Datenblatt für BQ24072T, 75T, 79T

1!. B X E I TEXAS INSTRUMENTS
IN
VSS
BAT
DC
GND
Adaptor
BQ24075T
BQ24079T
BQ24072T
CE
OUT
CHG
PGOOD
TRM
EN1
EN2
TS
ILIM ISET
TEMP
PACK-
SYSTEM
SYSOFF
System
ON /OFF
Control
13
8
15
46
1
2
3
5
10
11
97
1PF
4.7 PF
4.7 PF
1 k:
1.18 k:
1 k:
10 k:
1.13 k:
13 k:
VIN
12 16 14
PACK+
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Folder
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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
BQ24072T
,
BQ24075T
,
BQ24079T
SLUS937C DECEMBER 2009REVISED DECEMBER 2019
BQ2407xT Standalone 1-Cell 1.5-A Linear Battery Charger with Power Path and
Voltage-Based TS
1
1 Features
1 Fully Compliant USB Charger
Selectable 100 mA and 500 mA maximum input
current
100 mA Maximum current limit ensures
compliance to USB-IF standard
Input based dynamic power management (VIN-DPM)
for protection against poor USB sources
28 V Input lting with over-voltage protection
Integrated dynamic power path management
(DPPM) function simultaneously and
independently powers the system and charges the
battery
System output tracks battery voltage (BQ24072T)
Supports up to 1.5 A charge current with current
monitoring output (ISET)
Programmable Input Current Limit up to 1.5 A for
wall adapters
Battery disconnect function with SYSOFF input
Reverse current, short-circuit and thermal
protection
Flexible voltage based NTC thermistor input
Proprietary start up sequence limits inrush current
Status indication – charging/done, power good
Small 3 mm × 3 mm 16 Lead VQFN Package
2 Applications
Smart phones
PDAs
MP3 players
Low-power handheld devices
3 Description
The BQ2407xT series of devices are integrated Li-ion
linear chargers and system power path management
devices targeted at space-limited portable
applications. The devices operate from either a USB
port or AC adapter and support charge currents up to
1.5A. The input voltage range with input over-voltage
protection supports unregulated adapters. The USB
input current limit accuracy and start up sequence
allow the BQ2407xT to meet USB-IF inrush current
specification. Additionally, the input dynamic power
management (VIN - DPM) prevents the charger from
crashing incorrectly configure USB sources.
The BQ2407xT features dynamic power path
management (DPPM) that powers the system while
simultaneously and independently charging the
battery. The DPPM circuit reduces the charge current
when the input current limit causes the system output
to fall to the DPPM threshold; thus, supplying the
system load at all times while monitoring the charge
current separately. This feature reduces the number
of charge and discharge cycles on the battery, allows
for proper charge termination and enables the system
to run with a defective or absent battery pack.
Device Information(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
BQ24072T
VQFN (16) 3.00 mm x 3.00 mmBQ24075T
BQ24079T
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Simplified Circuit
l TEXAS INSTRUMENTS
2
BQ24072T
,
BQ24075T
,
BQ24079T
SLUS937C DECEMBER 2009REVISED DECEMBER 2019
www.ti.com
Product Folder Links: BQ24072T BQ24075T BQ24079T
Submit Documentation Feedback Copyright © 2009–2019, Texas Instruments Incorporated
Table of Contents
1 Features.................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Description (continued)......................................... 3
6 Device Options....................................................... 3
7 Pin Configuration and Functions......................... 4
8 Specifications......................................................... 6
8.1 Absolute Maximum Ratings ..................................... 6
8.2 ESD Ratings.............................................................. 6
8.3 Recommended Operating Conditions....................... 6
8.4 Thermal Information.................................................. 7
8.5 Electrical Characteristics........................................... 7
8.6 Typical Characteristics............................................ 10
9 Detailed Description............................................ 13
9.1 Overview ................................................................. 13
9.2 Functional Block Diagram....................................... 13
9.3 Feature Description................................................. 14
9.4 Device Functional Modes........................................ 20
10 Applications and Implementation...................... 25
10.1 Application Information.......................................... 25
10.2 Typical Applications .............................................. 25
11 Power Supply Recommendations ..................... 31
11.1 Power On .............................................................. 31
12 Layout................................................................... 33
12.1 Layout Guidelines ................................................. 33
12.2 Layout Example .................................................... 33
12.3 Thermal Package.................................................. 34
13 Device and Documentation Support ................. 35
13.1 Device Support .................................................... 35
13.2 Related Links ........................................................ 35
13.3 Receiving Notification of Documentation Updates 35
13.4 Support Resources ............................................... 35
13.5 Trademarks........................................................... 35
13.6 Electrostatic Discharge Caution............................ 35
13.7 Glossary................................................................ 35
14 Mechanical, Packaging, and Orderable
Information ........................................................... 35
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision B (November 2014) to Revision C Page
Changed the data sheet title ................................................................................................................................................. 1
Moved Storage temperature From: the ESD table to the Absolute Maximum Ratings.......................................................... 6
Changed the Handling Ratings table to ESD Ratings............................................................................................................ 6
Changed VIN-LOW To: IN-DPM in the Electrical Characteristics Power Path section ................................................................... 7
Changed VIN-LOW To VIN-DPM in the Functional Block Diagram ............................................................................................. 13
Changed: "R3 must be added.." To: "R8 must be added..." in the Battery Pack Temperature Monitoring section............. 20
Changed R6 From: 10 kΩTo: 19.1 kΩand R7 From: 13.2 kΩTo: 8.25 kΩin Figure 23 .................................................. 25
Changed text: "which for this case are R6 = 8.25 kand R7 = 19.1k.." To: "which for this case are R7 = 8.25 k
and R6 = 19.1 k"................................................................................................................................................................ 26
Changed Equation 8 ............................................................................................................................................................ 34
Changes from Revision A (April 2010) to Revision B Page
Added Handling Rating table, Feature Description section, Device Functional Modes, Application and
Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation
Support section, and Mechanical, Packaging, and Orderable Information section................................................................ 1
Deleted text from the Pin Configuration and Functions section: "Pin out designations are not final. Subject to
change." ................................................................................................................................................................................. 4
Changed VO(REG) to VBAT(REG) in Min Typ Max columns on the VRCH spec. of Electrical Characteristics table under
sub section BATTERY CHARGER......................................................................................................................................... 8
Changed IOUT 5.5 V To VOUT 5.5 V in Figure 28 .................................................................................................................. 27
l TEXAS INSTRUMENTS
3
BQ24072T
,
BQ24075T
,
BQ24079T
www.ti.com
SLUS937C DECEMBER 2009REVISED DECEMBER 2019
Product Folder Links: BQ24072T BQ24075T BQ24079T
Submit Documentation FeedbackCopyright © 2009–2019, Texas Instruments Incorporated
Changes from Original (December 2009) to Revision A Page
Added BQ24072T device to data sheet header..................................................................................................................... 1
Added BQ24072T feature bullet............................................................................................................................................. 1
Added "BQ24072T" to graphic entity...................................................................................................................................... 1
Added BQ24072T spec. to Ordering Info table...................................................................................................................... 3
Added BQ24072T Pin Diagram.............................................................................................................................................. 4
Added BQ24072T to VO(REG) in the Electrical Characteristics Power Path section................................................................ 7
Added "BQ24072T" to VDPPM in the Electrical Characteristics table....................................................................................... 8
Added "BQ24072T" to VBAT(REG) the Electrical Characteristics table...................................................................................... 8
Added BQ24072T Termination Disable (TD) description..................................................................................................... 17
Added graphic entity for BQ24072T DPPM and Battery Supplement Modes...................................................................... 23
Added graphic entity for BQ24072T Host Controlled Charger application........................................................................... 29
Added Termination Disable operation procedure................................................................................................................. 29
5 Description (continued)
Additionally, the regulated system input enables instant system turn-on when plugged in even with a totally
discharged battery. The power-path management architecture also permits the battery to supplement the system
current requirements when the adapter cannot deliver the peak system currents, enabling the use of a smaller
adapter.
The battery is charged in three phases: conditioning, constant current, and constant voltage. In all charge
phases, an internal control loop monitors the IC junction temperature and reduces the charge current if the
internal temperature threshold is exceeded. The charger power stage and charge current sense functions are
fully integrated. The charger function has high accuracy current and voltage regulation loops, charge status
display, and charge termination. The input current limit and charge current are programmable using external
resistors.
