
(Voltages referenced to GND.)
VCC .....................................................................-0.3V to +6.0V
RO ............................................................ -0.3V to (VCC + 0.3V)
RE, DE, DI ............................................................ -0.3V to +6.0V
A, B (VCC ≥ 3.6V) .............................................-8.0V to +13.0V
A, B (VCC < 3.6V) .............................................-9.0V to +13.0V
Short-Circuit Duration (RO, A, B) to GND ................. Continuous
Operating Temperature Range
MAX14783EE_ ............................................... -40°C to +85°C
MAX14783EA_ ............................................. -40°C to +125°C
Junction Temperature ...................................................... +150°C
Storage Temperature Range ............................ -65°C to +150°C
Continuous Power Dissipation (TA = +70°C)
µMAX (derate at 4.8mW/°C above +70°C) .................387mW
SO (derate at 7.6mW/°C above +70°C) ......................606mW
TDFN-EP (derate at 24.4mW/°C above +70°C) ........ 1951mW
Lead Temperature (soldering, 10s) ................................. +300ºC
Soldering Temperature (reflow) ...................................... +260°C
Junction-to-Case Thermal Resistance (θJC)
8-pin µMAX ..................................................................42°C/W
8-pin SO ......................................................................38°C/W
8-pin TDFN-EP ..............................................................8°C/W
Junction-to-Ambient Thermal Resistance (θJA)
8-pin µMAX ................................................................206°C/W
8-pin SO ....................................................................132°C/W
8-pin TDFN-EP ............................................................41°C/W
(Note 1)
(VCC = +3.0V to +5.5V, TA = TMIN to TMAX, unless otherwise specified. Typical values are at VCC = +5V and TA = +25°C.) (Notes 2, 3)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
POWER SUPPLY
Supply Voltage VCC 3.0 5.5 V
Supply Current ICC DE = VCC, RE = GND, no load 1.9 4 mA
Shutdown Supply Current ISHDN DE = GND, RE = VCC 10 µA
DRIVER
Differential Driver Output VOD
VCC = 4.5V, RL = 54Ω, Figure 1 2.1
VVCC = 3V, RL = 100Ω, Figure 1 2.0
VCC = 3V, RL = 54Ω, Figure 1 1.5
Change in Magnitude of Differential
Output Voltage ΔVOD RL = 54Ω or 100Ω, Figure 1 (Note 4) -0.2 0 +0.2 V
Driver Common-Mode Output
Voltage VOC RL = 54Ω or 100Ω, Figure 1 VCC / 2 3 V
Change in Magnitude of Common-
Mode Voltage ΔVOC RL = 54Ω or 100Ω, Figure 1 (Note 4) -0.2 +0.2 V
Single-Ended Driver Output High VOH A or B output, IA or B = -20mA 2.2 V
Single-Ended Driver Output Low VOL A or B output, IA or B = 20mA 0.8 V
Differential Output Capacitance COD DE = RE = VCC, f = 4MHz 12 pF
Driver Short-Circuit Output Current |IOST|0 ≤ VOUT ≤ +12V, output low 250 mA
-7V ≤ VOUT ≤ VCC, output high 250 mA
MAX14783E High-Speed 3.3V/5V RS-485/RS-422 Transceiver
with ±35kV HBM ESD Protection
www.maximintegrated.com Maxim Integrated
│
2
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Thermal Characteristics
Electrical Characteristics