Datenblatt für RN52 von Microchip Technology

6‘ MICROCHIP RN52 l MlanCHIF' RN52 Bluetooth" Audio Module (Pan # RN52-|IRM) I H (} (}
2015 Microchip Technology Inc. DS70005120A-page 1
RN52
Features:
• Fully qualified Bluetooth® version 3.0 module,
• Fully compatible with Bluetooth version 2.1+EDR,
1.2, and 1.1
• Embedded Bluetooth profiles: A2DP, AVRCP,
HFP/HSP and SPP
• Audio decoders: SBC, AAC, aptX
• Enhanced hands free voice capability narrowband
and wideband codecs with cVc DSP
• Software configurable through commands over
UART console interface
• Stereo analog differential audio output and input
for highest quality audio
• External Audio CODECs Supported via S/PDIF
and I2S Interface
• Integrated Amplifier for Driving 16Ω Speakers
• Dedicated GPIO pins enable MCUs to access
control and status functions efficiently
• SPP data connection interface over UART
• Supports wireless iAP profile advertising which is
discoverable by iOS devices (iAP protocol imple-
mentation on an external host microcontroller
required)
• Certifications: FCC, IC, CE, Bluetooth SIG
• Postage Stamp sized form factor: 13.5 x 26.0 x
2.7 mm
• Castellated SMT pads for easy and reliable PCB
mounting
• Environmentally Friendly, RoHS Compliant
• Bluetooth SIG QDID 58578
Applications:
• High-quality wireless stereo headsets
• Automotive hands free audio kits
• Wireless audio docking station for smartphones
• High-quality wireless speakers
• VoIP handsets
• Remote control for media player
• Medical data devices
RN52 Block Diagram:
PCB Antenna
Bluetooth 3.0
RF Baseband
RN52
UART
USB
I2S
S/PDIF
11 GPIO
Pins
1 AIO
16-Bit RISC MCU
Audio DSP
16-Bit Stereo
CODEC
16-MBit Flash
2 LEDs
MIC
MIC
Speake
r
Speake
r
RN52 Bluetooth® Audio Module
RN52
DS70005120A-page 2 2015 Microchip Technology Inc.
1.0 DEVICE OVERVIEW
Microchip’s RN52 Bluetooth audio module provides a
highly integrated solution for delivering high-quality ste-
reo audio in a small form factor. It combines a class 2
Bluetooth radio with an embedded DSP processor. The
module is programmed and controlled with a simple
ASCII command set.
The RN52 module complies with Bluetooth specifica-
tion version 3.0. It integrates an RF radio and a base-
band controller making it a complete Bluetooth
subsystem. The RN52 supports a variety of profiles
including A2DP, AVRCP, HSP/HFP, SPP and iAP. It
provides a UART interface, several user programmable
I/O pins, stereo speaker outputs, microphone inputs,
digital audio interface and a USB port. Standard RN52
and its variants support A2DP, AVRCP, HFP, SPP and
iAP in the capacity of Bluetooth Slave role. RN52SRC
supports A2DP, AVRCP, HFP in the capacity of
Bluetooth Master role.
RN52 supports wireless iAP profile advertising which is
discoverable by iOS devices. An external host micro-
controller is required to implement the iAP protocol and
communicate with the authentication coprocessor
while using the RN52 as a data pipe only to transfer the
iAP protocol data over Bluetooth back and forth with
the Apple device. A PIC® microcontroller can be used
to implement the iAP protocol using the Microchip MFi
Library.
Table 1-1 provides the general specifications for the
module. Table 1- 2 and Ta b l e 1 - 3 provide the module’s
weight, dimensions and electrical characteristics.
Figure 1-1 shows the module’s dimensions and
Figure 1-2 shows recommended landing pattern and
layout.
TABLE 1-1: GENERAL SPECIFICATIONS
Specification Description
Standard Bluetooth® 3.0, class 2
Frequency Band 2.4 ~ 2.48 GHz
Modulation Method GFSK, PI/4-DQPSK, 8 DPSK
Maximum Data Rate 3 Mbps
RF Input Impedance 50 ohms
Interface UART, GPIO, AIO, USB, I2S, S/PDIF, speaker, microphone
Operation Range 10 meters (33 feet)
Sensitivity -85 dBm at 0.1 % BER
RF TX Power 4 dBm
TABLE 1-2: WEIGHT AND DIMENSIONS
Specification Description
Dimensions 26.0 mm x 13.5 mm x 2.7 mm
Weight 1.2 g
TABLE 1-3: ELECTRICAL CHARACTERISTICS
Specification Description
Supply Voltage 3.0-3.6V DC
Working current Depends on profiles, 30 mA typical
Standby current (disconnected) < 0.5 mA
Temperature -40ºC to +85ºC
ESD JESD22-A224 class 0 product
Humidity 10% ~ 90% non-condensing
mm W HHHHHM , HHHJT
2015 Microchip Technology Inc. DS70005120A-page 3
RN52
FIGURE 1-1: MODULE DIMENSIONS
FIGURE 1-2: RECOMMENDED PCB FOOTPRINT
Figure 1-3 shows the pinout and Tab le 1-4 describes
the module’s pins.
0.00
2.55
0.85
3.75
4.95
6.15
7.35
8.55
9.75
10.95
12.65
13.50
0.0
26.00
PCB Outline: +/- 0.13 mm
PCB Thickness: +/- 0.100 mm
Tolerances:
(Top View)
Dimensions are in millimeters
21.20 21.40
20.00
18.80
17.60
16.40
15.20
14.00
12.80
11.60
10.40
9.20
8.00
6.80
5.60
4.40
3.20
2.00
(Side View)
26.00
21.40
0.70
0.00
0.00
0.80
2.70
0.75
12.75
0.8mm
1.6mm
0.80mm
Dimensions are in millimeters
0.00
2.55
0.85
3.75
4.95
6.15
7.35
8.55
9.75
10.95
12.65
13.50
0.0
26.00
21.20 21.40
20.00
18.80
17.60
16.40
15.20
14.00
12.80
11.60
10.40
9.20
8.00
6.80
5.60
4.40
3.20
2.00
3.25
4.65
6.05
7.45
8.85
10.25
20.70
Ground Pads
0.8 x 1.0 mm
Host Ground Plane Edge
(See Mounting Details)
(Top View)
S 3 9 i 3 9 | 1 1 1 . . 9 9 9 9 9 ‘23 0 0 Q 0 U 0 I GND GND —u 2 GP|O3 SPKRiLo —43 3 7 GPI02 5mm}. 7 A: 4 M03 SPKRiLr 741 5 — (3le SPKRJir 7 4D 67 59:05 AGND 39 7— GPIOIZ MICJir — 3B 5 GPIOI3 MICiLr — 37 e7 anon RN52 we}. 7 as m 7 GPIqu TOP VIEW MlciLo 7 35 II GPIOQ MICifilAS 7 34 ‘2 USED» LED!) — 33 I3— USBDO LEDI — 32 I4 UAR'iRTS SFLMOSI — 3| ‘57 UAR' CTS smscx 7 3n I67 UAR iT'X SF17M1SO 72E 17 uAR'jx 5 g 3 SPLSS —25 N z E o an o o 8 g I 1 1 I 9 a K E B E E B 5 9 w u o a > n a a a o 1 1 1 1 1 1 1 2 9 R F. F1 3 E R 8 R
RN52
DS70005120A-page 4 2015 Microchip Technology Inc.
