Scheda tecnica SD05T1, SZSD05T1 Series di onsemi

0N Semiconductor® www.0nseml.com o—k—o fiifl
© Semiconductor Components Industries, LLC, 2014
November, 2017 − Rev. 5
1Publication Order Number:
SD05T1/D
SD05T1Series,
SZSD05T1Series
ESD Protrection Diode
SOD−323 Diodes for ESD Protection
These surge protection diodes are designed for applications requiring
transient overvoltage protection capability. They are intended for use in
voltage and ESD sensitive equipment such as computers, printers,
business machines, communication systems, medical equipment and
other applications. These devices are ideal for situations where board
space is at a premium.
Specification Features:
•Steady State Power Routing of 300 mW
•Peak Power − 350 W (8 20 ms)
•Low Leakage
•Cathode Indicated by Polarity Band
•Package Weight: 4.507 mg/wmt
•Meets IEC61000−4−2 Level 4, 15 kV (Air), 8 kV (Contact)
•Meets IEC6100−4−4 Level 4, 40 A
•Meets IEC6100−4−5 (Lightning), 24 A
•Meets 16 kV Human Body Model ESD Requirements
•SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
•These Devices are Pb−Free and are RoHS Compliant
Mechanical Characteristics:
CASE: Void-free, transfer-molded, thermosetting plastic
Epoxy Meets UL 94, V−0
LEAD FINISH: 100% Matte Sn (Tin)
MOUNTING POSITION: Any
QUALIFIED MAX REFLOW TEMPERATURE: 260°C
Device Meets MSL 1 Requirements
Use the Device Number to order the 7 inch/3,000 unit reel.
Replace the “T1” with “T3” in the Device Number to order the
13 inch/10,000 unit reel.
www.onsemi.com
SOD−323
CASE 477
STYLE 1
MARKING DIAGRAM
xx = Specific Device Code
ZA = SD05T1
ZC = SD12T1
M = Month Code
G= Pb−Free Package
(Note: Microdot may be in either location)
Device Package Shipping†
ORDERING INFORMATION
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
xx MG
G
SD05T1G
SOD−323
(Pb−Free) 3000/Tape & Reel
SZSD05T1G
SD12T1G
SZSD12T1G
www onsem' com
SD05T1 Series, SZSD05T1 Series
www.onsemi.com
2
MAXIMUM RATINGS
Rating Symbol Value Unit
Peak Power Dissipation @ 20 ms (Note 1)
@ TL ≤ 25°C
Ppk 350 Watts
IEC 61000−4−2 (ESD) Air
Contact
±15
±8.0
kV
IEC 61000−4−4 (EFT) 40 A
ESD Voltage (Human Body Model (HBM) Waveform per IEC 61000−4−2) VPP 30 kV
Total Power Dissipation on FR−4 Board (Note 2) @ TA = 25°C
Derate above 25°C
°PD°300
2.4
°mW°
mW/°C
Thermal Resistance, Junction−to−Ambient RqJA 416 °C/W
Junction and Storage Temperature Range TJ, Tstg −55 to +150 °C
Lead Solder Temperature − Maximum (10 Second Duration) TL260 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
*Other voltages may be available upon request.
1. Nonrepetitive current pulse, per Figure 6.
2. FR−4 printed circuit board, single−sided copper, mounting pad 1 cm2.
ELECTRICAL CHARACTERISTICS
(TA = 25°C unless otherwise noted)
Symbol Parameter
IPP Maximum Reverse Peak Pulse Current
VCClamping Voltage @ IPP
VRWM Working Peak Reverse Voltage
IRMaximum Reverse Leakage Current @ VRWM
VBR Breakdown Voltage @ IT
ITTest Current
IFForward Current
VFForward Voltage @ IF
Uni−Directional
IPP
IF
V
I
IR
IT
VRWM
VCVBR
VF
ELECTRICAL CHARACTERISTICS
Device
VRWM
(V)
IR @ VRWM
(mA)
VBR, Breakdown Voltage
(V)
IT
mA
VC @ IPP = 5 A
(Note 3)
(V)
Max IPP
(Note 3)
(A)
VC @ Max IPP
(Note 3)
(V)
Max
Capacitance
(pF)
Min Max
VR = 0 V
f = 1.0 MHz
SD05T1G 5.0 10 6.2 7.3 1.0 9.8 24 14.5 350
SD12T1G 12 1.0 13.3 15.75 1.0 19 15 25 150
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
3. 8 × 20 ms pulse waveform.
