Datenblatt für TXS02612 von Texas Instruments

I TEXAS INSTRUMENTS
24 23 22 21 20
7 8 9 10 11
1
2
3
4
5
6
18
17
16
15
14
13
19
12
DAT2A
GND
DAT3A
CMDA
VCCA
DAT0A
DAT0B0
VCCB1
DAT1B0
DAT1B1
DAT0B1
CLKB1
SEL
DAT2B0
DAT3B0
VCCB0
CMDB0
CLKB0
DAT1A
DAT2B1
CLKA
DAT3B1
GND
CMDB1
Exposed
Center Pad
For RTW, if the exposed
center pad is used, it must
be connected to ground
or electrically open.
RTW PACKAGE
(TOP VIEW)
D
E
A
12
3
4 5
B
C
ZQS PACKAGE
(TOP VIEW)
TXS02612
www.ti.com
SCES682C –DECEMBER 2008–REVISED FEBRUARY 2009
SDIO PORT EXPANDER WITH VOLTAGE-LEVEL TRANSLATION
1FEATURES
• 6-to-12 Demultiplexer/Multiplexer Allows SDIO • Latch-Up Performance Exceeds 100 mA Per
Port Expansion JESD 78, Class II
• Built-in Level Translator Eliminates Voltage • ESD Performance A Port
Mismatch Between Baseband and SD Card or – 2000-V Human-Body Model (A114-B)
SDIO Peripheral – 100-V Machine Model (A115-A)
• VCCA, VCCB0, and VCCB1 Each Operate Over Full – 1500-V Charged-Device Model (C101)
1.1-V to 3.6-V Range • ±8-kV Contact Discharge IEC 61000-4-2 ESD
Performance (B Port)
DESCRIPTION/ORDERING INFORMATION
The TXS02612 is designed to interface the cell phone baseband with external SDIO peripherals. The device
includes a 6-channel SPDT switch with voltage-level translation capability. This allows a single SDIO port to be
interfaced with two SDIO peripherals. The TXS02612 has three separate supply rails that operate over the full
range of 1.1 V to 3.6 V. This allows the baseband and SDIO peripherals to operate at different supply voltages if
required.
The select (SEL) input is used to choose between the B0 port and B1 port. When SEL = Low, B0 port is
selected; when SEL = High, B1 port is selected. SEL is referenced to VCCA. For the unselected B port, the clock
output is held low, whereas the data and command I/Os are pulled high to their respective VCCB through a 70-kΩ
resistor (±30% tolerance).
ORDERING INFORMATION(1)
TAPACKAGE(2) ORDERABLE PART NUMBER TOP-SIDE MARKING
MicroStar Junior™ BGA Reel of 3000 TXS02612ZQSR YJ612
(VFBGA) – ZQS
–40°C to 85°C
QFN – RTW Reel of 3000 TXS02612RTWR YJ612
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
Table 1. ZQS PACKAGE TERMINAL
ASSIGNMENTS
1 2 3 4 5
ADAT2A SEL DAT3B0 CMDB0 CLKB0
BDAT3A DAT2B0 VCCB0 DAT0B0
CCMDA VCCA GND VCC B1 DAT1B0
DDAT0A CLKA GND DAT1B1 DAT0B1
EDAT1A DAT2B1 DAT3B1 CMDB1 CLKB1
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Copyright © 2008–2009, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
l TEXAS INSTRUMENTS xxxxx NOTE:
NOTE:
Switch positions shown in this
diagram are for the case when
SEL = Low
CLKA
SD/MMC
Memory Card
SDIO Peripheral
(Bluetooth,
WLAN, DTV, etc)
Digital Baseband
or Apps
Processor
DAT0A
DAT1A
DAT2A
DAT3A
CMDA
SEL
TXS02612
VCCA
VCCB0
VCCB1
VCCB0
VCCB1
VCCA
SDIO Port
Clock
Logic
DAT0B0
DAT0B1
DAT1B1
DAT1B0
DAT2B1
DAT2B0
DAT3B1
DAT3B0
CMDB1
CMDB0
CLKB0
CLKB1
TXS02612
SCES682C –DECEMBER 2008–REVISED FEBRUARY 2009
www.ti.com
APPLICATION BLOCK DIAGRAM
2Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated
l TEXAS INSTRUMENTS
TXS02612
www.ti.com
SCES682C –DECEMBER 2008–REVISED FEBRUARY 2009
PIN ASSIGNMENTS
RTW PACKAGE ZQS PACKAGE NAME FUNCTION TYPE
PIN NO. BALL NO.
