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Document Number: 73444
S09-1398-Rev. C, 20-Jul-09
Vishay Siliconix
SUD50P10-43L
Notes:
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter Symbol Test Conditions Min. Typ. Max. Unit
Static
Drain-Source Breakdown Voltage VDS VGS = 0 V, ID = - 250 µA - 100 V
VDS Temperature Coefficient ΔVDS/TJ ID = - 250 µA - 109 mV/°C
VGS(th) Temperature Coefficient ΔVGS(th)/TJ 5.9
Gate-Source Threshold Voltage VGS(th) VDS = VGS, ID = - 250 µA - 1 - 3 V
Gate-Source Leakage IGSS VDS = 0 V, VGS = ± 20 V ± 100 nA
Zero Gate Voltage Drain Current IDSS
VDS = - 100 V, VGS = 0 V - 1 µA
VDS = - 100 V, VGS = 0 V, TJ = 55 °C - 10
On-State Drain CurrentaID(on) V
DS ≥ 5 V, VGS = - 10 V - 40 A
Drain-Source On-State ResistanceaRDS(on)
VGS = - 10 V, ID = - 9.2 A 0.036 0.043 Ω
VGS = - 4.5 V, ID = - 7.7 A 0.040 0.048
Forward Transconductanceagfs VDS = - 15 V, ID = - 9.2 A 38 S
Dynamicb
Input Capacitance Ciss
VDS = - 50 V, VGS = 0 V, f = 1 MHz
4600
pFOutput Capacitance Coss 230
Reverse Transfer Capacitance Crss 175
Total Gate Charge Qg
VDS = - 50 V, VGS = - 10 V, ID = - 9.2 A 106 160
nC
VDS = - 50 V, VGS = - 4.5 V, ID = - 9.2 A
54 81
Gate-Source Charge Qgs 14
Gate-Drain Charge Qgd 26
Gate Resistance Rgf = 1 MHz 4 Ω
Tur n - On D e lay T i me td(on)
VDD = - 50 V, RL = 6.5 Ω
ID ≅ - 7.7 A, VGEN = - 10 V, Rg = 1 Ω
15 25
ns
Rise Time tr20 30
Turn-Off Delay Time td(off) 110 165
Fall Time tf100 150
Tur n - On D e lay Ti m e td(on)
VDD = - 50 V, RL = 6.5 Ω
ID ≅ - 7.7 A, VGEN = - 4.5 V, Rg = 1 Ω
42 65
ns
Rise Time tr160 240
Turn-Off Delay Time td(off) 100 150
Fall Time tf100 150
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current ISTC = 25 °C - 50 A
Pulse Diode Forward CurrentaISM - 40
Body Diode Voltage VSD IS = - 7.7 A - 0.8 - 1.2 V
Body Diode Reverse Recovery Time trr
IF = - 7.7 A, dI/dt = 100 A/µs, TJ = 25 °C
60 90 ns
Body Diode Reverse Recovery Charge Qrr 150 225 nC
Reverse Recovery Fall Time ta46 ns
Reverse Recovery Rise Time tb14