Datenblatt für TPS53627 von Texas Instruments

l TEXAS INSTRUMENTS V'.‘ X “HE
TPS53627
PWM1
CSP1
CSN1
PWM2
CSP2
CSN2
CSD9537x
Power Stage
SVID
Pin Strapping
Microprocessor
(µP)
SKIP
CSD9537x
Power Stage
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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPS53627
SLUSCX9 –MARCH 2017
TPS53627 2-Phase, D-CAP+™ Step-Down Controller
for VR13 CPU V
CORE
and DDR Memory
1
1 Features
1• Intel®VR13 Serial VID (SVID) Compliant
• 1- or 2-Phase Operation
• Supports Both Droop and Non-Droop Applications
• 8-Bit DAC with 10-mV Step
• 4.5-V to 28-V Conversion Voltage Range
• Output Range: 0.5 V to 2.3 V
• Optimized Efficiency at Light and Heavy Loads
• 8 Independent Levels of Overshoot Reduction
(OSR) and Undershoot Reduction (USR)
• Driverless Configuration for Efficient High-
Frequency Switching
• Supports Discrete, Power Block, Power Stage™
or DrMOS MOSFET Implementations
• Accurate, Adjustable Voltage Positioning
• 300-kHz to 1-MHz Frequency Selections
• Patented AutoBalance™ Phase Balancing
• Programmable ON-Pulse Extension for Load
Transient Boost
• Programmable Auto DCM and CCM Operation
• Selectable 8-level Current Limit
• Small, 4 mm × 4 mm, 32-Pin, VQFN PowerPad™
Package
2 Applications
• VDDQ for DDR Memory
• SoC Processor VCORE Power
3 Description
The TPS53627 device is a driverless, VR13 SVID
compliant, synchronous buck controller. Advanced
control features such as D-CAP+ ™architecture with
overlapping pulse support undershoot reduction
(USR) and overshoot reduction (OSR) to provide fast
transient response, lowest output capacitance and
high efficiency. The device also supports single-
phase operation in CCM and DCM operation for light-
load efficiency boost. The device integrates a full set
of VR13 I/O features including VR_READY
(PGOOD), ALERT and VR_HOT. The SVID interface
address allows programming from 00h to 07h.
Adjustable control of VOUT slew rate can be
programmed as high as 20mV/uS.
Paired with the TI NexFET™ Power Stage, this total
solution delivers exceptionally high speed and low
switching loss.
The TPS53627 device package is a space saving,
thermally enhanced 32-pin VQFN package that
operates from –40°C to +105°C.
Device Information(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
TPS53627 VQFN (32) 4.00 mm × 4.00 mm
(1) For all available packages, see the orderable addendum at
the end of the document.
.. Simplified Schematic
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TPS53627
SLUSCX9 –MARCH 2017
www.ti.com
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Table of Contents
1 Features.................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Device and Documentation Support.................... 3
5.1 Documentation Support ............................................ 3
5.2 Receiving Notification of Documentation Updates.... 3
5.3 Community Resources.............................................. 3
5.4 Trademarks............................................................... 3
5.5 Electrostatic Discharge Caution................................ 3
5.6 Glossary.................................................................... 3
6 Mechanical, Packaging, and Orderable
Information ............................................................. 3
4 Revision History
DATE REVISION NOTES
March 2017 * Initial release.
l TEXAS INSTRUMENTS
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TPS53627
www.ti.com
SLUSCX9 –MARCH 2017
Submit Documentation FeedbackCopyright © 2017, Texas Instruments Incorporated
5 Device and Documentation Support
5.1 Documentation Support
5.1.1 Related Documentation
For related documentation see the following:
TPS51604 Data Sheet
5.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
5.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
5.4 Trademarks
Power Stage, AutoBalance, PowerPad, D-CAP+, NexFET, E2E are trademarks of Texas Instruments.
Intel is a registered trademark of Intel Corporation.
All other trademarks are the property of their respective owners.