1 A1 DAT2A Data bit 2. Referenced to VCCA. I/O
3 B1 DAT3A Data bit 3. Referenced to VCCA. I/O
4 C1 CMDA Command bit. Referenced to VCCA. I/O
6 D1 DAT0A Data bit 0. Referenced to VCCA. I/O
7 E1 DAT1A Data bit 1. Referenced to VCCA. I/O
24 A2 SEL Select pin to choose between B0 and B1. Referenced to VCCA. Input
B2 Depopulated
5 C2 VCCA A-port supply voltage. 1.1 V ≤VCCA ≤3.6 V. Power
9 D2 CLKA Clock input A. Referenced to VCCA. Input
8 E2 DAT2B1 Data bit 2. Referenced to VCCB1. I/O
22 A3 DAT3B0 Data bit 3. Referenced to VCCB0. I/O
23 B3 DAT2B0 Data bit 2. Referenced to VCCB0. I/O
2 C3 GND Ground
11 D3 GND Ground
10 E3 DAT3B1 Data bit 3. Referenced to VCCB1. I/O
20 A4 CMDB0 Command bit. Referenced to VCCB0. I/O
21 B4 VCCB0 B0-port supply voltage. 1.1 V ≤VCCB0 ≤3.6 V. Power
17 C4 VCCB1 B1-port supply voltage. 1.1 V ≤VCCB1 ≤3.6 V. Power
15 D4 DAT1B1 Data bit 1. Referenced to VCCB1. I/O
12 E4 CMDB1 Command bit. Referenced to VCCB1. I/O
19 A5 CLKB0 Clock output. Referenced to VCCB0. Output
18 B5 DAT0B0 Data bit 0. Referenced to VCCB0. I/O
16 C5 DAT1B0 Data bit 1. Referenced to VCCB0. I/O
14 D5 DAT0B1 Data bit 0. Referenced to VCCB1. I/O
13 E5 CLKB1 Clock output. Referenced to VCCB1. Output
Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 3
Simplified Architecture of Command and Each Data Path
GATE
SPEED-UP
CIRCUITRY B-to-A
A-Port
(Data or
Command)
Bx-Port
(Data or
Command)
R1
(see Note A)
R
(see Note A)
2
TRANSLATOR
VCCB0
Simplified Architecture of the Clock Path
CLKA
SEL
TRANSLATOR
VCCB1
SPEED-UP
CIRCUITRY A-to-B
VCCA VCCBx
CLKB1
VCCB1
N-ch
GND
P-ch
VCCB0
GND
CLKB0
N-ch
P-ch
TXS02612
SCES682C –DECEMBER 2008–REVISED FEBRUARY 2009
www.ti.com
SIMPLIFIED INTERNAL STRUCTURE
A. R1and R2resistor values are determined based upon the logic level applied to the A port or B port, as follows:
R1and R2= 40 kΩwhen a logic level low is applied to the A port or B port.
R1and R2= 4 kΩwhen a logic level high is applied to the A port or B port.
R1and R2= 70 kΩwhen the port is deselected.
4Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated
l TEXAS INSTRUMENTS
TXS02612
www.ti.com
SCES682C –DECEMBER 2008–REVISED FEBRUARY 2009
FUNCTION TABLE
Clock Channel
SEL CLKB0 CLKB1 OPERATION
L Active Low CLKA to CLKB0
H Low Active CLKA to CLKB1
Data and Command Channel
SEL DATxB0 or CMDxB0 DATxB1 or CMDxB1 OPERATION
L Active Disabled, pulled to VCCB1 through 70 kΩDATxA to DATxB0, CMDA to CMDB0
H Disabled, pulled to VCCB0 through 70 kΩActive DATxA to DATxB1, CMDA to CMDB1
ABSOLUTE MAXIMUM RATINGS(1) (2)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VCCA
VCCB0 Supply voltage range(2) –0.5 4.6 V
VCCB1
A port, B0 port,
VIInput voltage range –0.5 VCCx + 0.5 V
B1 port, control inputs
Voltage range applied to any output in the high-impedance or A port, B0 port,
VO–0.5 VCCx + 0.5 V
power-off state B1 port
IIK Input clamp current VI< 0 –50 mA
IOK Output clamp current VO< 0 –50 mA
ICC/Continuous current through VCCA, VCCB0, VCCB1, or GND ±100 mA
IGND
Tstg Storage temperature range –65 150 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
PACKAGE THERMAL IMPEDANCE
PARAMETER UNIT
RTW package 66
qJA Package thermal impedance °C/W
ZQS package 171.6
Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 5
l TEXAS INSTRUMENTS
TXS02612
SCES682C –DECEMBER 2008–REVISED FEBRUARY 2009
www.ti.com
RECOMMENDED OPERATING CONDITIONS
VCCA VCCBx (1) MIN MAX UNIT
VCCA
VCCB0 Supply voltage 1.1 3.6 V
VCCB1
A-port I/Os VCCI – 0.2 VCCI
VIH High-level input voltage B-port I/Os 1.1 V to 3.6 V 1.1 V to 3.6 V VCCI – 0.2 VCCI V
SEL, CLKA VCCA × 0.65 V 3.6
A-port I/Os 0 0.15
VIL Low-level input voltage B-port I/Os 1.1 V to 3.6 V 1.1 V to 3.6 V 0 0.15 V
SEL, CLKA 0 VCCA × 0.35
Δt/Δv Input transition rise or fall rate CLK, SEL 10 ns/V
TAOperating free-air temperature –40 85 °C
(1) VCCBx refers to VCCB0 and VCCB1.
