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ams Datasheet Page 1

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TMD2672

Digital Proximity Detector

The TMD2672 family of devices provides a complete proximity

detection system and digital interface logic in a single 8-pin

surface mount module. The devices are register-set and

pin-compatible with the TMD2671 series and includes new and

improved proximity detection features. The proximity

detection includes improved signal-to-noise and accuracy. A

proximity offset register allows compensation for optical

system crosstalk between the IR LED and the sensor. To prevent

false proximity data measurement readings, a proximity

saturation indicator bit signals that the internal analog circuitry

has reached saturation. Interrupts have been enhanced with

the addition of a sleep-on-interrupt feature that also allows for

a single cycle operation. The device internal state machine

provides the ability to put the device in a low-power mode in

between proximity measurements, providing very low average

power consumption.

The proximity detection system includes an LED driver and an

IR LED, which are factory trimmed to eliminate the need for

end-equipment calibration due to component variations.

Ordering Information and Content Guide appear at end of

datasheet.

General Description

Page 2 ams Datasheet

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TMD2672 − General Description

Key Benefits & Features

The benefits and features of the TMD2672 digital proximity

detector, are listed below:

Figure 1:

Added Value of Using TMD2672

Note(s) and/or Footnote(s):

1. New or improved feature

Applications

• Mobile Handset Touchscreen Control and Automatic

Speakerphone Enable

• Mechanical Switch Replacement

•Paper Alignment

Benefits Features

• Eliminates need for customer

end-product calibration.

• Reduces the proximity noise

• Control of system crosstalk and offset

• Prevents false proximity detection in

bright light

• Selectable IR power-level without

external resistor

• Enables wide operating range

• Digital Proximity Detector, LED Driver, and IR LED in a

Single Optical Module

• Register Set- and Pin-Compatible with the TMD2671

Series

• Proximity Detection

- Reduced Proximity Count Variation (1)

- Programmable Offset Control Register (1)

-Saturation Indicator (1)

- Programmable Integration Time and Offset

- Current Sink Driver for IR LED

- 16,000:1 Dynamic Range

• Reduces external processor burden

• Maskable Proximity Interrupt

- Programmable Upper and Lower Thresholds with

Persistence Filter

• Enables dynamic power dissipation

control

• Power Management

- Low Power 2.2μA Sleep State with User-Selectable

Sleep-After-Interrupt Mode (1)

- 90μA Wait State with Programmable Wait Time from

2.7ms to > 8 seconds

• Industry standard two-wire interface

• I²C Fast Mode Compatible Interface

- Data Rates up to 400kbit/s

- Input Voltage Levels Compatible with VDD or 1.8V Bus

• Small foot-print module • 3.94mm × 2.36mm × 1.35mm Package

ams Datasheet Page 3

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TMD2672 − General Description

End Products and Market Segments

• Mobile Handsets, Tablets, Laptops and HDTVs

•White Goods

•Toys

• Digital Signage

•Printing

Block Diagram

The functional blocks of this device for reference are

shown below:

Figure 2:

TMD2672 Block Diagram

SDA

INT

SCL

Wait Control

Prox

ADC

Prox Control

Prox

Data

IR LED Constant

Current Sink

Prox

Integration

Upper Limit

Lower Limit

Interrupt

I2C Interface

GND

Channel 1

LEDA

LEDK

VDD

LDR

Channel 0

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TMD2672 − Detailed Description

A fully integrated proximity detection solution is provided with

an 850nm IR LED, LED driver circuit, and proximity detection

engine. An internal LED driver (LDR) pin, is externally connected

to the LED cathode (LEDK) to provide a controlled LED sink

current. This is accomplished with a proprietary current

calibration technique that accounts for all variances in silicon,

optics, package, and most important, IR LED output power. This

eliminates or greatly reduces the need for factory calibration

that is required for most discrete proximity sensor solutions.

The device is factory calibrated to achieve a proximity count

reading at a specified distance with a specific number of pulses.

In use, the number of proximity LED pulses can be programmed

from 1 to 255 pulses, which allows different proximity distances

to be achieved. Each pulse has a 16μs period, with a 7.2μs on

time.

The device provides a separate pin for level-style interrupts.

When interrupts are enabled and a pre-set value is exceeded,

the interrupt pin is asserted and remains asserted until cleared

by the controlling firmware. The interrupt feature simplifies and

improves system efficiency by eliminating the need to poll a

sensor for a proximity value. An interrupt is generated when the

value of a proximity conversion exceeds either an upper or

lower threshold. In addition, a programmable interrupt

persistence feature allows the user to determine how many

consecutive exceeded thresholds are necessary to trigger an

interrupt.

Detailed Description

O O

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TMD2672 − Pin Assignments

The TMD2672 pin assignments are described below:

Figure 3:

Pin Diagram (Top View)

Figure 4:

Terminal Functions

Package Module-8:

Package drawing is not to scale

Terminal Type Description

Name No.

VDD 1Supply voltage

SCL 2 I I²C serial clock input terminal - clock signal for I²C serial data

GND 3 Power supply ground. All voltages are referenced to GND.

LEDA 4 LED anode

LEDK 5 LED cathode. Connect to LDR pin when using internal LED driver circuit.

LDR 6 O LED driver input for proximity IR LED, constant current source LED driver

INT 7 O Interrupt - open drain (active low)

SDA 8 I/O I²C serial data I/O terminal - serial data I/O for I²C

Pin Assignments

VDD 1

SCL 2

GND 3

LEDA 4

8 SDA

7 INT

6 LDR

5 LEDK

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TMD2672 − Absolute Maximum Ratings

Stresses beyond those listed under Absolute Maximum Ratings

may cause permanent damage to the device. These are stress

ratings only. Functional operation of the device at these or any

other conditions beyond those indicated under Recommended

Operating Conditions is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

Figure 5:

Absolute Maximum Ratings over Operating Free-Air Temperature Range (unless otherwise noted)

Note(s) and/or Footnote(s):

1. All voltages are with respect to GND.

Symbol Parameter Min Max Unit

VDD Supply voltage (1) 3.8 V

Input terminal voltage -0.5 3.8 V

Output terminal voltage (except LDR) -0.5 3.8 V

Output terminal voltage (LDR) 3.8 V

Output terminal current (except LDR) -1 20 mA

Tstg Storage temperature range -40 85 °C

ESD tolerance, human body model ±2000 V

Absolute Maximum Ratings

ams Datasheet Page 7

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TMD2672 − Electrical Characteristics

All limits are guaranteed. The parameters with min and max

values are guaranteed with production tests or

SQC (Statistical Quality Control) methods.

