Datenblatt für WLP-6-03 Power Dissipation

- WLP-6-03 Power Dissipation {JESDSI-n 1‘ Measurement Condition Reference data ZVPower Dissigation v5. Ambient temgerature PowerDissvpahon Pd 1mm 9m) SUD 700 sun 500 400 we 200 100 PdrTa 25 AS 65 85 10 5 12 5 AmbientTemperatu re(“C|
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WLP-6-03 Power Dissipation (JESD51-7)
Power dissipation data for the WLP-6-03 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.
1. Measurement Condition (Reference data)
Condition：Mount on a board
Ambient：Natural convection
Soldering：Lead (Pb) free
Board：The board using 4 copper layer.
(76.2mm×114.3mm Area: about 8700mm2）
1st layer：No copper foil (Signal layer)
2nd layer：70mm×70mm_Connected to heat-sink.
3th layer：70mm×70mm_Connected to heat-sink.
4th layer：No copper foil (Signal layer)
Material：Glass Epoxy（FR-4）
Thickness：1.6mm
Through-hole：φ0.2mm x 60pcs
2.Power Dissipation vs. Ambient temperature
Board Mount(Tjmax = 125℃)
AmbientTemperature(℃) PowerDissipation Pd (mW) θja(℃/W)
25 840
119.03
85 336
Evaluation Board (Unit: mm)
76.2
114.3
8.74