
I (mA)
R
Figure 11. Junction capacitance versus reverse voltage
applied (typical values)
10
100
1000
1 1 0 100
F=1MHz
Vosc=30mV
Tj=25°C
V (V)
R
C(pF)
Figure 12. Forward voltage drop versus forward current
(high level)
0
5
10
15
20
25
30
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4
Tj=25°C
(Maximum values)
Tj=100°C
(Maximum values)
Tj=100°C
(Maximum values)
Tj=100°C
(Typical v alues)
Tj=100°C
(Typical v alues)
I (A)
FM
V (V)
FM
STPS3L60
Characteristics (curves)
DS2134 - Rev 7 page 5/17
Figure 13. Forward voltage drop versus forward current
(low level)
0
1
2
3
4
5
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
Tj=25°C
(Maximum values)
Tj=100°C
(Maximum values)
Tj=100°C
(Maximum values)
Tj=100°C
(Typical values)
Tj=100°C
(Typical values)
I (A)
FM
V (V)
FM
Figure 14. Thermal resistance junction to ambient versus
copper surface under each lead (SMB flat, SMB flat
Notch)
0
50
100
150
200
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Rth(j-a)(°C/W)
SMB flat
SMB flat Notch
SCu(cm²)
Epoxy printed board FR4, copper thickness: 35 μm
Figure 15. Thermal resistance junction to ambient versus
copper surface under each lead (SMB)
0
50
100
150
200
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
R (°C/W)
th(j-a)
SMB
S(Cu)(cm²)
Epoxy p ri nted circui t board FR4, coppe r t hick ness: 35 µm
Figure 16. Thermal resistance versus lead length (DO-15)
R (°C/W)
th
0
20
40
60
80
100
120
5 10 15 20 25
Rth(j-a)
Rth(j-I)
L (mm)
leads
Figure 17. Thermal resistance versus lead length
0
10
20
30
40
50
60
70
80
90
5 10 15 20 25
Rth(°C/W)
Rth(j -a)
Rth(j-l)
DO-201AD
Lleads (mm)
STPS3L60
Characteristics (curves)
DS2134 - Rev 7 page 6/17
'7W E}.
2Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.
2.1 SMB Flat Notch package information
• Epoxy meets UL94, V0
• Lead-free package
Figure 18. SMB Flat Notch package outline
b
D
E1
E
G1
V
V1
c
G
A1
A
L2
L1
L
L3
STPS3L60
Package information
DS2134 - Rev 7 page 7/17
Table 4. SMB Flat Notch mechanical data
Ref.
Dimensions
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 0.90 1.10 0.035 0.043
A1 0.05 0.002
b 1.95 2.20 0.077 0.087
c 0.15 0.40 0.006 0.016
D 3.30 3.95 0.130 0.156
E 5.20 5.60 0.205 0.220
E1 4.05 4.60 0.159 0.181
G 2.00 0.079
G1 1.20 0.047
L 0.75 1.20 0.030 0.047
L1 0.30 0.012
L2 0.60 0.024
L3 0.02 0.001
V 8° 8°
V1 8° 8°
Figure 19. Footprint recommendations, dimensions in mm (inches)
5.84
(0.230)
1.20
(0.047)
3.44
(0.136)
1.20
(0.047)
2.07
(0.082)
millimeters
(inches)
STPS3L60
SMB Flat Notch package information
DS2134 - Rev 7 page 8/17
fl
2.2 SMB package information
• Epoxy meets UL94, V0
• Lead-free package
Figure 20. SMB package outline
E1
E
D
C
L
A1
A2
b
Table 5. SMB package mechanical data
Ref.
Dimensions
Millimeters Inches (for reference only)
Min. Max. Min. Max.