Figure 6:

Recommended Operating Conditions

Note(s) and/or Footnote(s):

1. While the device is operational across the temperature range, functionality will vary with temperature. Specifications are stated

only at 25°C unless otherwise noted.

Figure 7:

Operating Characteristics, VDD = 3V, TA = 25°C (unless otherwise noted)

Symbol Parameter Min Nom Max Unit

VDD Supply voltage 2.6 3 3.6 V

Supply voltage accuracy, VDD total error including

transients -3 3 %

TAOperating free-air temperature range (1) -30 85 °C

Symbol Parameter Test Conditions Min Typ Max Unit

IDD Supply current

Active - LDR pulse off 195 250

μAWait state 90

Sleep state - no I²C activity 2.2 4

VOL INT, SDA output low

voltage

3mA sink current 0 0.4

6mA sink current 0 0.6

ILEAK Leakage current, SDA,

SCL, INT pins -5 5 μA

ILEAK Leakage current, LDR

pin -5 5 μA

VIH SCL, SDA input high

voltage

TMD26721 0.7 VDD V

TMD26723 1.25

VIL SCL, SDA input low

voltage

TMD26721 0.3 VDD V

TMD26723 0.54

Electrical Characteristics

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TMD2672 − Electrical Characteristics

Figure 8:

Proximity Characteristics, VDD = VLEDA = 3V, TA = 25°C, PEN = 1 (unless otherwise noted)

Note(s) and/or Footnote(s):

1. Value is factory-adjusted to meet the Prox count specification. Considerable variation (relative to the typical value) is possible after

adjustment.

2. Proximity offset varies with power supply characteristics and noise.

3. ILEDA is factory calibrated to achieve this specification. Offset and crosstalk directly sum with this value and is system dependent.

4. No glass or aperture above the module. Tested value is the average of 5 consecutive readings.

5. These parameters are ensured by design and characterization and are not 100% tested.

6. Proximity test was done using the following circuit. See “Application Information: Hardware” on page 31. section for recommended

application circuit.

Symbol Parameter Test Conditions Min Typ Max Unit

IDD Supply current LED On 3 mA

ILEDA LEDA current (1)

LED On, PDRIVE = 0 100

LED On, PDRIVE = 1 50

LED On, PDRIVE = 2 25

LED On, PDRIVE = 3 12.5

PTIME ADC conversion steps 1 256 steps

PTIME ADC conversion time PTIME = 0xFF

(= 1 conversion step) 2.58 2.73 2.9 ms

PTIME ADC counts per step PTIME = 0xFF

(= 1 conversion step) 0 1023 counts

PPULSE LED pulses (5) 0255pulses

LED On LED pulse width PPULSE = 1, PDRIVE = 0 7.3 μs

LED pulse period PPULSE = 2, PDRIVE = 0 16.0 μs

Proximity response, no

target (offset)

PPULSE = 8, PDRIVE = 0,

PGAIN = 4× (2) 100 counts

Prox count, 100mm target (3)

73mm × 83mm, 90%

reflective Kodak Gray Card,

PGAIN = 4×, PPULSE = 8,

PDRIVE = 0, PTIME = 0xFF (4)

450 520 590 counts

ams Datasheet Page 9

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TMD2672 − Electrical Characteristics

Figure 9:

Proximity Test Circuit

Figure 10:

IR LED Characteristics, VDD = 3V, TA = 25°C

Figure 11:

Wait Characteristics, VDD = 3V, TA = 25°C, WEN = 1 (unless otherwise noted)

Symbol Parameter Test Conditions Min Typ Max Unit

VFForward Voltage IF = 20mA 1.4 1.5 V

VRReverse Voltage IR = 10μA 5V

PORadiant Power IF = 20mA 4.5 mW

λpPeak Wavelength IF = 20mA 850 nm

ΔλSpectral Radiation

Bandwidth IF = 20mA 40 nm

TROptical Rise Time IF = 100mA, TW = 125ns,

duty cycle = 25% 20 40 ns

TFOptical Fall Time IF = 100mA, TW = 125ns,

duty cycle = 25% 20 40 ns

Parameter Test Conditions Min Typ Max Unit

Wait time WTIME = 0xFF (= 1 wait step) 2.73 2.9 ms

Wait steps 1 256 steps

TMD2672

VDD

1 mF

4VDD

GND LDR

LEDK

LEDA

1 mF 22 mF

Slop sun condition condition

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TMD2672 − Electrical Characteristics

Figure 12:

AC Electrical Characteristics, VDD = 3V, TA = 25°C (unless otherwise noted)

Note(s) and/or Footnote(s):

1. Specified by design and characterization; not production tested.

Figure 13:

Parameter Measurement Information: Timing Diagrams

Symbol Parameter (1) Test Conditions Min Typ Max Unit

f(SCL) Clock frequency (I²C only) 0 400 kHz

t(BUF) Bus free time between start and

stop condition 1.3 μs

t(HDSTA)

Hold time after (repeated) start

condition. After this period, the first

clock is generated.

0.6 μs

t(SUSTA) Repeated start condition setup time 0.6 μs

t(SUSTO) Stop condition setup time 0.6 μs

t(HDDAT) Data hold time 0 μs

t(SUDAT) Data setup time 100 ns

t(LOW) SCL clock low period 1.3 μs

t(HIGH) SCL clock high period 0.6 μs

tFClock/data fall time 300 ns

tRClock/data rise time 300 ns

CiInput pin capacitance 10 pF

Start

Condition

Stop

Condition

SDA

t(SUSTO)

t(SUDAT)

t(HDDAT)

t(BUF)

VIH

VIL

SCL

t(SUSTA)

t(HIGH)

t(F)

t(R)

t(HDSTA)

t(LOW)

VIH

VIL

PSS

ams Datasheet Page 11

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TMD2672 − Typical Operating Characteristics

Figure 14:

Spectral Responsivity

Figure 15:

Normalized Responsivity vs. Angular Displacement

Typical Operating

Characteristics

λ − Wavelength − nm

400

0.2

0.4

0.6

0.8

500 600 700 800 900 1000 1100

Normalized Responsivity

300

Ch 0

Ch 1

Q − Angular Displacement − °

Normalized Responsivity

0.2

0.4

0.6

0.8

1.0

−90 −60 −30 0 30 60 90

Optical Axis

-Q +Q

Both Axes

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TMD2672 − Typical Operating Characteristics

Figure 16:

Typical LDR Current vs. Voltage

Figure 17:

Normalized IDD vs. VDD and Temperature

LDR Voltage − V

LDR Current — mA

0 0.5 1 1.5 2 2.5

100

120

140

160

PDRIVE = 01

PDRIVE = 10

PDRIVE = 11

PDRIVE = 00

VDD — V

IDD — Active Current Normalized @ 3 V, 25C

94%

96%

98%

100%

102%

104%

106%

108%

110%

92%

2.7 2.8 2.9 3 3.1 3.2 3.3

75C

50C

0C

25C

ams Datasheet Page 13

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TMD2672 − Principles of Operation

System State Machine

An internal state machine provides system control of the

proximity detection and power management features of the

device. At power up, an internal power-on-reset initializes the

device and puts it in a low-power Sleep state.

