Datenblatt für BLM18xx H Series Spec von Murata Electronics

Spec. No. JENF243A-9101S-01 3.Ratin Impedance (9) DC Resws‘ance Initla\ Values
Spec. No. JENF243A-9101S-01 P.1/10
MURATA MFG.CO., LTD.
Reference Only
Chip Ferrite Bead BLM18□□□□□□H1D
Murata Standard Reference Specification[AEC-Q200]
1.Scope
This reference specification applies to Chip Ferrite Bead for Automotive Electronics BLM18_□H Series based on AEC-Q200.
2.Part Numbering
(ex.) BL M 18 AG 121 S Ｈ 1 D
(1) (2) (3) (4) (5) (6) (7) (8) (9)
(1)Product ID (4)Characteristics (7)Category(for Automotive Electronics)
(2)Type (5)Typical Impedance at 100MHz (8)Numbers of Circuit
(3)Dimension (L×Ｗ) (6)Performance (9)Packaging (D:Taping)
3.Rating
Customer
Part Number
MURATA
Part Number
Impedance ()
(at 100MHz)(*1)
(refer to below comment) Rated
Current
(mA)
DC Resistance
( max.) (*1)
(refer to below
comment) Remark
ESD Rank
2:2kV
6:25kV
Initial
Values
Values
After
Testing
Typical at 85℃ at 125℃
BLM18PG300SH1D 20 min. 30 1000 0.05 0.10
For DC
power line
6
BLM18PG330SH1D 33±25% 33 3000*2 1000
*2 0.025 0.050
BLM18PG600SH1D 40 min. 60 1000 0.1 0.2
BLM18PG121SH1D 120±25% 120 2000*2 1000*2 0.05 0.10
BLM18PG181SH1D 180±25% 180 1500*2 1000
*2 0.09 0.18
BLM18PG221SH1D 220±25% 220 1400*2 1000
*2 0.10 0.14
BLM18PG331SH1D 330±25% 330 1200*2 1000
*2 0.15 0.20
BLM18PG471SH1D 470±25% 470 1000 0.20 0.26
BLM18SP300SH1D 30±10 30 6000*2 4000
*2 0.008 0.010
BLM18SP101SH1D 100±25% 100 3700*2 2500
*2 0.022 0.026
BLM18SP221SH1D 220±25% 220 2800*2 1900
*2 0.040 0.048
BLM18SP601SH1D 600±25% 600 1500*2 1000
*2 0.140 0.168
BLM18SP102SH1D 1000±25% 1000 1200*2 800
*2 0.185 0.222
BLM18KG221SH1D 220±25% 220 2200*2 1500
*2 0.050 0.060
2
BLM18KG331SH1D 330±25% 330 1700*2 1200
*2 0.080 0.095
BLM18KG471SH1D 470±25% 470 1500*2 1000
*2 0.130 0.145
BLM18KG601SH1D 600±25% 600 1300*2 1000
*2 0.150 0.165
BLM18KG102SH1D 1000±25% 1000 1000*2 800
*2 0.200 0.230
BLM18SN220TH1D 22±7 22 8000*2 5000
*2 0.004 0.005
For DC
power line
(Thin type)
2
BLM18KG260TH1D 26±25% 26 6000*2 4000
*2 0.007 0.012
BLM18KG300TH1D 30±25% 30 5000*2 3300
*2 0.010 0.015
BLM18KG700TH1D 70±25% 70 3500*2 2200
*2 0.022 0.032
BLM18KG101TH1D 100±25% 100 3000*2 1900
*2 0.030 0.040
BLM18KG121TH1D 120±25% 120 3000*2 1900
*2 0.030 0.040
BLM18AG121SH1D 120±25% 120 800 0.18 0.28
For
general
use
2
BLM18AG151SH1D 150±25% 150 700 0.25 0.35
BLM18AG221SH1D 220±25% 220 700 0.25 0.35
BLM18AG331SH1D 330±25% 330 600 0.30 0.40
BLM18AG471SH1D 470±25% 470 550 0.35 0.45
BLM18AG601SH1D 600±25% 600 500 0.38 0.48
BLM18AG102SH1D 1000±25% 1000 450 0.50 0.60
E Spec. No. JENF243A-9101S-01 Impedance (9) DC Reswstance Initla\ Values
Spec. No. JENF243A-9101S-01 P.2/10
MURATA MFG.CO., LTD.
