Datenblatt für BALF-SPI-01D3 von STMicroelectronics

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This is information on a product in full production.
November 2015 DocID025035 Rev 5 1/12
12
BALF-SPI-01D3
50 Ω nominal input / conjugate match balun to SPIRIT1,
with integrated harmonic filter
Datasheet production data
Figure 1. Pin coordinates (top view)
Figure 2. Application schematic (top view)
Features
50 Ω nominal input / conjugate match to
SPIRIT1
Low insertion loss
Low amplitude imbalance
Low phase imbalance
Small footprint
Benefits
Very low profile (< 670 μm)
High RF performance
RF BOM and area reduction
Applications
868 MHz and 915 MHz impedance matched
balun filter
Optimized for SPIRIT1 sub GHz RFIC
Description
STMicroelectronics BALF-SPI-01D3 is an ultra
miniature balun. The BALF-SPI-01D3 integrates
matching network and harmonics filters. Matching
impedance has been customized for the SPIRIT1
ST transceiver.
The BALF-SPI-01D3 uses STMicroelectronics
IPD technology on non-conductive glass
substrate which optimize RF performance.
Flip-Chip package 6 bumps
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Characteristics BALF-SPI-01D3
2/12 DocID025035 Rev 5
1 Characteristics
Table 1. Absolute maximum ratings (limiting values)
Symbol Parameter Value Unit
Min. Typ. Max.
PIN Input power RFIN - 20 dBm
VESD
ESD ratings human body model (JESD22-A114-C), all I/O one at a
time while others connected to GND 2000 -
V
ESD ratings machine model, all I/O 200 -
TOP Operating temperature (JESD22-A115-C), all I/O -40 - +85 °C
Table 2. Impedances (Tamb = 25 °C)
Symbol Parameter Value Unit
Min. Typ. Max.
ZRX Nominal differential RX balun impedance
- match to SPIRIT1 - Ω
ZTX Nominal TX filter impedance
ZANT Antenna impedance - 50 - Ω
Table 3. RF performance (Tamb = 25 °C)
Symbol Parameter Test condition Value Unit
Min. Typ. Max.
F Frequency range (bandwidth) 779 868 956 MHz
S21RX-ANT
Insertion loss in bandwidth
without mismatch loss (RX balun) -1.7 -2 dB
S21TX-ANT
Insertion loss in bandwidth
without mismatch loss (TX filter) -1.4 -2 dB
S11ANT Input return loss in bandwidth (RX balun) -23 -15 dB
S11ANT Input return loss in bandwidth (TX filter) -15 -12 dB
imb Output phase imbalance (RX balun) 5 10 15 °
Aimb Output amplitude imbalance (RX balun) 0.35 0.8 dB
Att Harmonic levels (TX filter)
Attenuation at 2fo -35
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Attenuation at 3fo -40
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DocID025035 Rev 5 3/12
BALF-SPI-01D3 Characteristics
1.1 RF measurement (Rx balun)
Figure 3. Insertion loss (Tamb = 25 °C) Figure 4. Return loss antenna (Tamb = 25 °C)
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Characteristics BALF-SPI-01D3
4/12 DocID025035 Rev 5
1.2 RF measurement (Tx filter)
Figure 7. Transmission (Tamb = 25 °C) Figure 8. Insertion loss (Tamb = 25 °C)
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Figure 9. Attenuation (Tamb = 25 °C) Figure 10. Return loss antenna (Tamb = 25 °C)
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DocID025035 Rev 5 5/12
BALF-SPI-01D3 Application information
2 Application information
Figure 11. Application board EVB (4 layers)
Figure 12. TX output measurements with BALF-SPI-01D3 at 868 MHz
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Application information BALF-SPI-01D3
6/12 DocID025035 Rev 5
Figure 13. TX output power measurements over frequency with BALF-SPI-01D3
Figure 14. Harmonic measurements at Pout = 10 dBm with BALF-SPI-01D3
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DocID025035 Rev 5 7/12
BALF-SPI-01D3 Package information
3 Package information
Epoxy meets UL94, V0
Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
3.1 Flip-Chip package information
Figure 15. Flip-Chip package outline
Table 4. Flip-Chip package mechanical data
Parameter Description Min. Typ. Max. Unit
A Bump height + substrate thickness 0.590 0.650 0.710 mm
A1 Bump height 0.200 mm
A2 Substrate thickness 0.400 mm
b Bump diameter 0.210 0.250 0.290 mm
D Y dimension of the die 1.950 2.000 1.950 mm
D1 Y pitch 0.960 1.000 1.040 mm
D2 Y pitch2 0.460 0.500 0.540 mm
E X dimension of the die 1.350 1.400 1.450 mm
E1 X pitch 0.790 0.820 0.850 mm
fD1 Distance from bump to edge of die on Y
axis 0.295 mm
fD2 Distance from bump to edge of die on Y
axis 0.195 mm
ccc 0.05 mm
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Package information BALF-SPI-01D3
8/12 DocID025035 Rev 5
Figure 16. Recommended balun land pattern
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DocID025035 Rev 5 9/12
BALF-SPI-01D3 Package information
Figure 17. Footprint - 3 mils stencil -non solder
mask defined Figure 18. Footprint - 3 mils stencil - solder
mask defined
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Figure 19. Footprint - 5 mils stencil -non solder
mask defined Figure 20. Footprint - 5 mils stencil - solder
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Package information BALF-SPI-01D3
10/12 DocID025035 Rev 5
Figure 21. Marking
Figure 22. Flip Chip tape and reel specifications
Note: More information is available in the STMicroelectronics Application note:
AN2348 Flip-Chip: “Package description and recommendations for use”
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DocID025035 Rev 5 11/12
BALF-SPI-01D3 Ordering information
4 Ordering information
5 Revision history
Table 5. Ordering information
Order code Marking Weight Base Qty Delivery mode
BALF-SPI-01D3 SJ 3.0 mg 5000 Tape and Reel
Table 6. Document revision history
Date Revision Changes
27-Aug-2013 1 Initial release.
03-Oct-2013 2 Updated document title. Updated Table 1 with JESD22 references.
15-May-2015 3 Updated Figure 1 and Figure 15. Added Figure 19 and Figure 20.
18-Sep-2015 4 Updated Figure 15 and added Table 4.
17-Nov-2015 5 Updated Figure 2 and Figure 15.
BALF-SPI-01D3
12/12 DocID025035 Rev 5