When a start condition is detected on the I²C bus, the device

transitions to the Idle state where it checks the Enable register

(0x00) PON bit. If PON is disabled, the device will return to the

Sleep state to save power. Otherwise, the device will remain in

the Idle state until a proximity function is enabled. Once

enabled, the device will execute the Prox and Wait states in

sequence as indicated in Figure 18. Upon completion and

return to Idle, the device will automatically begin a new

prox-wait cycle as long as PON and PEN are enabled.

If the Prox function generates an interrupt and the

Sleep-After-Interrupt (SAI) feature is enabled the device will

transition to the Sleep state and remain in a low-power mode

until an I²C command is received.

See Interrupts for additional information.

Figure 18:

Simplified State Diagram

Principles of Operation

!PEN &

WEN

!WEN

PEN

Sleep

Idle

Wait

Prox

I2C

Start !PON

INT & SAI

WEN

FDIODEMIXUF,“ as”)

Page 14 ams Datasheet

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TMD2672 − Principles of Operation

Proximity Detection

Proximity detection is accomplished by measuring the amount

of IR energy, from the internal IR LED, reflected off an object to

determine its distance. The internal proximity IR LED is driven

by the integrated proximity LED current driver as shown in

Figure 19.

Figure 19:

Proximity Detection

The LED current driver, output on the LDR terminal, provides a

regulated current sink that eliminates the need for an external

current limiting resistor. PDRIVE sets the drive current to one of

four selectable levels.

Referring to the Detailed State Machine figure, the LED current

driver pulses the IR LED as shown in Figure 20 during the Prox

Accum state. Figure 20 also illustrates that the LED On pulse has

a fixed width of 7.3μs and period of 16.0μs. So, in addition to

setting the proximity drive current, 1 to 255 proximity

pulses (PPULSE) can be programmed. When deciding on the

number of proximity pulses, keep in mind that the signal

increases proportionally to PPULSE, while noise increases by

the square root of PPULSE.

CH1

Prox

Integration

Prox Control

Prox

ADC

Prox LED

Current Driver

CH0

PDATAH(r0x019)

PDRIVE(r0x0F, b7:6)

Prox

Data

LED

PTIME(r0x02)

PVALID(r0x13, b1)

PPULSE(r0x0E)

POFFSET(r0x1E)

PSAT(r0x13, b6)

PDIODE(r0x0F, b5:4)

Background Energy

PDATAL(r0x018)

Object

LDR

LEDK

LEDA

ams Datasheet Page 15

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TMD2672 − Principles of Operation

Figure 20:

Proximity LED Current Driver Waveform

Figure 19 illustrates light rays emitting from the internal IR LED,

reflecting off an object, and being absorbed by the CH0 and

CH1 photodiodes. The proximity diode selector (PDIODE)

determines which of the two photodiodes is used for a given

proximity measurement. Note that neither photodiode is

selected when the device first powers up, so PDIODE must be

set for proximity detection to work.

Referring again to Figure 20, the reflected IR LED and the

background energy is integrated during the LED On time, then

during the LED Off time, the integrated background energy is

subtracted from the LED On time energy, leaving the IR LED

energy to accumulate from pulse to pulse. During LED On time

integration, the proximity saturation bit in the Status

condition can occur if the proximity gain is set too high for the

lighting conditions, such as in the presence of bright sunlight.

Once asserted, PSAT will remain set until a special function

proximity interrupt clear command is received from the host

(see Command Register)

After the programmed number of proximity pulses have been

generated, the proximity ADC converts and scales the proximity

measurement to a 16-bit value, then stores the result in two

8-bit proximity data (PDATAx) registers. ADC scaling is

controlled by the proximity ADC conversion time (PTIME) which

is programmable from 1 to 256 2.73ms time units. However,

depending on the application, scaling the proximity data will

equally scale any accumulated noise. Therefore, in general, it is

recommended to leave PTIME at the default value of one 2.73ms

ADC conversion time (0xFF).

LED On LED Off

IR LED Pulses

Background

Energy

Reflected IR LED +

Background Energy

16.0 ms

7.3 ms

Page 16 ams Datasheet

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TMD2672 − Principles of Operation

In many practical proximity applications, a number of optical

system and environmental conditions can produce an offset in

the proximity measurement result. To counter these effects, a

proximity offset (POFFSET) is provided which allows the

proximity data to be shifted positive or negative. Additional

information on the use of the proximity offset feature is

provided in available ams application notes.

Once the first proximity cycle has completed, the proximity

valid (PVALID) bit in the Status register will be set and remain

set until the proximity detection function is disabled (PEN).

For additional information on using the proximity detection

function behind glass and for optical system design guidance,

please see available ams application notes.

ams Datasheet Page 17

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TMD2672 − Principles of Operation

Interrupts

The interrupt feature simplifies and improves system efficiency

by eliminating the need to poll the sensor for proximity values

outside a user-defined range. While the interrupt function is

always enabled and its status is available in the Status

using the proximity interrupt enable (PIEN) field in the Enable

Two 16-bit interrupt threshold registers allow the user to set

limits below and above a desired proximity range. An interrupt

can be generated when the proximity data (PDATA) falls below

the proximity interrupt low threshold (PILTx) or exceeds the

proximity interrupt high threshold (PIHTx).

It is important to note that the thresholds are evaluated in

sequence, first the low threshold, then the high threshold. As a

result, if the low threshold is set above the high threshold, the

high threshold is ignored and only the low threshold is

evaluated.