Reference Only
Customer
Part Number
MURATA
Part Number
Impedance ()
(at 100MHz)(*1)
(refer to below comment) Rated
Current
(mA)
DC Resistance
( max.) (*1)
(refer to below
comment) Remark
ESD Rank
2:2kV
6:25kV
Initial
Values
Values
After
Testing
Typical at 85℃ at 125℃
BLM18BB050SH1D 5±25% 5 800 0.05 0.10
For
high speed
signal line
2
BLM18BA050SH1D 5±25% 5 500 0.2 0.3
BLM18BB100SH1D 10±25% 10 700 0.10 0.20
BLM18BA100SH1D 10±25% 10 500 0.25 0.35
BLM18BB220SH1D 22±25% 22 700 0.20 0.30
BLM18BA220SH1D 22±25% 22 500 0.35 0.45
BLM18BB470SH1D 47±25% 47 600 0.25 0.35
BLM18BD470SH1D 47±25% 47 500 0.3 0.4
BLM18BA470SH1D 47±25% 47 300 0.55 0.65
BLM18BB600SH1D 60±25% 60 600 0.25 0.35
For
high speed
signal line
2
BLM18BA750SH1D 75±25% 75 300 0.70 0.80
BLM18BB750SH1D 75±25% 75 600 0.30 0.40
BLM18BB121SH1D 120±25% 120 550 0.30 0.40
BLM18BD121SH1D 120±25% 120 300 0.4 0.5
BLM18BA121SH1D 120±25% 120 200 0.9 1.0
BLM18BB141SH1D 140±25% 140 500 0.35 0.45
BLM18BB151SH1D 150±25% 150 450 0.37 0.47
BLM18BD151SH1D 150±25% 150 300 0.4 0.5
BLM18BB221SH1D 220±25% 220 450 0.45 0.55
BLM18BD221SH1D 220±25% 220 250 0.45 0.55
BLM18BB331SH1D 330±25% 330 400 0.58 0.68
BLM18BD331SH1D 330±25% 330 250 0.5 0.6
BLM18BD421SH1D 420±25% 420 250 0.55 0.65
BLM18BB471SH1D 470±25% 470 300 0.85 0.95
BLM18BD471SH1D 470±25% 470 250 0.55 0.65
BLM18BD601SH1D 600±25% 600 200 0.65 0.75
BLM18BD102SH1D 1000±25% 1000 200 0.85 0.95
BLM18BD152SH1D 1500±25% 1500 150 1.2 1.3
BLM18BD182SH1D 1800±25% 1800 150 1.5 1.6
BLM18BD222SH1D 2200±25% 2200 150 1.5 1.6
BLM18BD252SH1D 2500±25% 2500 150 1.5 1.6
Operating Temperature : -55°C to +125°C Storage Temperature : -55°C to +125°C
(*1)
Standard Testing Conditions
Unless otherwise specified In case of doubt
Temperature : Ordinary Temp. (15 °C to 35 °C ) Temperature : 20°C±2 °C
Humidity : Ordinary Humidity (25%(RH) to 85%(RH)) Humidity : 60%(RH) to 70%(RH)
Atmospheric pressure : 86kPa to 106kPa
(Note)As for Rated currentmarked with *2,
Rated Current is derated as right figure
depending on the operating temperature.
Operating Temperature (°C)
85 125
0
Rated Current (A)
at 85°C
Rated current
at 125°C
Rated current
Sgec. No. JENF243A-9101S-O1 1 6:0.1 0 810,1 F—WF—W \I‘U ‘ I El 9de WWW Tab‘e A TableE
Spec. No. JENF243A-9101S-01 P.3/10
MURATA MFG.CO., LTD.