ELECTRICAL CHARACTERISTICS
over recommended operating free-air temperature range (unless otherwise noted)
TA= 25°C TA= –40°C to 85°C
PARAMETER TEST CONDITIONS VCCA VCCBx UNIT
TYP MIN MAX
1.1 V 1.1 V 0.74
1.4 V 1.4 V VCCA × 0.67
VOHA IOH = –20 mA,
(DATA & 1.65 V 1.65 V VCCA × 0.67 V
VIBx ≥VCCBx – 0.2 V
CMD) 2.3 V 2.3 V VCCA × 0.67
3 V 3 V VCCA × 0.67
IOL = 135 mA, VIBx ≤0.15 V 1.1 V 1.1 V 0.35
IOL = 180 mA, VIBx ≤0.15 V 1.4 V 1.4 V 0.35
VOLA
(DATA & IOL = 220 mA, VIBx ≤0.15 V 1.65 V 1.65 V 0.45 V
CMD) IOL = 300 mA, VIBx ≤0.15 V 2.3 V 2.3 V 0.55
IOL = 620 mA, VIBx ≤0.15 V 3 V 3 V 0.70
1.1 V 1.1 V 0.74
1.4 V 1.4 V VCCBx × 0.67
VOHB IOH = –20 mA,
(DATA & 1.65 V 1.65 V VCCBx × 0.67 V
VIAx ≥VCCAx – 0.2 V
CMD) 2.3 V 2.3 V VCCBx × 0.67
3 V 3 V VCCBx × 0.67
IOH = – 0.5 mA 1.1 V 1.1 V 0.74
IOH = – 1 mA 1.4 V 1.4 V 1.05
VOHCLKB IOH = – 2 mA 1.65 V 1.65 V 1.2 V
IOH = – 4 mA 2.3 V 2.3 V 1.75
IOH = – 8 mA 3 V 3 V 2.3
IOL = 135 mA, VIAx ≤0.15 V 1.1 V 1.1 V 0.35
IOL = 180 mA, VIAx ≤0.15 V 1.4 V 1.4 V 0.35
VOLB
(DATA & IOL = 220 mA, VIAx ≤0.15 V 1.65 V 1.65 V 0.45 V
CMD) IOL = 300 mA, VIAx ≤0.15 V 2.3 V 2.3 V 0.55
IOL = 620 mA, VIAx ≤0.15 V 3 V 3 V 0.70
IOL = 0.5 mA 1.1 V 1.1 V 0.35
IOL = 1 mA 1.4 V 1.4 V 0.35
VOLCLKB IOL = 2 mA 1.65 V 1.65 V 0.45 V
IOL = 4 mA 2.3 V 2.3 V 0.55
IOL = 8 mA 3 V 3 V 0.7
6Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated
l TEXAS INSTRUMENTS
TXS02612
www.ti.com
SCES682C –DECEMBER 2008–REVISED FEBRUARY 2009
ELECTRICAL CHARACTERISTICS (continued)
over recommended operating free-air temperature range (unless otherwise noted)
TA= 25°C TA= –40°C to 85°C
PARAMETER TEST CONDITIONS VCCA VCCBx UNIT
TYP MIN MAX
SEL, CLKA ±1 ±2
II1.1 V to 3.6 V 1.1 V to 3.6 V mA
DAT, CMD ±1 ±2
1.1 V to 3.6 V 1.1 V to 3.6 V 12
VI= VO= Open, IO= 0,
ICCA 3.6 V 0 V 12 mA
SEL, CLK = High or Low 0 V 3.6 V –1
1.1 V to 3.6 V 1.1 V to 3.6 V 24
ICCB0 or VI= VO= Open, IO= 0, 3.6 V 0 V –12 mA
ICCB1 SEL, CLK = High or Low 0 V 3.6 V 24
CiSEL, CLKA 3.3 V 3.3 V 2.5 3.5 pF
A port 7 7.5
Cio 3.3 V 3.3 V pF
B port 9.5 10
TIMING REQUIREMENTS
TA= 25°C, VCCA = 1.2 V
VCCB = 1.2 V VCCB = 1.5 V VCCB = 1.8 V VCCB = 2.5 V VCCB = 3.3 V UNIT
TYP TYP TYP TYP TYP
Push-pull driving 60 80 120 120 120
Command Mbps
Open-drain driving 2 2 2 2 2
Data
rate Clock Push-pull driving 30 40 60 60 60 MHz
Data Push-pull driving 60 80 120 120 120 Mbps
Push-pull 17 13 8 8 8
CLK
driving
Open-drain 500 500 500 500 500
Pulse CMD
twns
driving
duration
Data 17 13 8 8 8
Push-pull
driving CMD 17 13 8 8 8
Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 7
l TEXAS INSTRUMENTS
TXS02612
SCES682C –DECEMBER 2008–REVISED FEBRUARY 2009
www.ti.com
TIMING REQUIREMENTS
over recommended operating free-air temperature range, VCCA = 1.5 V ± 0.1 V (unless otherwise noted)
VCCB = 1.5 V VCCB = 1.8 V VCCB = 2.5 V VCCB = 3.3 V
VCCB = 1.2 V ± 0.1 V ± 0.15 V ± 0.2 V ± 0.3 V UNIT
TYP MIN MAX MIN MAX MIN MAX MIN MAX
Push-pull driving 60 80 120 120 120
Command Mbps
Open-drain driving 2 2 2 2 2
Data
rate Clock Push-pull driving 30 40 60 60 60 MHz
