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D3+

D4+

SCL

SDA

THERM

ADD

V+

THERM2

TMP464

D1+

D2+

D-

GND

CDIFF

RS1 RS2

CDIFF

RS1 RS2

CDIFF

RS1 RS2

CDIFF

RS1 RS2

1.7 V to 3.6 V

CBYPASS

RSCL RSDA RT

RT2

2-Wire Interface

SMBus / I2C

Compatible

Controller

Overtemperature

Shutdown

Local

Zone 5

Remote

Zone 1

Remote

Zone 2

Remote

Zone 3

Remote

Zone 4

Product

Folder

Order

Now

Technical

Documents

Tools &

Software

Support &

Community

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

TMP464

SBOS835C –MAY 2017–REVISED OCTOBER 2019

TMP464 High-Accuracy 5-Channel (4-Remote and 1-Local) Temperature Sensor

1 Features

1• 4-Channel Remote Diode Temperature Sensor

• Local and Remote Accuracy: ±0.75°C (Maximum)

• Temperature Resolution: 0.0625°C

• Supply and Logic Voltage Range: 1.7 V to 3.6 V

• 43-µA Operating Current (1 SPS, All Channels

Active)

• 0.3-µA Shutdown Current

• Remote Diode: Series Resistance Cancellation,

η-Factor Correction, Offset Correction, and Diode

Fault Detection

• Register Lock Function Secures Key Registers

• I2C or SMBus™ Compatible Two-Wire Interface

With Pin-Programmable Address

• 16-pin VQFN Package

2 Applications

• MCU, GPU, ASIC, FPGA, DSP, and CPU

Temperature Monitoring

• Telecommunication Equipment

• Servers and Personal Computers

• Cloud Ethernet Switches

• Secure Data Centers

• Highly Integrated Medical Systems

• Precision Instruments and Test Equipment

• LED Lighting Thermal Control

3 Description

The TMP464 device is a high-accuracy, low-power

temperature sensor using a two-wire, SMBus or I2C

compatible interface. Up to four remote diode-

connected temperature zones can be monitored

simultaneously in addition to the local temperature.

Aggregating the temperature measurements across a

system allows improved performance through tighter

guard bands and can reduce board complexity. A

typical use case is for monitoring the temperature

across different processors, such as MCUs, GPUs,

and FPGAs in complex systems such as servers and

telecommunications equipment. Advanced features

such as series resistance cancellation, programmable

non-ideality factor, programmable offset, and

programmable temperature limits are included to

provide a robust thermal monitoring solution with

improved accuracy and noise immunity.

Each of the four remote channels (and the local

channel) can be programmed independently with two

thresholds that are triggered when the corresponding

temperature is exceeded at the measured location. In

addition, there is a programmable hysteresis setting

to avoid constant toggling around the threshold.

The TMP464 device provides high accuracy (0.75°C)

and high resolution (0.0625°C) measurement

capabilities. The device supports low voltage rails

(1.7 V to 3.6 V), common two-wire interfaces, and is

available in a small, space efficient package (3 mm ×

3 mm) for easy integration into computing systems.

The remote junction supports a temperature range

from –55°C to +150°C. The TMP464 has a

preprogrammed temperature limit of 125°C.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)

TMP464 VQFN (16) 3.00 mm × 3.00 mm

(1) For all available packages, see the orderable addendum at

the end of the data sheet.

Typical Application Schematic

See the Design Requirements section for remote diode recommendations.

l TEXAS INSTRUMENTS

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Table of Contents

1 Features.................................................................. 1

2 Applications ........................................................... 1

3 Description ............................................................. 1

4 Revision History..................................................... 2

5 Pin Configuration and Functions......................... 3

6 Specifications......................................................... 4

6.1 Absolute Maximum Ratings ...................................... 4

6.2 ESD Ratings.............................................................. 4

6.3 Recommended Operating Conditions....................... 4

6.4 Thermal Information.................................................. 4

6.5 Electrical Characteristics........................................... 5

6.6 Two-Wire Timing Requirements ............................... 6

6.7 Typical Characteristics.............................................. 7

7 Detailed Description.............................................. 9

7.1 Overview ................................................................... 9

7.2 Functional Block Diagram......................................... 9

7.3 Feature Description................................................. 10

7.4 Device Functional Modes........................................ 12

7.5 Programming........................................................... 12

7.6 Register Maps......................................................... 18

8 Application and Implementation ........................ 28

8.1 Application Information............................................ 28

8.2 Typical Application .................................................. 28

9 Power Supply Recommendations...................... 31

10 Layout................................................................... 32

10.1 Layout Guidelines ................................................. 32

10.2 Layout Example .................................................... 33

11 Device and Documentation Support ................. 34

11.1 Receiving Notification of Documentation Updates 34

11.2 Community Resources.......................................... 34

11.3 Trademarks........................................................... 34

11.4 Electrostatic Discharge Caution............................ 34

11.5 Glossary................................................................ 34

12 Mechanical, Packaging, and Orderable

Information ........................................................... 34

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision B (August 2017) to Revision C Page

• Changed the Device ID code from: 0x0464 to: 0x1468 ...................................................................................................... 27

Changes from Revision A (June 2017) to Revision B Page

• Changed 'QFN' to 'VQFN' in table header as per industry standard ..................................................................................... 4

Changes from Original (May 2017) to Revision A Page

• Updated packaging information ........................................................................................................................................... 34

*9 TEXAS INSTRUMENTS

16 NC5D2+

1NC 12 SDA

15 NC6D1+

2NC 11 THERM2

14 V+7D±

3D4+ 10 THERM

13 SCL8GND

4D3+ 9 ADD

Not to scale

Thermal Pad

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5 Pin Configuration and Functions

TMP464 RGT Package

16-Pin VQFN With Exposed Thermal Pad

Top View

NC - No internal connection

Pin Functions

PIN TYPE DESCRIPTION

NAME NO.

ADD 9 Digital Input Address select. Connect to GND, V+, SDA, or SCL.

D1+ 6 Analog input Positive connection to remote temperature sensors. A total of 4 remote channels are

supported. An unused channel must be connected to D–.

D2+ 5 Analog input Positive connection to remote temperature sensors. A total of 4 remote channels are

supported. An unused channel must be connected to D–.

D3+ 4 Analog input Positive connection to remote temperature sensors. A total of 4 remote channels are

supported. An unused channel must be connected to D–.

D4+ 3 Analog input Positive connection to remote temperature sensors. A total of 4 remote channels are

supported. An unused channel must be connected to D–.

D– 7 Analog input Negative connection to remote temperature sensors. Common for 4 remote channels.