Reference Only
4.Style and Dimensions
■ Equivalent Circuit
5.Marking
No marking.
6.Specifications
6-1.Electrical Performance
No. Item Specification Test Method
6-1-1 Impedance Meet item 3. Measuring Frequency : 100MHz±1MHz
Measuring Equipment : KEYSIGHT 4991A or the equivalent
Test Fixture : KEYSIGHT 16192A or the equivalent
6-1-2 DC Resistance Meet item 3. Measuring Equipment : Digital multi meter
For BLM18SN
Measuring Equipment : YOKOGAWA 755611 or the equivalent
Test Fixture : KEYSIGHT 16044A or the equivalent
＊Except resistance of the Substrate and Wire
6-2. Mechanical Performance(based on Table 13 for FILTER EMI SUPPRESSORS/FILTERS)
AEC-Q200 Rev.D issued June. 1 2010
AEC-Q200 Murata Specification / Deviation
No. Stress Test Method
3 High
Temperature
Exposure
1000hours at 125 deg C
Set for 24hours at room
temperature, then measured.
Meet Table A after testing.
Table A
4 Temperature Cycling 1000cycles
-55 deg C to +125 deg C
Set for 24hours at room
temperature, then measured.
Meet Table B after testing.
TableB
Appearance No damage
Impedance
Change
(at 100MHz)
Within ±30%
（for BLM18SN
Within ±50%）
(for BLM18KG
Within-10%to+50%)
DC Resistance Meet item 3.
P/N T
BLM18_SH 0.8±0.15
BLM18_TH 0.6±0.15
Resistance element becomes
dominant at high frequencies.
()
Appearance No damage
Impedance
Change
(at 100MHz)
Within ±30%
（for BLM18SN
Within ±50%）
DC
Resistance Meet item 3.
:
E
le
c
t
r
o
d
e
1
.
6
±
0
.1
5
0
.
8
±
0
.
1
5
0
.
4
±0
.
2
Ｔ
■
Unit Mass (Typical value)
BLM18_SH
：
0.005g
BLM18_TH
：
0.004g
(in mm)
Spec. No. JENF243A-9101S-01 TableC Tab‘e D
Spec. No. JENF243A-9101S-01 P.4/10
MURATA MFG.CO., LTD.
Reference Only
AEC-Q200 Murata Specification / Deviation
No. Stress Test Method
5 Destructive
Physical Analysis
Per EIA469
No electrical tests
No defects
7 Biased Humidity 1000hours at 85 deg C, 85%RH
Apply max rated current.
Meet Table C after testing.
TableC
8 Operational Life Apply 125 deg C 1000hours
Set for 24hours at room
temperature, then measured
Meet Table C after testing.
If the rated current of parts exceed 1A,
the operating temperature should be 85 deg C.
9 External Visual Visual inspection No abnormalities
10 Physical Dimension Meet ITEM 4
（Style and Dimensions）
No defects
12 Resistance to Solvents Per MIL-STD-202
Method 215
Not Applicable
13 Mechanical Shock Per MIL-STD-202 Method 213
Condition F
1500g's (14.7N)/0.5ms/
Half sine
Meet Table D after testing.
Table D
14 Vibration 5g's(0.049N) for 20 minutes,
12cycles each of 3 orientations
Test from 10-2000Hz.
Meet Table D after testing.
15 Resistance
to Soldering Heat
Solder temperature
260C+/-5 deg C
Immersion time 10s
Pre-heating:150C +/-10 deg,60s to 90s
Meet Table C after testing.
17 ESD Per AEC-Q200-002 Meet Table D after testing.
ESD Rank: Meet Item 3. (Rating)
18 Solderability Per J-STD-002
Method b : Not Applicable
95% of the terminations is to be soldered.
19 Electrical
Characterization
Measured : Impedance No defects
20 Flammability Per UL-94 Not Applicable
21 Board Flex Epoxy-PCB(1.6mm)
Deflection 2mm(min)
60s minimum holding tim
Meet Table C after testing.