Data Push-pull driving 60 80 120 120 120 Mbps
Push-pull 17 13 8 8 8
CLK
driving
Open-drain 500 500 500 500 500
Pulse CMD
twns
driving
duration
Data 17 13 8 8 8
Push-pull
driving CMD 17 13 8 8 8
TIMING REQUIREMENTS
over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted)
VCCB = 1.5 V VCCB = 1.8 V VCCB = 2.5 V VCCB = 3.3 V
VCCB = 1.2 V ± 0.1 V ± 0.15 V ± 0.2 V ± 0.3 V UNIT
TYP MIN MAX MIN MAX MIN MAX MIN MAX
Push-pull driving 60 80 120 120 120
Command Mbps
Open-drain driving 2 2 2 2 2
Data
rate Clock Push-pull driving 30 40 60 60 60 MHz
Data Push-pull driving 60 80 120 120 120 Mbps
Push-pull 17 13 8 8 8
CLK
driving
Open-drain 500 500 500 500 500
Pulse CMD
twns
driving
duration
Data 17 13 8 8 8
Push-pull
driving CMD 17 13 8 8 8
8Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated
l TEXAS INSTRUMENTS
TXS02612
www.ti.com
SCES682C –DECEMBER 2008–REVISED FEBRUARY 2009
TIMING REQUIREMENTS
over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (unless otherwise noted)
VCCB = 1.5 V VCCB = 1.8 V VCCB = 2.5 V VCCB = 3.3 V
VCCB = 1.2 V ± 0.1 V ± 0.15 V ± 0.2 V ± 0.3 V UNIT
TYP MIN MAX MIN MAX MIN MAX MIN MAX
Push-pull driving 60 80 120 120 120
Command Mbps
Open-drain driving 2 2 2 2 2
Data
rate Clock Push-pull driving 30 40 60 60 60 MHz
Data Push-pull driving 60 80 120 120 120 Mbps
Push-pull 17 13 8 8 8
CLK
driving
Open-drain 500 500 500 500 500
Pulse CMD
twns
driving
duration
Data 17 13 8 8 8
Push-pull
driving CMD 17 13 8 8 8
TIMING REQUIREMENTS
over recommended operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (unless otherwise noted)
VCCB = 1.5 V VCCB = 1.8 V VCCB = 2.5 V VCCB = 3.3 V
VCCB = 1.2 V ± 0.1 V ± 0.15 V ± 0.2 V ± 0.3 V UNIT
TYP MIN MAX MIN MAX MIN MAX MIN MAX
Push-pull driving 60 80 120 120 120
Command Mbps
Open-drain driving 2 2 2 2 2
Data
rate Clock Push-pull driving 30 40 60 60 60 MHz
Data Push-pull driving 60 80 120 120 120 Mbps
Push-pull 17 13 8 8 8
CLK
driving
Open-drain 500 500 500 500 500
Pulse CMD
twns
driving
duration
Data 17 13 8 8 8
Push-pull
driving CMD 17 13 8 8 8
Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 9
l TEXAS INSTRUMENTS
TXS02612
SCES682C –DECEMBER 2008–REVISED FEBRUARY 2009
www.ti.com
SWITCHING CHARACTERISTICS
TA= 25°C, VCCA = 1.2 V
VCCB = 1.2 V VCCB = 1.5 V VCCB = 1.8 V VCCB = 2.5 V VCCB = 3.3 V
FROM TO TEST
PARAMETER UNIT
(INPUT) (OUTPUT) CONDITIONS TYP TYP TYP TYP TYP
Push-pull driving 5.9 4.8 4.4 4 4.46
CMDA CMDB Open-drain driving 238 214 192 159 140
Push-pull driving 5.6 4.8 4.4 4.1 4
CMDB CMDA Open-drain driving 227 201 176 137 114
tPD ns
CLKA CLKB Push-pull driving 5.5 4.1 3.6 3.2 3
DATA DATB 5.8 4.8 4.4 4.2 6.8
Push-pull driving
DATB DATA 5.6 4.8 4.4 4.1 4
SEL B-Port Push-pull driving 13 11 10 9.4 9.1
trA A-port rise time Push-pull driving 4.8 5.1 5.1 5.3 5.7
trB B-port rise time Push-pull driving 6.1 3.8 2.9 1.9 1.5
trB CLKA CLKB Push-pull driving 5.2 3.4 2.6 1.7 1.3 ns
tfA A-port fall time Push-pull driving 3.4 2.8 2.6 2.6 2.6
tfB B-port fall time Push-pull driving 4.2 3 2.3 1.7 1.5