6 Device Options
PART NO. VOVP VBAT(REG) VOUT(REG) VDPPM OPTIONAL
FUNCTION
BQ24072TRGTR 6.6 V 4.2 V VBAT + 225 mV VOREG –100 mV TD
BQ24072TRGTT 6.6 V 4.2 V VBAT + 225 mV VOREG –100 mV TD
BQ24075TRGTR 6.6 V 4.2 V 5.5 V 4.3 V SYSOFF
BQ24075TRGTT 6.6 V 4.2 V 5.5 V 4.3 V SYSOFF
BQ24079TRGTR 6.6 V 4.1 V 5.5 V 4.3 V SYSOFF
BQ24079TRGTT 6.6 V 4.1 V 5.5 V 4.3 V SYSOFF
‘5‘ TEXAS INSTRUMENTS
16 ISET5EN2
1TS 12 ILIM
15 SYSOFF6EN1
2BAT 11 OUT
14 TMR7PGOOD
3BAT 10 OUT
13 IN8VSS
4CE 9 CHG
No t to scale
Th ermal
Pad
16 ISET5EN2
1TS 12 ILIM
15 TD6EN1
2BAT 11 OUT
14 TMR7PGOOD
3BAT 10 OUT
13 IN8VSS
4CE 9 CHG
No t to scale
Th ermal
Pad
4
BQ24072T
,
BQ24075T
,
BQ24079T
SLUS937C DECEMBER 2009REVISED DECEMBER 2019
www.ti.com
Product Folder Links: BQ24072T BQ24075T BQ24079T
Submit Documentation Feedback Copyright © 2009–2019, Texas Instruments Incorporated
7 Pin Configuration and Functions
BQ24072T RGT Package
QFN 16 Pin
Top View
BQ24075T and BQ24079 RGT Package
QFN 16 Pin
Top View
Pin Functions
PIN
DESCRIPTION
NAME
NUMBER
I/O
BQ24072T BQ24075T
BQ24079T
TS 1 1 I/O External NTC Thermistor Input. Connect the TS input to the center tap of a resistor divider from VIN to
GND with the NTC in parallel with the bottom resistor to monitor the NTC in the battery pack. For
applications that do not utilize the TS function, set the resistor divider to be a 20% ratio. See the Battery
Pack Temperature Monitoring section for details on calculating the resistor values.
BAT 2, 3 2, 3 I/O Charger Power Stage Output and Battery Voltage Sense Input. Connect BAT to the positive terminal of
the battery. Bypass BAT to VSS with a 4.7μF to 47μF ceramic capacitor.
CE 4 4 I Charge Enable Active-Low Input. Connect CE to a high logic level to place the battery charger in standby
mode. In standby mode, OUT is active and battery supplement mode is available. Connect /CE to a low
logic level to enable the battery charger. CE is internally pulled down with ~285k. Do not leave CE
unconnected to ensure proper operation.
EN2 5 5 I Input Current Limit Configuration Inputs. Use EN1 and En2 to control the maximum input current and
enable USB compliance. See for the description of the operation states. EN1 and EN2 are internally
pulled down with ~285k. Do not leave EN1 or EN2 unconnected to ensure proper operation.
EN1 6 6 I
PGOOD 7 7 O Open-Drain Power Good Status Indication Output. PGOOD pulls to VSS when a valid input source is
detected. PGOOD is high-impedance when the input power is not within specified limits. Connect
PGOOD to the desired logic voltage rail using a 1kto 100kresistor, or use with an LED for visual
indication.
VSS 8 8 Ground. Connect to the thermal pad and to the ground rail of the circuit.
CHG 9 9 O Open-Drain Charging Status Indication Output. CHG pulls to VSS when the battery is charging. CHG is
high-impedance when charging is complete or when the charger is disabled. CHG flashes to indicate a
timer fault. Connect CHG to the desired logic voltage rail using a 1kto 100kresistor, or use with an
LED for visual indication.
OUT 10, 11 10, 11 O System Supply Output. OUT provides a regulated output when the input is below the OVP threshold and
above the regulation voltage. When the input is out of the operation range, OUT is connected to VBAT
except when SYSOFF is high. Connect OUT to the system load. Bypass OUT to VSS with a 4.7μF to
47μF ceramic capacitor.
ILIM 12 12 O Adjustable Current Limit Programming Input. Connect a 1.07kto 7.5kresistor from ILIM to VSS to
program the maximum input current (EN2=1, EN1=0). The input current includes the system load and the
battery charge current. Leaving ILIM unconnected disables all charging.
IN 13 13 I Input Power Connection. Connect IN to the external DC supply (AC adapter or USB port). The input
operating range is 4.35V to 6.6V. The input accepts voltages up to 26V without damage, but operation is
suspended. Bypass IN to VS with a 1μF to 10μF ceramic capacitor.
TMR 14 14 I Timer Programming Input. TMR controls the pre-charge and fast-charge safety timers. Connect TMR to
VSS to disable all safety timers. Connect a 18kto 72kresistor between TMR and VSS to program the
timers to a desired length. Leave TMR unconnected to set the timers to the default values.
l TEXAS INSTRUMENTS
5
BQ24072T
,
BQ24075T
,
BQ24079T
www.ti.com
SLUS937C DECEMBER 2009REVISED DECEMBER 2019
Product Folder Links: BQ24072T BQ24075T BQ24079T
Submit Documentation FeedbackCopyright © 2009–2019, Texas Instruments Incorporated
Pin Functions (continued)
PIN
DESCRIPTION
NAME
NUMBER
I/O
BQ24072T BQ24075T
BQ24079T
SYSOFF 15 I System Enable Input. Connect SYSOFF high to turn off the FET connecting the battery to the system
output. When an adapter is connected, charge is also disabled. Connect SYSOFF low for normal
operation. SYSOFF is internally pulled up to VBAT through a large resistor (~5M). Do not leave
SYSOFF unconnected to ensure proper operation.
TD 15 I Termination Disable Input. Connect TD high to disable charger termination. Connect TD to VSS to
enable charger termination. TD is checked during startup only and cannot be changed during operation.
See the TD section in this datasheet for a description of the behavior when termination is disabled. TD is
internally pulled down to VSS with ~285 kΩ. Do not leave TD unconnected to ensure proper operation.
ISET 16 16 I/O Fast Charge Current Programming Input. Connect a 590 to 3 kresistor from ISET to VSS to program
the fast charge current level. Charging is disabled if ISET is left unconnected. While charging, the voltage
ISET reflects the actual charging current and can be used to monitor charge current. See the Charge
Current Translator section of this datasheet for more details.
Thermal
Pad -- There is an internal electrical connection between the exposed thermal pad and the VSS pin of the
device. The thermal pad must be connected to the same potential as the VSS pin on the printed circuit
board. Do not use the thermal pad as the primary ground input for the device. VSS must be connected to
ground at all times.
Table 1. EN1/EN2 Settings
EN2 EN1 MAXIMUM INPUT CURRENT INTO IN
0 0 100 mA. USB100 mode
0 1 500 mA. USB500 mode
1 0 Set by external resistor from ILIM to VSS
1 1 Standby (USB suspend mode)
l TEXAS INSTRUMENTS
6
BQ24072T
,
BQ24075T
,
BQ24079T
SLUS937C DECEMBER 2009REVISED DECEMBER 2019
www.ti.com
Product Folder Links: BQ24072T BQ24075T BQ24079T
Submit Documentation Feedback Copyright © 2009–2019, Texas Instruments Incorporated
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The IC operational charging life is reduced to 20,000 hours, when charging at 1.5A and 125°C. The thermal regulation feature reduces
charge current if the IC’s junction temperature reaches 125°C; thus without a good thermal design the maximum programmed charge
current may not be reached.
8 Specifications
8.1 Absolute Maximum Ratings(1) (2)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Input voltage
IN (with respect to VSS) –0.3 28 V
BAT (with respect to VSS) –0.3 5 V
OUT, EN1, EN2, CE, TS, ISET, PGOOD, CHG, ILIM, VREF,
ITERM, SYSOFF, TD (with respect to VSS) –0.3 7 V
Input current IN 1.6 A
Output current (Continuous)
OUT 5 A
BAT (Discharge mode) 5 A
BAT (Charging mode) 1.5 A
Output sink current CHG, PGOOD 15 mA
Junction temperature, TJ–40 150 °C
Storage temperature , Tstg –65 150 °C
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
8.2 ESD Ratings
VALUE UNIT
V(ESD) Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000 V
Charged device model (CDM), per JEDEC specification JESD22-C101,
all pins(2) ±500 V
(1) The IC operational charging life is reduced to 20,000 hours, when charging at 1.5A and 125°C. The thermal regulation feature reduces
charge current if the IC’s junction temperature reaches 125°C; thus without a good thermal design the maximum programmed charge
current may not be reached.
(2) Use a 1% tolerance resistor RISET to avoid issues with the RISET short test when using the maximum charge current setting.