22 Terminal Strength Per AEC-Q200-006 No defects
30 Electrical
Transient
Conduction
Per ISO-7637-2 Not Applicable
Appearance No damage
Impedance
Change
(at 100MHz)
Within ±30%
DC Resistance Meet item 3.
Appearance No damage
Impedance
Change
(at 100MHz)
Within ±30%
（for BLM18KG/SN
Within ±50%）
DC
Resistance Meet item 3.
S ec. No. JENF243A-9101S-01 (Léf%¥‘ 66$» 7 i , ‘_,_ - e l:> @ % mber(*1 0000 w
Spec. No. JENF243A-9101S-01 P.5/10
MURATA MFG.CO., LTD.
Reference Only
7.Specification of Packaging
7-1.Appearance and Dimensions (8mm-wide paper tape)
(in mm)
(1) Taping
Products shall be packaged in the cavity of the base tape of 8mm-wide,4mm-pitch continuously
and sealed by top tape and bottom tape.
(2) The sprocket holes are to the right as the tape is pulled toward the user.
(3) Spliced point:The base tape and top tape have no spliced point
(4) Cavity:There shall not be burr in the cavity.
(5) Missing components number
Missing components number within 0.025% of the number per reel or 1 pc., whichever is greater,
and are not continuous. The specified quantity per reel are kept.
7-2.Tape Strength
(1)Pull Strength
Top tape 5N min.
Bottom tape
(2)Peeling off force of Top tape
0.1N to 0.6N (Minimum value is typical.)
*Speed of Peeling off:300mm/min
7-3.Taping Condition
(1)Standard quantity per reel
Quantity per 180mm reel: 4000 pcs. / reel
(2)There shall be leader-tape (top tape and empty tape ) and trailer- tape(empty tape) as follows.
(3)On paper tape, the top tape and the base tape shall not be adhered at the tip of the empty leader tape
for more than 5 pitch.
(4)Marking for reel
The following items shall be marked on a label and the label is stuck on the reel.
(Customer part number, MURATA part number, Inspection number(1) , RoHS marking (2) , Quantity, etc)
1) « Expression of Inspection No. » □□ OOOO 
(1) (2) (3)
(1) Factory Code
(2) Date First digit : Year / Last digit of year
Second digit : Month / Jan. to Sep. 1 to 9, Oct. to Dec. O, N, D
Third, Fourth digit : Day
(3) Serial No.
2) « Expression of RoHS marking » ROHS – Y (△)
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
Top tape
Bottom tape Base tape
165 to 180 degree F
1.5
1.1max.
Direction of feed
4.0±0.1 4.0±0.1
1.85±0.1
2.0±0.05
3.5±0.05 1.75±0.1
8.0±0.3
+0.1
-0
1.05±0.1
BLM18_SH：1.1 max.
BLM18_TH：0.85max.
Sgec. No. JENF243A-9101S-01 trailer 10:05 160 min. \eadev "o ' A labe' __ 190mm. _ 210mm ] +o‘ ploduttsmragepan emprytape covertape‘ ‘8 ortoptape ( V \ 013.0:02 77> ‘ \ 021.0:03 dlrectlon of feed ; \ / \ \ ~\,,,/ / amofo ' (m mm) er Case
Spec. No. JENF243A-9101S-01 P.6/10
MURATA MFG.CO., LTD.
Reference Only
(5)Outside package
These reels shall be packed in the corrugated cardboard package and the following items shall be marked
on a label and the label is stuck on the box.
(Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS discrimination(
2) ,Quantity, etc)
(6)Dimensions of reel and taping(leader-tape, trailer-tape)
7-4. Specification of Outer Case
Outer Case Dimensions
(mm) Standard Reel Quantity in Outer Case
(Reel)
W D H
186 186 93 5

Above Outer Case size is typical. It depends on a quantity of an order.
8. Caution
8-1.Rating
Do not use products beyond the Operating Temperature Range and Rated Current.