tfB CLKA CLKB Push-pull driving 3.1 2.1 1.6 1.2 1
ChA-to-ChB skew Push-pull driving 0.4 0.4 0.3 0.4 0.4
ChB-to-ChA skew Push-pull driving 0.3 0.3 0.3 0.3 0.4
tsk(O) ns
Channel-to-Clock 1.68 1.5 1.5 1.5 1.7
Push-pull driving
skew
Push-pull driving 60 80 120 120 120
Command Mbps
Open-drain driving 2 2 2 2 2
Max data rate Clock Push-pull driving 30 40 60 60 60 MHz
Data Push-pull driving 60 80 120 120 120 Mbps
10 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated
l TEXAS INSTRUMENTS
TXS02612
www.ti.com
SCES682C –DECEMBER 2008–REVISED FEBRUARY 2009
SWITCHING CHARACTERISTICS
over operating free-air temperature range, VCCA = 1.5 V ± 0.1 V (unless otherwise noted)
VCCB = 1.2 V VCCB = 1.5 V VCCB = 1.8 V VCCB = 2.5 V VCCB = 3.3 V
FROM TO TEST ± 0.1 V ± 0.15 V ± 0.2 V ± 0.3 V
PARAMETER UNIT
(INPUT) (OUTPUT) CONDITIONS TYP MIN MAX MIN MAX MIN MAX MIN MAX
Push-pull driving 5.1 13 9 8 7.5
CMDA CMDB Open-drain driving 210 777 756 684 758
Push-pull driving 4.5 10.6 9.2 8.5 8.2
CMDB CMDA Open-drain driving 200 616 560 433 375
tPD ns
CLKA CLKB Push-pull driving 4.7 13.1 9.8 6 5.2
DATA DATB 5.1 13 9 8 7.8
Push-pull driving
DATB DATA 4.5 11 9.3 8.8 8.4
SEL B-Port Push-pull driving 9.5 26 21 19 18
trA A-port rise time Push-pull driving 2.7 1.5 5.8 1.7 5.9 1.7 6 1.8 6.1
trB B-port rise time Push-pull driving 3.3 1.7 8.2 1.3 6.6 1 4.3 0.8 2.9 ns
trB CLKA CLKB Push-pull driving 5.2 1.7 6.4 1.3 4.9 0.9 3.2 0.8 2.5
tfA A-port fall time Push-pull driving 2.4 1 3.9 0.9 3.4 0.9 3.2 1.3 3.3
tfB B-port fall time Push-pull driving 3.7 1.1 6.3 0.9 5.2 0.6 3.9 0.6 3.2 ns
tfB CLKA CLKB Push-pull driving 3.1 0.9 4.1 0.8 3.2 0.5 2.2 0.5 1.9
ChA-to-ChB skew Push-pull driving 0.32 0.47 0.58 0.63 0.63
ChB-to-ChA skew Push-pull driving 0.27 0.24 0.23 0.22 0.22
tsk(O) ns
Channel-to-Clock 1.47 1.66 1.68 1.82 1.77
Push-pull driving
skew
Push-pull driving 60 80 120 120 120
Command Mbps
Open-drain driving 2 2 2 2 2
Max data rate Clock Push-pull driving 30 40 60 60 60 MHz
Data Push-pull driving 60 80 120 120 120 Mbps
Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 11
l TEXAS INSTRUMENTS
TXS02612
SCES682C –DECEMBER 2008–REVISED FEBRUARY 2009
www.ti.com
SWITCHING CHARACTERISTICS
over operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted)
VCCB = 1.2 V VCCB = 1.5 V VCCB = 1.8 V VCCB = 2.5 V VCCB = 3.3 V
FROM TO TEST ± 0.1 V ± 0.15 V ± 0.2 V ± 0.3 V
PARAMETER UNIT
(INPUT) (OUTPUT) CONDITIONS TYP MIN MAX MIN MAX MIN MAX MIN MAX
Push-pull driving 4.8 12 8 6 5.7
CMDA CMDB Open-drain driving 183 726 715 686 780
Push-pull driving 4 9 7 6.4 6
CMDB CMDA Open-drain driving 175 565 563 441 392
tPD ns
CLKA CLKB Push-pull driving 4.5 13 9 5.4 4.5
DATA DATB 4.7 12 8.4 6 5.8
Push-pull driving
DATB DATA 4.1 9 7.5 6.4 6.3
SEL B-Port Push-pull driving 8.2 22 17 14.8 14
trA A-port rise time Push-pull driving 2 1.1 4 1.1 4.3 1.2 4.5 1.3 4.6
trB B-port rise time Push-pull driving 6.2 1.7 7.9 1.2 6.2 1 4.3 0.8 3.1 ns
trB CLKA CLKB Push-pull driving 5.2 1.7 6.4 1.3 4.9 0.9 3.2 0.8 2.5
tfA A-port fall time Push-pull driving 1.8 0.8 3.2 0.7 2.8 0.7 1.7 0.7 2.6