To further control when an interrupt occurs, the device provides

an interrupt persistence feature. The persistence filter allows

the user to specify the number of consecutive out-of-range

proximity occurrences before an interrupt is generated. The

persistence filter register (0x0C) allows the user to set the

proximity persistence filter (PPERS) values. See the persistence

filter register for details on the persistence filter values. Once

the persistence filter generates an interrupt, it will continue

until a special function interrupt clear command is received

(see Command Register).

Figure 21:

Programmable Interrupt

Prox

ADC

Prox

Data

Prox

Integration

Channel 0

Upper Limit

Lower Limit

Prox Persistence

PILTH(r 0x09), PILTL(r 0x08)

PIHTH(r 0x0B), PIHTL(r 0x0A) PPERS(r 0x0C, b7:4)

Channel 1

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TMD2672 − Principles of Operation

State Diagram

The system state machine shown in Figure 18 provides an

overview of the states and state transitions that provide system

control of the device. This section highlights the programmable

features that affect the state machine cycle time, and provides

details to determine system level timing.

When the proximity detection feature is enabled (PEN), the

state machine transitions through the Prox Init, Prox Accum,

Prox Wait, and Prox ADC states. The Prox Init and Prox Wait times

are a fixed 2.73ms, whereas the Prox Accum time is determined

by the number of proximity LED pulses (PPULSE) and the Prox

ADC time is determined by the integration time (PTIME). The

formulas to determine the Prox Accum and Prox ADC times are

given in the associated boxes in Figure 22. If an interrupt is

generated as a result of the proximity cycle, it will be asserted

at the end of the Prox ADC state and transition to the Sleep state

if SAI is enabled.

When the power management feature is enabled (WEN), the

state machine will transition in turn to the Wait state. The wait

time is determined by WLONG, which extends normal operation

by 12× when asserted, and WTIME. The formula to determine

the wait time is given in the box associated with the Wait state

in Figure 22.

Figure 22:

Expanded State Diagram

Prox

Wait

Sleep

Idle

Wait

Prox

Init

Prox

Accum

Prox

ADC

Prox

Time: 2.73 ms

PPULSE: 0 ~ 255 pulses

Time: 16.0 μs/pulse

Range: 0 ~ 4.1 ms

Time: 2.73 ms

PTIME: 1 ~ 256 steps

Time: 2.73 ms/step

Range: 2.73 ms ~ 699 ms WTIME: 1 ~ 256 steps

WLONG = 0 WLONG = 1

Time: 2.73 ms/step 32.8 ms/step

Range: 2.73 ms ~ 699 ms 32.8 ms ~ 8.39s

!WEN

!PON

C Start

WEN

!PEN & WEN

Note: PON, PEN, WEN, and SAI are fields in the Enable register (0x00).

PEN

INT & SAI

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TMD2672 − Principles of Operation

Power Management

Power consumption can be managed with the Wait state

because the wait state consumes only 90μA of IDD current. An

example of the power management feature is shown in

Figure 23. With the assumptions provided in the example, the

average IDD is estimated to be 157μA.

Figure 23:

Power Management

Note(s) and/or Footnote(s):

1. Prox Accum - LED On time = 7.3μs per pulse × 4 pulses = 29.3μs = 0.029ms

2. Prox Accum - LED Off time = 8.7μs per pulse × 4 pulses = 34.7μs = 0.035ms

Average IDD Current = ((2.73 × 0.195) + (0.029 × 103) + (0.035 x 0.195) + (2 x 2.73 x0.195) + (49.2 × 0.090)) / 57.45≈ 157 μA

Keeping with the same programmed values as the example,

Figure 24 shows how the average IDD current is affected by the

Wait state time, which is determined by WEN, WTIME, and

WLONG. Note that the worst-case current occurs when the Wait

state is not enabled.

Figure 24:

Average IDD Current

System State

Machine State Programmable

Parameter Programmed

Value Duration Typical

Current

Prox Init 2.73ms 0.195mA

Prox Accum PPULSE 0x04 0.064ms

Prox Accum − LED On 0.029ms (1) 103mA

Prox Accum − LED Off 0.035ms (2) 0.195mA

Prox Wait 2.73ms 0.195mA

Prox ADC PTIME 0xFF 2.73ms 0.195mA

Wait

WTIME 0xEE

49.2ms 0.090mA

WLONG 0

WEN WTIME WLONG Wait State Average IDD Current

0n/an/a0ms 556μA

1 0xFF 0 2.73ms 440μA

1 0xEE 0 49.2ms 157μA

1 0x00 0 699ms 99μA

10x0018389ms 90μA

I26 Read Protocol — Combined Forma DEI

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TMD2672 − Principles of Operation

I²C Protocol

Interface and control are accomplished through an I²C serial

compatible interface (standard or fast mode) to a set of registers

that provide access to device control functions and output data.

The devices support the 7-bit I²C addressing protocol.

The I²C standard provides for three types of bus transaction:

read, write, and a combined protocol (Figure 25). During a write

operation, the first byte written is a command byte followed by

data. In a combined protocol, the first byte written is the

command byte followed by reading a series of bytes. If a read

command is issued, the register address from the previous

command will be used for data access. Likewise, if the MSB of

the command is not set, the device will write a series of bytes

at the address stored in the last valid command with a register

address. The command byte contains either control information

or a 5-bit register address. The control commands can also be

used to clear interrupts.

The I²C bus protocol was developed by Philips (now NXP). For

a complete description of the I²C protocol, please review the

NXP I²C design specification at

http://www.i2c-bus.org/references.

Figure 25:

I²C Protocols

Data ByteSlave AddressS

AAA

811 1 8

Command Code

...

C Write Protocol

C Read Protocol

C Read Protocol — Combined Format

DataSlave AddressS

AAA

811 1 8

Data

...

Slave AddressSlave AddressS

ARA

811 1 7 11

Command Code Sr

Data AA

81 8

Data

...

AAcknowledge (0)

NNot Acknowledged (1)

PStop Condition

RRead (1)

SStart Condition

Sr Repeated Start Condition

WWrite (0)

... Continuation of protocol

Master-to-Slave

Slave-to-Master

ams Datasheet Page 21

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TMD2672 − Principles of Operation

The device is controlled and monitored by data registers and a

command register accessed through the serial interface. These

registers provide for a variety of control functions and can be

read to determine results of the ADC conversions. The Register

Set is summarized in Figure 26.

Figure 26:

The mechanics of accessing a specific register depends on the

specific protocol used. See the section on I²C protocols on the

previous pages. In general, the Command register is written first

to specify the specific control/status register for following

read/write operations.

