Datenblatt für HMC1106 von Analog Devices Inc.

ANALOG DEVICES RnHS/ $5; I iia
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
MIXERS - CHIP
1
HMC1106
v01.0314
GaAs MMIC MIXER
15 - 36 GHz
General Description
Features
Functional Diagram
Passive: No DC Bias Required
Low LO Power: +15 dBm
LO/RF Isolation: 38 dB
LO/IF Isolation: 32 dB
RF/IF Isolation: 25 dB
Wide IF Bandwidth: DC to 24 GHz
Die Size: 1.79 x 1.46 x 0.1 mm
Electrical Specifications, TA = +25° C, LO = 36.1 GHz, LO = +15 dBm, LSB [1]
Typical Applications
The HMC1106 is ideal for:
• Microwave Point-to-Point Radios
• VSAT & SATCOM
• Test Equipment & Sensors
• Military End-Use
• Automotive Radar
The HMC1106 is a double-balanced mixer which can
be used as a downconverter with DC to 24 GHz at
the IF port, 20 to 50 GHz at the LO port, and 15 to
36 GHz at the RF port. This passive MMIC mixer is
fabricated with GaAs Shottky diode technology. All
bond pads and the die backside are Ti/Au metallized
and the Shottky devices are fully passivated for
reliable operation. All data shown herein is measured
with the chip in a 50 Ohm environment and contacted
with RF probes.
Parameter Min. Typ. Max. Min. Typ. Max Min. Typ. Max Units
RF Frequency Range 15 -24 24 - 27 27 - 36 GHz
LO Frequency Range 20 - 50 GHz
IF Frequency Range DC - 24 GHz
Conversion Loss 9 12 11 14 10 14 dB
LO to RF Isolation 38 38 38 dB
LO to IF Isolation [2] 25 32 25 32 25 32 dB
RF to IF Isolation [3] 15 22 15 18 15 25 dB
IP3 (Input) 16 16 22 dBm
[1] Unless otherwise noted , all measurements performed as downconverter with LO Frequency = 36.1 GHz and LO Power = +15 dBm
[2] Typical value = 22 dB at LO = 20 GHz
[3] Data taken with LO = 30 GHz
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
ANALOG DEVICES E:
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
MIXERS - CHIP
2
HMC1106
v01.0314
GaAs MMIC MIXER
15 - 36 GHz
Conversion Loss vs. Temperature
LO = 36.1 GHz [1]
Conversion Loss vs. LO Power
LO = 36.1 GHz [1]
[1] Measurement taken at fixed LO frequency, LSB
[2] Measurement taken at fixed IF frequency, LSB
-18
-16
-14
-12
-10
-8
-6
-4
-2
0
14 16 18 20 22 24 26 28 30 32 34 36
+25 C +85 C -55 C
CONVERSION LOSS (dB)
RF FREQUENCY (GHz)
-18
-16
-14
-12
-10
-8
-6
-4
-2
0
14 16 18 20 22 24 26 28 30 32 34 36
13 dBm 15 dBm 17 dBm
CONVERSION LOSS (dB)
RF FREQUENCY (GHz)
Conversion Loss vs. Temperature
IF = 12.1 GHz [2]
Conversion Loss vs. LO Power
IF = 12.1 GHz [2]
-18
-16
-14
-12
-10
-8
-6
-4
-2
0
15 17 19 21 23 25 27 29 31 33 35 37
+25 C +85 C -55 C
CONVERSION LOSS (dB)
RF FREQUENCY (GHz)
-18
-16
-14
-12
-10
-8
-6
-4
-2
0
15 17 19 21 23 25 27 29 31 33 35 37
13 dBm 15 dBm 17 dBm
CONVERSION LOSS (dB)
RF FREQUENCY (GHz)
Conversion Loss vs. Temperature
IF = 16.1 GHz [2]
Conversion Loss vs. LO Power