GND 8 Ground Supply ground connection

NC 1, 2, 15, 16 — No connection, may be left floating or connected to GND or V+

SCL 13 Digital input Serial clock line for I2C or SMBus compatible two-wire interface.

Input; requires a pullup resistor to a voltage between 1.7 V and 3.6 V (not necessarily V+) if

driven by an open-drain output.

SDA 12 Bidirectional digital

input-output Serial data line for I2C- or SMBus compatible two-wire interface. Open-drain; requires a pullup

resistor to a voltage between 1.7 V and 3.6 V, not necessarily V+.

THERM 10 Digital output Thermal shutdown or fan-control pin.

Active low; open-drain; requires a pullup resistor to a voltage between 1.7 V and 3.6 V, not

necessarily V+. If this pin is not used it may be left open or grounded.

THERM2 11 Digital output Second THERM output.

Active low; open-drain; requires a pullup resistor to a voltage between 1.7 V and 3.6 V, not

necessarily V+. If this pin is not used it may be left open or grounded.

V+ 14 Power supply Positive supply voltage, 1.7 V to 3.6 V; requires 0.1-µF bypass capacitor to ground.

l TEXAS INSTRUMENTS

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(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN MAX UNIT

Power supply V+ –0.3 6 V

Input voltage

THERM, THERM2, SDA, SCL, and ADD only –0.3 6

VD1+ through D4+ –0.3 ((V+) + 0.3)

and ≤6

D– only –0.3 0.3

Input current SDA sink –25 mA

All other pins –10 10

Operating temperature –55 150 °C

Junction temperature (TJ, maximum) 150 °C

Storage temperature, Tstg –60 150 °C

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE UNIT

V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V

Charged device model (CDM), JEDEC specification JESD22-C101(2) ±750

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN NOM MAX UNIT

V+ Supply voltage 1.7 3.6 V

TAOperating free-air temperature –40 125 °C

TDRemote junction temperature –55 150 °C

6.4 Thermal Information

THERMAL METRIC

TMP464

UNITRGT (VQFN)

16 PINS

RθJA Junction-to-ambient thermal resistance 46 °C/W

RθJC(top) Junction-to-case (top) thermal resistance 43 °C/W

RθJB Junction-to-board thermal resistance 17 °C/W

ψJT Junction-to-top characterization parameter 0.8 °C/W

ψJB Junction-to-board characterization parameter 5 °C/W

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6.5 Electrical Characteristics

at TA= –40°C to +125°C and V+ = 1.7 V to 3.6 V (unless otherwise noted)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

TEMPERATURE MEASUREMENT

TLOCAL Local temperature sensor accuracy TA= –40°C to 100°C, V+ = 1.7 V to 3.6 V –0.75 ±0.125 0.75 °C

TA= –40°C to 125°C, V+ = 1.7 V to 3.6 V –1 ±0.5 1 °C

TREMOTE Remote temperature sensor accuracy

TA= –10°C to 85°C, TD= –55°C to 150°C

V+ = 1.7 V to 3.6 V –0.75 ±0.125 0.75

TA= –40°C to 125°C, TD= –55°C to 150°C

V+ = 1.7 V to 3.6 V –1 ±0.5 1 °C

Local temperature error supply sensitivity V+ = 1.7 V to 3.6 V –0.15 ±0.05 0.15 °C/V

Remote temperature error supply sensitivity V+ = 1.7 V to 3.6 V –0.25 ±0.1 0.25 °C/V

Temperature resolution

(local and remote) 0.0625 °C

ADC conversion time One-shot mode, per channel (local or remote) 16 17 ms

ADC resolution 13 Bits

Remote sensor

source current

High

Series resistance 1 kΩ(maximum)

120

µAMedium 45

Low 7.5

ηRemote transistor ideality factor 1.008

SERIAL INTERFACE (SCL, SDA)

VIH High-level input voltage 0.7 × (V+) V

VIL Low-level input voltage 0.3 × (V+) V

Hysteresis 200 mV

SDA output-low sink current 20 mA

VOL Low-level output voltage IO= –20 mA, V+ ≥2 V 0.15 0.4 V

IO= –15 mA, V+ < 2 V 0.2 × V+ V

Serial bus input leakage current 0 V ≤VIN ≤3.6 V –1 1 μA

Serial bus input capacitance 4 pF

DIGITAL INPUTS (ADD)

VIH High-level input voltage 0.7 × (V+) V

VIL Low-level input voltage –0.3 0.3 × (V+) V

Input leakage current 0 V ≤VIN ≤3.6 V –1 1 μA

Input capacitance 4 pF

DIGITAL OUTPUTS (THERM, THERM2)

Output-low sink current VOL = 0.4 V 6 mA

VOL Low-level output voltage IO= –6 mA 0.15 0.4 V

IOH High-level output leakage current VO= V+ 1 μA

POWER SUPPLY

V+ Specified supply voltage range 1.7 3.6 V

IQQuiescent current

Active conversion, local sensor 240 375

µA

Active conversion, remote sensors 400 600

Standby mode (between conversions) 15 21

Shutdown mode, serial bus inactive 0.3 4

Shutdown mode, serial bus active, fS= 400 kHz 120 µA

Shutdown mode, serial bus active, fS= 2.56 MHz 300 µA

POR Power-on-reset threshold Rising edge 1.5 1.65 V

Falling edge 1 1.2 1.35

POH Power-on-reset hysteresis 0.2 V

‘5‘ TEXAS INSTRUMENTS

P S

t(HD:STA)

t(HD:DAT)

t(HIGH)

t(SU:DAT)

t(SU:STO)

S P

SCL

SDA

t(LOW)

VIH

VIL

t(BUF)

VIH

VIL

t(SU:STA)

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(1) The maximum tHD;DAT can be 0.9 µs for fast mode, and is less than the maximum tVD;DAT by a transition time.

(2) tVD;DAT = time for data signal from SCL LOW to SDA output (HIGH to LOW, depending on which is worse).

6.6 Two-Wire Timing Requirements

at TA= –40°C to +125°C and V+ = 1.7 V to 3.6 V (unless otherwise noted)

The master and the slave have the same V+ value. Values are based on statistical analysis of samples tested during initial

release.

MIN MAX UNIT

fSCL SCL operating frequency Fast mode 0.001 0.4 MHz

High-speed mode 0.001 2.56

tBUF Bus free time between stop and start

condition

Fast mode 1300 ns

High-speed mode 160

tHD;STA Hold time after repeated start condition.

After this period, the first clock is generated.