*Include SZ−prefix devices where applicable.
SD05T1 Series, SZSD05T1 Series
www.onsemi.com
3
TYPICAL CHARACTERISTICS
Figure 1. SD05 Typical Capacitance versus Bias
Voltage
−55 85
1000
Figure 2. SD12 Typical Capacitance versus
Bias Voltage
TEMPERATURE (°C)
125 145
100
10
LEAKAGE CURRENT (nA)
0 1.5 3.5 5
280
220
180
160
120
100
C, CAPACITANCE (pF)
BIAS (V)
200
140
100
90
80
70
60
50
40
30
20
10
0
0 25 50 75 100 125 150 175 200
TA, AMBIENT TEMPERATURE (°C)
PEAK PULSE DERATING IN % OF PEAK
POWER OR CURRENT @ TA = 25°C
100
90
80
70
60
50
40
30
20
10
0020406080
t, TIME (ms)
% OF PEAK PULSE CURRENT
tP
tr
PULSE WIDTH (tP) IS DEFINED
AS THAT POINT WHERE THE
PEAK CURRENT DECAY = 8 ms
PEAK VALUE IRSM @ 8 ms
HALF VALUE IRSM/2 @ 20 ms
0.5 2.5 4.5
6545255−35
Figure 3. SD05 Typical Leakage Current
versus Temperature
−55 95
100
Figure 4. SD12 Typical Leakage Current
versus Temperature
TEMPERATURE (°C)
120 145
10
1
0.1
LEAKAGE CURRENT (nA)
04 812
140
120
80
60
20
0
C, CAPACITANCE (pF)
BIAS (V)
100
40
2610
704520−5−30
240
260
1234
−15 105
Figure 5. Pulse Derating Curve Figure 6. 8 × 20 ms Pulse Waveform
a Lfifl¢ Ti]: ding fl: m0 STVLE Fm ‘ SOLDERING FOOTPRINT“ 0.63 a 9 0.025 0.53 0033 scum m” ) muss ‘Fov addinona‘ Infovmahcn on em Fla-Free snategy and solderin detai‘s‘ p‘ease download the ON Semiconducmr Soldenng an Mounllng Techniques Reference Manuah SOLDERRM/D, a a e Mademavks m Semxcunduclm Cnmpnnems In "sine \ghlsmanumhernlpalems \rademavks Dav www mm cumrsuerguwaxem Mavkmg gm
SD05T1 Series, SZSD05T1 Series
www.onsemi.com
4
PACKAGE DIMENSIONS
SOD−323
CASE 477−02
ISSUE H
1.60
0.063
0.63
0.025
ǒmm
inchesǓ
SCALE 10:1
0.83
0.033
2.85
0.112
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
STYLE 1:
PIN 1. CATHODE
2. ANODE
HE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. LEAD THICKNESS SPECIFIED PER L/F DRAWING
WITH SOLDER PLATING.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
5. DIMENSION L IS MEASURED FROM END OF
RADIUS.
NOTE 3
D
12bE
A3
A1
A
CNOTE 5
L
HE
DIM MIN NOM MAX
MILLIMETERS
A0.80 0.90 1.00
A1 0.00 0.05 0.10
A3 0.15 REF
b0.25 0.32 0.4
C0.089 0.12 0.177
D1.60 1.70 1.80
E1.15 1.25 1.35
0.08
2.30 2.50 2.70
L
0.031 0.035 0.040
0.000 0.002 0.004
0.006 REF
0.010 0.012 0.016
0.003 0.005 0.007
0.062 0.066 0.070
0.045 0.049 0.053
0.003
0.090 0.098 0.105
MIN NOM MAX
INCHES
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