IF = 16.1 GHz [2]
-18
-16
-14
-12
-10
-8
-6
-4
-2
0
15 17 19 21 23 25 27 29 31 33
+25 C +85 C -55 C
CONVERSION LOSS (dB)
RF FREQUENCY (GHz)
-18
-16
-14
-12
-10
-8
-6
-4
-2
0
15 17 19 21 23 25 27 29 31 33
13 dBm 15 dBm 17 dBm
CONVERSION LOSS (dB)
RF FREQUENCY (GHz)
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
ANALOG DEVICES RnHS/ $5; I
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
MIXERS - CHIP
3
HMC1106
v01.0314
GaAs MMIC MIXER
15 - 36 GHz
[1] Measurement taken at fixed IF frequency, LSB
[2] Measurement taken at fixed LO frequency, LSB
0
5
10
15
20
25
30
35
14 16 18 20 22 24 26 28 30 32 34 36
+25 C +85 C -55 C
IP3 (dBm)
RF FREQUENCY (GHz)
0
5
10
15
20
25
30
35
14 16 18 20 22 24 26 28 30 32 34 36
13 dBm 15 dBm 17 dBm
IP3 (dBm)
RF FREQUENCY (GHz)
Input IP3 vs. Temperature
LO = 36.1 GHz [2]
Input IP3 vs. LO Power
LO = 36.1 GHz [2]
0
5
10
15
20
25
30
35
14 16 18 20 22 24 26 28 30 32 34 36
+25 C +85 C -55 C
IP3 (dBm)
RF FREQUENCY (GHz)
Input IP3 vs. Temperature
IF = 12.1 GHz [1]
Input IP3 vs. LO Power
IF = 12.1 GHz [1]
0
5
10
15
20
25
30
35
14 16 18 20 22 24 26 28 30 32 34 36
13 dBm 15 dBm 17 dBm
IP3 (dBm)
RF FREQUENCY (GHz)
Conversion Loss vs. IF [1] Input IP3 vs. IF [1]
-18
-16
-14
-12
-10
-8
-6
-4
-2
0
14 16 18 20 22 24 26 28 30 32 34 36 38 40
0.1 GHz
4.1 GHz
8.1 GHz
12.1 GHz
16.1 GHz
20.1 GHz
24.1 GHz
CONVERSION LOSS (dB)
RF FREQUENCY (GHz)
0
5
10
15
20
25
30
35
14 16 18 20 22 24 26 28 30 32 34 36 38 40
0.1 GHz
4.1 GHz
8.1 GHz
12.1 GHz
16.1 GHz
20.1 GHz
24.1 GHz
IP3 (dBm)
RF FREQUENCY (GHz)
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
ANALOG DEVICES
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
MIXERS - CHIP
4
HMC1106
v01.0314
GaAs MMIC MIXER
15 - 36 GHz
Input IP3 vs. Temperature
IF = 16.1 GHz [1]
Input IP3 vs. LO Power
IF = 16.1 GHz [1]
0
5
10
15
20
25
30
35
14 16 18 20 22 24 26 28 30 32 34
+25 C +85 C -55 C
IP3 (dBm)
RF FREQUENCY (GHz)
0
5
10
15
20
25
30
35
14 16 18 20 22 24 26 28 30 32 34
13 dBm 15 dBm 17 dBm
IP3 (dBm)
RF FREQUENCY (GHz)
RF Return Loss vs. Temperature
LO = 30GHz
RF Return Loss vs. LO Power
LO = 30GHz
-35
-30
-25
-20
-15
-10
-5
0
14 16 18 20 22 24 26 28 30 32 34 36 38 40
25 C 85 C -85 C
RETURN LOSS (dB)
RF FREQUENCY (GHz)
-35
-30
-25
-20
-15
-10
-5
0
14 16 18 20 22 24 26 28 30 32 34 36 38 40
13 dBm 15 dBm 17 dBm
RETURN LOSS (dB)
RF FREQUENCY (GHz)
-25
-20
-15
-10
-5
0
20 25 30 35 40 45 50
25 C 85 C -55 C
RETURN LOSS (dB)
LO FREQUENCY (GHz)
-25
-20
-15
-10
-5
0
20 25 30 35 40 45 50
13 dBm 14 dBm
RETURN LOSS (dB)
LO FREQUENCY (GHz)
LO Return Loss vs. Temperature [2] LO Return Loss vs. LO Power
[1] Measurement taken at fixed IF frequency, LSB
[2] Measurement taken at LO power = +14 dBm
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
ANALOG DEVICES