8.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNITS
VIN IN voltage range 4.35 26 V
IN operating voltage range 4.35 6.4 V
IIN Input current, IN pin 1.5 A
IOUT Current, OUT pin 4.5 A
IBAT Current, BAT pin (Discharging) 4.5 A
ICHG Current, BAT pin (Charging) 1.5(1) A
TJJunction Temperature 0 125 °C
RILIM Maximum input current programming resistor 1.07 7.5 k
RISET Fast-charge current programming resistor(2) 590 3000
RITERM Termination current programming resistor 0 15 k
RTMR Timer programming resistor 18 72 k
l TEXAS INSTRUMENTS
7
BQ24072T
,
BQ24075T
,
BQ24079T
www.ti.com
SLUS937C DECEMBER 2009REVISED DECEMBER 2019
Product Folder Links: BQ24072T BQ24075T BQ24079T
Submit Documentation FeedbackCopyright © 2009–2019, Texas Instruments Incorporated
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
8.4 Thermal Information
THERMAL METRIC(1) RGT [VQFN] UNIT
16 PINS
RθJA Junction-to-ambient thermal resistance 45.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 53.6 °C/W
RθJB Junction-to-board thermal resistance 18.1 °C/W
ψJT Junction-to-top characterization parameter 1.1 °C/W
ψJB Junction-to-board characterization parameter 18.0 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 5.2 °C/W
8.5 Electrical Characteristics
Over junction temperature range (0°C < TJ< 125°C) and the recommended supply voltage range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
INPUT
VUVLO Under-voltage lock-out VIN: 0V 4V 3.2 3.3 3.4 V
VHYS-UVLO Hysteresis on UVLO VIN: 4V 0V 200 300 mV
VIN-DT Input power detection threshold (Input power detected if VIN > VBAT + VIN-DT)
VBAT = 3.6V, VIN: 3.5V 4V 55 80 140 mV
VHYS-INDT Hysteresis on VIN-DT VBAT = 3.6V, VIN: 4V 3.5V 20 mV
tDGL(PGOOD) Deglitch time, input power detected
status Time measured from VIN: 0V 5V,
1μs rise-time to PGOOD = LO 1.2 ms
VOVP Input overvoltage protection threshold VIN: 5V 7V 6.4 6.6 6.8 V
VHYS-OVP Hysteresis on OVP VIN: 7V 5V 240 mV
tBLK(OVP) Input over-voltage blanking time 50 μs
tREC(OVP) Input over-voltage recovery time Time measured from VIN: 11V 5V 1μs
fall-time to PGOOD = LO 1.2 ms
ILIM, ISET SHORT CIRCUIT TEST
ISC Current source 1.3 mA
VSC 520 mV
QUIESCENT CURRENT
IBAT(PDWN) Sleep current into BAT pin CE = LO or HI, input power not detected, no load
on OUT pin 6.5 μA
IIN(STDBY) Standby current into IN pin EN1= HI, EN2=HI, VIN 6V 50 μA
EN1= HI, EN2=HI, VIN > 6V 200
ICC Active supply current, IN pin CE = LO, VIN = 6V, no load on OUT pin,
VBAT > VBAT(REG), (EN1,EN2)(HI,HI) 1.5 mA
POWER PATH
VDO(IN-OUT) VIN – VOUT VIN = 4.3V, IIN = 1A, VBAT = 4.2V 300 475 mV
VDO(BAT-
OUT) VBAT – VOUT IOUT = 1A, VIN = 0V, VBAT > 3V 50 100 mV
VO(REG)
OUT pin voltage regulation
(BQ24072T)
VIN > VOUT + VDO(IN-OUT) , VBAT< 3.2 V 3.3 3.4 3.5
V
VIN > VOUT + VDO(IN-OUT) , VBAT 3.2 V VBAT +
150 mV VBAT +
225 mV VBAT +
270 mV
OUT pin voltage regulation
(BQ24075T, BQ24079T) VIN > VOUT + VDO(IN-OUT) 5.4 5.5 5.6
IIN-MAX Maximum input current
EN1 = LO, EN2 = LO 90 95 100 mA
EN1 = HI, EN2 = LO 450 475 500 mA
EN2 = HI, EN1 = LO KILIM/RIL IM A
KILIM Maximum input current factor ILIM 500mA 1500 1600 1700 A
200mA < ILIM < 500mA 1330 1512 1700
IIN-MAX Programmable input current limit
range EN2 = HI, EN1 = LO, RILIM = 8kto 1.1k200 1500 mA
VIN-DPM Input voltage threshold when input
current is reduced EN2 = LO, EN1 = X 4.35 4.5 4.63 V
l TEXAS INSTRUMENTS
8
BQ24072T
,
BQ24075T
,
BQ24079T
SLUS937C DECEMBER 2009REVISED DECEMBER 2019
www.ti.com
Product Folder Links: BQ24072T BQ24075T BQ24079T
Submit Documentation Feedback Copyright © 2009–2019, Texas Instruments Incorporated
Electrical Characteristics (continued)
Over junction temperature range (0°C < TJ< 125°C) and the recommended supply voltage range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VDPPM Output voltage threshold when
charging current is reduced
BQ24072T VO(REG)
–180 mV VO(REG)
–100 mV VO(REG)
–30 mV V
BQ24075T, BQ24079T 4.2 4.3 4.4
VBSUP1 Enter battery supplement mode VOUT falling, Supplement mode entered when
VOUT < VBSUP1
VBAT
40mV V
VBSUP2 Exit battery supplement mode VOUT rising, Supplement mode exited when VOUT
> VBSUP2
VBAT
20mV V
VO(SC1) Output short-circuit detection
threshold, power-on 0.8 0.9 1.0 V
VO(SC2)
Output short-circuit detection
threshold, supplement mode VBAT
VOUT > VO(SC2) indicates short-circuit 200 250 300 mV
tDGL(SC2) Deglitch time, supplement mode short
circuit 250 μs
tREC(SC2) Recovery time, supplement mode
short circuit 60 ms
BATTERY CHARGER
IBAT(SC) Source current for BAT pin short-
circuit detection 4 7.5 11 mA
VBAT(SC) BAT pin short-circuit detection
threshold 1.6 1.8 2.0 V
VBAT(REG) Battery charge voltage BQ24072T, BQ24075T 4.16 4.20 4.24 V
BQ24079T 4.059 4.100 4.141
VLOWV Pre-charge to fast-charge transition
threshold 2.9 3 3.1 V
tDGL1(LOWV) Deglitch time on pre-charge to fast-
charge transition 25 ms
tDGL2(LOWV) Deglitch time on fast-charge to pre-
charge transition 25 ms
ICHG Battery fast charge current range VBAT(REG) > VBAT > VLOWV, VIN = 5V, CE = LO,
EN1= LO, EN2 = HI 300 1500 mA
ICHG Battery fast charge current CE = LO, EN1= LO, EN2 = HI, VBAT > VLOWV,
VIN = 5V, IIN-MAX > ICHG, no load on OUT pin,
thermal loop not active, DPM loop not active KISET/RISET A
KISET Fast charge current factor 797 890 975 AΩ
IPRECHG Pre-charge current KPRECHG /RISET A
kPRECHG Pre-charge current factor 70 88 106
ITERM Charge current value for termination
detection threshold
CE = LO, (EN1,EN2)(LO,LO),
VBAT > VRCH, t < tMAXCH, VIN = 5V, DPM loop not
active, thermal loop not active 0.09×ICHG 0.1×ICHG 0.11×ICHG
CE = LO, (EN1,EN2)=(LO,LO),
VBAT > VRCH, t < tMAXCH, VIN = 5V, DPM loop not
active, thermal loop not active 0.027×ICHG 0.033×ICHG 0.040×ICHG
tDGL(TERM) Deglitch time, termination detected 25 ms
VRCH Recharge detection threshold VBAT(REG)
–140mV VBAT(REG)
–100mV VBAT(REG)
–60mV V
tDGL(RCH) Deglitch time, recharge threshold
detected 62.5 ms
tDGL(NO-IN) Delay time, input power loss to
charger turn-off VBAT = 3.6V. Time measured from VIN:
5V 3.3V 1μs fall-time 20 ms
IBAT(DET) Sink current for battery detection 5 7.5 10 mA
tDET Battery detection timer 250 ms
BATTERY CHARGING TIMERS
tPRECHG Pre-charge safety timer value TMR = floating 1440 1800 2160 s
tMAXCH Charge safety timer value TMR = floating 14400 18000 21600 s
tPRECHG Pre-charge safety timer
value(externally set) 18k< RTMR < 72kRTMR x KTMR s
l TEXAS INSTRUMENTS
9
BQ24072T
,
BQ24075T
,
BQ24079T
www.ti.com
SLUS937C DECEMBER 2009REVISED DECEMBER 2019
Product Folder Links: BQ24072T BQ24075T BQ24079T
Submit Documentation FeedbackCopyright © 2009–2019, Texas Instruments Incorporated
Electrical Characteristics (continued)
Over junction temperature range (0°C < TJ< 125°C) and the recommended supply voltage range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tMAXCH Charge safety timer value (externally
set) 18k< RTMR < 72kΩ10 x RTMR x KTMR s
KTMR Timer factor 35 45 55 s / k
BATTERY – PACK NTC MONITOR
VHOT High temperature trip point Battery charging 12 12.5 13 % of
VIN
VHYS(HOT) Hysteresis on high trip point Battery charging 1 % of
VIN
VCOLD Low temperature trip point Battery charging 24.5 25 25.5 % of
VIN
VHYS(COLD) Hysteresis on low trip point Battery charging 1 % of
VIN
tDGL(TS) Deglitch time, pack temperature fault
detection Battery charging 50 ms
THERMAL REGULATION
TJ(REG) Temperature Regulation Limit 125 °C
TJ(OFF) Thermal shutdown temperature 155 °C
TJ(OFF-HYS) Thermal shutdown hysteresis 20 °C
LOGIC LEVELS ON EN1, EN2, CE, SYSOFF, TD
VIL Logic LOW input voltage 0 0.4 V
VIH Logic HIGH input voltage 1.4 6.0 V
IIL 1μA
IIH 10 μA
LOGIC LEVELS ON PGOOD, CHG
VOL Output LOW voltage ISINK = 5 mA 0.4 V
l TEXAS INSTRUMENTS
3.60
3.62
3.64
3.66
3.68
3.70
3.72
3.74
3.76
3.78
3.80
0 25 50 75 100 125
T -JunctionTemperature-°C
J
V -OutputVoltage-V
O
V =5V,
V =3.5V,
I =1 A
IN
BAT
L
0
20
40
60
80
100
120
025 50 75 100 125
T -JunctionTemperature-°C
J
DropoutVoltage-V -V
BAT OUT
VBAT =3V
VBAT =3.9V
I =1 A
L
3
3.2
3.4
3.6
3.8
4
4.2
4.4
4.6
22.5 33.5 4 4.5
V -OutputVoltage-V
O
V -BatteryVoltage-V
BAT
V =5V
IN
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0 25 50 75 100 125
T -JunctionTemperature-°C
J
DropoutVoltage-V -V
IN OUT
I =1 A
L
600
400
100
Temperature- C
o
300
200
500
0
120 125 130 135 140 145
I -mA
BAT
10
BQ24072T
,
BQ24075T
,
BQ24079T
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8.6 Typical Characteristics
VIN = 6 V, EN1 = 1, EN2 = 0, TA= 25°C, unless otherwise noted.