FIGURE 1-3: PIN DIAGRAM
TABLE 1-4: PIN DESCRIPTION(1) (SHEET 1 OF 3)
Pin Symbol I/O Type Description Directio
nDefau
lt
1 GND Ground. Ground.
2 GPIO3 Digital Driving this pin high during bootup will put the
module in Device Firmware Update (DFU)
mode. The device will enter DFU mode in 3
seconds. The pin should only be asserted high
before the device enters DFU mode and not
after. (USB device powers VBUS. PIO3 requires
47K to ground and 22K to USB VBUS if USB
VBUS is supplying power to the main board.)
During runtime, if the pin is driven high, the
device will reset and reboot.
Note: Device will reset within 500 ms after the IO
is driven high. A reset pulse of 100 ms is recom-
mended. If IO continues to be driven high after
reset, the device will naturally enter DFU mode.
The device will enter DFU mode in 3 seconds.
Input Low
3 GPIO2 Digital Reserved, event indicator pin. A microcontroller
can enter Command mode and poll the state
register using the Q action command
Output High
4 AIO0 Bidirectional Analog programmable input/output line I/O
2015 Microchip Technology Inc. DS70005120A-page 5
RN52
5 GPIO4 Digital Factory Reset mode. To reset the module to the
factory defaults, GPIO4 should be high on
power-up and then toggle low, high, low, high
with a 1 second wait between the transitions.
During runtime, the module will enter voice com-
mand mode if this pin is driven low.
Reserved. Not available for reconfiguring as a
general purpose IO pin.
Input Low
6 GPIO5 Bidirectional with program-
mable strength internal
pull-up/down
Programmable I/O I/O High
7 GPIO12 Bidirectional with program-
mable strength internal
pull-up/down
Programmable I/O I/O High
8 GPIO13 Bidirectional with program-
mable strength internal
pull-up/down
Programmable I/O I/O High
9 GPIO11 Bidirectional with program-
mable strength internal
pull-up/down
Programmable I/O I/O High
10 GPIO10 Bidirectional with program-
mable strength internal
pull-up/down
Programmable I/O I/O High
11 GPIO9 Digital When you drive this signal low, the module’s
UART goes into Command mode. If this signal is
asserted high, the UART is in Data mode.
Reserved
Input High
12 USBD- Bidirectional USB data minus I/O
13 USBD+ Bidirectional USB data plus with selectable internal 1.5 Kohm
pull-up resistor
I/O
14 UART_RTS CMOS output, tri-state, with
weak internal pull-up
UART request to send active low Output
15 UART_CTS CMOS input with weak
internal pull-down
UART clear to send active low Input
16 UART_TX CMOS output, tri-state, with
weak internal pull-up
UART data output Output
17 UART_RX CMOS input with weak
internal pull-down
UART data input Input
18 GND Ground Ground
19 GPIO7 Bidirectional with program-
mable strength internal
pull-up/down
Driving this pin low sets the UART baud rate to
9,600. By default, the pin is high with a baud rate
of 115,200
I/O High
20 GPIO6 Bidirectional with program-
mable strength internal
pull-up/down
Programmable I/O I/O High
21 PWREN Analog Pull high to power up RN52 Input Low
22 VDD 3.3-V power input 3.3V power input
23 PCM_IN CMOS input, with weak
internal pull down
Synchronous data input, configurable for
SPDIF_IN or SD_IN (I2S)
Input
TABLE 1-4: PIN DESCRIPTION(1) (SHEET 2 OF 3)
Pin Symbol I/O Type Description Directio
nDefau
lt
RN52
DS70005120A-page 6 2015 Microchip Technology Inc.
24 PCM_OUT CMOS output, with weak
internal pull down
Synchronous data output, configurable for
SPDIF_OUT or SD_OUT (I2S)
Output
25 PCM_SYNC Bidirectional with weak
internal pull down
Synchronous data sync; WS (I2S) Output
26 PCM_CLK CMOS input, with weak
internal pull down
Synchronous data clock; SCK (I2S) Output
27 GND Ground Ground
28 SPI_SS CMOS input with weak
internal pull-up
Chip select for Synchronous Serial Interface
active low
Input
29 SPI_MISO CMOS output, tri-state, with
weak internal pull-down
Serial Peripheral Interface (SPI) output Output
30 SPI_CLK Input with weak internal
pull-down
SPI clock Input
31 SPI_MOSI CMOS input, with weak
internal pull-down
SPI input Input
32 LED1 Open drain output Drives an LED. For the RN-52-EK Board, this
signal drives the red LED
Output
33 LED0 Open drain output Drives an LED. For the RN-52-EK Board, this
signal drives the blue LED
Output
34 MIC_BIAS Analog Microphone bias Output
35 MIC_L+ Analog Microphone input positive, left Input
36 MIC_R+ Analog Microphone input positive, right Input
37 MIC_L- Analog Microphone input negative, left Input
38 MIC_R- Analog Microphone input negative, right Input
39 AGND Analog Ground connection for audio
40 SPK_R- Analog Speaker output negative (right side) Output
41 SPK_L- Analog Speaker output negative (left side) Output
42 SPK_R+ Analog Speaker output positive (right side) Output
43 SPK_L+ Analog Speaker output positive (left side) Output
44 GND Ground Ground
45 GND Ground RF ground
46 GND Ground RF ground
47 GND Ground RF ground
48 GND Ground RF ground
49 GND Ground RF ground
50 GND Ground RF ground
Note 1: All GPIO pins default to input with weak pull-down.