Address Register Name R/W Register Function Reset Value

---- COMMAND W Specifies register address 0x00

0x00 ENABLE R/W Enables states and interrupts 0x00

0x02 PTIME R/W Proximity ADC time 0xFF

0x03 WTIME R/W Wait time 0xFF

0x08 PILTL R/W Proximity interrupt low threshold low byte 0x00

0x09 PILTH R/W Proximity interrupt low threshold high byte 0x00

0x0A PIHTL R/W Proximity interrupt high threshold low byte 0x00

0x0B PIHTH R/W Proximity interrupt high threshold high byte 0x00

0x0C PERS R/W Interrupt persistence filter 0x00

0x0D CONFIG R/W Configuration 0x00

0x0E PPULSE R/W Proximity pulse count 0x00

0x0F CONTROL R/W Control register 0x00

0x11 REVISION R Die revision number Rev Num.

0x12 ID R Device ID ID

0x13 STATUS R Device status 0x00

0x18 PDATAL R Proximity ADC low data register 0x00

0x19 PDATAH R Proximity ADC high data register 0x00

0x1E POFFSET R/W Proximity Offset register 0x00

Page 22 ams Datasheet

Document Feedback [v1-00] 2015-Mar-23

TMD2672 − Principles of Operation

Command Register

The Command Register specifies the address of the target

Figure 27:

Command Register

76543210

COMMAND TYPE ADD

Field Bits Description

COMMAND 7 Select Command Register. Must write as 1 when addressing Command Register.

TYPE 6:5

Selects type of transaction to follow in subsequent data transfers:

Field Value Description

00 Repeated byte protocol transaction

01 Auto-increment protocol transaction

10 Reserved - Do not use

11 Special function - See description below

Transaction type 00 will repeatedly read the same register with each data access.

Transaction type 01 will provide an auto-increment function to read successive

ADD 4:0

Address Register/Special Function Register. Depending on the transaction type,

see above, this field either specifies a special function command or selects the

specific control-status-register for following write and read transactions:

Field Value Description

00000 Normal - no action

00101 Proximity interrupt clear

Proximity Interrupt Clear clears any pending proximity interrupt. This special

function is self clearing.

ams Datasheet Page 23

[v1-00] 2015-Mar-23 Document Feedback

TMD2672 − Principles of Operation

Enable Register (0x00)

The Enable Register is used to power the device on/off, enable

functions, and interrupts.

Figure 28:

Enable Register

Proximity Time Control Register (0x02)

The Proximity Timing Register controls the integration time of

the proximity ADC in 2.73ms increments. Upon power up, the

Proximity Time Register is set to 0xFF. It is recommended that

this register be programmed to a value of 0xFF (1 integration

cycle).

Figure 29:

Proximity Time Control Register

76543210

Reserved SAI PIEN Reserved WEN PEN Reserved PON

Field Bits Description

Reserved 7 Reserved. Write as 0.

SAI 6 Sleep After Interrupt. 0 = not enabled, 1 = enabled

PIEN 5 Proximity Interrupt Mask. When asserted, permits proximity interrupts to be

generated.

Reserved 4 Reserved. Write as 0.

WEN 3 Wait Enable. This bit activates the wait feature. Writing a 1 activates the wait timer.

Writing a 0 disables the wait timer.

PEN 2 Proximity Enable. This bit activates the proximity function. Writing a 1 enables

proximity. Writing a 0 disables proximity.

Reserved 1 Reserved. Write as 0.

PON 0

Power ON. This bit activates the internal oscillator to permit the timers and ADC

channel to operate. Writing a 1 activates the oscillator. Writing a 0 disables the

oscillator.

Field Bits Description

PTIME 7:0

Value INTEG_CYCLES Time Max Count

0xFF 1 2.73ms 1023

Page 24 ams Datasheet

Document Feedback [v1-00] 2015-Mar-23

TMD2672 − Principles of Operation

Wait Time Register (0x03)

Wait time is set 2.73ms increments unless the WLONG bit is

asserted, in which case the wait times are 12× longer. WTIME is

programmed as a 2’s complement number. Upon power up, the

Wait Time Register is set to 0xFF.

Figure 30:

Proximity Time Control Register

Note(s) and/or Footnote(s):

1. The Proximity Wait Time Register should be configured before PEN is asserted.

Proximity Interrupt Threshold Register

(0x08 - 0x0B)

The Proximity Interrupt Threshold Registers provide the values

to be used as the high and low trigger points for the comparison

function for interrupt generation. If the value generated by

proximity channel crosses below the lower threshold specified,

or above the higher threshold, an interrupt is signaled to the

host processor.

Figure 31:

Proximity Interrupt Threshold Register

Field Bits Description

WTIME 7:0

0xFF 1 2.72ms 0.032 sec

0xB6 74 200ms 2.4 sec

0x00 256 700ms 8.3 sec

PILTL 0x08 7:0 Proximity low threshold lower byte

PILTH 0x09 7:0 Proximity low threshold upper byte

PIHTL 0x0A 7:0 Proximity high threshold lower byte

PIHTL 0x0B 7:0 Proximity high threshold upper byte

ams Datasheet Page 25

[v1-00] 2015-Mar-23 Document Feedback

TMD2672 − Principles of Operation

Persistence Register (0x0C)

The Persistence Register controls the filtering interrupt

capabilities of the device. Configurable filtering is provided to

allow interrupts to be generated after each ADC integration

cycle or if the ADC integration has produced a result that is

outside of the values specified by threshold register for some

specified amount of time.

Figure 32:

Persistence Register

Configuration Register (0x0D)

The Configuration Register sets the wait long time.

Figure 33:

Enable Register

76543210

PPERS Reserved

Field Bits Description

PPERS 7:4

Proximity Interrupt Persistence. Controls rate of proximity interrupt to the host

processor.

Field Value Meaning Interrupt Persistence Function

0000 ---- Every proximity cycle generates an interrupt

0001 1 1 proximity value out of range

0010 2 2 consecutive proximity values out of range

.... .... ....

1111 15 15 consecutive proximity values out of range

Reserved 3:0 Default setting is 0x00.

76543210

Reserved WLONG Reserved

Field Bits Description

Reserved 7:2 Reserved. Write as 0.

WLONG 1 Wait Long. When asserted, the wait cycles are increased by a factor 12× from that

programmed in the WTIME register.

Reserved 0 Reserved. Write as 0.

améW 2=3$$i iﬁ

Page 26 ams Datasheet

Document Feedback [v1-00] 2015-Mar-23

TMD2672 − Principles of Operation

Proximity Pulse Count Register (0x0E)

The Proximity Pulse Count Register sets the number of

proximity pulses that will be transmitted. PPULSE defines the

number of pulses to be transmitted at a 62.5kHz rate.