8-2.Surge current
Excessive surge current (pulse current or rush current) than specified rated current applied to the product may cause a
critical failure, such as an open circuit, burnout caused by excessive temperature rise.
Please contact us in advance in case of applying the surge current.
8-3.Fail Safe
Be sure to provide an appropriate fail-safe function on your product to prevent from a second damage
that may be caused by the abnormal function or the failure of our products.
8-4.Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party's life, body or property.
(1)Aircraft equipment (6)Disaster prevention / crime prevention equipment
(2)Aerospace equipment (7)Traffic signal equipment
(3)Undersea equipment (8)Transportation equipment (trains,ships,etc.)
(4)Power plant control equipment (9)Data-processing equipment
(5)Medical equipment (10)Applications of similar complexity and /or reliability requirements
to the applications listed in the above
W
D
Label
H
Sgec. No. JENF243A-9101S-01 Reflow 0.8 0.7 2.5 0.7 2.0 0.7 BLM1BSN BLM18$P 05‘015 17‘025 3‘04 5‘06 12k: 6.0 1.65 3.3 Flux Use rcsmrbased flux, but not mghly ammo flux (wxlh chlorme comenl exceedmg 0.2mm ) So‘der Use Sn73.0A970.50u solder
Spec. No. JENF243A-9101S-01 P.7/10
MURATA MFG.CO., LTD.
Reference Only
9. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
9-1.Land pattern designing
< For BLM18 series (except BLM18P/BLM18S/BLM18K type) >
Type Soldering a b c
BLM18
(except18P/18S/
BLM18K type)
Flow 0.8 2.5 0.7
Reflow 0.7 2.0 0.7
(in mm)
< For BLM18P/BLM18S/BLM18K type >
9-2.Soldering Conditions
Products can be applied to reflow and flow soldering.
(1) Flux,Solder
Flux Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. )
Do not use water-soluble flux.
Solder Use Sn-3.0Ag-0.5Cu solder
Standard thickness of solder paste : 100
µ
m to 200
m
(2) Soldering conditions

Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited
to 150
℃
max. Also cooling into solvent after soldering should be in such a way that the temperature difference
is limited to 100
℃
max.
Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.

Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
Type
Rated
Current
(A)
Soldering a b c
Land pad thickness
and dimension d
18µm 35µm 70µm
BLM18P
BLM18K
0.5 to 1.5
Flow/
Reflow
Flow
0.8
Reflow
0.7
Flow
2.5
Reflow
2.0
0.7
0.7 0.7 0.7
1.7 to 2.5 1.2 0.7 0.7
3 to 4 2.4 1.2 0.7
5 to 6 6.4 3.3 1.65
BLM18SN 8 - 6.4 3.3
BLM18SP 1.2 to 6.0
-
6.4
-
a
b
Chip Ferrite Bead
Solder Resist
Pattern
c
a
b
Chip Ferrite Bead
Solder Resist
Pattern
d
c
The excessive heat by land pads may cause deterioration
at joint of products with substrate.
(in mm)
Spec. No. JENF243A-9101S-01
Spec. No. JENF243A-9101S-01 P.8/10
MURATA MFG.CO., LTD.
Reference Only
(3)soldering profile
□Flow soldering profile
Standard Profile Limit Profile
Pre-heating 150℃、60s min.
Heating 250℃、4～6s 265℃±3℃、5s max.
Cycle of flow 2 times 2 times
□Reflow soldering profile
Standard Profile Limit Profile
Pre-heating 150～180°C 、90s±30s
Heating above 220°C、30s～60s above 230°C、60s max.
Peak temperature 245±3°C 260°C,10s
Cycle of reflow 2 times 2 times
9-3.Reworking with soldering iron
Pre-heating: 150°C, 1 min Soldering iron output: 80W max.
Tip temperature: 350°C max. Tip diameter:φ3mm max.
Soldering time : 3(+1,-0) seconds. Times : 2times max.
Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the crack
on the ferrite material due to the thermal shock.