Fast mode 600 ns

High-speed mode 160

tSU;STA Repeated start condition setup time Fast mode 600 ns

High-speed mode 160

tSU;STO Stop condition setup time Fast mode 600 ns

High-speed mode 160

tHD;DAT Data hold time Fast mode 0 (1)ns

High-speed mode 0 130

tVD;DAT Data valid time(2) Fast mode 0 900 ns

High-speed mode — —

tSU;DAT Data setup time Fast mode 100 ns

High-speed mode 20

tLOW SCL clock low period Fast mode 1300 ns

High-speed mode 250

tHIGH SCL clock high period Fast mode 600 ns

High-speed mode 60

tF– SDA Data fall time Fast mode 20 × (V+ / 5.5) 300 ns

High-speed mode 100

tF, tR– SCL Clock fall and rise time Fast mode 300 ns

High-speed mode 40

tRRise time for SCL ≤100 kHz Fast mode 1000 ns

High-speed mode

Serial bus timeout Fast mode 15 20 ms

High-speed mode 15 20

Figure 1. Two-Wire Timing Diagram

l TEXAS INSTRUMENTS ‘m 4500 n

Series Resistance (:)

Remote Temperature Error (qC)

0 500 1000 1500 2000 2500 3000 3500 4000 4500

-0.5

-0.4

-0.3

-0.2

-0.1

0.1

0.2

0.3

0.4

0.5

V+ = 1.8 V

V+ = 3.6 V

Differential Capacitance (nF)

Remote Temperature Error (qC)

0 2 4 6 8 10 12 14 16 18 20

-40

-35

-30

-25

-20

-15

-10

-5

Remote Error Power Supply Sensitivity (°C/V)

Device Junction Temperature (°C)

60-40 40 12080 100

-0.6

-0.4

-0.2

0.2

0.4

0.8

0.6

Min Limit

-0.8

-1

Max Limit Average + 3V

-20 0 20

Average - 3V

Typical Units

Leakage Resistance (M:)

Remote Temperature Error (qC)

1 10 100

-40

-30

-20

-10

D+ to V+

D+ to GND

Ambient Temperature (qC)

Local Temperature Error (qC)

-40 -20 0 20 40 60 80 100 120

-1.5

-1

-0.5

0.5

1.5

Average + 3V

Average - 3V

Max Limit

Min Limit

Typical Units

Device Junction Temperature (qC)

Remote Temperature Error (qC)

-50 -25 0 25 50 75 100 125

-1.5

-1

-0.5

0.5

1.5

Average + 3V

Average - 3V

Max Limit

Min Limit

Typical Units

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6.7 Typical Characteristics

at TA= 25°C and V+ = 3.6 V (unless otherwise noted)

Typical behavior of 75 devices over temperature at V+ = 1.8 V

Figure 2. Local Temperature Error vs Ambient Temperature

Typical behavior of 75 devices over temperature at V+ = 1.8 V

with the remote diode junction at 150°C.

Figure 3. Remote Temperature Error vs Device Junction

Temperature

Typical behavior of 30 devices over temperature with V+ from 1.8

V to 3.6 V

Figure 4. Remote Temperature Error Power Supply

Sensitivity vs Device Junction Temperature Figure 5. Remote Temperature Error vs Leakage Resistance

No physical capacitance during measurement

Figure 6. Remote Temperature Error vs Series Resistance

No physical series resistance on D+, D– pins during measurement

Figure 7. Remote Temperature Error vs

Differential Capacitance

l TEXAS INSTRUMENTS 400 800 10M 400

V+ Voltage (V)

V+ Current (PA)

1.5 2 2.5 3 3.5 4

300

310

320

330

340

350

360

370

380

390

400

V+ Voltage (V)

Shutdown Supply Current (PA)

1.5 2 2.5 3 3.5 4

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

Conversion Rate (Hz)

Supply Current (PA)

0.05 0.1 1 10 100

120

160

200

240

280

320

360

400

V+ = 1.8 V

V+ = 3.6 V

Frequency (Hz)

V+ Current (PA)

100

200

300

400

500

600

700

800

1k 10k 100k 1M 10M

V+ = 1.8 V

V+ = 3.6 V

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Typical Characteristics (continued)

at TA= 25°C and V+ = 3.6 V (unless otherwise noted)

Figure 8. Quiescent Current vs Conversion Rate ° Figure 9. Shutdown Quiescent Current

vs SCL Clock Frequency

Figure 10. Quiescent Current vs Supply Voltage

(at Default Conversion Rate of 16 Conversions Per Second) Figure 11. Shutdown Quiescent Current vs Supply Voltage

l TEXAS INSTRUMENTS

ADC

Oscillator

Voltage

Reference

MUX

Bank

Serial

Interface

Control

Logic

MUX

16 × I 6 × I I

V+

Local

Thermal

BJT

ADD

SCL

SDA

D1+

D2+

D3+

D4+

GND

V+

THERM

THERM2

D-

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7 Detailed Description

7.1 Overview

The TMP464 device is a digital temperature sensor that combines a local temperature measurement channel

and four remote-junction temperature measurement channels in a VQFN-16 package. The device has a two-

wire-interface that is compatible with I2C or SMBus interfaces and includes four pin-programmable bus address

options. The TMP464 is specified over a local device temperature range from –40°C to +125°C. The TMP464

device also contains multiple registers for programming and holding configuration settings, temperature limits,

and temperature measurement results. The TMP464 pinout includes THERM and THERM2 outputs that signal

overtemperature events based on the settings of temperature limit registers.

7.2 Functional Block Diagram

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(1) Resolution is 0.0625°C per count. Negative numbers are represented in two's-complement format.

7.3 Feature Description

7.3.1 Temperature Measurement Data

The local and remote temperature sensors have a resolution of 13 bits (0.0625°C). Temperature data that result

from conversions within the default measurement range are represented in binary form, as shown in the

Standard Binary column of Table 1. Negative numbers are represented in two's-complement format. The

resolution of the temperature registers extends to 255.9375°C and down to –256°C, but the actual device is

limited to ranges as specified in the Electrical Characteristics table to meet the accuracy specifications. The

TMP464 device is specified for ambient temperatures ranging from –40°C to +125°C; parameters in the Absolute

Maximum Ratings table must be observed to prevent damage to the device.