tfB B-port fall time Push-pull driving 3.5 1 5.6 0.9 3.5 0.6 1.9 0.6 3 ns
tfB CLKA CLKB Push-pull driving 3.1 0.9 4.1 0.8 3.2 0.5 2.2 0.5 1.9
ChA-to-ChB skew Push-pull driving 0.33 0.45 0.48 0.53 0.67
ChB-to-ChA skew Push-pull driving 0.28 0.24 0.23 0.23 0.22
tsk(O) ns
Channel-to-Clock 1.51 1.58 1.46 1.56 1.48
Push-pull driving
skew
Push-pull driving 60 80 120 120 120
Command Mbps
Open-drain driving 2 2 2 2 2
Max data rate Clock Push-pull driving 30 40 60 60 60 MHz
Data Push-pull driving 60 80 120 120 120 Mbps
12 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated
l TEXAS INSTRUMENTS
TXS02612
www.ti.com
SCES682C –DECEMBER 2008–REVISED FEBRUARY 2009
SWITCHING CHARACTERISTICS
over operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (unless otherwise noted)
VCCB = 1.2 V VCCB = 1.5 V VCCB = 1.8 V VCCB = 2.5 V VCCB = 3.3 V
FROM TO TEST ± 0.1 V ± 0.15 V ± 0.2 V ± 0.3 V
PARAMETER UNIT
(INPUT) (OUTPUT) CONDITIONS TYP MIN MAX MIN MAX MIN MAX MIN MAX
Push-pull driving 4.4 11 7.4 4.4 3.8
CMDA CMDB Open-drain driving 143 544 596 605 669
Push-pull driving 3.8 7.6 5.5 4.2 3.7
CMDB CMDA Open-drain driving 137 434 444 414 372
tPD ns
CLKA CLKB Push-pull driving 4.1 12 8 4.8 3.8
DATA DATB 4.4 11 7 4.5 3.8
Push-pull driving
DATB DATA 4.4 8 5.5 4.1 3.7
SEL B-Port Push-pull driving 7 18 13 10.5 9
trA A-port rise time Push-pull driving 1.4 0.75 2.2 0.74 2.2 1.06 2.6 0.7 2.8
trB B-port rise time Push-pull driving 6.3 1.91 7.7 1.34 6.1 0.95 4.2 0.83 3.2 ns
trB CLKA CLKB Push-pull driving 5.2 1.67 6.4 1.27 4.9 0.9 3.2 0.76 2.6
tfA A-port fall time Push-pull driving 1.1 0.58 1.9 0.58 2 0.61 1.9 0.57 1.9
tfB B-port fall time Push-pull driving 3.6 1.04 5.4 0.87 4.3 0.66 3.4 0.57 3 ns
tfB CLKA CLKB Push-pull driving 3.1 0.92 4.2 0.79 3.2 0.56 2.2 0.49 1.9
ChA-to-ChB skew Push-pull driving 0.41 0.43 0.39 0.59 0.68
ChB-to-ChA skew Push-pull driving 0.41 0.24 0.2 0.19 0.18
tsk(O) ns
Channel-to-Clock 2.11 1.47 1.3 1.25 1.21
Push-pull driving
skew
Push-pull driving 60 80 120 120 120
Command Mbps
Open-drain driving 2 2 2 2 2
Max data rate Clock Push-pull driving 30 40 60 60 60 MHz
Data Push-pull driving 60 80 120 120 120 Mbps
Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 13
l TEXAS INSTRUMENTS
TXS02612
SCES682C –DECEMBER 2008–REVISED FEBRUARY 2009
www.ti.com
SWITCHING CHARACTERISTICS
over operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (unless otherwise noted)
VCCB = 1.2 V VCCB = 1.5 V VCCB = 1.8 V VCCB = 2.5 V VCCB = 3.3 V
FROM TO TEST ± 0.1 V ± 0.15 V ± 0.2 V ± 0.3 V
PARAMETER UNIT
(INPUT) (OUTPUT) CONDITIONS TYP MIN MAX MIN MAX MIN MAX MIN MAX
Push-pull driving 4.4 11 7 4.1 3.3
CMDA CMDB Open-drain driving 116 432 477 506 533
Push-pull driving 4.2 7.5 5.4 3.8 3
CMDB CMDA Open-drain driving 112 349 363 347 324
tPD ns
CLKA CLKB Push-pull driving 4.1 12 7.8 4.4 3.5
DATA DATB 4.3 11 6.8 4 3.8
Push-pull driving
DATB DATA 7.9 7.8 5.4 3.4 3
SEL B-Port Push-pull driving 6.4 16 11.5 8.8 7.6
trA A-port rise time Push-pull driving 1.1 0.57 1.7 0.57 1.8 0.56 1.7 0.53 1.8