Figure 34:

Proximity Pulse Count Register

76543210

PPULSE

Field Bits Description

PPULSE 7:0 Proximity Pulse Count. Specifies the number of proximity pulses to be generated.

ams Datasheet Page 27

[v1-00] 2015-Mar-23 Document Feedback

TMD2672 − Principles of Operation

Control Register (0x0F)

The Control Register provides four bits of control to the analog

block. These bits control the diode drive current and diode

selection functions.

Figure 35:

Control Register

Note(s) and/or Footnote(s):

1. LED STRENGTH values (italic) are nominal operating values. Specifications can be found in the Proximity Characteristics table.

76543210

PDRIVE PDIODE PGAIN Reserved

Field Bits Description

PDRIVE (1) 7:6

Proximity LED Drive Strength

Field Value LED STRENGTH - PDL = 0 LED STRENGTH - PDL = 1

00 100mA 11.1mA

01 50mA 5.6mA

10 25mA 2.8mA

11 12.5mA 1.4mA

PDIODE 5:4

Proximity Diode Selector

Field Value Diode Selection

00 Proximity uses neither diode

01 Proximity uses the CH0 diode

10 Proximity uses the CH1 diode

11 Reserved - Do not write

PGAIN 3:2

Proximity Gain

Field Value Proximity Gain Value

00 1× gain

01 2× gain

10 4× gain

11 8× gain

Reserved 1:0 Reserved

cm 3,2. §

Page 28 ams Datasheet

Document Feedback [v1-00] 2015-Mar-23

TMD2672 − Principles of Operation

Revision Register (0x11)

The Revision Register shows the silicon revision number. It is a

read-only register and shows the revision level of the silicon

used internally.

Figure 36:

Revision Register

ID Register (0x12)

The ID Register provides the value for the part number. The ID

Figure 37:

ID Register

76543210

Reserved DIE_REV

Field Bits Description

Reserved 7:4 Reserved Bits read as 0

DIE_REV 3:0 Die revision number Die revision number

76543210

Field Bits Description

ID 7:0 Part number identification

0x32 = TMD26721

0x3B = TMD26723

ams Datasheet Page 29

[v1-00] 2015-Mar-23 Document Feedback

TMD2672 − Principles of Operation

Status Register (0x13)

The Status Register provides the internal status of the device.

This register is read only.

Figure 38:

Status Register

Proximity Data Register (0x18 - 0x19h)

Proximity data is stored as a 16-bit value. To ensure the data is

read correctly, a two-byte I²C read transaction should be

utilized with auto increment protocol bits set in the Command

read, the upper eight bits are stored into a shadow register,

which is read by a subsequent read to the upper byte. The upper

ends between the reading of the lower and upper registers.

Figure 39:

PDATA Registers

76543210

Reserved PSAT PINT Reserved PVALID Reserved

Field Bits Description

Reserved 7 Reserved

PSAT 6 Proximity Saturation. Indicates that the proximity measurement saturated.

PINT 5 Proximity Interrupt. Indicates that the device is asserting a proximity interrupt.

Reserved 4:2 Reserved. Bits read as 0.

PVALID 1 Proximity Valid. Indicates that the proximity channel has completed an integration

cycle after PEN has been asserted.

Reserved 0 Reserved

PDATAL 0x18 7:0 Proximity data low byte

PDATAH 0x19 7:0 Proximity data high byte

Page 30 ams Datasheet

Document Feedback [v1-00] 2015-Mar-23

TMD2672 − Principles of Operation

Proximity Offset Register (0x1E)

The 8-bit Proximity Offset Register provides compensation for

proximity offsets caused by device variations, optical crosstalk,

and other environmental factors. Proximity offset is a

sign-magnitude value where the sign bit, bit 7, determines if

the offset is negative (bit 7 = 0) or positive (bit 7 = 1). At power

up, the register is set to 0x00. The magnitude of the offset

compensation depends on the proximity gain (PGAIN),

proximity LED drive strength (PDRIVE), and the number of

proximity pulses (PPULSE). Because a number of environmental

factors contribute to proximity offset, this register is best suited

for use in an adaptive closed-loop control system. See available

ams application notes for proximity offset register application

information.

Figure 40:

Proximity Offset Register

76543210

SIGN MAGNITUDE

Field Bits Description

SIGN 7 Proximity Offset Sign. The offset sign shifts the proximity data negative when

equal to 0 and positive when equal to 1.

MAGNITUDE 6:0

Proximity Offset Magnitude. The offset magnitude shifts the proximity data

positive or negative, depending on the proximity offset sign. The actual amount of

the shift depends on the proximity gain (PGAIN), proximity LED drive strength

(PDRIVE), and the number of proximity pulses (PPULSE).

SDA

ams Datasheet Page 31

[v1-00] 2015-Mar-23 Document Feedback

TMD2672 − Application Information: Hardware

LED Driver Pin with Proximity Detection

In a proximity sensing system, the included IR LED can be pulsed

with more than 100mA of rapidly switching current, therefore,

a few design considerations must be kept in mind to get the

best performance. The key goal is to reduce the power supply

noise coupled back into the device during the LED pulses.

Averaging of multiple proximity samples is recommended to

reduce the proximity noise.

The first recommendation is to use two power supplies; one for

the device VDD and the other for the IR LED. In many systems,

there is a quiet analog supply and a noisy digital supply. By

connecting the quiet supply to the VDD pin and the noisy supply

to the LEDA pin, the key goal can be met. Place a 1μF low-ESR

decoupling capacitor as close as possible to the VDD pin and

another at the LEDA pin, and at least 10μF of bulk capacitance

to supply the 100mA current surge. This may be distributed as

two 4.7μF capacitors.

Figure 41:

Proximity Sensing Using Separate Power Supplies

If it is not possible to provide two separate power supplies, the

device can be operated from a single supply. A 22Ω resistor in

series with the VDD supply line and a 1μF low ESR capacitor

effectively filter any power supply noise. The previous capacitor

placement considerations apply.