Table 1. Temperature Data Format (Local and Remote Temperature)

TEMPERATURE

(°C)

LOCAL OR REMOTE TEMPERATURE REGISTER VALUE

(0.0625°C RESOLUTION)

STANDARD BINARY(1)

BINARY HEX

–64 1110 0000 0000 0000 E0 00

–50 1110 0111 0000 0000 E7 00

–25 1111 0011 1000 0000 F3 80

–0.1250 1111 1111 1111 0000 FF F0

–0.0625 1111 1111 1111 1000 FF F8

0 0000 0000 0000 0000 00 00

0.0625 0000 0000 0000 1000 00 08

0.1250 0000 0000 0001 0000 00 10

0.1875 0000 0000 0001 1000 00 18

0.2500 0000 0000 0010 0000 00 20

0.3125 0000 0000 0010 1000 00 28

0.3750 0000 0000 0011 0000 00 30

0.4375 0000 0000 0011 1000 00 38

0.5000 0000 0000 0100 0000 00 40

0.5625 0000 0000 0100 1000 00 48

0.6250 0000 0000 0101 0000 00 50

0.6875 0000 0000 0101 1000 00 58

0.7500 0000 0000 0110 0000 00 60

0.8125 0000 0000 0110 1000 00 68

0.8750 0000 0000 0111 0000 00 70

0.9375 0000 0000 0111 1000 00 78

1 0000 0000 1000 0000 00 80

5 0000 0010 1000 0000 02 80

10 0000 0101 0000 0000 05 00

25 0000 1100 1000 0000 0C 80

50 0001 1001 0000 0000 19 00

75 0010 0101 1000 0000 25 80

100 0011 0010 0000 0000 32 00

125 0011 1110 1000 0000 3E 80

127 0011 1111 1000 0000 3F 80

150 0100 1011 0000 0000 4B 00

175 0101 0111 1000 0000 57 80

191 0101 1111 1000 0000 5F 80

l TEXAS INSTRUMENTS

Temperature (°C)

100

THERM2

THERM Limit

THERM Limit - Hysteresis

THERM

110

120

130

140

150

Temperature Conversion Complete

Time

Measured

Temperature

THERM2 Limit

THERM2 Limit - Hysteresis

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Both local and remote temperature data use two bytes for data storage with a two's-complement format for

negative numbers. The high byte stores the temperature with 2°C resolution. The second or low byte stores the

decimal fraction value of the temperature and allows a higher measurement resolution, as shown in Table 1. The

measurement resolution for both the local and the remote channels is 0.0625°C.

7.3.2 Series Resistance Cancellation

Series resistance cancellation automatically eliminates the temperature error caused by the resistance of the

routing to the remote transistor or by the resistors of the optional external low-pass filter. A total up to 1-kΩseries

resistance can be cancelled by the TMP464 device, which eliminates the need for additional characterization and

temperature offset correction. See Figure 6 for details on the effects of series resistance on sensed remote

temperature error.

7.3.3 Differential Input Capacitance

The TMP464 device tolerates differential input capacitance of up to 1000 pF with minimal change in temperature

error. The effect of capacitance on the sensed remote temperature error is illustrated in Figure 7.

7.3.4 Sensor Fault

The TMP464 device can sense a fault at the D+ resulting from an incorrect diode connection. The TMP464

device can also sense an open circuit. Short-circuit conditions return a value of –256°C. The detection circuitry

consists of a voltage comparator that trips when the voltage at D+ exceeds (V+) – 0.3 V (typical). The

comparator output is continuously checked during a conversion. If a fault is detected, then the RxOP bit in the

Remote Channel Status register is set to 1.

When not using the remote sensor with the TMP464 device, the corresponding D+ and D– inputs must be

connected together to prevent meaningless fault warnings.

7.3.5 THERM Functions

Operation of the THERM (pin 10) and THERM2 (pin 11) interrupt pins are shown in Figure 12.

The hysteresis value is stored in the THERM Hysteresis register and applies to both the THERM and THERM2

interrupts.

Figure 12. THERM and THERM2 Interrupt Operation

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7.4 Device Functional Modes

7.4.1 Shutdown Mode (SD)

The TMP464 shutdown mode enables the user to save maximum power by shutting down all device circuitry

other than the serial interface, and reducing current consumption to typically less than 0.3 μA; see Figure 11.

Shutdown mode is enabled when the shutdown bit (SD, bit 5) of the Configuration Register is HIGH; the device

shuts down immediately. When the SD bit is LOW, the device maintains a continuous-conversion state.

7.5 Programming

7.5.1 Serial Interface

The TMP464 device operates only as a slave device on the two-wire bus (I2C or SMBus). Connections to either

bus are made using the open-drain I/O lines, SDA, and SCL. The SDA and SCL pins feature integrated spike

suppression filters and Schmitt triggers to minimize the effects of input spikes and bus noise. The TMP464

device supports the transmission protocol for fast (1 kHz to 400 kHz) and high-speed (1 kHz to 2.56 MHz)

modes. All data bytes are transmitted MSB first.

While the TMP464 device is unpowered bus traffic on SDA and SCL may continue without any adverse effects to

the communication or to the TMP464 device itself. As the TMP464 device is powering up, the device does not

load the bus, and as a result the bus traffic may continue undisturbed.

7.5.1.1 Bus Overview

The TMP464 device is compatible with the I2C or SMBus interface. In I2C or SMBus protocol, the device that

initiates the transfer is called a master, and the devices controlled by the master are slaves. The bus must be

controlled by a master device that generates the serial clock (SCL), controls the bus access, and generates the

start and stop conditions.

To address a specific device, a start condition is initiated. A start condition is indicated by pulling the data line

(SDA) from a high-to-low logic level when SCL is high. All slaves on the bus shift in the slave address byte, with

the last bit indicating whether a read or write operation is intended. During the ninth clock pulse, the addressed

slave responds to the master by generating an acknowledge (ACK) bit and pulling SDA low.

Data transfer is then initiated and sent over eight clock pulses followed by an acknowledge bit (ACK). During

data transfer, SDA must remain stable when SCL is high. A change in SDA when SCL is high is interpreted as a

control signal. The TMP464 device has a word register structure (16-bit wide), with data writes always requiring

two bytes. Data transfer occurs during the ACK at the end of the second byte.

After all data are transferred, the master generates a stop condition. A stop condition is indicated by pulling SDA

from low to high when SCL is high.

l TEXAS INSTRUMENTS W ( ”03‘ H H ,., -------- -mmmm

1 9 1 9

ACK

Device

Start by

Master

R/W0 1 A0

1 0 A1 P7 P6 P5 P4 P3 P2 P1 P0

ACK

Device

Frame 1

Serial Bus Address Byte

from Master

Frame 2

Pointer Byte from Master

D7 D6 D5 D4 D3 D2 D1 D0

1 9

ACK

Device

Stop

Master

1 9

D15 D14 D13 D12 D11 D10 D9 D8

ACK

Device

Frame 3

Word MSB from Master

Frame 4

Word LSB from Master

SCL

(continued)

SDA

(continued)

SCL

SDA

1 9 1 9

ACK

Device

Start by

Master

SCL

SDA R/W

0 1 A0

1 0 A1

ACK

Device

Frame 1

Serial Bus Address

Byte from Master

Frame 2

Pointer Byte

from Master

P7 P6 P5 P4 P3 P2 P1 P0

Stop

Master

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Programming (continued)

7.5.1.2 Bus Definitions

The TMP464 device has a two-wire interface that is compatible with the I2C or SMBus interface. Figure 13

through Figure 18 illustrate the timing for various operations on the TMP464 device. The bus definitions are as

follows:

Bus Idle: Both SDA and SCL lines remain high.

