MaxiGrip Board Rework

maxiGRIP™ and Board Rework Costs

Advanced Thermal Solutions Inc

This tutorial discusses use of the latest technology to attach heat sinks to BGA devices that minimizes potential damage to either the component or the PCB itself during the rework process.

Related Parts

AbbildungHersteller-TeilenummerBeschreibungBefestigungsmethodeFormVerfügbare MengePreisDetails anzeigen
HEAT SINK 27MM X 27MM X 12.5MMATS-52270G-C1-R0HEAT SINK 27MM X 27MM X 12.5MMThermoband, Klebstoff (enthalten)Quadratisch, abgewinkelte Rippen90 - Sofort$10.30Details anzeigen
HEAT SINK 25MM X 25MM X 14.5MMATS-51250K-C1-R0HEAT SINK 25MM X 25MM X 14.5MMClip, Thermo-MaterialQuadratisch, abgewinkelte Rippen0 - Sofort$11.09Details anzeigen
HEAT SINK 33MM X 33MM X 7.5MMATS-52330B-C1-R0HEAT SINK 33MM X 33MM X 7.5MMThermoband, Klebstoff (enthalten)Quadratisch, abgewinkelte Rippen77 - Sofort$9.15Details anzeigen
HEAT SINK 27MM X 27MM X 14.5MMATS-53270K-C1-R0HEAT SINK 27MM X 27MM X 14.5MMClip, Thermo-MaterialQuadratisch, Rippen607 - Sofort$13.10Details anzeigen
HEAT SINK 25MM X 25MM X 12.5MMATS-50250G-C1-R0HEAT SINK 25MM X 25MM X 12.5MMClip, Thermo-MaterialQuadratisch, abgewinkelte Rippen935 - Sofort$13.64Details anzeigen
HEAT SINK 23MM X 23MM X 12.5MMATS-50230G-C1-R0HEAT SINK 23MM X 23MM X 12.5MMClip, Thermo-MaterialQuadratisch, abgewinkelte Rippen60 - Sofort$13.48Details anzeigen
HEAT SINK 19MM X 19MM X 12.5MMATS-50190G-C1-R0HEAT SINK 19MM X 19MM X 12.5MMClip, Thermo-MaterialQuadratisch, abgewinkelte Rippen32 - Sofort$13.25Details anzeigen
HEAT SINK 21MM X 21MM X 12.5MMATS-50210G-C1-R0HEAT SINK 21MM X 21MM X 12.5MMClip, Thermo-MaterialQuadratisch, abgewinkelte Rippen100 - Sofort$13.35Details anzeigen
HEAT SINK 19MM X 19MM X 9MMATS-56001-C1-R0HEAT SINK 19MM X 19MM X 9MMThermoband, Klebstoff (enthalten)Quadratisch, abgewinkelte Rippen1367 - Sofort$6.95Details anzeigen
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Related Videos

ATS Explains - Thermal Interface Material
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Datum der Veröffentlichung: 2018-01-26

Advanced Thermal Solutions - maxiGRIP
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Datum der Veröffentlichung: 2012-10-15

Related Product Highlight

Kühlkörper-Befestigungslösungen Mit den Kühlkörperbefestigungen von Advanced Thermal Solutions können Ingenieure nahezu jeden Kühlkörper auf Leiterplatten mechanisch befestigen.
maxiFLOW™ with maxiGRIP™ Heatsinks ATS BGA cooling solutions with maxiGRIP attachment come preassembled with phase change thermal interface materials for easy installation/removal.

Related Articles and Blogs

Feasibility Study of an LED-Based Lighting System Using Analytical Modeling A study of the heat loads for an outdoor LED-based lighting system using analytical modeling to determine the feasibility of the design with solar heat load.
Device Thermal Coupling on a PCB A look at how components on a printed circuit board thermally couple and the design considerations that help minimize heat dissipation problems.
Air Flow Measurement in Electronic Systems An analysis of circuit board air flow measurement techniques and the considerations required to obtain an accurate reading in this complex environment.

Related Product Training Modules

Introduction to Heat Sinks This module will review the use of heat sinks, including how a heat sink works, the factors that impact heat sink thermal performance, common heat sink materials, and thermal interface materials.
maxiGRIP™ Flip-Chip Overview of the maxiGRIP Flip-Chip and review of importance of selecting the correct TIM.
Phase Change - Pressure Increase maxiGRIP™ ATS maxiGRIP and superGRIP are ideal solutions when used with phase change TIM for increased thermal and mechanical performance.