trB B-port rise time Push-pull driving 6.2 1.96 7.7 1.43 6.1 0.95 4.2 0.71 3.1 ns
trB CLKA CLKB Push-pull driving 5.2 1.67 6.4 1.26 4.9 0.91 3.3 0.76 2.5
tfA A-port fall time Push-pull driving 1 0.53 1.6 0.52 1.6 0.53 1.6 0.56 1.6
tfB B-port fall time Push-pull driving 3.4 0.95 5.2 0.8 4.1 0.63 3.2 0.58 2.9 ns
tfB CLKA CLKB Push-pull driving 3.1 0.92 4.1 0.79 3.2 0.56 2.2 0.49 1.9
ChA-to-ChB skew Push-pull driving 0.39 0.36 0.39 0.57 0.65
ChB-to-ChA skew Push-pull driving 0.45 0.3 0.19 0.19 0.18
tsk(O) ns
Channel-to-Clock 1.7 1.61 1.34 1.22 1.14
Push-pull driving
skew
Push-pull driving 60 80 120 120 120
Command Mbps
Open-drain driving 2 2 2 2 2
Max data rate Clock Push-pull driving 30 40 60 60 60 MHz
Data Push-pull driving 60 80 120 120 120 Mbps
OPERATING CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
VCCA
1.2 V 1.5 V 1.8 V 2.5 V 3.3 V
PARAMETER TEST CONDITIONS VCCB UNIT
1.2 V 1.5 V 1.8 V 2.5 V 3.3 V
TYP TYP TYP TYP TYP
A-port input, B-port output 14.5 12.9 12.1 13.4 15
CpdA CL= 0, f = 10 MHz,
B-port input, A-port output 20.7 20.7 21 22 23.2
Data tr= tr= 1 ns,
and A-port input, B-port output 23.2 23.4 23.6 24.5 25.5 pF
OE = outputs enabled
CMD CpdB B-port input, A-port output 14.1 12.2 11.5 12.9 14.4
A-port input, B-port output OE = outputs disabled 0.1 0.1 0.1 0.1 0.1
CpdA A-port input, B-port output CL= 0, f = 10 MHz, 0.4 0.4 0.4 0.5 0.7
Clock tr= tr= 1 ns, pF
CpdB B-port input, A-port output 14 13.9 13.8 13.8 13.7
OE = outputs enabled
14 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated
l TEXAS INSTRUMENTS
TXS02612
www.ti.com
SCES682C –DECEMBER 2008–REVISED FEBRUARY 2009
POWER-UP CONSIDERATIONS
The following power-up sequence for this TXS02612 SDIO port expander with voltage-level translator should be
followed to ensure proper operation and to avoid any unnecessary excessive supply current, bus contention,
oscillations, or other anomalies caused by improperly biased device pins. The following power-up sequence
should be used to safe-guard against these problems:
1. Connect the ground pin of the device first before any power-supply voltage is applied.
2. Connect and power up VCCA, which internally powers up the SEL control logic of the TXS02612.
3. Depending on the port to be chosen, the SEL pin can be high or low. If SEL high is needed (i.e., A port to
B1port), ramp the SEL pin with the VCCA power supply. Otherwise, keep SEL Low.
4. Apply VCCB0 and VCCB1 only after the VCCA power supply is applied.
Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 15
l TEXAS INSTRUMENTS 2 \siov an ompmwlm \mema‘ candmons such lhanhe ompm \s hwgh‘ except when msamed by‘he oulpm comm
VOL
tPLH tPHL
Output
Control
(low-level
enabling)
Output
Waveform1
CMDandDATA
(seeNoteB)
tPZL tPLZ
VCCA/2VCCA/2
VCCI
0V
VCCI /2
VOH
VOL
0V
0.2x
VCCO
VCCO/2
VCCI
0V
VCCI/2 VCCI/2
tw
Input
VCCA
VCCO
VOLTAGEWAVEFORMS
PROPAGATIONDELAY TIMES
VOLTAGEWAVEFORMS
PULSEDURATION
VOLTAGEWAVEFORMS
ENABLE ANDDISABLETIMES
Output
Input
NOTES: A. CLincludesprobeandjigcapacitance.