2: Refer to the “Bluetooth Audio Module Command Reference User’s Guide” (DS50002154) and the
“RN52SRC Bluetooth Audio Module Command Reference User’s Guide” (DS50002343) for more
information about the behavior of the pin and optional features that can be enabled.
TABLE 1-4: PIN DESCRIPTION(1) (SHEET 3 OF 3)
Pin Symbol I/O Type Description Directio
nDefau
lt
2015 Microchip Technology Inc. DS70005120A-page 7
RN52
1.1 Audio Interface Circuit
Description
The RN52 audio interface circuit consists of:
• Analog audio interface with differential audio
inputs and outputs
• Digital audio interface with configurable S/PDIF
and I2S interface (A2DP audio output only)
The audio input circuitry has a dual audio input that can
be configured as single-ended or fully differential and
programmed for microphone or line input. It has an
analog and digital programmable gain stage so that it
can be optimized for different microphones. See
Figure 1-5.
1.1.1 DIGITAL AUDIO INTERFACE
The stereo audio CODEC interface has a digital audio
interface. It supports the I2S and S/PDIF interfaces.
The RN52 I2S interface is I2S Master and provides the
bit clock and phase sync clock. The I2S or S/PDIF
interface can be configured through command console.
The typical application interface can be seen in
Figure 1-4.
The audio resolution supported is 24-bit and the max
channel size is 32-bit. The supported sample rates are
8KHz, 32KHz, 44.1KHz and 48KHz. The audio resolu-
tion and the sample rate can be configured using the
UART console command. Refer the RN52 command
specification for more information.
FIGURE 1-4: I2S AND SPDIF CONNECTIONS
1.1.2 ANALOG AUDIO INTERFACE
The audio input circuitry has a dual audio input that can
be configured as single-ended or fully differential and
programmed for microphone or line input. It has an
analog and digital programmable gain stage so that it
can be optimized for different microphones. The micro-
phone inputs MIC_L+, MIC_L-, MIC_R+ and MIC_R-
are shown in Figure 1-6.
The audio output circuitry consists of a differential
speaker output preceded by a gain stage and a class
AB amplifier. The speaker outputs SPK_L+, SPK_L-,
SPK_R+ and SPK_R- are shown in Figure 1-6.
The fully differential architecture in the analog signal
path results in low noise sensitivity and good power
supply rejection while effectively doubling the signal
amplitude. It operates from a 1.5V single power supply
and uses a minimum of external components.
The typical application interface is shown in Figure 1-5.
RN52
I2S MASTER
SDOx
SDIx
SCKx
SSx
DAC/ADC/CODEC/DSP
I2S SLAVE
SDIx
SDOx
SCKx
SSx
Serial Clock
Frame Sync. Pulse
RN52
S/PDIF
GND
S/PDIF OUT
S/PDIF IN
VDD
DAC/ADC/CODEC/DSP
S/PDIF
GND
S/PDIF IN
S/PDIF OUT
VDD IN
RN52
DS70005120A-page 8 2015 Microchip Technology Inc.
FIGURE 1-5: RN52 AUDIO INTERFACE BLOCK DIAGRAM
FIGURE 1-6: STEREO CODEC AUDIO INPUT/OUTPUT STAGES
SPK_L+
SPK_L-
SPK_R+
SPK_R-
MIC_L+
MIC_L-
MIC_R+
MIC_R-
MIC_BIAS
RN52
Audio
PA
MIC &
Bias
System
Mainboard
S/PDIF & I2S
SPK_L+
SPK_L-
MIC_L+
MIC_L-
Input
Amplifier
Output
Amplifier
SPK_R+
SPK_R-
MIC_R+
MIC_R-
Input
Amplifier
Output
Amplifier
ΣΔ-ADC
ΣΔ-ADC
LP Filter
LP Filter
Digital
Circuitry
DAC
DAC
RN52
2015 Microchip Technology Inc. DS70005120A-page 9
RN52
1.1.3 ANALOG-TO-DIGITAL CONVERTER
(ADC)
The ADC consists of two second-order sigma delta
(SD) converters, resulting in two separate channels
with identical functionality. Each ADC supports the
following sample rates:
•8 kHz
•16 kHz
•32 kHz
• 44.1 kHz
•48 kHz
The ADC analog amplifier is a two-stage amplifier. The
first stage selects the correct gain for either micro-
phone or line input. See Figure 1-7.
FIGURE 1-7: ADC ANALOG AMPLIFIER BLOCK DIAGRAM
1.1.4 DIGITAL-TO-ANALOG CONVERTER
(DAC)
The DAC consists of two third-order SD converters,
resulting in two separate channels with identical func-
tionality. Each DAC supports the following sample
rates:
•8 kHz
•16 kHz
•32 kHz
• 44.1 kHz
•48 kHz
1.1.4.1 Speaker Output
The speaker output is capable of driving a speaker with
an impedance of at least 8 ohms directly. The overall
gain of the speaker output is approximately -21 dB to
0 dB in 1.5 dB steps.
1.1.4.2 Microphone Input
The RN52 audio input is intended for use from 1 μA at
94 dB SPL to about 10 μA at 94 dB SPL, which requires
microphones with sensitivity between –40 and –60
dBV. The RN52 microphone mode input impedance is
typically 6 kohm. The line mode input impedance is typ-
ically between 6 kohm and 30 kohm. The overall gain
of the microphone input is approximately -3 dB to 42 dB
in 1.5 dB steps. MIC_BIAS requires a minimum load to
maintain regulation. MIC_BIAS maintains regulation
within 0.199 and 1.229 mA. Therefore, if you use a
microphone with specifications below these limits, the
microphone output must be pre-loaded with a large
value resistor to ground.
–
+
–
+
P
N
Gain 0:7Line Mode/Microphone Mode
Bypass or 24-dB Gain -3 to 18 dB Gain
P
N
RN52
DS70005120A-page 10 2015 Microchip Technology Inc.