Figure 1. Thermal Regulation Figure 2. Dropout Voltage vs Temperature
Figure 3. Dropout Voltage vs Temperature Figure 4. BQ24072T Output Regulation Voltage vs Battery
Voltage
Figure 5. BQ24072T Output Regulation Voltage vs
Temperature
Figure 6. Output Regulation Voltage vs Temperature
l TEXAS INSTRUMENTS
R=900
ISET W
0.95
0.97
0.99
1.01
1.03
1.05
33.2 3.4 3.6 3.8 4 4.2
I -FastChargeCurrent- A
BAT
V -BatteryVoltage-V
BAT
R=3k
ISET W
280
285
290
295
300
305
310
3 3.2 3.4 3.6 3.8 4 4.2
I -FastChargeCurrent- A
BAT
V -BatteryVoltage-V
BAT
6.45
6.50
6.55
6.60
6.65
6.70
0 25 50 75 100 125
T -JunctionTemperature-°C
J
V -OutputVoltageThreshold-V
OVP
6.6V
V Rising
I
V Falling
I
0
100
200
300
400
500
600
700
800
5 6 7 8 9 10
V -InputVoltage-V
I
I -InputCurrent-mA
LIM
RILIM
USB500
USB100
4.180
4.185
4.190
4.195
4.200
4.205
4.210
0510 15 20 25 30
T -JunctionTemperature-°C
J
V -RegulationVoltage-V
BAT
4.08
4.085
4.09
4.095
4.1
4.105
4.11
0 5 10 15 20 25 30
V -RegulationVoltage-V
BAT
T -JunctionTemperature-°C
J
11
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,
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,
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Typical Characteristics (continued)
VIN = 6 V, EN1 = 1, EN2 = 0, TA= 25°C, unless otherwise noted.
Figure 7. BQ24075T BAT Regulation Voltage vs
Temperature
Figure 8. BQ24079T Battery Regulation Voltage vs
Temperature
Figure 9. Overvoltage ProtectionThreshold vs Temperature Figure 10. Input Current Limit vs Input Voltage
Figure 11. Fastcharge Current vs Battery Voltage Figure 12. Fastcharge Current vs Battery Voltage
l TEXAS INSTRUMENTS
95
96
97
98
99
100
101
102
103
104
105
2 2.2 2.4 2.6 2.8 3
I -PrechargeCurrent- A
BAT
V -BatteryVoltage-V
BAT
R=900
ISET W
28.5
29
29.5
30
30.5
31
31.5
2 2.2 2.4 2.6 2.8 3
I -PrechargeCurrent- A
BAT
V -BatteryVoltage-V
BAT
R=3k
ISET W
12
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,
BQ24075T
,
BQ24079T
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Typical Characteristics (continued)
VIN = 6 V, EN1 = 1, EN2 = 0, TA= 25°C, unless otherwise noted.
Figure 13. Fastcharge Current vs Battery Voltage Figure 14. Precharge Current vs Battery Voltage
l TEXAS INSTRUMENTS
USB100
USB5 00
VREF- ILIM
USB-susp
Short Detect
Short Detect
TJ(REG)
TJ
VDPPM
VOUT
VBAT(REG)
VBAT(SC)
VO(REG)
VO(SC1) OUT-SC1
tDGL(TERM)
BAT-SC
Q1
Q2
tDGL1(LOWV)
tDGL(RCH)
VLOWV
VRCH
VCOLD
VHOT
tDGL(NO-IN)
tDGL(PGOOD)
tBLK(OVP)
VBAT + VIN-DT
VUVLO
VOVP
VIN
Dynamically
Controlled
Oscillator
VIPRECHG
V
ICHG
VISET
Fast- Charge
Timer
Pre- Charge
Timer
Halt timers
Timer fault
EN1
EN2
USB Suspend
EN2
CE
IN
EN1
EN2
CHG
PGOOD
TS
OUT
BAT
ISET
ILIM
Charge Control
VIN-DPM
VBAT OUT- SC2
Reset timers
tDGL( TS)
VOUT
Supplement
tDGL(SC2)
VBAT
250mV
40mV
tDGL2(LOWV)
225mV)
2.25V
Fastcharge
225mV
Precharge
SYSOFF
CHARGEPUMP
V
IN
TMR
13
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,
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,
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9 Detailed Description
9.1 Overview
The BQ2407x devices are integrated Li-Ion linear chargers and system power path management devices
targeted at space-limited portable applications. The device powers the system while simultaneously and
independently charging the battery. This feature reduces the number of charge and discharge cycles on the
battery, allows for proper charge termination and enables the system to run with a defective or absent battery
pack. It also allows instant system turn-on even with a totally discharged battery. The input power source for
charging the battery and running the system can be an AC adapter or a USB port. The devices feature Dynamic
Power Path Management (DPPM), which shares the source current between the system and battery charging,
and automatically reduces the charging current if the system load increases. When charging from a USB port,
the input dynamic power management (VIN-DPM) circuit reduces the input current if the input voltage falls below a
threshold, preventing the USB port from crashing. The power-path architecture also permits the battery to
supplement the system current requirements when the adapter cannot deliver the peak system currents.
9.2 Functional Block Diagram
l TEXAS INSTRUMENTS pare-um: ccnsrcnncc Vnuam Elna _____ “Ill-y mm. cvnbn Ian-w Cur-m Dom: cm- W
14
BQ24072T
,
BQ24075T
,
BQ24079T
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Product Folder Links: BQ24072T BQ24075T BQ24079T
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9.3 Feature Description
9.3.1 Undervoltage Lockout (UVLO)
The BQ2407X family remains in power down mode when the input voltage at the IN pin is below the
undervoltage threshold (UVLO). During the power down mode the host commands at the control inputs (CE, EN1
and EN2) are ignored. The Q1 FET connected between IN and OUT pins is off, and the status outputs, CHG and
PGOOD, are high impedance. The Q2 FET that connects BAT to OUT is ON. (If SYSOFF is high, Q2 is off).
During power down mode, the VOUT(SC2) circuitry is active and monitors for overload conditions on OUT.
9.3.2 Overvoltage Protection (OVP)
The BQ2407xT accepts inputs up to 28V without damage. Additionally, an overvoltage protection (OVP) circuit is
implemented that shuts off the internal LDO and discontinues charging when VIN > VOVP for a period longer than
tDGL(OVP). When in OVP, the system output (OUT) is connected to the battery and PGOOD is high impedance.
Once the OVP condition is removed, a new power on sequence starts (See the POWER ON section). The safety
timers are reset and a new charge cycle will be indicated by the CHG output.
9.3.3 Dynamic Power-Path Management
The BQ2407xT features an OUT output that powers the external load connected to the battery. This output is
active whenever a source is connected to IN or BAT. The following sections discuss the behavior of OUT with a
source connected to IN to charge the battery and a battery source only.
9.3.4 Battery Charging
Set CE low to initiate battery charging. First, the device checks for a short-circuit on the BAT pin by sourcing
IBAT(SC) to the battery and monitoring the voltage. When the BAT voltage exceeds VBAT(SC), the battery charging
continues. The battery is charged in three phases: conditioning pre-charge, constant current fast charge (current
regulation) and a constant voltage tapering (voltage regulation). In all charge phases, an internal control loop
monitors the IC junction temperature and reduces the charge current if an internal temperature threshold is
exceeded.
Figure 15. Typical Charging Cycle
l TEXAS INSTRUMENTS
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,
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,
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Feature Description (continued)
Figure 15 illustrates a normal Li-Ion charge cycle using the BQ2407xT. In the pre-charge phase, the battery is
charged at with the pre-charge current (IPRECHG). Once the battery voltage crosses the VLOWV threshold, the
battery is charged with the fast-charge current (ICHG). As the battery voltage reaches VBAT(REG), the battery is held
at a constant voltage of VBAT(REG) and the charge current tapers off as the battery approaches full charge. When
the battery current reaches ITERM, the CHG pin indicates charging done by going high-impedance.
Note that termination detection is disabled whenever the charge rate is reduced because of the actions of the
thermal loop, the DPPM loop or the VIN-DPM loop.
The value of the fast-charge current is set by the resistor connected from the ISET pin to VSS, and is given by
Equation 1.
ICHG = KISET / RISET (1)
The charge current limit is adjustable up to 1.5A. The valid resistor range is 590to 3 k. Note that if ICHG is
programmed as greater than the input current limit, the battery will not charge at the rate of ICHG, but at the
slower rate of IIN(MAX) (minus the load current on the OUT pin, if any). In this case, the charger timers will be
proportionately slowed down.
9.3.5 Charge Current Translator
When the charger is enabled, internal circuits generate a current proportional to the charge current at the ISET
input. The current out of ISET is 1/400 (±10%) of the charge current. This current, when applied to the external
charge current programming resistor, RISET, generates an analog voltage that can be monitored by an external
host to calculate the current sourced from BAT.
VISET = ICHARGE / 400 × RISET (2)
StartPrecharge
/CHG= Low
Batteryshortdetected? Yes
No
No tPRECHARGE
Elapsed?
