Datenblatt für QSS Series von Samtec Inc.

HIGH-SPEED GROUND PLANE SOCKET fl — \J v \/ ’Q ’4' — — N
(0.635 mm) .025" QSS SERIES
Alignment
Pin
QSS–050–01–F–D–A
QSS–075–01–F–D–A
QSS–025–01–L–D–A
Polarized
Integral metal plane
for power or ground
Blade & Beam
Design
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM
(3.63)
.143
02
01
(No. of Positions per Row/25) x
(20.00) .7875 + (10.90) .429
(20.00) .7875
(No. of Positions per Row/25) x
(20.00) .7875 + (1.27) .050
01
02
(7.49)
.295
(0.15)
.006
(0.635)
.025
(7.24)
.285
(0.76)
.030
(0.89)
.035
DIA
(3.56)
.140
DIA
(No. of Positions per Row/25) x
(20.00) .7875 + (5.72) .225
QSS NO. OF POSITIONS
PER ROW D
PLATING
OPTION
OTHER
OPTION
–025, –050, –075
(50 total positions per bank)
–F
= Gold Flash on Signal Pins and
Ground Plane, Matte Tin on tails
–L
= 10 µ" (0.25 µm) Gold on Signal Pins
and Ground Plane, Matte Tin on tails
–C*
= Electro-Polished Selective
50 µ" (1.27 µm) min Au over
150 µ" (3.81 µm) Ni on Signal Pins
in contact area, 10 µ" (0.25 µm) min
Au over 50 µ" (1.27 µm) Ni on
Ground Plane in contact area,
Matte Tin over 50 µ" (1.27 µm) min
Ni on all solder tails
01 A
–GP
= Guide Holes
for mating
with QTS-RA
–K
= (8.25 mm)
.325" DIA
Polyimide Film
Pick &
Place Pad
–TR
= Tape & Reel
HIGH-SPEED GROUND PLANE SOCKET
Note:
Some lengths, styles and
options are non-standard,
non-returnable.
*Note: –C Plating passes
10 year MFG testing
Board Mates:
QTS
Cable Mates:
SQCD
Standoffs:
SO
For complete specifications and
recommended PCB layouts see
www.samtec.com?QSS
Insulator Material:
Liquid Crystal Polymer
Contact Material:
Phosphor Bronze
Plating:
Au or Sn over
50 µ" (1.27 µm) Ni
Current Rating:
Contact: 1.8 A per pin
(2 pins powered)
Ground Plane:
23.1 A per ground plane
(1 ground plane powered)
Operating Temp:
-55 °C to +125 °C
Voltage Rating:
285 VAC
Max Cycles:
100
RoHS Compliant:
Ye s
SPECIFICATIONS
For complete scope of
recognitions see
www.samtec.com/quality
RECOGNITIONS
PROCESSING
Lead–Free Solderable:
Ye s
SMT Lead Coplanarity:
(0.10 mm) .004" max (025-050)
(0.15 mm) .006" max (075)*
*(.004" stencil solution
may be available; contact
IPG@samtec.com)
Board Stacking:
For applications requiring more
than two connectors per board
contact ipg@samtec.com
FILE NO. E111594
ALSO AVAILABLE
(MOQ Required)
• 11 mm & 16 mm
stack height
• 30 µ" (0.76 µm) Gold
• Differential Pair and
“Partitionable” (combine
differential & single-ended
banks in same connector)
available.
• 100 & 125 positions per row
• Edge Mount
• –LS2 Locking screw hole
for QTS–RA–LS2
QTS
LEAD STYLE
MATED HEIGHT
WITH QSS
–01 (5.00) .197
–02 (8.00) .315
Processing conditions will affect
mated height. See SO Series for
board space tolerances
®
EXTENDED LIFE
PRODUCT
10 YEAR MFG
WITH 50 µ" GOLD
HIGH MATING
CYCLES
Gbps
25
HIGH-SPEED CHANNEL PERFORMANCE
QSS/QTS @ 5 mm Mated Stack Height
Rating based on Samtec reference channel.
For full SI performance data visit Samtec.com
or contact SIG@samtec.com
Compatible with
UMPT/UMPS for flexible
two-piece power/signal solutions
POWER/SIGNAL
APPLICATION
F-219