TABLE 1-5: DIGITAL TO ANALOG CONVERTER
Parameter Conditions Min Typ Max Unit
Resolution — — — 16 Bits
Ouput Sample Rate, Fsample —8—48kHz
Signal to Noise Ratio, SNR fin = 1 kHz
B/W = 20 Hz→20 kHz
A-Weighted
THD+N < 0.01%
0dBFS signal
Load = 100 kΩ
Fsample —95—dB
8 kHz — 95 — dB
16 kHz — 95 — dB
32 kHz — 95 — dB
44.1 kHz — 95 — dB
48 kHz — 95 — dB
Analog Gain Analog Gain Resolution = 3 dB 0 — -21 dB
Output voltage full-scale swing (differential) — 750 — mV rms
Allowed Load Resistive 16(8) — O.C. Ω
Capacitive — — 500 pF
THD + N 100 kΩ load — — 0.01 %
THD + N 16 kΩ load — — 0.1 %
SNR (Load = 16Ω, 0 dBFS input relative to digital silence) — 95 — dB
TABLE 1-6: ANALOG TO DIGITAL CONVERTER
Parameter Conditions Min Typ Max Unit
Resolution — — — 16 Bits
Input Sample Rate, Fsample — 8 — 44.1 kHz
Signal to Noise Ratio, SNR fin = 1 kHz
B/W = 20 Hz→20 kHz
A-Weighted
THD+N < 1%
150 mVpk-pk input
Fsample
8 kHz — 79 — dB
16 kHz — 76 — dB
32 kHz — 75 — dB
44.1 kHz — 75 — dB
Analog Gain Analog Gain Resolution = 3 dB — — 42 dB
Input full scale at maximum gain (differential) — 4 — mV rms
Input full scale at minimum gain (differential) — 800 — mV rms
3 dB Bandwidth — 20 — kHz
Microphone mode input impedance — 6.0 — kΩ
THD + N (microphone input) @ 30 mV rms input — 0.04 — %
2015 Microchip Technology Inc. DS70005120A-page 11
RN52
1.2 General Purpose IO (GPIO) Ports
User programmable bidirectional GPIO ports are pro-
vided. The GPIO ports can be used as typical digital IO
ports. The directionality of the GPIOs can be config-
ured through console commands. The GPIOs can also
be read or asserted using the console commands. The
digital input and output voltage levels are provided in
Table 1-7.
TABLE 1-7: DIGITAL INPUT AND OUTPUT VOLTAGE LEVELS
Voltage Information Min Typ Max Unit
Input Voltage Levels
VIL input logic level low -0.3 — 0.25 x VDD V
VIH input logic level high 0.625 x VDD —VDD + 0.3 V
Output Voltage Levels
VOL output logic level low, Iol = 4.0 mA 0 — 0.125 V
VOH output logic level high, IOH = -4.0 mA 0.75 x VDD —VDD V
RN52
DS70005120A-page 12 2015 Microchip Technology Inc.
1.3 Power Consumption
The power consumption of the RN52 for various
connection states are provided in Figure 1-8.
TABLE 1-8: POWER CONSUMPTION
Role Connection Audio Packet
Type Description Current (mA)
— Stand-by — Active connection 0.07
— Page Scan — Interval = 1280 ms 0.5
— Inquiry and Page Scan — Inquiry scan = 1280 ms
Page scan = 1280 ms
0.88
RN52 A2DP ACL No Traffic 15
RN52 A2DP ACL Audio stream RX 21
RN52 A2DP ACL Sniff = 40 ms 1.7
RN52 A2DP ACL Sniff = 1280 ms 0.26
RN52 HFP eSCO-EV3 — 26
RN52 HFP eSCO-EV3 Setting S1 27
RN52 HFP eSCO-2EV3 Setting S2 28
RN52 HFP eSCO-2EV3 Setting S3 25
RN52 HFP eSCO-EV5 — 22
RN52 HFP SCO-HV1 — 42
RN52 HFP SCO-HV3 — 28
RN52 HFP SCO-HV3 Sniff = 30 ms 22
RN52SRC A2DP ACL No traffic 4.4
RN52SRC A2DP ACL Audio stream TX 9.2
RN52SRC A2DP ACL Sniff = 40 ms 1.9
RN52SRC A2DP ACL Sniff = 1280 ms 0.2
RN52SRC HFP eSCO-EV3 — 24
RN52SRC HFP eSCO-EV3 Setting S1 23
RN52SRC HFP eSCO-2EV3 Setting S2 22
RN52SRC HFP eSCO-2EV3 Setting S3 17
RN52SRC HFP eSCO-EV5 — 17
RN52SRC HFP SCO-HV1 — 42
RN52SRC HFP SCO-HV3 — 23
RN52SRC HFP SCO-HV3 Sniff = 30 ms 22
2015 Microchip Technology Inc. DS70005120A-page 13
RN52
2.0 APPLICATIONS
The following sections provide information on design-
ing with the RN52 module, including restoring factory
defaults, using the LED interface, minimizing radio
interference, solder reflow profile, typical application,
etc.
2.1 Minimizing Radio Interference
When laying out the host PCB for the RN52 module,
the areas under the antenna and shielding connections
should not have surface traces, ground planes or
exposed via (see Figure 2-1). For optimal radio perfor-
mance, the RN52 module’s antenna end should
protrude at least 31 mm beyond any metal enclosure.
Figure 2-2 shows examples of good, bad, and
acceptable positioning of the RN52 on the host PCB.
FIGURE 2-1: MINIMIZING RADIO INTERFERENCE
FIGURE 2-2: PCB EXAMPLE LAYOUT
21.4 mm
4.6 mm
(Top View)
Dimensions are in millimeters
Keep area around antenna
(approximately 31 mm) clear
of metallic structures for
best performance
31 mm
31 mm
Edge of Ground Plain
RN52
RN52
RN52 RN52
Good
Acceptable
Acceptable
Bad
s‘or, 5e also d wn in F LED
RN52
DS70005120A-page 14 2015 Microchip Technology Inc.
2.2 LED Interface
The RN52 includes two pads dedicated to driving the
LED indicators. The firmware can control both termi-
nals, and the battery charger can set LED0. The termi-
nals are open-drain outputs; therefore, the LED must
be connected from a positive supply rail to the pad in
series with a current limiting resistor. You should oper-
ate the LED pad (LED0 or LED1 pins) with a pad volt-
age below 0.5V. In this case, the pad can be thought of
as a resistor, RON. The resistance, together with the
external series resistor, sets the current, ILED, in the
LED. The current is also dependent on the external
voltage, VDD, as shown in Figure 2-3.
FIGURE 2-3: LED INTERFACE
The LEDs can be used to indicate the module’s con-
nection status. Table 2-1 describes the LED functions.
2.3 Device Firmware Updates
The module has a Device Firmware Update (DFU)
mode in which you use the USB interface to update the
firmware. Implementing the DFU feature is highly rec-
ommended because firmware updates offer new fea-
tures and enhance the module’s functionality. Follow
the reference design shown in Figure 2-7 to support
this mode.