BeginCharging
EndCharge
Flash/CHG
IBAT < ITERM
Yes
Yes
TD = Low
(72, ’73 Only)
(74, 75= YES)
No
TerminationReached
BATTFET Off
WaitforV
BAT < VRCH
Yes
No
VBAT > VLOWV
StartFastcharge
ICHARGE setbyISET
No
EndCharge
Flash/CHG
No
tFASTCHARGE
Elapsed?
ChargeDone
/CHG= Hi-Z
VBAT < VRCH
No
BatteryDetected?
RunBatteryDetection
Yes
Yes
No
16
BQ24072T
,
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,
BQ24079T
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Product Folder Links: BQ24072T BQ24075T BQ24079T
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Feature Description (continued)
Figure 16. Battery Charging Flow Diagram
l TEXAS INSTRUMENTS
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Feature Description (continued)
9.3.6 Battery Detection and Recharge
The BQ2407xT automatically detects if a battery is connected or removed. Once a charge cycle is complete, the
battery voltage is monitored. When the battery voltage falls below VRCH, the battery detection routine is run.
During battery detection, current (IBAT(DET)) is pulled from the battery for a duration tDET to see if the voltage on
BAT falls below VLOWV. If not, charging begins. If it does, then it indicates that the battery is missing or the
protector is open. Next, the precharge current is applied for tDET to close the protector if possible. If VBAT < VRCH,
then the protector is closed and charging is initiated. If VBAT > VRCH, then the battery is determined to be missing
and the detection routine continues.
9.3.7 Termination Disable (TD Input, BQ24072T)
The BQ24072T contains a TD input that allows termination to be enabled/ disabled. Connect TD to a logic high
to disable charge termination. When termination is disabled, the device goes through the pre-charge, fast-charge
and CV phases, then remains in the CV phase. During the CV phase, the charger maintains the output voltage at
BAT equal to VBAT(REG), and charging current does not terminate. The charge current is set by ICHG or IINmax,
whichever is less. Battery detection is not performed. The CHG output is high impedance once the current falls
below ITERM and does not go low until the input power or CE are toggled. When termination is disabled, the pre-
charge and fast-charge safety timers are also disabled.
9.3.8 Battery Disconnect (SYSOFF Input)
The BQ24075T and BQ24079T feature a SYSOFF input that allows the user to turn the FET Q2 off and
disconnect the battery from the OUT pin. This is useful for disconnecting the system load from the battery,
factory programming where the battery is not installed or for host side impedance track fuel gauging, such as
BQ27500, where the battery open circuit voltage level must be detected before the battery charges or
discharges. The CHG output remains low when SYSOFF is high. Connect SYSOFF to VSS, to turn Q2 on for
normal operation. SYSOFF is internally pulled to VBAT through ~5 Mresistor.
9.3.9 Dynamic Charge Timers (TMR Input)
The BQ2407xT devices contain internal safety timers for the pre-charge and fast-charge phases to prevent
potential damage to the battery and the system. The timers begin at the start of the respective charge cycles.
The timer values are programmed by connecting a resistor from TMR to VSS. The resistor value is calculated
using the following equation:
tPRECHG = KTMR × RTMR
tMAXCHG = 10 × KTMR × RTMR
Leave TMR unconnected to select the internal default timers. Disable the timers by connecting TMR to VSS.
Note that timers are suspended when the device is in thermal shutdown, and the timers are slowed proportionally
to the charge current when the device enters thermal regulation.
1. During the fast charge phase, several events increase the timer durations.
2. The system load current activates the DPPM loop which reduces the available charging current
3. The input current is reduced because the input voltage has fallen to VIN-DPM
4. The device has entered thermal regulation because the IC junction temperature has exceeded TJ(REG)
During each of these events, the internal timers are slowed down proportionately to the reduction in charging
current. For example, if the charging current is reduced by half for two minutes, the timer clock is reduced to half
the frequency and the counter counts half as fast resulting in only one minute of "counting" time.
If the precharge timer expires before the battery voltage reaches VLOWV, the BQ2407xT indicates a fault
condition. Additionally, if the battery current does not fall to ITERM before the fast charge timer expires, a fault is
indicated. The CHG output flashes at approximately 2 Hz to indicate a fault condition. The fault condition is
cleared by toggling CE or the input power, entering/ exiting USB suspend mode, or an OVP event.
l TEXAS INSTRUMENTS
18
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,
BQ24075T
,
BQ24079T
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Feature Description (continued)
9.3.10 Status Indicators (PGOOD, CHG)
The BQ2407xT contains two open-drain outputs that signal its status. The PGOOD output signals when a valid
input source is connected. PGOOD is low when (VBAT + VIN(DT)) < VIN < VOVP. When the input voltage is outside
of this range, PGOOD is high impedance.
The charge cycle after power-up, CE going low, or exiting OVP is indicated with the CHG output on (low - LED
on), whereas all refresh (subsequent) charges will result in the CHG output off (open – LED off). In addition, the
CHG signals timer faults by flashing at approximately 2 Hz.
Table 2. PGOOD Status Indicator
INPUT STATE PGOOD OUTPUT
VIN < VUVLO Hi impedance
VUVLO < VIN < VIN(DT) Hi impedance
VIN(DT) < VIN < VOVF Low
VIN < VOVP Hi impedance
Table 3. CHG Status Indicator
CHARGE STATE CHG OUTPUT
Charging Low (for first charge cycle)
Charging suspended by thermal loop, or DPPM loop
Safety timers expired Flashing at 2 Hz
Charging done
Hi impedance
Recharging after termination
IC disabled or no valid input power
Battery absent
9.3.11 Thermal Regulation and Thermal Shutdown
The BQ2407xT contain a thermal regulation loop that monitors the die temperature. If the temperature exceeds
TJ(REG), the device automatically reduces the charging current to prevent the die temperature from increasing
further. In some cases, the die temperature continues to rise despite the operation of the thermal loop,
particularly under high VIN and heavy OUT system load conditions. Under these conditions, if the die temperature
increases to TJ(OFF), the input FET Q1 is turned OFF. FET Q2 is turned ON to ensure that the battery still powers
the load on OUT. Once the device die temperature cools by TJ(OFF-HYS), the input FET Q1 is turned on and the
device returns to thermal regulation. Continuous overtemperature conditions result in a "hiccup" mode. During
thermal regulation, the safety timers are slowed down proportionately to the reduction in current limit.
Note that this feature monitors the die temperature of the BQ2407xT. This is not synonymous with ambient
temperature. Self heating exists due to the power dissipated in the IC because of the linear nature of the battery
charging algorithm and the LDO associated with OUT. A modified charge cycle with the thermal loop active is
shown in Figure 17. Battery termination is disabled during thermal regulation.
l TEXAS INSTRUMENTS 777777 7 7 7 7’ l I I l \ ' l l I I I ””” 7 ’ , , z , ’ , I l 7 7777777777
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7
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IO(CHG)
V(LOWV)
I(PRECHG)
I(TERM)
TJ(REG)
19
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,
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,
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Figure 17. Charge Cycle Modified by Thermal Loop
9.3.12 Battery Pack Temperature Monitoring
The BQ2407xT features an external battery pack temperature monitoring input. The TS input connects to the
NTC thermistor in the battery pack to monitor battery temperature and prevent dangerous over-temperature
conditions. During charging, the voltage at TS is continuously monitored. If, at any time, the voltage at TS is
outside of the operating range (VCOLD to VHOT), charging is suspended. The timers maintain their values but
suspend counting. When the voltage measured at TS returns to within the operation window, charging is
resumed and the timers continue counting. When charging is suspended due to a battery pack temperature fault,
the CHG output remains low and continues to indicate charging.
(3)
(4)
l TEXAS INSTRUMENTS Adapter
TS TEMP
PACK
+
PACK-
+
+
VHOT
VCOLD
R7
R6
IN
Adapter
R8
Not necessary
in all
applications
BQ240xT
+
20
BQ24072T
,
BQ24075T
,
BQ24079T
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Where:
VCOLD = 0.25 X VIN
VHOT = 0.125 X VIN
RHOT is the expected thermistor resistance at the programmed hot threshold, RCOLD is the expected thermistor
resistance at the programmed cold threshold. If the value of R6 is less than 100 k, R8 must be added to protect
the IC from 28V inputs. If R6 is greater than 100 k, R8 does not need to be used.
Figure 18. NTC Monitoring Function
For applications that do not require the TS monitoring function, set R6 = 200 kand R7 = 49.9 kto set the TS
voltage at a valid level and maintain charging.
9.4 Device Functional Modes
9.4.1 Input Source Connected (Adapter or USB)
With a source connected, the dynamic power-path management (DPPM) circuitry of the BQ2407xT monitors the
input current continuously. The OUT output for the BQ24075T and BQ24079T is regulated to a fixed voltage
(VO(REG)). For the BQ24072T, OUT is regulated to 225 mV above the voltage at BAT. If the BAT voltage is less
than 3.2 V, OUT is clamped to 3.4 V. This allows for proper startup of the system load even with a discharged
battery. The current into IN is shared between charging the battery and powering the system load at OUT. The
BQ2407xT has internal selectable current limits of 100 mA (USB100) and 500 mA (USB500) for charging from
USB ports, as well as a resistor-programmable input current limit.
