TLE9471ESV33XUMA1 Footprints und Modelle

TLE9471ESV33XUMA1

Infineon Technologies

IC SYST BASIS CHIP TSDSO24-1

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This CAD Model Agreement (the “Agreement”) applies to any CAD Model (each a “Model” and collectively “Models”) you request from Digi-Key Corporation (“DigiKey”) and is a legally binding agreement between you and DigiKey. BY CLICKING “DOWNLOAD” BUTTON, YOU AGREE ON BEHALF OF YOURSELF, YOUR EMPLOYER, AND ANY OTHER PERSON OR ENTITY THAT YOU REPRESENT OR FOR WHICH YOU ARE THE AGENT (COLLECTIVELY REFERRED AS “YOU” OR “YOUR”) THAT YOU ARE BOUND BY THIS AGREEMENT. This Agreement is in addition to and supplements DigiKey’s Website Terms of Use and Conditions of Order. By agreeing to this Agreement you reaffirm your agreement to DigiKey’s Website Terms of Use and Conditions of Order. To the extent there is a conflict between this Agreement and DigiKey’s Website Terms of Use and Conditions of Order, this Agreement will control with respect to the Models you request. For the avoidance of doubt and without limiting the preceding, DigiKey’s Conditions of Order shall apply to any purchase of products by you from DigiKey.

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TLE9471ESV33XUMA1

Infineon Technologies

IC SYST BASIS CHIP TSDSO24-1

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TLE9471ESV33XUMA1 Footprints und Modelle

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