FIGURE 2-4: USB DFU PORT AND
GPIO3 SCHEMATIC
2.4 Restore Factory Defaults with
GPIO4
The GPIO4 pin should be connected to a switch,
jumper or resistor so it can be accessed. This pin is
used to reset the module to its factory default settings,
which is critical in situations where the module has
been misconfigured. To reset the module to the factory
defaults, GPIO4 should be high on power-up and then
toggle low, high, low, high with a 1 second wait between
the transitions.
2.5 Power Control and Regulation
The VDD pin controls the power to the RN52 module.
The VDD pin should be used to turn the RN52 module
on and off, if the hardware power cycle feature is
desired.
The PWREN pin provides the power enable functional-
ity. This pin is internally connected as an enable pin to
the voltage regulator and can only be used to turn on
the voltage regulator after VDD power is provided to the
RN52 module. The PWREN pin cannot be used to turn
the voltage regulator off.
On later versions of the firmware, the RN52 also pro-
vides a module reset GPIO pin, which resets the RN52
module when asserted high, and also provides a con-
sole command which can be used to perform a module
reset.
TABLE 2-1: STATUS LED FUNCTIONS
Blue LED Red LED Description
Flashing Flashing The RN52 module is
discoverable.
Off Flashing The module is connected.
Flashing Off The module is connectable.
Note: A 47 K pull-down resistor (R2 in
Figure 2-4) is required on GPIO3 even if
you do not use the USB for DFU.
VDD
LED Forward
Voltage, VF
Resistor Voltage
Drop, VR
Pad Voltage, VPAD
RLED
|LED
LED0 or
LED1
RON = 20 Ω
GND
5
D+
3D-
2VBUS
1
MTAB 6
J2
VBUS
(3.3V)
USBD-
USBD+
47k
R2
22k
R1
GPIO3 MBR120
D1
10nF
C4
USB Mini B Connector
(JAE DX2R005HN2E700)
2015 Microchip Technology Inc. DS70005120A-page 15
RN52
2.6 Solder Reflow Profile
The lead-free solder reflow temperature and times are:
•Temperature – 230° C, 60 seconds maximum,
peak 245° C maximum
•Preheat temperature – 165° ± 15° C, 90 to 120
seconds
•Time – Single pass, one time
To reflow solder the module onto a PCB, use an RoHS-
compliant solder paste equivalent to NIHON ALMIT
paste or OMNIX OM-310 solder paste from Alpha met-
als. See Tab l e 2-2.
Figure 2-5 and Figure 2-6 show the solder reflow
temperature profiles.
FIGURE 2-5: SOLDER REFLOW TEMPERATURE PROFILE
Note: Use no-clean flux and DO NOT water
wash.
TABLE 2-2: PASTE SOLDER RECOMMENDATIONS
Manufacturer Part Number Metal Composition Liquidus Temperature
Alpha Metals
http://www.alphametals.com
OMNIX OM-310 SAC305 (96.5% Sn, 3%
Ag, 0.5% Cu)
~220°C
NIHON ALMIT Co. LTD
http://almit.co.jp
LFM-70W INP 88% Sn, 3.5% Ag, 0.5%
Bi, 8% In
~215°C
Yemperaxure ('0 4m 11-, ‘ [mm 1w 5 “my nu‘i u Mum-m um [um] rm ”me mm (mm 7451mm mum) munml mu nnommmmwm m. m hruwd MWmu no 1|me[$e(ond£)
RN52
DS70005120A-page 16 2015 Microchip Technology Inc.
FIGURE 2-6: SOLDER REFLOW CURVE
2015 Microchip Technology Inc. DS70005120A-page 17
RN52
2.7 Typical Application Schematic
Figure 2-7 shows a typical application circuit with LDO,
stereo audio/microphone PA, USB/UART, AVRCP
switches and LED0/LED1.
FIGURE 2-7: TYPICAL APPLICATION CIRCUIT FOR A2DP AUDIO STREAMING AND AVRCP
REMOTE CONTROL
VBUS
VBUS
RESET 18
3V 3OU T 16
USBDP 14
USBDM 15
GND
17
CBUS2
10 CBUS1
21
VCCIO 1
CBUS3
11
CBUS4
9
CBUS0
22
GND
20
RI
3DCD
7DSR
6DTR
31 CTS
8RTS
32 RXD
2TXD
30
VCC 19
OSCI 27
OSCO 28
AGND
24
TEST
26
GND
4
THPAD
33
FT232RQ
U1
GND
5
D+
3D-
2VBUS
1
MTAB 6
USB Mini B / CSR UART
J1
1
2
3
4
5
6
J4
SPI MASTER
SPI _MI SO
SPI _MOSI
SPI _SCK
SPI _SS
3.3V
UART_RX
UART_TX
UART_CTS
UART_RTS
Vin
1
GND
2
Vout 3
Tab
4
TC1262- 3.3V U2
1uF
C6
1uF
C7
VBUS 3.3V
100nF
C3
100nF
C1
100nF
C2
Blue LED
D3
Red LED
D2
S2
Vol Down
S3
Play / Pause
S6
Next
S1
Prev
S4
Vol Up
BTN_VOL UP
BTN_VOL DOWN
BTN_NEXT
BTN_PL AY
BTN_PREVI OUS
47R
R8
470
R9
3.3V
GND
5
D+
3D-
2VBUS
1
MTAB 6
USB Mini B / RSVD USB
J2
GPIO4 5
GPIO5 6
GPIO12 7
GPIO13 8
GPIO11 9
GPIO10 10
GPIO9 11
USBD- 12
USBD+ 13
UART_RTS 14
UART_CTS 15
UART_TX 16
PCM _CLK 26
SPI _SS
28
SPI_MISO
29
SPI_SCK
30
PCM _IN 23
VDD 22
LED0
33
MIC_BIAS
34
MIC_L+
35
MIC_R+
36
MIC_L-
37
MIC_R-
38
PCM _OUT 24
GPIO7 19
PCM _SY NC 25
SPI_MOSI
31
LED1
32
PWREN 21
GPIO6 20
UART_RX 17
AIO0 4
GPIO2 3
AGND
39
SPKR_R-
40
GND 1
GND 18
GND 27
GND
44
GPIO3 2
SPKR_L-
41
GND
50
GND
49
GND
48
GND
47
GND
46
GND
45
SPKR_R+
42
SPKR_L +
43
M1
RN52 Module
PI O7
PI O6
LED0
LED1
LED0
LED1
VBUS
USBD-
USBD+
SPI _MI SO
SPI _MOSI
SPI _SCK
SPI _SS
3.3V
SPKR_R-
SPKR_L -
SPKR_R+
SPKR_L +
S5
Wake
3.3V
PCM_CL K
PCM_SYNC
PCM_OUT
PCM_IN
SPKR_R-
SPKR_L -
SPKR_R+
SPKR_L +
VBUS
47k
R2
22k
R1
PI O3
1uF
C21
1uF
C22
1uF
C13
1uF
C14
1uF
C12
2k2
R7
2k2
R6
47nF
C8
47nF
C10
47nF
C11
47nF
C9
MI C_L
MI C_R
1uF
C18
22k
R17
22k
R15
47k
R11
22k
R13
47k
R14
47k
R10
47k
R16
22k
R12
1 2
3 4
5 6
7 8
9 10
11 12
13 14
15 16
J3
EXT Connector
PCM_CL K
PCM_SYNC
PCM_OUT
PCM_I N
3.3V
IN1+
3
IN1-
2
Vo2 9
BYPASS
4
IN2-
8
IN2+
7
SHUTDOWN 6
GND
5
VDD 10
Vo1 1
PAD
11
U4
TPA6112
100uF
C23
100uF
C20
100uF
C17
100uF
C19
10uF
C15
100nF
C16
MBR120
D1
10nF
C4
VBUS
PI O9
3.3V
BTN_VOLDOWN
BTN_PREVI OUS
BTN_PLAY