The BQ2407xT is USB IF compliant for the inrush current testing. The USB spec allows up to 10 μF to be hard
started, which establishes 50μC as the maximum inrush charge value when exceeding 100 mA. The input
current limit for the BQ2407xT prevents the input current from exceeding this limit, even with system
capacitances greater than 10 μF. Note that the input capacitance to the device must be selected small enough to
prevent a violation (<10 μF), as this current is not limited. Figure 19 demonstrates the startup of the BQ2407xT
and compares it to the USB-IF specification.
l TEXAS INSTRUMENTS U531 0 Current Limil 50v!) 100 usldlv 20 mNdiv
21
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,
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Device Functional Modes (continued)
Figure 19. USB-IF Inrush Current Test
The input current limit selection is controlled by the state of the EN1 and EN2 pins as shown in Table 1. When
using the resistor-programmable current limit, the input current limit is set by the value of the resistor connected
from the ILIM pin to VSS, and is given by the equation:
IIN-MAX = KILIM / RILIM (5)
The input current limit is adjustable up to 1.5 A. The valid resistor range is 1.07 kto 7.5 k.
When the IN source is connected, priority is given to the system load. The DPPM and Battery Supplement
modes are used to maintain the system load. Figure 21 illustrates an example of the DPPM and supplement
modes. These modes are explained in detail in the following sections.
9.4.1.1 Input DPM Mode (VIN-DPM)
The BQ2407xT uses the VIN-DPM mode for operation from current-limited USB ports. When EN1 and EN2 are
configured for USB100 (EN2=0, EN1=0) or USB500 (EN2=0, EN1=1) modes, the input voltage is monitored. If
VIN falls to VIN-DPM, the input current limit is reduced to prevent the input voltage from falling further. This prevents
the BQ2407xT from crashing poorly designed or incorrectly configured USB sources. Figure 20 shows the VIN-
DPM behavior to a current limited source. In this figure, the input source has a 400 mA current limit and the device
is in USB500 mode (EN1=1, EN2=0).
l TEXAS INSTRUMENTS 200 "IA/div , Input collapses Input regulaléd [a VIN-DPM 500 mAldiv Input current limit Is 200 mAldiv reduced to prevent crashing the supply 200 mA/div 4 msldiv
22
BQ24072T
,
BQ24075T
,
BQ24079T
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Device Functional Modes (continued)
Figure 20. VIN-DPM Mode
9.4.1.2 DPPM Mode
When the sum of the charging and system load currents exceeds the maximum input current (programmed with
EN1, EN2 and ILIM pins), the voltage at OUT decreases. Once the voltage on the OUT pin falls to VDPPM, the
BQ2407xT enters DPPM mode. In this mode, the charging current is reduced as the OUT current increases in
order to maintain the system output. Battery termination is disabled while in DPPM mode.
9.4.1.3 Battery Supplement Mode
While in DPPM mode, if the charging current falls to zero and the system load current increases beyond the
programmed input current limit, the voltage at OUT reduces further. When the OUT voltage drops below the
VBSUP1 threshold, the battery supplements the system load. The battery stops supplementing the system load
when the voltage at OUT rises above the VBSUP2 threshold.
During supplement mode, the battery supplement current is not regulated (BAT-FET is fully on), however there is
a short circuit protection circuit built in. demonstrate supplement mode. If during battery supplement mode, the
voltage at OUT drops VO(SC2) below the BAT voltage, the OUT output is turned off if the overload exists after
tDGL(SC2). The short circuit recovery timer then starts counting. After tREC(SC2), OUT turns on and attempts to
restart. If the short circuit remains, OUT is turned off and the counter restarts. Battery termination is disabled
while in supplement mode.
*5; TEXAS INSTRUMENTS WMWWW swmmme my 7,777,777,777 E
A
1200mA
900mA
400mA
0mA
IOUT
900mA
500mA
0mA
IIN
500mA
-300mA
0mA
IBAT
3.8V
3.7V
~3.6V
VOUT
DPPMLoop Active
SupplementMode
5.5V
23
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,
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,
BQ24079T
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Device Functional Modes (continued)
Figure 21. BQ24075T, '79T DPPM and Battery Supplement Modes
(VOREG = 5.5 V, VBAT = 3.6 V)
Figure 22. BQ24072T DPPM and Battery Supplement Modes
(VOREG = VBAT + 225 mV, VBAT = 3.6 V)
l TEXAS INSTRUMENTS
24
BQ24072T
,
BQ24075T
,
BQ24079T
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Device Functional Modes (continued)
9.4.2 Input Source Not Connected
When no source is connected to the IN input, OUT is powered strictly from the battery. During this mode the
current into OUT is not regulated, similar to Battery Supplement Mode, however the short circuit circuitry is
active. If the OUT voltage falls below the BAT voltage by 250 mV for longer than tDGL(SC2), OUT is turned off. The
short circuit recovery timer then starts counting. After tREC(SC2), OUT turns on and attempts to restart. If the short
circuit remains, OUT is turned off and the counter restarts. This ON/OFF cycle continues until the overload
condition is removed.
‘5‘ TEXAS INSTRUMENTS E. ii
IN
VSS
BAT
DC+
GND
Adaptor
HOST
BQ24075T
BQ24079T
CE
OUT
CHG
PGOOD
SYSOFF
EN1
EN2
TS
TMR
ILIM
ISET
TEMP
PACK +
PACK-
C1
1µF C2
4.7µF
C3
4.7 µF
R3
1.13 kW
R2
1.18 kW
R4
1.5 kW
R5
R1
46.8 kW
SYSTEM
R6
19.1 kW
R7
8.25 kW.
R8
100 kW
1.5 kW
25
BQ24072T
,
BQ24075T
,
BQ24079T
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10 Applications and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
10.1 Application Information
The BQ2407xT series of devices are integrated Li-ion linear chargers and system power path management
devices targeted at space-limited portable applications.
10.2 Typical Applications
10.2.1 Using the BQ24075T, BQ24079T to Disconnect the Battery from the System
The BQ24075T and BQ24079T are designed for applications that require the input supply to be passed through
to the output (OUT). For these devices, the OUT regulation threshold is set to 5.5 V. for applications with a
typical regulation on the adapter of 5 V, the main LDO in the BQ24075T and BQ24079T operates in dropout
mode so that OUT is as high as possible to supply downstream devices. The input OVP and regulation threshold
on OUT protect downstream devices from faulty or incorrect adapters. The BQ24075T and BQ24079T also
contain a SYSOFF input that disconnects the OUT output from the battery to prevent standby loads from draining
the battery during long storage intervals. See the "System ON/OFF" section for more details.
NOTE: VIN = UVLO to VOVP, IFASTCHG = 800mA, IIN(MAX) = 1.35A, Battery Temperature Charge Range = 0°C to 50°C, 6.25
hour Fastcharge Safety Timer
Figure 23. Using the BQ24075T, BQ24079T to Disconnect the Battery from the System
10.2.1.1 Design Requirements
Supply voltage = 5 V
Fast charge current of approximately 800 mA; ISET – pin 16
Input Current Limit = 1.35 A; ILIM – pin 12
Safety timer duration, Fast-Charge = 6.25 hours; TMR – pin 14
Battery Temperature Sense = 10 k; NTC (103AT-2), 0°C to 50°C Operation
l TEXAS INSTRUMENTS
5
11
1.25
6 19.14
1 1 1 1
7 8250 28160
IN
COLD
V
V
R k
R RCOLD
--
= = = W
+ +
1 1 1 1
5 28160 4086
1.25 0.625
7 8.236
5 5
4086 1 28160 1
1 1 0.625 1.25
IN
COLD HOT
IN IN
HOT COLD
V RCOLD RHOT
V V
R k
V V
RHOT RCOLD
V V
é ù é ù
´ ´ ´ - ´ ´ ´ -
ê ú ê ú
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= = = W
é ù é ù é ù é ù
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´ - - ´ -
ê ú ê ú ê ú ê ú
ë û ë û
ë û ë û
26
BQ24072T
,
BQ24075T
,
BQ24079T
SLUS937C DECEMBER 2009REVISED DECEMBER 2019
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Product Folder Links: BQ24072T BQ24075T BQ24079T
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Typical Applications (continued)
10.2.1.2 Detailed Design Procedure
10.2.1.2.1 Program the Fast Charge Current (ISET):
• RISET = KISET / ICHG
• KISET = 890 A; from the Electrical Characteristics table
• RISET = 890 A/ 0.8 A = 1.1125 k
Select the closest standard value, which for this case is 1.13 k. Connect this resistor between ISET (pin 16)
and VSS.
10.2.1.2.2 Program the Input Current Limit (ILIM):
• RILIM = KILIM / IIN(MAX)
• KILIM = 1600 A; from the Electrical Characteristics table
• RISET = 1600 A/ 1.35 A = 1.19 k
Select the closest standard value, which for this case is 1.18 k. Connect this resistor between ILIM (pin 12)
and VSS.
10.2.1.2.3 Program 6.25-hour Fast-Charge Safety Timer (TMR):
• RTMR = tMAXCHG / (10 × KTMR)
• KTMR = 45 s/kfrom the Electrical Characteristics table.
• RTMR = (6.25 hr × 3600 s/hr) / (10 x 45 s/k) = 46.8k;
Select the closest standard value, which for this case is 46.4 k. Connect this resistor between TMR (pin 2)
and VSS.
10.2.1.2.4 TS Function:
Using a 10 kNTC thermistor in the battery pack (103AT-2). Connect a resistor divider from VIN to VSS with the
thermistor and TS connected to the center tap (R6 and R7 in Figure 23).
