Advanced Thermal Solutions Inc Introduction to Heat Sinks

Introduction to Heat Sinks

Advanced Thermal Solutions Inc

This module will review the use of heat sinks, including how a heat sink works, the factors that impact heat sink thermal performance, common heat sink materials, and thermal interface materials.

Related Parts

AbbildungHersteller-TeilenummerBeschreibungVerfügbare MengePreisDetails anzeigen
HEAT SINK 31MM X 31MM X 19.5MMATS-51310R-C1-R0HEAT SINK 31MM X 31MM X 19.5MM0 - Sofort$14.46Details anzeigen
HEAT SINK 42.5 X 42.5 X 19.5MMATS-51425R-C1-R0HEAT SINK 42.5 X 42.5 X 19.5MM218 - Sofort$15.09Details anzeigen
HEAT SINK 19MM X 19MM X 7.5MMATS-52190B-C1-R0HEAT SINK 19MM X 19MM X 7.5MM459 - Sofort$7.57Details anzeigen
HEATSINK TO-220 W/TAB BLACKATS-PCB1049HEATSINK TO-220 W/TAB BLACK9375 - Sofort$1.78Details anzeigen
SUPERGRIP HEATSINK 19X19X7.5MMATS-X53190B-C1-R0SUPERGRIP HEATSINK 19X19X7.5MM0 - Sofort$15.59Details anzeigen
SUPERGRIP HEATSINK 23X23X12.5MMATS-X53230G-C1-R0SUPERGRIP HEATSINK 23X23X12.5MM0 - Sofort$17.14Details anzeigen
HEATSINKATS-1605-C1-R0HEATSINK461 - Sofort$20.10Details anzeigen
HEAT SINK 25MM X 25MM X 7.5MMATS-50250B-C0-R0HEAT SINK 25MM X 25MM X 7.5MM97 - Sofort$7.01Details anzeigen
HEAT SINK PASSIVE BGA SPREAD CLPATS-50250B-C3-R0HEAT SINK PASSIVE BGA SPREAD CLP66 - Sofort$8.69Details anzeigen
HEAT SINK 29X29 X 7.5MM W/O TIMATS-50290B-C0-R0HEAT SINK 29X29 X 7.5MM W/O TIM597 - Sofort$7.14Details anzeigen
HEAT SINK 29X29X12.5MM W/O TIMATS-50290G-C0-R0HEAT SINK 29X29X12.5MM W/O TIM0 - Sofort$7.54Details anzeigen
HEATSINK 29X29X17.5MM CUSTOM TIMATS-50290P-C4-R0HEATSINK 29X29X17.5MM CUSTOM TIM0 - Sofort$8.43Details anzeigen
HEAT SINK 31MM X 31MM X 7.5MMATS-50310B-C0-R0HEAT SINK 31MM X 31MM X 7.5MM0 - Sofort$7.74Details anzeigen
HEATSINK 31MMX31MMX12.5MM W/O TIATS-50310G-C0-R0HEATSINK 31MMX31MMX12.5MM W/O TI0 - Sofort$7.69Details anzeigen
HEAT SINK 35MM X 35MM X 7.5MMATS-50350B-C0-R0HEAT SINK 35MM X 35MM X 7.5MM0 - Sofort$7.24Details anzeigen
HEATSINK 35MMX35MMX12.5MM W/O TIATS-50350G-C0-R0HEATSINK 35MMX35MMX12.5MM W/O TI9 - Sofort$7.99Details anzeigen
HEAT SINK 31MM X 31MM X 12.5MMATS-50350P-C3-R0HEAT SINK 31MM X 31MM X 12.5MM125 - Sofort$10.46Details anzeigen
HEATSINK 40X40X12.5MMATS-50400G-C3-R0HEATSINK 40X40X12.5MM89 - Sofort$9.61Details anzeigen
HEAT SINK T766ATS-50450G-C3-R0HEAT SINK T766661 - Sofort$9.00Details anzeigen
PTM Veröffentlicht am:

Related Videos

ATS fanSINK™ Heat Sink Family Overview
ATS fanSINK™ Heat Sink Family Overview

Datum der Veröffentlichung: 2021-11-01

How To Install The superGRIP™ Heat Sink Attachment
How To Install The superGRIP™ Heat Sink Attachment

Datum der Veröffentlichung: 2020-01-24

MEMS Oscillator ruggedness vs quartz part 2
MEMS Oscillator ruggedness vs quartz part 2

Datum der Veröffentlichung: 2018-03-13

Related Product Highlight

Professionelles Wärmemanagement von PCIe®-Karten Die PCIe®-Strangpressprofile von ATS sind regalfertige Lösungen speziell für das Wärmemanagement von PCIe-Karten.
Kühlkörper-Befestigungslösungen Mit den Kühlkörperbefestigungen von Advanced Thermal Solutions können Ingenieure nahezu jeden Kühlkörper auf Leiterplatten mechanisch befestigen.
dualFLOW™- und quadFLOW™-Hochleistungs-Aktivkühler Die dualFLOW- und quadFLOW-Kühler von Advanced Thermal Solutions verbessern die Wärmeleistung im Vergleich zu anderen CPU-Kühlern um mindestens 20 %.

Related Articles and Blogs

Feasibility Study of an LED-Based Lighting System Using Analytical Modeling A study of the heat loads for an outdoor LED-based lighting system using analytical modeling to determine the feasibility of the design with solar heat load.
Device Thermal Coupling on a PCB A look at how components on a printed circuit board thermally couple and the design considerations that help minimize heat dissipation problems.
Air Flow Measurement in Electronic Systems An analysis of circuit board air flow measurement techniques and the considerations required to obtain an accurate reading in this complex environment.

Related Product Training Modules

maxiFLOW Power Brick Heat Sink Technology ATS’s power brick heat sinks are engineered to create minimum pressure drop and maximize fin surface area
maxiGRIP™ and Board Rework Costs maxiGrip delivers enhanced cooling and enables the user to avoid any damage to the PCB and the BGA package itself.
maxiGRIP™ Flip-Chip Overview of the maxiGRIP Flip-Chip and review of importance of selecting the correct TIM.