BTN_NEXT
BTN_VOLUP
PI O2
PI O6
PI O7
1
2
J8
MI CL
1
2
J6
MI CR
MI C_L
MI C_R
1
2
J11
Battery
VBUS
1
2
3
4
5
6
7
8
9
10
11
12
J10
1 2
3 4
5 6
7 8
9 10
J7
PI O4
PWREN
PWREN
SPKR_R-
SPKR_L -
SPKR_R+
SPKR_L +
MI C_BI AS
MI C_L +
MI C_R+
MI C_L -
MI C_R-
MI C_L +
MI C_R+
MI C_L -
MI C_R-
MI C_BI AS
AI O0
UART_RX
UART_TX
UART_CTS
UART_RTS
USBD-
USBD+
BTN_VOL UP
BTN_VOL DOWN
BTN_NEXT
BTN_PLAY
BTN_PREVI OUS
PI O3
PI O9
PI O2
PI O4
AI O0
MI C_L +
MI C_R+
MI C_L -
MI C_R-
MI C_BI AS
3
5
4
2
1
J5
Mic
3
5
4
2
1J9
Headphones
2k2R70
UART_RX
UART_TX
Device
Firmware
Update
RN52
DS70005120A-page 18 2015 Microchip Technology Inc.
3.0 BLUETOOTH SIG
CERTIFICATION
The RN52 Bluetooth Audio Module has been certified
by Bluetooth SIG and the Qualified Design ID is 58578
and the Declaration ID is D023391. The Qualified
Design Listing certificate can be accessed on
www.microchip.com/rn52 or at the Bluetooth SIG list-
ings website.
4.0 REGULATORY APPROVAL
This section outlines the regulatory information for the
RN52 module for the following countries:
• United States
• Canada
• Europe
• Australia
• New Zealand
4.1 United States
The RN52 module has received Federal Communica-
tions Commission (FCC) CFR47 Telecommunications,
Part 15 Subpart C “Intentional Radiators” modular
approval in accordance with Part 15.212 Modular
Transmitter approval. Modular approval allows the end
user to integrate the RN52 module into a finished prod-
uct without obtaining subsequent and separate FCC
approvals for intentional radiation, provided no
changes or modifications are made to the module cir-
cuitry. Changes or modifications could void the user’s
authority to operate the equipment. The end user must
comply with all of the instructions provided by the
Grantee, which indicate installation and/or operating
conditions necessary for compliance.
The finished product is required to comply with all appli-
cable FCC equipment authorizations regulations,
requirements and equipment functions not associated
with the transmitter module portion. For example, com-
pliance must be demonstrated to regulations for other
transmitter components within the host product; to
requirements for unintentional radiators (Part 15 Sub-
part B “Unintentional Radiators”), such as digital
devices, computer peripherals, radio receivers, etc.;
and to additional authorization requirements for the
non-transmitter functions on the transmitter module
(i.e., Verification, or Declaration of Conformity) (e.g.,
transmitter modules may also contain digital logic func-
tions) as appropriate.
4.1.1 LABELING AND USER
INFORMATION REQUIREMENTS
The RN52 module has been labeled with its own FCC
ID number, and if the FCC ID is not visible when the
module is installed inside another device, then the out-
side of the finished product into which the module is
installed must also display a label referring to the
enclosed module. This exterior label can use wording
as follows:
A user’s manual for the product should include the
following statement:
Additional information on labeling and user information
requirements for Part 15 devices can be found in KDB
Publication 784748 available at the FCC Office of Engi-
neering and Technology (OET) Laboratory Division
Knowledge Database (KDB) http://apps.fcc.gov/oetcf/
kdb/index.cfm.
4.1.2 RF EXPOSURE
All transmitters regulated by FCC must comply with RF
exposure requirements. OET Bulletin 65, Evaluating
Compliance with FCC Guidelines for Human Exposure
to Radio Frequency Electromagnetic Fields, provides
assistance in determining whether proposed or existing
transmitting facilities, operations or devices comply
with limits for human exposure to Radio Frequency
Contains Transmitter Module FCC ID: T9J-RN52
or
Contains FCC ID: T9J-RN52
This device complies with Part 15 of the FCC Rules.
Operation is subject to the following two conditions:
(1) this device may not cause harmful interference,
and (2) this device must accept any interference
received, including interference that may cause
undesired operation
This equipment has been tested and found to comply
with the limits for a Class B digital device, pursuant to
part 15 of the FCC Rules. These limits are designed
to provide reasonable protection against harmful
interference in a residential installation. This equip-
ment generates, uses and can radiate radio fre-
quency energy, and if not installed and used in
accordance with the instructions, may cause harmful
interference to radio communications. However,
there is no guarantee that interference will not occur
in a particular installation. If this equipment does
cause harmful interference to radio or television
reception, which can be determined by turning the
equipment off and on, the user is encouraged to try to
correct the interference by one or more of the follow-
ing measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment
and receiver.
• Connect the equipment into an outlet on a circuit
different from that to which the receiver is con-
nected.
• Consult the dealer or an experienced radio/TV
technician for help.