Start Data Transfer: A change in the state of the SDA line (from high to low) when the SCL line is high defines

a start condition. Each data transfer initiates with a start condition.

Stop Data Transfer: A change in the state of the SDA line (from low to high) when the SCL line is high defines

a stop condition. Each data transfer terminates with a repeated start or stop condition.

Data Transfer: The number of data bytes transferred between a start and stop condition is not limited and is

determined by the master device. The receiver acknowledges the data transfer.

Acknowledge: Each receiving device, when addressed, is obliged to generate an acknowledge bit. A device

that acknowledges must pull down the SDA line during the acknowledge clock pulse in such a way

that the SDA line is stable low during the high period of the acknowledge clock pulse. Take setup

and hold times into account. On a master receive, data transfer termination can be signaled by the

master generating a not-acknowledge on the last byte that is transmitted by the slave.

Figure 13. Two-Wire Timing Diagram for Write Pointer Byte

Figure 14. Two-Wire Timing Diagram for Write Pointer Byte and Value Word

l TEXAS INSTRUMENTS

D7 D6 D5 D4 D3 D2 D1 D0

1 9 1 9

ACK

Device

Repeat

Start by

Master

NACK

Master

SCL

(continued)

SDA

(continued) Stop

Master

R/W

0 1 A0

1 0 A1

1 9

D15 D14 D13 D12 D11 D10 D9 D8

ACK

Master

Frame 3

Serial Bus Address

Byte from Master

Frame 4

Data Byte 1 from

Device

Frame 5

Data Byte 2 from

Device

1 9 1 9

ACK

Device

Start by

Master

SCL

SDA R/W

0 1 A0

1 0 A1

ACK

Device

Frame 1

Serial Bus Address

Byte from Master

Frame 2

Pointer Byte

from Master

P7 P6 P5 P4 P3 P2 P1 P0

1 9 1 9

ACK

Device

Repeat

Start by

Master

NACK

Master

SCL

(continued)

SDA

(continued) Stop

Master

R/W

0 1 A0

1 0 A1 D15 D14 D13 D12 D11 D10 D9 D8

Frame 3

Serial Bus Address

Byte from Master

Frame 4

Data Byte 1 from

Device

1 9 1 9

ACK

Device

Start by

Master

SCL

SDA R/W

0 1 A0

1 0 A1

ACK

Device

Frame 1

Serial Bus Address

Byte from Master

Frame 2

Pointer Byte

from Master

P7 P6 P5 P4 P3 P2 P1 P0

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Programming (continued)

(1) The master must leave SDA high to terminate a single-byte read operation.

Figure 15. Two-Wire Timing Diagram for Pointer Set Followed by a Repeat Start and Single-Byte Read

Format

Figure 16. Two-Wire Timing Diagram for Pointer Byte Set Followed by a Repeat Start and Word (Two-

Byte) Read

l TEXAS INSTRUMENTS um."- 07 «EM 3 Device 3 Device mm m‘ /‘ m7 4*7 4» Device i Device

D7 D6 D5 D4 D3 D2 D1 D0

1 9 1 9

ACK

Device

Start by

Master

ACK

Master

SCL

SDA R/W

0 1 A0

1 0 A1

1 9

D15 D14 D13 D12 D11 D10 D9 D8

ACK

Master

Frame 3

Serial Bus Address

Byte from Master

Frame 4

Word 1 MSB from

Device

Frame 5

Word 1 LSB from

Device

D7 D6 D5 D4 D3 D2 D1 D0

1 9

NACK

Master

Stop

Master

1 9

D15 D14 D13 D12 D11 D10 D9 D8

ACK

Master

Frame (2N + 2)

Word N MSB from

Device

Frame (2N + 3)

Word N LSB from

Device

SCL

(continued)

SDA

(continued)

D7 D6 D5 D4 D3 D2 D1 D0

1 9 1 9

ACK

Device

Repeat

Start by

Master

ACK

Master

SCL

(continued)

SDA

(continued) R/W

0 1 A0

1 0 A1

1 9

D15 D14 D13 D12 D11 D10 D9 D8

ACK

Master

Frame 3

Serial Bus Address

Byte from Master

Frame 4

Word 1 MSB from

Device

Frame 5

Word 1 LSB from

Device

1 9 1 9

ACK

Device

Start by

Master

SCL

SDA R/W

0 1 A0

1 0 A1

ACK

Device

Frame 1

Serial Bus Address

Byte from Master

Frame 2

Pointer Byte from

Master

P7 P6 P5 P4 P3 P2 P1 P0

D7 D6 D5 D4 D3 D2 D1 D0

1 9

NACK

Master

Stop

Master

1 9

D15 D14 D13 D12 D11 D10 D9 D8

ACK

Master

Frame (2N + 2)

Word N MSB from

Device

Frame (2N + 3)

Word N LSB from

Device

SCL

(continued)

SDA

(continued)

80h Block Read Auto Increment Pointer

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Programming (continued)

Figure 17. Two-Wire Timing Diagram for Pointer Byte Set Followed by a Repeat Start and Multiple-Word

(N-Word) Read

Figure 18. Two-Wire Timing Diagram for Multiple-Word (N-Word) Read Without a Pointer Byte Set

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Programming (continued)

7.5.1.3 Serial Bus Address

To communicate with the TMP464 device, the master must first address slave devices using a slave address

byte. The slave address byte consists of seven address bits and a direction bit indicating the intent of executing a

read or write operation. The TMP464 device allows up to four devices to be addressed on a single bus. The

assigned device address depends on the ADD pin connection as described in Table 2.

Table 2. TMP464 Slave Address Options

ADD PIN CONNECTION SLAVE ADDRESS

BINARY HEX

GND 1001000 48

V+ 1001001 49

SDA 1001010 4A

SCL 1001011 4B

7.5.1.4 Read and Write Operations

Accessing a particular register on the TMP464 device is accomplished by writing the appropriate value to the

pointer register. The value for the pointer register is the first byte transferred after the slave address byte with the

R/W bit low. Every write operation to the TMP464 device requires a value for the pointer register (see Figure 14).

The TMP464 registers can be accessed with block or single register reads. Block reads are only supported for

pointer values 80h to 84h. Registers at 80h through 84h mirror the Remote and Local Temperature registers (00h

to 04h). Pointer values 00h to 04h are for single register reads.