• RHOT = 4.086 k; 50°C threshold from NTC data sheet
• RCOLD = 28.16 k; 0°C threshold from NTC data sheet
• VCOLD = 0.25 x VIN = 0.25 x 5 V = 1.25 V
• VHOT = 0.125 x VIN = 0.125 x 5 V = 0.625 V
(6)
(7)
Since the calculated values for R6 is less than 100 k, a 100 kresistor for R8 must be used. Choose the
closest standard values, which for this case are R7 = 8.25 kand R6 = 19.1 k.
For applications that do not require the TS monitoring function, set R6 = 200 kand R7 = 49.9 kto set the TS
voltage at a valid level and maintain charging.
10.2.1.2.5 CHG and PGOOD LED Status:
Connect a 1.5 kresistor in series with a LED between OUT and CHG to indicate charging status. Connect a
1.5 kresistor in series with a LED between OUT and PGOOD to indicate when a valid input source is
connected.
l TEXAS INSTRUMENTS _ — /‘ .._..._.
IOUT
IBAT
200mA/div
2 ms/div
VOUT
5.5V
500mV/div
200mA/div
VCHG
IBAT
2V/div
400ms/div
VBAT
1 A/div
5V/div
Battery
Removed
BatteryDetectionMode
VCHG
IBAT
2V/div
400 ms/div
VBAT
1 A/div
5V/div
ChargingInitiated
BatteryDetectionMode
BatteryInserted
VIN
500mV/div
4ms/div
5V/div
IBAT
VPGOOD 5V/div
V
3.6V
BAT
500mA/div
27
BQ24072T
,
BQ24075T
,
BQ24079T
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Typical Applications (continued)
10.2.1.2.6 Processor Monitoring Status:
Connect a pullup resistor (on the order of 100 k) between the processor power rail and CHG and PGOOD.
10.2.1.2.7 System ON/OFF (SYSOFF):
Connect SYSOFF high to disconnect the battery from the system load. Connect SYSOFF low for normal
operation.
10.2.1.2.8 Selecting IN, OUT and BAT Capacitors
In most applications, all that is needed is a high-frequency decoupling capacitor (ceramic) on the power pin,
input, output and battery pins. Using the values shown on the application diagram, is recommended. After
evaluation of these voltage signals with real system operational conditions, one can determine if capacitance
values can be adjusted toward the minimum recommended values (DC load application) or higher values for fast
high amplitude pulsed load applications. Note if designed high input voltage sources (bad adapters or wrong
adapters), the capacitor needs to be rated appropriately. Ceramic capacitors are tested to 2x their rated values
so a 16 V capacitor may be adequate for a 30 V transient (verify tested rating with capacitor manufacturer).
10.2.1.3 Application Curves
RLOAD = 10
Figure 24. Adapter Plug-In Battery Connected Figure 25. Battery Detection / Battery Inserted
Figure 26. Battery Detection / Battery Removed
ILOAD = 25 mA TO 250 mA
Figure 27. Entering and Exiting, DPPM Mode
l TEXAS INSTRUMENTS
5V/div
500mA/div
4ms/div
2V/div
VSYSOFF
IBAT
V
4V
BAT
VOUT
BatteryPowering
System SystemPowerOff
2V/div
200mV/div
500mA/div
40 s/divm
VIN
IBAT
V
4.2V
BAT
V
4.3V
OUT
5V/div
2V/div
400 s/divm
500mA/div
VSYSOFF
IBAT
V
4V
BAT
V
5.5V
OUT
2 ms/div
IOUT
IBAT
V
4.1 V
BAT
V
5.5 V
OUT
500 mA/div
500 mV/div
500 mA/div
Supplement Mode
VCE
IBAT
V
3.6V
BAT
VCHG
500mA/div
1V/div
5V/div
5V/div
10ms/div
MandatoryPrecharge
28
BQ24072T
,
BQ24075T
,
BQ24079T
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Product Folder Links: BQ24072T BQ24075T BQ24079T
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Typical Applications (continued)
ILOAD = 25 mA to 750 mA
Figure 28. BQ24075T, BQ24079T Entering and Exiting
Battery, Supplement Mode
Figure 29. Charger On/Off Using CE
VIN = 5.5 V to 8.5 V
Figure 30. OVP Fault
VIN = 6 V
Figure 31. BQ24075T, BQ24079T System On/Off With Input
Connected
VIN = 0 V
Figure 32. BQ24075T, BQ24079T System On/Off With Input Not Connected
‘5‘ TEXAS INSTRUMENTS xx LI: xx L<(|; szj="">
IN
VSS
BAT
DC+
GND
Adaptor
HOST
BQ24072T
CE
OUT
TD
EN1
EN2
TS
TEMP PACK+
PACK-
SYSTEM
ISET
PGOOD
CHG
TMR
ILM
R3
1.13 kW
R8
100 kW
R1
46.4 kW
R2
1.18 kW
R5
1.5 kW
C2
4.7 Fm
C1
1 Fm
C3
4.7 Fm
R4
1.5 kW
R6
10 kW
R7
13.2 kW
29
BQ24072T
,
BQ24075T
,
BQ24079T
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Typical Applications (continued)
10.2.2 BQ24072T in a Host Controlled Charger Application
The BQ24072T is designed for applications that require a lower regulation on the system rail. For BQ24072T, the
OUT regulation threshold is set to VBAT + 225 mV. The lower regulation point protects downstream devices from
the higher voltage on the supply. Additionally, the lower difference between the BAT and OUT outputs decreases
the voltage drop during supplement events. The BQ24072T also contains a TD input that enables/disables the
termination function. See the Termination Disable: section for more details.
Figure 33. Using BQ24072T in a Host Controlled Charger Application
10.2.2.1 Design Requirements
Refer to the Design Requirements for the Design Requirements.
10.2.2.2 Detailed Design Procedures
Refer to the Detailed Design Procedure for the Detailed Design Procedures.
10.2.2.2.1 Termination Disable:
Connect TD high to disable termination. Connect TD low to enable termination.
l TEXAS INSTRUMENTS
IOUT
IBAT
200mA/div
2 ms/div
VOUT
5.5V
500mV/div
200mA/div
IOUT
IBAT
V
3.6V
BAT
500mA/div
200mV/div
1ms/div
V
3.825V
OUT
1 A/div
SupplementMode
TrackingtoV +225mV
BAT
30
BQ24072T
,
BQ24075T
,
BQ24079T
SLUS937C DECEMBER 2009REVISED DECEMBER 2019
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Product Folder Links: BQ24072T BQ24075T BQ24079T
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Typical Applications (continued)
10.2.2.3 Application Curves
ILOAD = 25 mA to 250 mA
Figure 34. Entering and Exiting, DPPM Mode
RLOAD = 20 Ωto 40 Ω
Figure 35. BQ2472T Entering and Exiting Battery,
Supplement Mode
l TEXAS INSTRUMENTS
/ PGOOD = Low
VUVLO <VIN <VOVP
and
VIN >V BAT +VIN (DT)
No
Yes
EN1=EN2=1
Yes
No
ILIMorISET short?
Yes
/ PGOOD= Hi -Z
/CHG = Hi-Z
BATTFET ON
BeginStartup
IIN (MAX ) 100mA
VOUT short?
Yes
No
No
InputCurrent
LimitsetbyEN1
andEN2
/CE = Low
No
BeginCharging
Yes
31
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,
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,
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11 Power Supply Recommendations
11.1 Power On
When VIN exceeds the UVLO threshold, the BQ2407xT powers up. While VIN is below VBAT + VIN(DT), the host
commands at the control inputs (CE, EN1 and EN2) are ignored. The Q1 FET connected between IN and OUT
pins is off, and the status outputs CHG and PGOOD are high impedance. The Q2 FET that connects BAT to
OUT is ON. (If SYSOFF is high, Q2 is off). During this mode, the VOUT(SC2) circuitry is active and monitors for
overload conditions on OUT.
Once VIN rises above VBAT + VIN(DT), PGOOD is driven low to indicate the valid power status and the CE, EN1,
and EN2 inputs are read. The device enters standby mode if (EN1 = EN2 = HI) or if an input overvoltage
condition occurs. In standby mode, Q1 is OFF and Q2 is ON so OUT is connected to the battery input. (If
SYSOFF is high, FET Q2 is off). During this mode, the VOUT(SC2) circuitry is active and monitors for overload
conditions on OUT.
When the input voltage at IN is within the valid range: VIN > UVLO AND VIN > VBAT + VIN(DT) AND VIN < VOVP, and
the EN1 and EN2 pins indicate that the USB suspend mode is not enabled [(EN1, EN2) (HI, HI)] all internal
timers and other circuit blocks are activated. The device then checks for short-circuits at the ISET and ILIM pins.
If no short conditions exists, the device switches on the input FET Q1 with a 100mA current limit to checks for a
short circuit at OUT. When VOUT is above VSC, the FET Q1 switches to the current limit threshold set by EN1,
EN2 and RILIM and the device enters into the normal operation. During normal operation, the system is powered
by the input source (Q1 is regulating), and the device continuously monitors the status of CE, EN1 and EN2 as
well as the input voltage conditions.
Figure 36. Startup Flow Diagram
l TEXAS INSTRUMENTS
32
BQ24072T
,
BQ24075T
,
BQ24079T
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Power On (continued)
11.1.1 Half-Wave Adapters
Some adapters implement a half rectifier topology, which causes the adapter output voltage to fall below the
battery voltage during part of the cycle. To enable operation with adapters under those conditions, the BQ2407xT
family keeps the charger on for at least 20 msec (typical) after the input power puts the part in sleep mode. This
feature enables use of external adapters using 50 Hz networks. The input must not drop below the UVLO voltage
for the charger to work properly. Thus, the battery voltage should be above the UVLO to help prevent the input
from dropping out. Additional input capacitance may be needed.