5.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
5.6 Glossary
SLYZ022 —TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
6 Mechanical, Packaging, and Orderable Information
The following pages include mechanical packaging and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
I TEXAS INSTRUMENTS Samples Samples
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
TPS53627RSMR ACTIVE VQFN RSM 32 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 105 TPS
53627
TPS53627RSMT ACTIVE VQFN RSM 32 250 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 105 TPS
53627
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
I TEXAS INSTRUMENTS
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 2
I TEXAS INSTRUMENTS REEL DIMENSIONS TAPE DIMENSIONS 7 “K0 '«m» Reel Diame|er AD Dimension deswgned to accommodate the componem wwdlh E0 Dimension desxgned to accommodate the componenl \ength KO Dimenslun deswgned to accommodate the componem thickness 7 w OveraH wwdm loe earner cape i p1 Pitch between successwe cavuy cemers f T Reel Width (W1) QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE O O O D O O D O Sprockemoles ,,,,,,,,,,, ‘ User Direcllon 0' Feed Pockel Quadrams
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TPS53627RSMR VQFN RSM 32 3000 330.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2
TPS53627RSMT VQFN RSM 32 250 180.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2
PACKAGE MATERIALS INFORMATION
www.ti.com 30-Mar-2017
Pack Materials-Page 1
I TEXAS INSTRUMENTS TAPE AND REEL BOX DIMENSIONS
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TPS53627RSMR VQFN RSM 32 3000 367.0 367.0 35.0
TPS53627RSMT VQFN RSM 32 250 210.0 185.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 30-Mar-2017
Pack Materials-Page 2
www.ti.com
GENERIC PACKAGE VIEW
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
VQFN - 1 mm max heightRSM 32
PLASTIC QUAD FLATPACK - NO LEAD
4 x 4, 0.4 mm pitch
4224982/A
HU—fi ‘UUUMUU‘
www.ti.com
PACKAGE OUTLINE
C
32X 0.25
0.15
2.8 0.05
32X 0.45
0.25
1 MAX
(0.2) TYP
0.05
0.00
28X 0.4
2X
2.8
2X 2.8
A4.1
3.9 B
4.1
3.9
0.25
0.15
0.45
0.25
4X (0.45)
(0.1)
VQFN - 1 mm max heightRSM0032B
PLASTIC QUAD FLATPACK - NO LEAD
4219108/B 08/2019
PIN 1 INDEX AREA
0.08 C
SEATING PLANE
1
817
24
916
32 25
(OPTIONAL)
PIN 1 ID
0.1 C A B
0.05
EXPOSED
THERMAL PAD
DETAIL
SEE TERMINAL
SYMM
SYMM
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
33
SEE SIDE WALL
DETAIL
SIDE WALL DETAIL
OPTIONAL METAL THICKNESS
SCALE 3.000
DETAIL
OPTIONAL TERMINAL
TYPICAL
www.ti.com
EXAMPLE BOARD LAYOUT
0.05 MIN
ALL AROUND
0.05 MAX
ALL AROUND
32X (0.2)
32X (0.55)
( 0.2) TYP
VIA
28X (0.4)
(3.85)
(3.85)
( 2.8)
(R0.05)
TYP
(1.15)
(1.15)
VQFN - 1 mm max heightRSM0032B
PLASTIC QUAD FLATPACK - NO LEAD
4219108/B 08/2019
SYMM
1
8
916
17
24
25
32
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:20X
33
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
EXPOSED METAL
METAL
SOLDER MASK
OPENING
SOLDER MASK DETAILS
NON SOLDER MASK
DEFINED
(PREFERRED)
EXPOSED METAL
M QEEQW i flUg flU flU m$®$iiéfi
www.ti.com
EXAMPLE STENCIL DESIGN
32X (0.55)
32X (0.2)
28X (0.4)
(3.85)
(3.85)
4X ( 1.23)
(R0.05) TYP
(0.715)
(0.715)
VQFN - 1 mm max heightRSM0032B
PLASTIC QUAD FLATPACK - NO LEAD
4219108/B 08/2019
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
33
SYMM
METAL
TYP
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
EXPOSED PAD 33:
77% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
SCALE:20X
SYMM
1
8
916
17
24
25
32
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