2015 Microchip Technology Inc. DS70005120A-page 19
RN52
(RF) fields adopted by the Federal Communications
Commission (FCC). The bulletin offers guidelines and
suggestions for evaluating compliance.
If appropriate, compliance with exposure guidelines for
mobile and unlicensed devices can be accomplished
by the use of warning labels and by providing users
with information concerning minimum separation dis-
tances from transmitting structures and proper installa-
tion of antennas.
The following statement must be included as a CAU-
TION statement in manuals and OEM products to alert
users of FCC RF exposure compliance:
If the RN52 module is used in a portable application
(i.e., the antenna is less than 20 cm from persons
during operation), the integrator is responsible for per-
forming Specific Absorption Rate (SAR) testing in
accordance with FCC rules 2.1091.
4.1.3 HELPFUL WEB SITES
Federal Communications Commission (FCC):
http://www.fcc.gov
FCC Office of Engineering and Technology (OET)
Laboratory Division Knowledge Database (KDB):
http://apps.fcc.gov/oetcf/kdb/index.cfm
4.2 Canada
The RN52 module has been certified for use in Canada
under Industry Canada (IC) Radio Standards Specifica-
tion (RSS) RSS-210 and RSSGen. Modular approval
permits the installation of a module in a host device
without the need to recertify the device.
4.2.1 LABELING AND USER
INFORMATION REQUIREMENTS
Labeling Requirements for the Host Device (from Sec-
tion 3.2.1, RSS-Gen, Issue 3, December 2010): The
host device shall be properly labeled to identify the
module within the host device.
The Industry Canada certification label of a module
shall be clearly visible at all times when installed in the
host device, otherwise the host device must be labeled
to display the Industry Canada certification number of
the module, preceded by the words “Contains transmit-
ter module”, or the word “Contains”, or similar wording
expressing the same meaning, as follows:
User Manual Notice for License-Exempt Radio Appara-
tus (from Section 7.1.3 RSS-Gen, Issue 3, December
2010): User manuals for license-exempt radio appara-
tus shall contain the following or equivalent notice in a
conspicuous location in the user manual or
alternatively on the device or both:
Transmitter Antenna (from Section 7.1.2 RSS-Gen,
Issue 3, December 2010): User manuals for transmit-
ters shall display the following notice in a conspicuous
location:
The above notice may be affixed to the device instead
of displayed in the user manual.
4.2.2 HELPFUL WEB SITES
Industry Canada: http://www.ic.gc.ca/
To satisfy FCC RF Exposure requirements for mobile
and base station transmission devices, a separation
distance of 20 cm or more should be maintained
between the antenna of this device and persons
during operation. To ensure compliance, operation at
closer than this distance is not recommended.
The antenna(s) used for this transmitter must not be
co-located or operating in conjunction with any other
antenna or transmitter.
Contains transmitter module IC: 6514A-RN52
This device complies with Industry Canada license-
exempt RSS standard(s). Operation is subject to the
following two conditions: (1) this device may not
cause interference, and (2) this device must accept
any interference, including interference that may
cause undesired operation of the device.
Le présent appareil est conforme aux CNR d'Indus-
trie Canada applicables aux appareils radio exempts
de licence. L'exploitation est autorisée aux deux con-
ditions suivantes: (1) l'appareil ne doit pas produire
de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même
si le brouillage est susceptible d'en compromettre le
fonctionnement.
Under Industry Canada regulations, this radio trans-
mitter may only operate using an antenna of a type
and maximum (or lesser) gain approved for the trans-
mitter by Industry Canada. To reduce potential radio
interference to other users, the antenna type and its
gain should be so chosen that the equivalent isotrop-
ically radiated power (e.i.r.p.) is not more than that
necessary for successful communication.
Conformément à la réglementation d'Industrie Can-
ada, le présent émetteur radio peut fonctionner avec
une antenne d'un type et d'un gain maximal (ou
inférieur) approuvé pour l'émetteur par Industrie Can-
ada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il
faut choisir le type d'antenne et son gain de sorte
que la puissance isotrope rayonnée équivalente
(p.i.r.e.) ne dépasse pas l'intensité nécessaire à
l'établissement d'une communication satisfaisante.
(60681
RN52
DS70005120A-page 20 2015 Microchip Technology Inc.
4.3 Europe
The RN52 module is an R&TTE Directive assessed
radio module that is CE marked and has been
manufactured and tested with the intention of being
integrated into a final product.
The RN52 module has been tested to R&TTE Directive
1999/5/EC Essential Requirements for Health and
Safety (Article (3.1(a)), Electromagnetic Compatibility
(EMC) (Article 3.1(b)), and Radio (Article 3.2) and are
summarized in Table 3-1: European Compliance Test-
ing. A Notified Body Opinion has also been issued. All
test reports are available on the RN52 product web
page at http://www.microchip.com.
The R&TTE Compliance Association provides
guidance on modular devices in document Technical
Guidance Note 01 available at http://www.rtteca.com/
html/download_area.htm.
4.3.1 LABELING AND USER
INFORMATION REQUIREMENTS
The label on the final product which contains the RN52
module must follow CE marking requirements. The
R&TTE Compliance Association Technical Guidance
Note 01 provides guidance on final product CE
marking.
4.3.2 ANTENNA REQUIREMENTS
From R&TTE Compliance Association document
Technical Guidance Note 01:
Provided the integrator installing an assessed
radio module with an integral or specific antenna
and installed in conformance with the radio mod-
ule manufacturer’s installation instructions
requires no further evaluation under Article 3.2
of the R&TTE Directive and does not require fur-
ther involvement of an R&TTE Directive Notified
Body for the final product. [Section 2.2.4]
4.3.3 HELPFUL WEB SITES
A document that can be used as a starting point in
understanding the use of Short Range Devices (SRD)
in Europe is the European Radio Communications
Committee (ERC) Recommendation 70-03 E, which
can be downloaded from the European Radio
Communications Office (ERO) at: http://www.ero.dk/.
Additional helpful web sites are:
• Radio and Telecommunications Terminal
Equipment (R&TTE):
http://ec.europa.eu/enterprise/rtte/index_en.htm
• European Conference of Postal and
Telecommunications Administrations (CEPT):
http://www.cept.org
• European Telecommunications Standards
Institute (ETSI):
http://www.etsi.org
• European Radio Communications Office (ERO):
http://www.ero.dk
• The Radio and Telecommunications Terminal
Equipment Compliance Association (R&TTE CA):
http://www.rtteca.com/
Note: To maintain conformance to the testing
listed in Table 4-1, the module shall be
installed in accordance with the installa-
tion instructions in this data sheet and
shall not be modified.