Application Information:

Hardware

TMD2672 INT

SDA

SCL

VDD

LEDA

1 mF

Voltage

Regulator

Voltage

Regulator

 10 mF

* Cap Value Per Regulator Manufacturer Recommendation

GND

VBUS

RPRPRPI

1 mF

LDR

LEDK

Page 32 ams Datasheet

Document Feedback [v1-00] 2015-Mar-23

TMD2672 − Application Information: Hardware

Figure 42:

Proximity Sensing Using Single Power Supply

VBUS in the above figures refers to the I²C bus voltage which is

either VDD or 1.8V. Be sure to apply the specified I²C bus voltage

shown in the Ordering Information table for the specific device

being used.

The I²C signals and the Interrupt are open-drain outputs and

require pull-up resistors. The pull-up resistor (RP) value is a

function of the I²C bus speed, the I²C bus voltage, and the

capacitive load. The ams EVM running at 400kbps, uses 1.5kΩ

resistors. A 10kΩ pull-up resistor (RPI) can be used for the

interrupt line.

1 mF

Voltage

Regulator

 10 mF

1 mF

22 W

TMD2672 INT

SDA

SCL

VDD

LEDA

GND

VBUS

RPRPRPI

LDR

LEDK

%llll %Illl I i T

ams Datasheet Page 33

[v1-00] 2015-Mar-23 Document Feedback

TMD2672 − Application Information: Hardware

PCB Pad Layout

Suggested PCB pad layout guidelines for the surface mount

module are shown in Figure 43. Flash Gold is recommended

surface finish for the landing pads.

Figure 43:

Suggested Module PCB Layout

Note(s) and/or Footnote(s):

1. All linear dimensions are in mm.

2. This drawing is subject to change without notice.

0.72  0.05

0.25  0.05

0.60  0.05 0.80  0.05

\\ ++\<—+ h="" ‘d—b‘="">

Page 34 ams Datasheet

Document Feedback [v1-00] 2015-Mar-23

TMD2672 − Package Info rmat ion

Figure 44:

Module Packaging Configuration

Note(s) and/or Footnote(s):

1. All linear dimensions are in millimeters. Dimension tolerance is ± 0.05mm unless otherwise noted.

2. Contacts are copper with NiPdAu plating.

3. This package contains no lead (Pb).

4. This drawing is subject to change without notice.

Package Information

0.60

0.25

BOTTOM VIEW

0.05

0.72

0.80

END VIEW

2.36  0.2

2.10  0.1

1.35

 0.

MODULE Dual Flat No-Lead

 1.0

3.73

 0.1

3.94

 0.2

Detector

LED

TOP VIEW SIDE VIEW

 0.9

1.18 0.58

2.40

Green

RoHS

ams Datasheet Page 35

[v1-00] 2015-Mar-23 Document Feedback

TMD2672 − Carrier Tape & Reel Information

Figure 45:

Module Carrier Tape

Note(s) and/or Footnote(s):

1. All linear dimensions are in millimeters. Dimension tolerance is ±0.10mm unless otherwise noted.

2. The dimensions on this drawing are for illustrative purposes only. Dimensions of an actual carrier may vary slightly.

3. Symbols on drawing Ao, Bo, and Ko are defined in ANSI EIA Standard 481-B 2001.

4. Each reel is 330 millimeters in diameter and contains 2500 parts.

5. ams packaging tape and reel conform to the requirements of EIA Standard 481-B.

6. In accordance with EIA standard, device pin 1 is located next to the sprocket holes in the tape.

7. This drawing is subject to change without notice.

Carrier Tape & Reel Information

Unit Orientation

TOP VIEW

DETAIL A

2.70

0.29

 0.02

8 Max

4.00

12.00

5.50  0.05

 1.50 2.00  0.05

+ 0.30

− 0.10

1.75

 1.00

 0.05

DETAIL B

4.30

6 Max

1.70

8.00

Page 36 ams Datasheet

Document Feedback [v1-00] 2015-Mar-23

TMD2672 − Soldering & Storage Information

Soldering Information

The module has been tested and has demonstrated an ability

to be reflow soldered to a PCB substrate. The process,

equipment, and materials used in these test are detailed below.

The solder reflow profile describes the expected maximum heat

exposure of components during the solder reflow process of

product on a PCB. Temperature is measured on top of

component. The components should be limited to a maximum

of three passes through this solder reflow profile.

Figure 46:

Solder Reflow Profile

Figure 47:

Solder Reflow Profile Graph

Parameter Reference Device

Average temperature gradient in preheating 2.5°C/sec

Soak time tsoak 2 to 3 minutes

Time above 217°C (T1)t

1Max 60 sec

Time above 230°C (T2)t

2Max 50 sec

Time above Tpeak - 10°C (T3)t

3Max 10 sec

Peak temperature in reflow Tpeak 260°C

Temperature gradient in cooling Max -5°C/sec

Soldering & Storage

Information

tsoak

Tpeak

Not to scale — for reference only

Time (sec)

Temperature (C)

ams Datasheet Page 37

[v1-00] 2015-Mar-23 Document Feedback

TMD2672 − Soldering & Storage Information

Storage Information

Moisture Sensitivity

Optical characteristics of the device can be adversely affected

during the soldering process by the release and vaporization of

moisture that has been previously absorbed into the package.

To ensure the package contains the smallest amount of

absorbed moisture possible, each device is dry-baked prior to

being packed for shipping. Devices are packed in a sealed

aluminized envelope called a moisture barrier bag with silica

gel to protect them from ambient moisture during shipping,

handling, and storage before use.

The Moisture Barrier Bags should be stored under the following

conditions:

• Temperature Range: < 40°C

• Relative Humidity: < 90%

• Total Time: No longer than 12 months from the date code

on the aluminized envelope if unopened.

Rebaking of the reel will be required if the devices have been

stored unopened for more than 12 months and the Humidity

Indicator Card shows the parts to be out of the allowable

moisture region.

Opened reels should be used within 168 hours if exposed to the

following conditions:

• Temperature Range: < 30°C

• Relative Humidity: < 60%

If rebaking is required, it should be done at 50°C for 12 hours.

The Module has been assigned a moisture sensitivity level of

MSL 3.