7.5.1.4.1 Single Register Reads

When reading from the TMP464 device, the last value stored in the pointer register by a write operation is used

to determine which register is read by a read operation. To change which register is read for a read operation, a

new value must be written to the pointer register. This transaction is accomplished by issuing a slave address

byte with the R/W bit low, followed by the pointer register byte; no additional data are required. The master can

then generate a start condition and send the slave address byte with the R/W bit high to initiate the read

command; see Figure 15 through Figure 17 for details of this sequence.

If repeated reads from the same register are desired, continually sending the pointer register bytes is not

necessary because the TMP464 device retains the pointer register value until the value is changed by the next

write operation. The register bytes are sent by the MSB first, followed by the LSB. If only one byte is read (MSB),

a consecutive read of TMP464 device results in the MSB being transmitted first. The LSB can only be accessed

through two-byte reads.

The master terminates a read operation by issuing a not-acknowledge (NACK) command at the end of the last

byte to be read or transmitting a stop condition. For a single-byte operation, the master must leave the SDA line

high during the acknowledge time of the first byte that is read from the slave.

The TMP464 register structure has a word (two-byte) length, so every write transaction must have an even

number of bytes (MSB and LSB) following the pointer register value (see Figure 14). Data transfers occur during

the ACK at the end of the second byte or LSB. If the transaction does not finish, signaled by the ACK at the end

of the second byte, then the data is ignored and not loaded into the TMP464 register. Read transactions do not

have the same restrictions and may be terminated at the end of the last MSB.

7.5.1.4.2 Block Register Reads

The TMP464 supports block mode reads at address 80h through 84h for temperature results alone. Setting the

pointer register to 80h signals to the TMP464 device that a block of more than two bytes must be transmitted

before a stop is issued. In this mode, the TMP464 device auto increments the internal pointer. If the transmission

is terminated before register 84h is read, the pointer increments so a consecutive read (without a pointer set) can

access the next register.

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7.5.1.5 Timeout Function

The TMP464 device resets the serial interface if either SCL or SDA are held low for 17.5 ms (typical) between a

start and stop condition. If the TMP464 device is holding the bus low, the device releases the bus and waits for a

start condition. To avoid activating the timeout function, maintain a communication speed of at least 1 kHz for the

SCL operating frequency.

7.5.1.6 High-Speed Mode

For the two-wire bus to operate at frequencies above 1 MHz, the master device must issue a high-speed mode

(HS-mode) master code (0000 1xxx) as the first byte after a start condition to switch the bus to high-speed

operation. The TMP464 device does not acknowledge the master code byte, but switches the input filters on

SDA and SCL and the output filter on SDA to operate in HS-mode, allowing transfers up to 2.56 MHz. After the

HS-mode master code is issued, the master transmits a two-wire slave address to initiate a data transfer

operation. The bus continues to operate in HS-mode until a stop condition occurs on the bus. Upon receiving the

stop condition, the TMP464 device switches the input and output filters back to fast mode.

7.5.2 TMP464 Register Reset

The TMP464 registers can be software reset by setting bit 15 of the Software Reset register (20h) to 1. This

software reset restores the power-on-reset state to all TMP464 registers and aborts any conversion in progress.

7.5.3 Lock Register

All of the configuration and limit registers may be locked for writes (making the registers write-protected), which

decreases the chance of software runaway from issuing false changes to these registers. The Lock column in

Table 3 identifies which registers may be locked. Lock mode does not effect read operations. To activate the lock

mode, Lock Register C4h must be set to 0x5CA6. The lock only remains active while the TMP464 device is

powered up. Because the TMP464 device does not contain nonvolatile memory, the settings of the configuration

and limit registers are lost once a power cycle occurs regardless if the registers are locked or unlocked.

In lock mode, the TMP464 device ignores a write operation to configuration and limit registers except for Lock

mode, so the registers must be unlocked before the registers accept writes of new data.

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(1) Register bits highlighted in purple are reserved for future use and always reports 0; writes to these bits are ignored.

(2) Register bits highlighted in green show sign extended values.

7.6 Register Maps

Table 3. Register Map

PTR POR Lock TMP464 Functional Registers - BIT DESCRIPTION REGISTER DESCRIPTION

(HEX) (HEX) (Y/N) 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0

00 0000 N/A LT12 LT11 LT1

0LT9 LT8 LT7 LT6 LT5 LT4 LT3 LT2 LT1 LT0 0(1) 0 0 Local temperature

01 0000 N/A RT12 RT11 RT

10 RT9 RT8 RT7 RT

6RT

5RT4 RT3 RT2 RT1 RT0 0 0 0 Remote temperature 1

02 0000 N/A RT12 RT11 RT

10 RT9 RT8 RT7 RT

6RT

5RT4 RT3 RT2 RT1 RT0 0 0 0 Remote temperature 2

03 0000 N/A RT12 RT11 RT

10 RT9 RT8 RT7 RT

6RT

5RT4 RT3 RT2 RT1 RT0 0 0 0 Remote temperature 3

04 0000 N/A RT12 RT11 RT

10 RT9 RT8 RT7 RT

6RT

5RT4 RT3 RT2 RT1 RT0 0 0 0 Remote temperature 4

20 0000 N/A RST 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Software Reset Register

21 N/A N/A 0 0 0 0 R4TH R3TH R2

TH R1

TH LTH 0 0 0 0 0 0 0 THERM Status

22 N/A N/A 0 0 0 0 R4TH

2R3TH

2R2

LTH2 0 0 0 0 0 0 0 THERM2 Status

23 N/A N/A 0 0 0 0 R4O

PN R3O

PN R2

0 0 0 0 0 0 0 0 Remote channel OPEN Status

30 0F9C Y 0 0 0 0 REN4 REN3 RE

N2 RE

N1 LEN OS SD CR2 CR1 CR0 BU

SY 0 Configuration Register (Enables,

OneShot, ShutDown, ConvRate,

BUSY)

38 0080 Y 0 HYS1

1HY

S10 HYS9 HYS8 HYS7 HY

S6 HY

S5 HYS4 0 0 0 0 0 0 0 THERM hysteresis

39 3E80

(125°C) Y LTH1_

12 LTH1

_11 LT

_10

LTH1

_09 LTH1

_08 LTH1

_07 LT

_06

_05

LTH1

_04 LTH1

_03 0 0 0 0 0 0 Local temp THERM limit

3A 7FC0

(225.5°C) Y LTH2_

12 LTH2

_11 LT

_10

LTH2

_09 LTH2

_08 LTH2

_07 LT

_06

_05

LTH2

_04 LTH2

_03 0 0 0 0 0 0 Local temp THERM2 limit

40 0000 Y ROS12 ROS

12(2) RO

S10 ROS

9ROS

8ROS

7RO

S6 RO

S5 ROS

4ROS

3ROS

2ROS

1ROS0 0 0 0 Remote temp 1 offset

41 0000 Y RNC7 RNC

6RN

C5 RNC

4RNC

3RNC

2RN

C1 RN

C0 0 0 0 0 0 0 0 0 Remote temp 1 η-factor correction

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Table 3. Register Map (continued)

