Datenblatt für FBS10-06SC von IXYS

TMTTMT
© 2008 IXYS All rights reserved 1 - 2
20080602a
FBS 10-06SC
IXYS reserves the right to change limits, test conditions and dimensions.
Advanced Technical Information
Silicon Carbide
Schottky Rectifier Bridge
in ISOPLUS i4-PAC™
Features
• Silicon Carbide Schottky Diodes
- no reverse recovery at turn off
- only charge of junction capacity
- soft turn off waveform
- no forward recovery at turn on
- switching behaviour independent of
temperature
- low leakage current
• ISOPLUS i4-PAC™ package
- isolated back surface
- low coupling capacity between pins
and heatsink
- enlarged creepage towards heatsink
- application friendly pinout
- high reliability
- industry standard outline
Applications
• output rectifiers of high end switch
mode power supplies
• other high frequency rectifiers
Rectifier Bridge
Symbol Conditions Maximum Ratings
VRRM 600 V
IFAV
ID(AV)M
IFSM
TC = 90°C; sine 180° (per diode)
TC = 90°C
TC = 25°C; t = 10 ms; sine 50 Hz
3
6.6
12
A
A
A
Ptot TC = 25°C (per diode) 19 W
Symbol Conditions Characteristic Values
(TVJ = 25°C, unless otherwise specified)
min. typ. max.
VFIF = 4 A TVJ = 25°C
TVJ = 125°C
1.7
1.9
2.0 V
V
IRVR = VRRM TVJ = 25°C
TVJ = 125°C 0.04
0.2 mA
mA
CJVR = 400 V TVJ = 125°C 9 pF
RthJC
RthJS
(per diode)
11.5
8 K/W
K/W
VRRM = 600 V
IdAVM = 6.6 A
Cjunction = 9 pF
1
4
5
2
1
5
E7 (A, if L7 772 M b4 02 D7 DIM M/LUMETER /N(HE$ M/N MAX MIN MAX A 4,83 5,27 0, 790 0, 205 A7 2,59 3,00 0, 702 0, 778 A2 7,77 2, 76 0, 046 0, 005 6 7,74 7,40 0,045 0,055 :57 7,47 7,73 0,058 0,068 :52 2,54 2, 79 0, 700 0, 770 [ 0,57 0, 74 0 020 0, 029 0 20,00 27,34 0,879 0, 840 D7 74, 99 75, 75 0,590 0, 620 02 7,65 2, 03 0, 065 0, 000 E 19,56 20,29 0, 770 0, 799 [7 76,76 77,53 0,660 0,690 9 3,07 55[ 0, 75 BSL’ L 79,87 27,34 0, 750 0840 L 7 2, 71 2,59 0, 083 0, 702 H 5,33 5,20 0,270 0,244 I? 2,54 4,57 0, 700 0, 700 W 7 0, 70 7 0, 004
© 2008 IXYS All rights reserved 2 - 2
20080602a
FBS 10-06SC
IXYS reserves the right to change limits, test conditions and dimensions.
Advanced Technical Information
Dimensions in mm (1 mm = 0.0394“)
Die konvexe Form des Substrates ist typ. < 0,05 mm
über der Kunststoffoberfläche der Bauteilunterseite
The convex bow of substrate is typ. < 0.05 mm over
plastic surface level of device bottom side
Component
Symbol Conditions Maximum Ratings
TVJ
Tstg
operating -40...+175
-40...+125
°C
°C
VISOL IISOL < 1 mA; 50/60 Hz 2500 V~
FCmounting force with clip 20 - 120 N
Symbol Conditions Characteristic Values
min. typ. max.
Cpcoupling capacity between shorted
pins and mounting tab in the case
40 pF
dS; dA
dS; dA
pin - pin
pin - backside metal
1.7
5.5
mm
mm
Weight 9 g