Product Highlights

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Image of Amphenol Industrial Operations/ATZ TS1 Series Single-Pole Connectors TS1 Series Single-Pole Connectors Datum der Veröffentlichung: 2026-04-24

Amphenol Industrial Operations/ATZ TS1 series single-pole connectors are designed to handle the high-voltage and high-current demands of modern electrified platform.

Image of HellermannTyton BundleTag Adhesive-Backed Label
Neues Produkt New Product
BundleTag Adhesive-Backed Label Datum der Veröffentlichung: 2026-04-24

The HellermannTyton BundleTag is a one-piece, adhesive-backed label that displays critical tracking data and bar codes.

Image of Laird - Performance Materials Broadband EMI Split/Snap-On Ferrite Cable Cores Broadband EMI Split/Snap-On Ferrite Cable Cores Datum der Veröffentlichung: 2026-04-24

Laird - Performance Materials 28A series broadband EMI split and snap‑on ferrite cable cores offer effective common‑mode noise suppression for cables and wire assemblies.

Image of GlobTek NEMA 5-15P to C13 Power Cord Family NEMA 5-15P to C13 Power Cord Family Datum der Veröffentlichung: 2026-04-24

The GlobTek NEMA 5-15P to C13 power cord family covers multiple SKUs with triple regional approval for North America (cULus), Japan (PSE), and Taiwan (BSMI).

Image of LabVIEW Engineering Software Updated Entwicklungssoftware LabVIEW Aktualisiert: 2026-04-24

LabVIEW von NI ist eine grafische Programmierumgebung, die einzigartige Produktivitätssteigerungen bei der Entwicklung von Prüfsystemen ermöglicht.

NI
Image of HellermannTyton Aerial Support Tie Spacers Aerial Support Tie Spacers Datum der Veröffentlichung: 2026-04-24

HellermannTyton aerial support tie spacers increase separation between aerial cables, such as where fiber optic cables enter aerial splice enclosures.

4 Series NDIR Hydrocarbon Gas Sensor - Honeywell Sensing and Productivity Solutions 4 Series NDIR Hydrocarbon Gas Sensor Datum der Veröffentlichung: 2026-04-24

Honeywell Sensing and Productivity Solutions sensors are designed for industrial safety, gas detection, emissions analysis/monitoring, and other relevant gas sensing applications.

Image of Amphenol Communications Solutions PCIe® Gen 6 Mini Cool Edge 0.60 mm Card Edge Connectors PCIe® Gen 6 Mini Cool Edge 0.60 mm Card Edge Connectors Datum der Veröffentlichung: 2026-04-24

The Amphenol Communications Solutions PCIe® Gen 6 connector meets EDSFF E1/E3, SFF-A-1002, OCP NIC 3.0, GEN Z, and PCIe® enclosure compatible form factor (PECFF) specifications.

Image of Thermal Grizzly Conductonaut 1g Liquid Metal Thermal Compound Conductonaut 1g Liquid Metal Thermal Compound Datum der Veröffentlichung: 2026-04-24

Conductonaut 1g is a liquid metal thermal compound from Thermal Grizzly that is designed for high-efficiency applications.

Image of MCC 100 V Dual N and P-Channel MOSFET in DFN3333-D Package
Neues Produkt New Product
100 V Dual N- and P-Channel MOSFET in DFN3333-D Package Datum der Veröffentlichung: 2026-04-24

The Micro Commercial Co 100 V dual N- and P-Channel MOSFET in DFN3333-D package are designed for compact power applications.

Image of MCC SICWT40120G6M 1200 V Silicon Carbide Schottky Diode
Neues Produkt New Product
SICWT40120G6M 1200 V Silicon Carbide Schottky Diode Datum der Veröffentlichung: 2026-04-23

The MCC SICWT40120G6M SiC Schottky diode is optimized for demanding power systems requiring reliable operation under extreme conditions.

Image of Amphenol Sine Systems' ecomate® Plastic Series Circular Connectors Updated Kunststoff-Rundsteckverbinder der Serie ecomate® Aktualisiert: 2026-04-23

Die Kunststoff-Rundsteckverbinder der Serie ecomate® von Amphenol Sine Systems zeichnen sich durch reduzierte Abmessungen und ein robustes Design aus und sind damit ideal für industrielle Anwendungen.

Rugged Inline USB Type-C Panel-Mount Socket System with Screw-Lock Retention - GlobTek Rugged Inline USB Type-C Panel-Mount Socket System with Screw-Lock Retention Datum der Veröffentlichung: 2026-04-23

GlobTek inline USB-C socket system with dual-screw retention ensures reliable panel-mounted connectivity for industrial and mobile applications.

Image of 3M™ Extreme Sealing Tape+
Neues Produkt New Product
Updated Hochleistungs-Dichtband + Aktualisiert: 2026-04-23

Das Hochleistungs-Dichtband + von 3M™ ist robust genug, um Sonne, Regen, Schnee sowie extremen Temperaturen standzuhalten und selbst einer Hochdruckreinigung zu trotzen.

3M
Image of Vishay Intertechnology IHLL/IHLP Series Power Inductors IHLL Series Commercial and IHLP Series Automotive Power Inductors Datum der Veröffentlichung: 2026-04-23

Vishay Intertechnology IHLL commercial and IHLP automotive power inductors come in 2.0 mm x 1.6 mm x 1.2 mm 0806 and 3.2 mm x 2.5 mm x 1.2 mm 1210 case sizes.

Image of Thermal Grizzly Duronaut 2g Thermal Paste Duronaut 2g Thermal Paste Datum der Veröffentlichung: 2026-04-22

Thermal Grizzly Duronaut 2 g thermal paste is safe to use on all electronic components, preventing any risk of short circuits during application.

Image of Same Sky's Microphone Development Kit Updated Mikrofon-Entwicklungskit Aktualisiert: 2026-04-22

Die Mikrofon-Entwicklungskits von CUI Devices bestehen jeweils aus vier trennbaren Evaluierungsschaltungen.

HCTSM1x Series Automotive Isolation Power Transformers - Bourns Automotive High Clearance/Creepage Distance Isolation Power Transformer - HCTSM1x Series Datum der Veröffentlichung: 2026-04-22

Bourns Magnetics Product Line Models HCTSM100308BAL, HCTSM110102HAL, and HCTSM110304HAL are high clearance/creepage distance isolation power transformers.

Image of Murata XRCGB Crystal Units XRCGB Crystal Units Datum der Veröffentlichung: 2026-04-22

Murata XRCGB series supports wireless communications (Wi-Fi, BLE, NFC, Zigbee), wired interfaces (Ethernet, USB), and a wide array of electronic products.

Image of Texas Instruments TMS320C64 C64x Fixed Point DSP TMS320C64 C64x Fixed Point DSP Datum der Veröffentlichung: 2026-04-22

Texas Instruments C64x+™ devices are upward code-compatible from previous devices that are part of the C6000™ DSP platform.