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
MIXERS - CHIP
5
HMC1106
v01.0314
GaAs MMIC MIXER
15 - 36 GHz
LO/RF Isolation vs. Temperature LO/RF Isolation vs. LO Power
-80
-70
-60
-50
-40
-30
-20
-10
0
10 15 20 25 30 35 40 45 50
+25 C +85 C -55 C
LO FREQUENCY (GHz)
-80
-70
-60
-50
-40
-30
-20
-10
0
10 15 20 25 30 35 40 45 50
13 dBm 15 dBm 17 dBm
ISOLATION (dB)
LO FREQUENCY (GHz)
LO/IF Isolation vs. Temperature LO/IF Isolation vs. LO Power
-50
-40
-30
-20
-10
0
10 15 20 25 30 35 40 45 50
+25 C +85 C -55 C
LO FREQUENCY (GHz)
-50
-40
-30
-20
-10
0
10 15 20 25 30 35 40 45 50
13 dBm 15 dBm 17 dBm
LO FREQUENCY (GHz)
RF/IF Isolation vs. Temperature
LO = 20 GHz
-50
-40
-30
-20
-10
0
10 15 20 25 30 35 40
+25 C +85 C -55 C
ISOLATION (dB)
RF FREQUENCY (GHz)
-50
-40
-30
-20
-10
0
10 15 20 25 30 35 40
13 dBm 15 dBm 17 dBm
RF FREQUENCY (GHz)
RF/IF Isolation vs. LO Power
LO = 20 GHz
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
ANALOG DEVICES @
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
MIXERS - CHIP
6
HMC1106
v01.0314
GaAs MMIC MIXER
15 - 36 GHz
RF/IF Isolation vs. Temperature
LO = 30 GHz
RF/IF Isolation vs. LO Power
LO = 30 GHz
-50
-40
-30
-20
-10
0
10 15 20 25 30 35 40
+25 C +85 C -55 C
ISOLATION (dB)
RF FREQUENCY (GHz)
-50
-40
-30
-20
-10
0
10 15 20 25 30 35 40
13 dBm 15 dBm 17 dBm
RF FREQUENCY (GHz)
MxN Spurious Outputs, RF = 20GHz
nLO
mRF 01234
0xx 1000
19.8 0000
258.5 30.3 41.7 0 0
3 0 35 46.6 56 0
4 0 78.5 62.6 57.4 0
RF = 20 GHz @ -4 dBm
LO = 35 GHz @ +13 dBm
Data taken without IF hybrid
All values in dBc below IF power level
MxN Spurious Outputs, RF = 25 GHz
nLO
mRF 01234
0xx 0000
112.5 022.5 0 0
256.5 25 33.3 0 0
3 0 53.7 55.8 57 0
40073.6 64.4 68.8
RF = 25 GHz @ -4 dBm
LO = 35 GHz @ +13 dBm
Data taken without IF hybrid
All values in dBc below IF power level
MxN Spurious Outputs, RF = 30 GHz
nLO
mRF 01234
0xx 5000
116.5 0.2 22.7 0 0
2 0 42.6 57.3 45.5 0
30050.5 60.1 0
40063.2 68.5 67. 3
RF = 30 GHz @ -4 dBm
LO = 35 GHz @ +13 dBm
Data taken without IF hybrid
All values in dBc below IF power level
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
ANALOG DEVICES
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
MIXERS - CHIP
7
HMC1106
v01.0314
GaAs MMIC MIXER
15 - 36 GHz
Standard Alternate
GP-2 (Gel Pack) [2]
[1] For more information refer to the “Packaging
information” Document in the Product Support Section of
our website.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
Die Packaging Information [1]
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM].
2. DIE THICKNESS IS 0.004”
3. BOND PADS 1, 2 & 3 are 0.0059” [0.150] X 0.0039” [0.099].
4. BACKSIDE METALLIZATION: GOLD.
5. BOND PAD METALLIZATION: GOLD.
6. BACKSIDE METAL IS GROUND.
7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS.