Page 38 ams Datasheet

Document Feedback [v1-00] 2015-Mar-23

TMD2672 − Ordering & Contact Information

Figure 48:

Ordering Information

Note(s) and/or Footnote(s):

1. Contact ams for availability.

Buy our products or get free samples online at:

www.ams.com/ICdirect

Technical Support is available at:

www.ams.com/Technical-Support

Provide feedback about this document at:

www.ams.com/Document-Feedback

For further information and requests, e-mail us at:

ams_sales@ams.com

For sales offices, distributors and representatives, please visit:

www.ams.com/contact

Headquarters

ams AG

Tobelbaderstrasse 30

8141 Unterpremstaetten

Austria, Europe

Tel: +43 (0) 3136 500 0

Website: www.ams.com

Device Address Leads Interface Description Ordering Number

TMD26721 0x39 Module-8 I²C Vbus = VDD Interface TMD26721

TMD26723 0x39 Module-8 I²C Vbus = 1.8V Interface TMD26723

TMD26725 (1) 0x29 Module-8 I²C Vbus = VDD Interface TMD26725

TMD26727 (1) 0x29 Module-8 I²C Vbus = 1.8V Interface TMD26727

Ordering & Contact Information

ams Datasheet Page 39

[v1-00] 2015-Mar-23 Document Feedback

TMD2672 − RoHS Compliant & ams Green Statement

RoHS: The term RoHS compliant means that ams AG products

fully comply with current RoHS directives. Our semiconductor

products do not contain any chemicals for all 6 substance

categories, including the requirement that lead not exceed

0.1% by weight in homogeneous materials. Where designed to

be soldered at high temperatures, RoHS compliant products are

suitable for use in specified lead-free processes.

ams Green (RoHS compliant and no Sb/Br): ams Green

defines that in addition to RoHS compliance, our products are

free of Bromine (Br) and Antimony (Sb) based flame retardants

(Br or Sb do not exceed 0.1% by weight in homogeneous

material).

Important Information: The information provided in this

statement represents ams AG knowledge and belief as of the

date that it is provided. ams AG bases its knowledge and belief

on information provided by third parties, and makes no

representation or warranty as to the accuracy of such

information. Efforts are underway to better integrate

information from third parties. ams AG has taken and continues

to take reasonable steps to provide representative and accurate

information but may not have conducted destructive testing or

chemical analysis on incoming materials and chemicals. ams AG

and ams AG suppliers consider certain information to be

proprietary, and thus CAS numbers and other limited

information may not be available for release.

RoHS Compliant & ams Green

Statement

Page 40 ams Datasheet

Document Feedback [v1-00] 2015-Mar-23

TMD2672 − Copyrights & Disclaimer

Unterpremstaetten, Austria-Europe. Trademarks Registered. All

rights reserved. The material herein may not be reproduced,

adapted, merged, translated, stored, or used without the prior

written consent of the copyright owner.

Devices sold by ams AG are covered by the warranty and patent

indemnification provisions appearing in its General Terms of

Trade. ams AG makes no warranty, express, statutory, implied,

or by description regarding the information set forth herein.

ams AG reserves the right to change specifications and prices

at any time and without notice. Therefore, prior to designing

this product into a system, it is necessary to check with ams AG

for current information. This product is intended for use in

commercial applications. Applications requiring extended

temperature range, unusual environmental requirements, or

high reliability applications, such as military, medical

life-support or life-sustaining equipment are specifically not

recommended without additional processing by ams AG for

each application. This product is provided by ams AG “AS IS”

and any express or implied warranties, including, but not

limited to the implied warranties of merchantability and fitness

for a particular purpose are disclaimed.

ams AG shall not be liable to recipient or any third party for any

damages, including but not limited to personal injury, property

damage, loss of profits, loss of use, interruption of business or

indirect, special, incidental or consequential damages, of any

kind, in connection with or arising out of the furnishing,

performance or use of the technical data herein. No obligation

or liability to recipient or any third party shall arise or flow out

of ams AG rendering of technical or other services.

Copyrights & Disclaimer

ams Datasheet Page 41

[v1-00] 2015-Mar-23 Document Feedback

TMD2672 − Document Status

Document Status Product Status Definition

Product Preview Pre-Development

Information in this datasheet is based on product ideas in

the planning phase of development. All specifications are

design goals without any warranty and are subject to

change without notice

Preliminary Datasheet Pre-Production

Information in this datasheet is based on products in the

design, validation or qualification phase of development.

The performance and parameters shown in this document

are preliminary without any warranty and are subject to

change without notice

Datasheet Production

Information in this datasheet is based on products in

ramp-up to full production or full production which

conform to specifications in accordance with the terms of

ams AG standard warranty as given in the General Terms of

Trade

Datasheet (discontinued) Discontinued

Information in this datasheet is based on products which

conform to specifications in accordance with the terms of

ams AG standard warranty as given in the General Terms of

Trade, but these products have been superseded and

should not be used for new designs

Document Status

Page 42 ams Datasheet

Document Feedback [v1-00] 2015-Mar-23

TMD2672 − Revision Information

1. Page and figure numbers for the previous version may differ from page and figure numbers in the current revision

2. Correction of typographical errors is not explicitly mentioned.

Changes from 149C (2012-Aug) to current revision 1-00 (2015-Mar-23) Page

Content of TAOS datasheet was converted to the latest ams design

Revision Information

ams Datasheet Page 43

[v1-00] 2015-Mar-23 Document Feedback

TMD2672 − Content Guide

1 General Description

2 Key Benefits & Features

2 Applications

3 End Products and Market Segments

3 Block Diagram

4 Detailed Description

5 Pin Assignments

6Absolute Maximum Ratings

7 Electrical Characteristics

11 Parameter Measurement Information

12 Typical Operating Characteristics

14 Principles of Operation

14 System State Machine

15 Proximity Detection

17 Interrupts

18 State Diagram

19 Power Management

20 I²C Protocol

21 Register Set

22 Command Register

23 Enable Register (0x00)

23 Proximity Time Control Register (0x02)

24 Wait Time Register (0x03)

24 Proximity Interrupt Threshold Register

(0x08 - 0x0B)

25 Persistence Register (0x0C)

25 Configuration Register (0x0D)

26 Proximity Pulse Count Register (0x0E)

27 Control Register (0x0F)

28 Revision Register (0x11)

28 ID Register (0x12)

29 Status Register (0x13)

29 Proximity Data Register (0x18 - 0x19h)

30 Proximity Offset Register (0x1E)

31 Application Information: Hardware

31 LED Driver Pin with Proximity Detection

33 PCB Pad Layout

34 Package Information

35 Carrier Tape & Reel Information

36 Soldering & Storage Information

36 Soldering Information

37 Storage Information

37 Moisture Sensitivity

38 Ordering & Contact Information

39 RoHS Compliant & ams Green Statement

40 Copyrights & Disclaimer

41 Document Status

42 Revision Information

Content Guide

Scheda tecnica TMD2672 di ams-OSRAM USA INC.

INFORMAZIONI

GUIDA

CONTATTI

SEGUICI