PTR POR Lock TMP464 Functional Registers - BIT DESCRIPTION REGISTER DESCRIPTION

(HEX) (HEX) (Y/N) 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0

42 3E80 Y RTH1_

12 RTH1

_11 RT

_10

RTH1

_09 RTH1

_08 RTH1

_07 RT

_06

_05

RTH1

_04 RTH1

_03 0 0 0 0 0 0 Remote temp 1 THERM limit

43 7FC0 Y RTH2_

12 RTH2

_11 RT

_10

RTH2

_09 RTH2

_08 RTH2

_07 RT

_06

_05

RTH2

_04 RTH2

_03 0 0 0 0 0 0 Remote temp 1 THERM2 limit

48 0000 Y ROS12 ROS

12 RO

S10 ROS

9ROS

8ROS

7RO

S6 RO

S5 ROS

4ROS

3ROS

2ROS

1ROS0 0 0 0 Remote temp 2 offset

49 0000 Y RNC7 RNC

6RN

C5 RNC

4RNC

3RNC

2RN

C1 RN

C0 0 0 0 0 0 0 0 0 Remote temp 2 η-factor correction

4A 3E80 Y RTH1_

12 RTH1

_11 RT

_10

RTH1

_09 RTH1

_08 RTH1

_07 RT

_06

_05

RTH1

_04 RTH1

_03 0 0 0 0 0 0 Remote temp 2 THERM limit

4B 7FC0 Y RTH2_

12 RTH2

_11 RT

_10

RTH2

_09 RTH2

_08 RTH2

_07 RT

_06

_05

RTH2

_04 RTH2

_03 0 0 0 0 0 0 Remote temp 2 THERM2 limit

50 0000 Y ROS12 ROS

12 RO

S10 ROS

9ROS

8ROS

7RO

S6 RO

S5 ROS

4ROS

3ROS

2ROS

1ROS0 0 0 0 Remote temp 3 offset

51 0000 Y RNC7 RNC

6RN

C5 RNC

4RNC

3RNC

2RN

C1 RN

C0 0 0 0 0 0 0 0 0 Remote temp 3 η-factor correction

52 3E80 Y RTH1_

12 RTH1

_11 RT

_10

RTH1

_09 RTH1

_08 RTH1

_07 RT

_06

_05

RTH1

_04 RTH1

_03 0 0 0 0 0 0 Remote temp 3 THERM limit

53 7FC0 Y RTH2_

12 RTH2

_11 RT

_10

RTH2

_09 RTH2

_08 RTH2

_07 RT

_06

_05

RTH2

_04 RTH2

_03 0 0 0 0 0 0 Remote temp 3 THERM2 limit

58 0000 Y ROS12 ROS

12 RO

S10 ROS

9ROS

8ROS

7RO

S6 RO

S5 ROS

4ROS

3ROS

2ROS

1ROS0 0 0 0 Remote temperature 4 offset

59 0000 Y RNC7 RNC

6RN

C5 RNC

4RNC

3RNC

2RN

C1 RN

C0 0 0 0 0 0 0 0 0 Remote temp 4 η-factor correction

5A 3E80 Y RTH1_

12 RTH1

_11 RT

_10

RTH1

_09 RTH1

_08 RTH1

_07 RT

_06

_05

RTH1

_04 RTH1

_03 0 0 0 0 0 0 Remote temp 4 THERM limit

5B 7FC0 Y RTH2_

12 RTH2

_11 RT

_10

RTH2

_09 RTH2

_08 RTH2

_07 RT

_06

_05

RTH2

_04 RTH2

_03 0 0 0 0 0 0 Remote temp 4 THERM2 limit

80 0000 N/A LT12 LT11 LT1

0LT9 LT8 LT7 LT6 LT5 LT4 LT3 LT2 LT1 LT0 0 0 0 Local temperature (Block read range -

auto increment pointer register)

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Table 3. Register Map (continued)

PTR POR Lock TMP464 Functional Registers - BIT DESCRIPTION REGISTER DESCRIPTION

(HEX) (HEX) (Y/N) 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0

81 0000 N/A RT12 RT11 RT

10 RT9 RT8 RT7 RT

6RT

5RT4 RT3 RT2 RT1 RT0 0 0 0 Remote temperature 1 (Block read

range - auto increment pointer

82 0000 N/A RT12 RT11 RT

10 RT9 RT8 RT7 RT

6RT

5RT4 RT3 RT2 RT1 RT0 0 0 0 Remote temperature 2 (Block read

range - auto increment pointer

83 0000 N/A RT12 RT11 RT

10 RT9 RT8 RT7 RT

6RT

5RT4 RT3 RT2 RT1 RT0 0 0 0 Remote temperature 3 (Block read

range - auto increment pointer

84 0000 N/A RT12 RT11 RT

10 RT9 RT8 RT7 RT

6RT

5RT4 RT3 RT2 RT1 RT0 0 0 0 Remote temperature 4 (Block read

range - auto increment pointer

C4 8000 N/A Write 0x5CA6 to lock registers and 0xEB19 to unlock registers Lock Registers after initialization

Read back: locked 0x8000; unlocked 0x0000

FE 5449 N/A 0 1 0 1 0 1 0 0 0 1 0 0 1 0 0 1 Manufacturers Identification Register

FF 1468 N/A 0 0 0 1 0 1 0 0 0 1 1 0 1 0 0 0 Device Identification/Revision Register

l TEXAS INSTRUMENTS

Pointer Register

Serial

Interface

Local Temp

Remote Temp 1

Remote Temp 3

Remote Temp 4

Remote Temp 2

Configuration

Lock Initialization

Remote 1 Offset

Remote 1 K -factor

Remote 1 THERM

Remote 1 THERM2

Remote 2 Offset

Remote 2 K -factor

Remote 2 THERM

Remote 2 THERM2

Remote 3 Offset

Remote 3 K -factor

Remote 3 THERM

Remote 3 THERM2

Remote 4 Offset

Remote 4 K -factor

Remote 4 THERM

Remote 4 THERM2

SDA

SCL

Device ID

Manufacturer ID

Local THERM Limit

Local THERM2 Limit

THERM Hysterisis

Software Reset

THERM Status

Remote Open Status

THERM2 Status

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7.6.1 Register Information

The TMP464 device contains multiple registers for holding configuration information, temperature measurement

results, and status information. These registers are described in Figure 19 and Table 3.