B. Waveform1isforanoutputwithinternalconditionssuchthattheoutputislow,exceptwhendisabledbytheoutputcontrol.
Waveform
C. Allinputpulsesaresuppliedbygeneratorshavingthefollowingcharacteristics:PRR 10MHz,Z O=50Ω,dv/dt≥1V/ns.
D. Theoutputsaremeasuredoneatatime,withonetransitionpermeasurement.
E. tP L Z andt
P HZ arethesameast
dis .
F. tP Z L andt
P Z H arethesameast
en.
G. tP L H andt
P HL arethesameast
pd.
H. VCCI istheV CC associatedwiththeinputport.
I. VCCO istheV CC associatedwiththeoutputport.
J. Allparametersandwaveformsarenotapplicabletoalldevices.
1MΩ
15pF
DATA RATE,PULSEDURATION,PROPAGATIONDELAY ENABLE/DISABLE,
OUTPUTRISE ANDFALL TIMEMEASUREMENTUSING
A PUSH-PULL DRIVER
VCCO
VCCI
DUT
IN OUT
1MΩ
15pF
DATA RATE,PULSEDURATION,PROPAGATIONDELAY,
OUTPUTRISE ANDFALL TIMEMEASUREMENTUSING
ANOPEN-DRAINDRIVER
VCCO
VCCI
DUT
IN OUT
0.8x VCCO
VCCI /2
tr
0.2x VCCO
tf
VCCO/2 VCCO/2
TXS02612
SCES682C –DECEMBER 2008–REVISED FEBRUARY 2009
www.ti.com
PARAMETER MEASUREMENT INFORMATION
Figure 1. Load Circuit and Voltage Waveforms
16 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated
I TEXAS INSTRUMENTS Samples
PACKAGE OPTION ADDENDUM
www.ti.com 20-Jan-2021
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
TXS02612RTWR ACTIVE WQFN RTW 24 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 YJ612
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
I TEXAS INSTRUMENTS ‘3‘ V.'
PACKAGE MATERIALS INFORMATION
www.ti.com 3-Jun-2022
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TXS02612RTWR WQFN RTW 24 3000 330.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 3-Jun-2022
TAPE AND REEL BOX DIMENSIONS
Width (mm)
W
L
H
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TXS02612RTWR WQFN RTW 24 3000 356.0 356.0 35.0
Pack Materials-Page 2
www.ti.com
GENERIC PACKAGE VIEW
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
WQFN - 0.8 mm max heightRTW 24
PLASTIC QUAD FLATPACK - NO LEAD
4 x 4, 0.5 mm pitch
4224801/A
\‘T flnnmnn
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
PACKAGE OUTLINE
4219135/B 11/2016
www.ti.com
WQFN - 0.8 mm max height
PLASTIC QUAD FLATPACK-NO LEAD
RTW0024B
A
0.08 C
0.1 C A B
0.05 C
B
SYMM
SYMM
4.15
3.85
4.15
3.85
PIN 1 INDEX AREA
0.8 MAX
0.05
0.00
C
SEATING PLANE
PIN 1 ID
(OPTIONAL)
2X
2.5
20X 0.5
2X 2.5
1
6
18
13
712
24 19
2.45±0.1
24X 0.3
0.18
24X 0.5
0.3
(0.2) TYP
25
EXPOSED
THERMAL PAD
¢| |A , A @fifi? ,,,,, AA A A ,,,,,,,, mm A
NOTES: (continued)
3. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271).
EXAMPLE BOARD LAYOUT
4219135/B 11/2016
www.ti.com
WQFN - 0.8 mm max height
RTW0024B
PLASTIC QUAD FLATPACK-NO LEAD
SYMM
SYMM
LAND PATTERN EXAMPLE
SCALE: 20X
( 2.45)
24X (0.6)
24X (0.24)
1
6
712
13
18
19
24
(3.8)
(0.97)
(3.8)
(0.97)
25
(R0.05)
TYP
20X (0.5)
(Ø0.2) TYP
VIA
0.07 MAX
ALL AROUND 0.07 MIN
ALL AROUND
METAL
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK DETAILS
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
EXAMPLE STENCIL DESIGN
4219135/B 11/2016
www.ti.com
WQFN - 0.8 mm max height
RTW0024B
PLASTIC QUAD FLATPACK-NO LEAD
SYMM
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD 25:
78% PRINTED COVERAGE BY AREA UNDER PACKAGE
SCALE: 20X
(3.8)
(0.64) TYP
1
6
712
13
18
19
24
25
(0.64)
TYP
4X( 1.08)
(R0.05) TYP
(3.8)
20X (0.5)
24X (0.24)
24X (0.6)
METAL
TYP
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, regulatory or other requirements.
These resources are subject to change without notice. TI grants you permission to use these resources only for development of an
application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license
is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you
will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these
resources.
TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on ti.com or provided in conjunction with
such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for
TI products.
TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2022, Texas Instruments Incorporated