A1 1.90 2.45 0.074 0.097
A2 0.05 0.20 0.001 0.008
b 1.95 2.20 0.076 0.087
c 0.15 0.40 0.005 0.016
D 3.30 3.95 0.129 0.156
E 5.10 5.60 0.200 0.221
E1 4.05 4.60 0.159 0.182
L 0.75 1.50 0.029 0.060
STPS3L60
SMB package information
DS2134 - Rev 7 page 9/17
Figure 21. SMB recommended footprint
2.60
(0.102)
5.84
(0.230)
1.62
2.18
(0.086)
1.62
)640.0()460.0(
STPS3L60
SMB package information
DS2134 - Rev 7 page 10/17
‘ ‘x “ tri‘ L J L; id 4
2.3 SMB Flat package information
• Epoxy meets UL94, V0
• Lead-free package
Figure 22. SMB Flat package outline
D
A
L 2x
L2 2 x
L1 2 x
EE1
b
c
Table 6. SMB Flat mechanical data
Ref.
Dimensions
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 0.90 1.10 0.035 0.044
b 1.95 2.20 0.076 0.087
c 0.15 0.40 0.005 0.016
D 3.30 3.95 0.129 0.156
E 5.10 5.60 0.200 0.221
E1 4.05 4.60 0.159 0.182
L 0.75 1.50 0.029 0.060
L1 0.40 0.016
L2 0.60 0.024
STPS3L60
SMB Flat package information
DS2134 - Rev 7 page 11/17
Figure 23. Footprint recommendations, dimensions in mm (inches)
5.84
(0.230)
1.20
(0.047)
3.44
(0.136)
1.20
(0.047)
2.07
(0.082)
millimeters
(inches)
STPS3L60
SMB Flat package information
DS2134 - Rev 7 page 12/17
2.4 DO-201AD package information
• Epoxy meets UL 94, V0
Figure 24. DO-201AD package outline
Table 7. DO-201AD package mechanical data
Ref.
Dimensions
Millimeters Inches (for reference only)
Min. Typ. Max. Min. Typ. Max.
A - 9.50 - 0.374
B 25.40 - 1.000 -
C - 5.30 - 0.209
D(1) - 1.30 - 0.051
E - 1.25 0.049
Note 2(2) 15.00 0.590
1. The lead diameter D is not controlled over zone E
2. The minimum length, which must stay straight between the right angles after bending, is 15 mm (0.59”)
STPS3L60
DO-201AD package information
DS2134 - Rev 7 page 13/17
2.5 DO-15 package information
• Epoxy meets UL 94, V0
Figure 25. DO-15 package outline
Table 8. DO-15 package mechanical data
Ref.
Dimensions
Millimeters Inches (for reference only)
Min. Typ. Max. Min. Typ. Max.
A 6.05 - 6.75 0.238 - 0.266
B 2.95 - 3.53 0.116 - 0.139
C 26.00 - 31.00 1.024 - 1.220
D 0.71 - 0.88 0.028 - 0.0035
STPS3L60
DO-15 package information
DS2134 - Rev 7 page 14/17
3Ordering information
Table 9. Ordering information
Order code Marking Package Weight Base qty. Delivery mode
STPS3L60UFN B36 SMB Flat Notch 0.056 g 5000 Tape and reel
STPS3L60U G36 SMB 0.107 g 2500 Tape and reel
STPS3L60UF FG36 SMB Flat 0.050 g 5000 Tape and reel
STPS3L60RL STPS3L60 DO-201AD 1.12 g 1900 Tape and reel
STPS3L60Q STPS3L60 DO-15
0.04 g
1000 Ammopack
STPS3L60QRL STPS3L60 DO-15 6000 Tape and reel
STPS3L60
Ordering Information
DS2134 - Rev 7 page 15/17
Revision history
Table 10. Document revision history
Date Version Changes
July-2003 5A Previous issue.
12-Jun-2009 6 Reformatted to current standards. Added SMBflat package. Added ECOPACK statement. Added
cathode band graphics.
31-Jan-2020 7 Added Section 2.1 SMB Flat Notch package information.
STPS3L60
DS2134 - Rev 7 page 16/17
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STPS3L60
DS2134 - Rev 7 page 17/17