When integrating a radio module into a
completed product the integrator
becomes the manufacturer of the final
product and is therefore responsible for
demonstrating compliance of the final
product with the essential requirements of
the R&TTE Directive.
TABLE 4-1: EUROPEAN COMPLIANCE TESTING
Certification Standards Article Laboratory Report Number Date
Safety EN 60950-1:2006+A11:2009+A1:2010 (3.1(a)) Worldwide
Testing
Services
(Taiwan)
Co., Ltd.
W6M21301-13004-L 2/23/2013
Health EN 50371:2002-03 W6M21301-13004-50371 5/31/2013
EMC EN 301 489-1 V1.8.1 (2008-04) (3.1(b)) W6M21301-13004-E-16 2/7/2013
EN 301 489-17 V2.1.1 (2009-05)
Radio EN 300 328 V1.7.1 (2006-10) (3.2) W6M21301-13004-T-45 5/31/2013
Notified
Body
Opinion
—
Eurofins
Product
Service
GmbH
U9M-1304-2756-C-V01 6/13/2013
2015 Microchip Technology Inc. DS70005120A-page 21
RN52
4.4 Australia
The Australia radio regulations do not provide a modu-
lar approval policy similar to the United States (FCC)
and Canada (IC). However, RN52 module RF transmit-
ter test reports can be used in part to demonstrate com-
pliance in accordance with ACMA Radio
communications “Short Range Devices” Standard
2004 (The Short Range Devices standard calls up the
AS/NZS 4268:2008 industry standard). The RN52
module test reports can be used as part of the product
certification and compliance folder. For more informa-
tion on the RF transmitter test reports, contact
Microchip Technology Australia sales office.
To meet overall Australian final product compliance, the
developer must construct a compliance folder contain-
ing all relevant compliance test reports, e.g. RF, EMC,
electrical safety and DoC (Declaration of Conformity),
etc. It is the responsibility of the integrator to know what
is required in the compliance folder for ACMA compli-
ance. All test reports are available on the RN52 product
web page at http://www.microchip.com. For more infor-
mation on Australia compliance, refer to the Australian
Communications and Media Authority web site:
http://www.acma.gov.au/.
4.4.1 HELPFUL WEB SITES
The Australian Communications and Media Authority:
www.acma.gov.au/.
4.5 New Zealand
The New Zealand radio regulations do not provide a
modular approval policy similar to the United States
(FCC) and Canada (IC). However, RN52 module RF
transmitter test reports can be used in part to demon-
strate compliance against the New Zealand “General
User Radio License for Short Range Devices”. New
Zealand Radio communications (Radio Standards)
Notice 2010 calls up the AS / NZS 4268:2008 industry
standard. The RN52 module test reports can be used
as part of the product certification and compliance
folder. All test reports are available on the RN52 prod-
uct web page at http://www.microchip.com. For more
information on the RF transmitter test reports, contact
Microchip Technology sales office.
Information on the New Zealand short range devices
license can be found in the following web links:
http://www.rsm.govt.nz/cms/licensees/types-oflicence/
general-user-licences/short-range-devices
and
http://www.rsm.govt.nz/cms/policy-and-planning/spec-
trum-policy-overview/legislation/gazette-notices/prod-
uct-compliance/radiocommunications-radiostandards-
notice-2010.
To meet overall New Zealand final product compliance,
the developer must construct a compliance folder con-
taining all relevant compliance test reports e.g. RF,
EMC, electrical safety and DoC (Declaration of Confor-
mity) etc. It is the responsibility of the developer to
know what is required in the compliance folder for New
Zealand Radio communications. For more information
on New Zealand compliance, refer to the web site:
http://www.rsm.govt.nz/.
4.5.1 HELPFUL WEB SITES
Radio Spectrum Ministry of Economic Development:
http://www.rsm.govt.nz/.
RN52
DS70005120A-page 22 2015 Microchip Technology Inc.
5.0 ORDERING INFORMATION
Table 5-1 provides ordering information for the RN52
module.
Go to http://www.microchip.com for current pricing and
a list of distributors carrying Microchip products.
TABLE 5-1: ORDERING INFORMATION(1)
Part Number Description
RN52-I/RM Standard application firmware (A2DP/AVRCP/SPP) (master).
Note 1: For other configurations, contact Microchip directly.
2015 Microchip Technology Inc. DS70005120A-page 23
RN52
6.0 REVISION HISTORY
Revision A (September 2015)
• This replaces Roving Networks document “RN52
Bluetooth Audio Module Data Sheet”, version 1.1r
3/20/13.
RN52
DS70005120A-page 24 2015 Microchip Technology Inc.
NOTES:
YSTEM
2015 Microchip Technology Inc. DS70005120A-page 25
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer,
LANCheck, MediaLB, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC,
SST, SST Logo, SuperFlash and UNI/O are registered
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
The Embedded Control Solutions Company and mTouch are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo,
CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit
Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet,
KleerNet logo, MiWi, motorBench, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, RightTouch logo, REAL ICE, SQI, Serial Quad I/O,
Total Endurance, TSHARC, USBCheck, VariSense,
ViewSpan, WiperLock, Wireless DNA, and ZENA are
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2015, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
ISBN: 978-1-63277-794-2
Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITY MANAGEMENT S
YSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
Q ‘MICRDCHIP
DS70005120A-page 26 2015 Microchip Technology Inc.
AMERICAS
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Austin, TX
Tel: 512-257-3370
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Novi, MI
Tel: 248-848-4000
Houston, TX
Tel: 281-894-5983
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
New York, NY
Tel: 631-435-6000
San Jose, CA
Tel: 408-735-9110
Canada - Toronto
Tel: 905-673-0699
Fax: 905-673-6509
ASIA/PACIFIC
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2943-5100
Fax: 852-2401-3431
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
China - Dongguan
Tel: 86-769-8702-9880
China - Hangzhou
Tel: 86-571-8792-8115
Fax: 86-571-8792-8116
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
ASIA/PACIFIC
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
India - Pune
Tel: 91-20-3019-1500
Japan - Osaka
Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Taiwan - Kaohsiung
Tel: 886-7-213-7828
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
EUROPE
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Germany - Dusseldorf
Tel: 49-2129-3766400
Germany - Karlsruhe
Tel: 49-721-625370
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Italy - Venice
Tel: 39-049-7625286
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Poland - Warsaw
Tel: 48-22-3325737
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
Worldwide Sales and Service
07/14/15