When the input is between VUVLO and VIN(DT), the device enters sleep mode. After entering sleep mode for 20 ms
the internal FET connection between the IN and OUT pin is disabled and pulling the input to ground will not
discharge the battery, other than the leakage on the BAT pin. If one has a full 1000mAHr battery and the leakage
is 10 μA, then it would take 1000 mAHr/10μA = 100000 hours (11.4 years) to discharge the battery. The battery
‘s self discharge is typically 5 times higher than this.
l TEXAS INSTRUMENTS
33
BQ24072T
,
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,
BQ24079T
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12 Layout
12.1 Layout Guidelines
1. To obtain optimal performance, the decoupling capacitor from IN to GND (thermal pad) and the output filter
capacitors from OUT to GND (thermal pad) should be placed as close as possible to the BQ2407xT, with
short trace runs to both IN, OUT and GND (thermal pad).
2. All low-current GND connections should be kept separate from the high-current charge or discharge paths
from the battery. Use a single-point ground technique incorporating both the small signal ground path and the
power ground path.
3. The high current charge paths into IN pin and from the OUT pin must be sized appropriately for the
maximum charge current in order to avoid voltage drops in these traces.
The BQ2407xT family is packaged in a thermally enhanced MLP package. The package includes a thermal pad
to provide an effective thermal contact between the IC and the printed circuit board (PCB); this thermal pad is
also the main ground connection for the device. Connect the thermal pad to the PCB ground connection. Full
PCB design guidelines for this package are provided in QFN and SON PCB Attachment Application Report.
12.2 Layout Example
Figure 37. BQ2407xT Layout
l TEXAS INSTRUMENTS
34
BQ24072T
,
BQ24075T
,
BQ24079T
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12.3 Thermal Package
The BQ2407xT family is packaged in a thermally enhanced MLP package. The package includes a thermal pad
to provide an effective thermal contact between the IC and the printed circuit board (PCB). The power pad
should be directly connected to VSS. Full PCB design guidelines for this package are provided in the application
note entitled: QFN/SON PCB Attachment Application Note. The most common measure of package thermal
performance is thermal impedance (θJA) measured (or modeled) from the chip junction to the air surrounding the
package surface (ambient).
The mathematical expression for θJA is: = (TJ– T) / P
Where:
• TJ= chip junction temperature
T = ambient temperature
P = device power dissipation
Factors that can influence the measurement and calculation of θJA include
Whether or not the device is board mounted
Trace size, composition, thickness, and geometry
Orientation of the device (horizontal or vertical)
Volume of the ambient air surrounding the device under test and airflow
Whether other surfaces are in close proximity to the device being tested
Due to the charge profile of Li-Ion batteries the maximum power dissipation is typically seen at the beginning of
the charge cycle when the battery voltage is at its lowest. Typically after fast charge begins the pack voltage
increases to 3.4 V within the first 2 minutes. The thermal time constant of the assembly typically takes a few
minutes to heat up so when doing maximum power dissipation calculations, 3.4 V is a good minimum voltage to
use. This is verified, with the system and a fully discharged battery, by plotting temperature on the bottom of the
PCB under the IC (pad should have multiple vias), the charge current and the battery voltage as a function of
time. The fast charge current will start to taper off if the part goes into thermal regulation.
The device power dissipation, P, is a function of the charge rate and the voltage drop across the internal
PowerFET. It can be calculated from Equation 8 when a battery pack is being charged:
P = [VIN – VOUT] × [ IOUT + IBAT ] + [VOUT – VBAT] × IBAT (8)
The thermal loop feature reduces the charge current to limit excessive IC junction temperature. It is
recommended that the design not run in thermal regulation for typical operating conditions (nominal input voltage
and nominal ambient temperatures) and use the feature for non typical situations such as hot environments or
higher than normal input source voltage. With that said, the IC still performs as described, if the thermal loop is
always active.
l TEXAS INSTRUMENTS
35
BQ24072T
,
BQ24075T
,
BQ24079T
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Product Folder Links: BQ24072T BQ24075T BQ24079T
Submit Documentation FeedbackCopyright © 2009–2019, Texas Instruments Incorporated
13 Device and Documentation Support
13.1 Device Support
13.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
13.2 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to order now.
Table 4. Related Links
PARTS PRODUCT FOLDER ORDER NOW TECHNICAL
DOCUMENTS TOOLS &
SOFTWARE SUPPORT &
COMMUNITY
BQ24072T Click here Click here Click here Click here Click here
BQ24075T Click here Click here Click here Click here Click here
BQ24079T Click here Click here Click here Click here Click here
13.3 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
13.4 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
13.5 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
13.6 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
13.7 Glossary
SLYZ022 TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
14 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
I TEXAS INSTRUMENTS Samples Samples Sample: Sample: Samples Samples
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
BQ24072TRGTR ACTIVE VQFN RGT 16 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 PAP
BQ24072TRGTT ACTIVE VQFN RGT 16 250 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 PAP
BQ24075TRGTR ACTIVE VQFN RGT 16 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 OEC
BQ24075TRGTT ACTIVE VQFN RGT 16 250 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 OEC
BQ24079TRGTR ACTIVE VQFN RGT 16 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 OED
BQ24079TRGTT ACTIVE VQFN RGT 16 250 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 OED
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
I TEXAS INSTRUMENTS
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 2
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
I TEXAS INSTRUMENTS 5:. V.’
PACKAGE MATERIALS INFORMATION
www.ti.com 3-Jun-2022
TAPE AND REEL INFORMATION
Reel Width (W1)
REEL DIMENSIONS
A0
B0
K0
W
Dimension designed to accommodate the component length
Dimension designed to accommodate the component thickness
Overall width of the carrier tape
Pitch between successive cavity centers
Dimension designed to accommodate the component width
TAPE DIMENSIONS
K0 P1
B0 W
A0
Cavity
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Pocket Quadrants
Sprocket Holes
Q1 Q1Q2 Q2
Q3 Q3Q4 Q4 User Direction of Feed
P1
Reel
Diameter
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
BQ24072TRGTR VQFN RGT 16 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2
BQ24072TRGTT VQFN RGT 16 250 180.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2
BQ24075TRGTR VQFN RGT 16 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2
BQ24075TRGTT VQFN RGT 16 250 180.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2
BQ24079TRGTR VQFN RGT 16 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2
BQ24079TRGTT VQFN RGT 16 250 180.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 3-Jun-2022
TAPE AND REEL BOX DIMENSIONS
Width (mm)
W
L
H
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
BQ24072TRGTR VQFN RGT 16 3000 367.0 367.0 35.0
BQ24072TRGTT VQFN RGT 16 250 210.0 185.0 35.0
BQ24075TRGTR VQFN RGT 16 3000 367.0 367.0 35.0
BQ24075TRGTT VQFN RGT 16 250 210.0 185.0 35.0
BQ24079TRGTR VQFN RGT 16 3000 367.0 367.0 35.0
BQ24079TRGTT VQFN RGT 16 250 210.0 185.0 35.0
Pack Materials-Page 2
GENERIC PACKAGE VIEW RGT 16 VQFN - 1 mm max heigm PLASTIC QUAD FLATPACKV N0 LEAD Images above are jusl a represenlalion of the package family, aclual package may vary Refel lo the product dala sheel for package details. 4203495” I TEXAS INSTRI IMFNTS
www.ti.com
PACKAGE OUTLINE
C
16X 0.30
0.18
1.68 0.07
16X 0.5
0.3
1.0
0.8
(0.2) TYP
0.05
0.00
12X 0.5
4X
1.5
A3.1
2.9 B
3.1
2.9
VQFN - 1 mm max heightRGT0016C
PLASTIC QUAD FLATPACK - NO LEAD
4222419/C 04/2021
PIN 1 INDEX AREA
0.08
SEATING PLANE
1
4
9
12
58
16 13
(OPTIONAL)
PIN 1 ID 0.1 C A B
0.05
EXPOSED
THERMAL PAD
SYMM
SYMM
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
SCALE 3.600
www.ti.com
EXAMPLE BOARD LAYOUT
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
16X (0.24)
16X (0.6)
( 0.2) TYP
VIA
12X (0.5)
(2.8)
(2.8)
(0.58)
TYP
( 1.68)
(R0.05)
ALL PAD CORNERS (0.58) TYP
VQFN - 1 mm max heightRGT0016C
PLASTIC QUAD FLATPACK - NO LEAD
4222419/C 04/2021
SYMM
1
4
58
9
12
13
16
SYMM
LAND PATTERN EXAMPLE
SCALE:20X
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
METAL
SOLDER MASK
OPENING
SOLDER MASK DETAILS
NON SOLDER MASK
DEFINED
(PREFERRED)
www.ti.com
EXAMPLE STENCIL DESIGN
16X (0.6)
16X (0.24)
12X (0.5)
(2.8)
(2.8)
( 1.55)
(R0.05) TYP
VQFN - 1 mm max heightRGT0016C
PLASTIC QUAD FLATPACK - NO LEAD
4222419/C 04/2021
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
SYMM
ALL AROUND
METAL
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD 17:
85% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
SCALE:25X
SYMM
1
4
58
9
12
13
16
17
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