9-4.Solder Volume
Solder shall be used not to be exceeded as shown below.
1/3T≦t≦T
(T:Chip thickness)
Accordingly increasing the solder volume, the mechanical stress to product is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
Recommendable
Upper Limit
t
Limit Profile
Standard Profile
90s±30s
230℃
260℃
245℃±3℃
220℃
30s～60s
60s max.
180
150
Temp.
(s)
(℃)
Time.
250℃
Heating Time
150
Limit Profile
Standard Profile
(s)Time.
Temp.
(℃)
60s min.
265℃±3℃
Sgec. No. JENF243A-9101S-O1 ”TE“? )oooo ( ) OOOOL ETD m *1 A > D is valid when stress is added vertically to the perforation as wilh Hand Sepai If a Culling Disc is usedy sliess wiH be diagonal lo the PCB. therefore A > D is invaiid (3) Mounting Components Near Screw Hoies When a component is mounted near a screw hoie‘ it may be aflecled by the board deiiectio the tightening oi the screw Mount the component in a position as tar away from the screw ICU-NEE Screw Haie Recommended 9-6.Mounting density Add speciai attention to radiating heat of products when mounting the inductor near the produ The excessive heat by other products may cause deterioration at joint of this product with sub 9-7. Operating Environment Do not use this product und Resislance of Ihe Ferrile m (1) in the corrcdioie atmosphe and etc (the sea breeze (2) in the atmosphere where li (a) in the atmosphere where th 9-8. Resin coating The impedance vaiue may resin to be used for coating use, piease make the rehab
Spec. No. JENF243A-9101S-01 P.9/10
MURATA MFG.CO., LTD.
Reference Only
9-5.Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.
<Products direction>
Products shall be located in the sideways
direction (Length:a
b) to the mechanical
stress.
(2)Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Contents of Measures Stress Level
(1) Turn the mounting direction of the component parallel to the board separation surface. A
>
D *1
(2) Add slits in the board separation part. A
>
B
(3) Keep the mounting position of the component away from the board separation surface. A
>
C
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
(3)
Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.
9-6.Mounting density
Add special attention to radiating heat of products when mounting the inductor near the products with heating.
The excessive heat by other products may cause deterioration at joint of this product with substrate.
9-7. Operating Environment
Do not use this product under the following environmental conditions, on deterioration of the Insulation
Resistance of the Ferrite material and/or corrosion of Inner Electrode may result from the use.
(1) in the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases
and etc.
(the sea breeze, Cl
2
, H
2
S, NH
3
, SO
2
, NO
2
,etc)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
(3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew.
9-8. Resin coating
The impedance value may change and/or it may affect on the product's performance due to high cure-stress of
resin to be used for coating / molding products. So please pay your careful attention when you select resin. In prior to
use, please make the reliability evaluation with the product mounted in your application set.
〈
Poor example
〉〈
Good example
〉
b
a
Screw Hole
Recommended
Perforation
Slit
A
B
C
D
5990. N0. JENF243A-9101S-01
Spec. No. JENF243A-9101S-01 P.10/10
MURATA MFG.CO., LTD.
Reference Only
9-9.Cleaning Conditions
Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate, resulting in cracked chips or broken
solder joints. Before starting your production process,
test your cleaning equipment / process to insure it does not degrade this product.
9-10. Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the
substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to
the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending Twisting
9-11.Storage Conditions
(1)Storage period
Use the products within 6 months after delivered.
Solderability should be checked if this period is exceeded.
(2)Storage conditions
Products should be stored in the warehouse on the following conditions.
Temperature : -10°C to 40°C
Humidity : 15% to 85% relative humidity
No rapid change on temperature and humidity
Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization
of electrode, resulting in poor solderability.
Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
Avoid storing the product by itself bare (i.e.exposed directly to air).
(3)Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
10. Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the agreed specifications.
(3) The contents of this reference specification are subject to change without advance notice. Please approve our product
specifications or transact the approval sheet for product specifications before ordering.