8. OVERALL DIE SIZE ± 0.002
Outline Drawing
LO Input Power +17 dB m
Maximum Junction Temperature 175 °C
Continuous Pdiss (T= 85 °C)
(derate 1.75 mW/°C above 85°C) 157 mW
Thermal Resistance (RTH)
(junction to die bottom) 570 °C/W
Operating Temperature -55 to +85 °C
Storage Temperature -65 to 150 °C
ESD Sensitivity (HBM) Class1A, passed 250V
Absolute Maximum Ratings
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
ANALOG DEVICES RnHS/ SE; LO ;~{}i m4? Y‘GND 1 MIL GOLD WIRE (WEDGE BOND) 3 MIL |:I D NOMINAL GAP 5‘ E E I 0 EEE E ” E EEG K—EE: 50 OHM J TRANSMISSION LINE
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
MIXERS - CHIP
8
HMC1106
v01.0314
GaAs MMIC MIXER
15 - 36 GHz
Pad Descriptions
Pad Number Function Description Pad Schematic
1LO This pad is AC coupled
and Matched to 50 Ohms.
2RF This pad is AC coupled
and Matched to 50 Ohms.
3IF This pad is DC coupled
and Matched to 50 Ohms.
Die Bottom GND Die bottom must be connected to RF/DC ground
Assembly Diagram
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
ANALOG DEVICES
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
MIXERS - CHIP
9
HMC1106
v01.0314
GaAs MMIC MIXER
15 - 36 GHz
Mounting & Bonding Techniques for Millimeterwave GaAs MMICs
The die should be attached directly to the ground plane eutectically or with
conductive epoxy (see HMC general Handling, Mounting, Bonding Note).
50 Ohm Microstrip transmission lines on 0.127mm (5 mil) thick alumina
thin film substrates are recommended for bringing RF to and from the chip
(Figure 1). One way to accomplish this is to attach the 0.102mm (4 mil)
thick die to a 0.150mm (6 mil) thick molybdenum heat spreader (moly-
tab) which is then attached to the ground plane (Figure 2). Microstrip
substrates should be located as close to the die as possible in order to
minimize bond wire length. Typical die-to-substrate spacing is 0.076mm to
0.152 mm (3 to 6 mils).
Handling Precautions
Follow these precautions to avoid permanent damage.
Storage: All bare die are placed in either Waffle or Gel based ESD protec-
tive containers, and then sealed in an ESD protective bag for shipment.
Once the sealed ESD protective bag has been opened, all die should be
stored in a dry nitrogen environment.
Cleanliness: Handle the chips in a clean environment. DO NOT attempt
to clean the chip using liquid cleaning systems.
Static Sensitivity: Follow ESD precautions to protect against > ± 250V
ESD strikes.
Transients: Suppress instrument and bias supply transients while bias is
applied. Use shielded signal and bias cables to minimize inductive pick-
up.
General Handling: Handle the chip along the edges with a vacuum collet
or with a sharp pair of bent tweezers. The surface of the chip may have
fragile air bridges and should not be touched with vacuum collet, tweezers,
or fingers.
Mounting
The chip is back-metallized and can be die mounted with AuSn eutectic preforms or with electrically conductive epoxy.
The mounting surface should be clean and flat.
Eutectic Die Attach: A 80/20 gold tin preform is recommended with a work surface temperature of 255 °C and a tool
temperature of 265 °C. When hot 90/10 nitrogen/hydrogen gas is applied, tool tip temperature should be 290 °C. DO
NOT expose the chip to a temperature greater than 320 °C for more than 20 seconds. No more than 3 seconds of
scrubbing should be required for attachment.
Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed
around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer’s schedule.
Wire Bonding
Ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage
temperature of 150 °C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recom-
mended. Use the minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started on
the chip and terminated on the package or substrate. All bonds should be as short as possible <0.31mm (12 mils).
0.102mm (0.004”) Thick GaAs MMIC
Wire Bond
RF Ground Plane
0.127mm (0.005”) Thick Alumina
Thin Film Substrate
0.076mm
(0.003”)
Figure 1.
0.102mm (0.004”) Thick GaAs MMIC
Wire Bond
RF Ground Plane
0.254mm (0.010”) Thick Alumina
Thin Film Substrate
0.076mm
(0.003”)
Figure 2.
0.150mm (0.005”) Thick
Moly Tab
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
ANALOG DEVICES
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
MIXERS - CHIP
10
HMC1106
v01.0314
GaAs MMIC MIXER
15 - 36 GHz
Notes:
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D