7.6.1.1 Pointer Register

Figure 19 shows the internal register structure of the TMP464 device. The 8-bit pointer register addresses a

given data register. The pointer register identifies which of the data registers must respond to a read or write

command on the two-wire bus. This register is set with every write command. A write command must be issued

to set the proper value in the pointer register before executing a read command. Table 3 describes the pointer

to unassigned pointer values are ignored and does not affect the operation of the device. Reading an

unassigned register returns undefined data and is ACKed.

Figure 19. TMP464 Internal Register Structure

7.6.1.2 Local and Remote Temperature Value Registers

The TMP464 device has multiple 16-bit registers that hold 13-bit temperature measurement results. The 13 bits

of the local temperature sensor result are stored in register 00h. The 13 bits of the four remote temperature

sensor results are stored in registers 01h through 04h. The four assigned LSBs of both the local (LT3:LT0) and

remote (RT3:RT0) sensors indicate the temperature value after the decimal point (for example, if the temperature

result is 10.0625°C, then the high byte is 0000 0101 and the low byte is 0000 1000). These registers are read-

only and are updated by the ADC each time a temperature measurement is complete. Asynchronous reads are

supported, so a read operation can occur at any time and results in valid conversion results being transmitted

once the first conversion is complete after power up for the channel being accessed. If after power up a read is

initiated before a conversion is complete, the read operation results in all zeros (0x0000).

7.6.1.3 Software Reset Register

The Software Reset Register allows the user to reset the TMP464 registers through software by setting the reset

bit (RST, bit 15) to 1. The power-on-reset value for this register is 0x0000. Resets are ignored when the device is

in lock mode, so writing a 1 to the RST bit does not reset any registers.

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Table 4. Software Reset Register Format

STATUS REGISTER (READ = 20h, WRITE = 20h, POR = 0x0000)

BIT NUMBER BIT NAME FUNCTION

15 RST 1 software reset device; writing a value of 0 is ignored

14-0 0 Reserved for future use; always reports 0

7.6.1.4 THERM Status Register

The THERM Status register reports the state of the THERM limit comparators for local and four remote

temperatures. Table 5 lists the status register bits. The THERM Status register is read-only and is read by

accessing pointer address 21h.

Table 5. THERM Status Register Format

THERM STATUS REGISTER (READ = 21h, WRITE = N/A)

BIT NUMBER BIT NAME FUNCTION

15:12 0 Reserved for future use; always reports 0.

11 R4TH 1 when Remote 4 exceeds the THERM limit

10 R3TH 1 when Remote 3 exceeds the THERM limit

9 R2TH 1 when Remote 2 exceeds the THERM limit

8 R1TH 1 when Remote 1 exceeds the THERM limit

7 LTH 1 when Local sensor exceeds the THERM limit

6:0 0 Reserved for future use; always reports 0.

The R4TH:R1TH and LTH flags are set when the corresponding temperature exceeds the respective

programmed THERM limit (39h, 42h, 4Ah, 52h, and 5Ah). These flags are reset automatically when the

temperature returns below the THERM limit minus the value set in the THERM Hysteresis register (38h). The

THERM output goes low in the case of overtemperature on either the local or remote channels, and goes high as

soon as the measurements are less than the THERM limit minus the value set in the THERM Hysteresis register.

The THERM Hysteresis register (38h) allows hysteresis to be added so that the flag resets and the output goes

high when the temperature returns to or goes below the limit value minus the hysteresis value.

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7.6.1.5 THERM2 Status Register

The THERM2 Status register reports the state of the THERM2 limit comparators for local and remote 1-4

temperatures. Table 6 lists the status register bits. The THERM2 Status register is read-only and is read by

accessing pointer address 22h.

Table 6. THERM2 Status Register Format

THERM2 STATUS REGISTER (READ = 22h, WRITE = N/A)

BIT NUMBER BIT NAME FUNCTION

15:12 0 Reserved for future use; always reports 0.

11 R4TH2 1 when Remote 4 exceeds the THERM2 limit

10 R3TH2 1 when Remote 3 exceeds the THERM2 limit

9 R2TH2 1 when Remote 2 exceeds the THERM2 limit

8 R1TH2 1 when Remote 1 exceeds the THERM2 limit

7 LTH2 1 when Local Sensor exceeds the THERM2 limit

6:0 0 Reserved for future use; always reports 0.

The R4TH2:R1TH2 and LTH2 flags are set when the corresponding temperature exceeds the respective

programmed THERM2 limit (3Ah, 43h, 4Bh, 53h, 5Bh, 63h, 6Bh, 73h, 7Bh). These flags are reset automatically

when the temperature returns below the THERM2 limit minus the value set in the THERM Hysteresis register

(38h). The THERM2 output goes low in the case of overtemperature on either the local or remote channels, and

goes high as soon as the measurements are less than the THERM2 limit minus the value set in the THERM

Hysteresis register. The THERM Hysteresis register (38h) allows hysteresis to be added so that the flag resets

and the output goes high when the temperature returns to or goes below the limit value minus the hysteresis

value.

7.6.1.6 Remote Channel Open Status Register

The Remote Channel Open Status register reports the state of the connection of remote channels one through

four. Table 7 lists the status register bits. The Remote Channel Open Status register is read-only and is read by

accessing pointer address 23h.

Table 7. Remote Channel Open Status Register Format

REMOTE CHANNEL OPEN STATUS REGISTER (READ = 23h, WRITE = N/A)

BIT NUMBER BIT NAME FUNCTION

15:12 0 Reserved for future use; always reports 0.

11 R4OPEN 1 when Remote 4 channel is an open circuit

10 R3OPEN 1 when Remote 3 channel is an open circuit

9 R2OPEN 1 when Remote 2 channel is an open circuit

8 R1OPEN 1 when Remote 1 channel is an open circuit

7:0 0 Reserved for future use; always reports 0.

The R4OPEN:R1OPEN bits indicate an open-circuit condition on remote sensors four through one, respectively.

The setting of these flags does not directly affect the state of the THERM or THERM2 output pins. Indirectly, the

temperature reading(s) may be erroneous and exceed the respective THERM and THERM2 limits, activating the

THERM or THERM2 output pins.

l TEXAS INSTRUMENTS

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7.6.1.7 Configuration Register

The Configuration Register sets the conversion rate, starts one-shot conversion of all enabled channels, enables

conversion the temperature channels, controls the shutdown mode and reports when a conversion is in process.

The Configuration Register is set by writing to pointer address 30h, and is read from pointer address 30h.

Table 8 summarizes the bits of the Configuration Register.

Table 8. Configuration Register Bit Descriptions

CONFIGURATION REGISTER (READ = 30h, WRITE = 30h, POR = 0x0F9C)

BIT NUMBER NAME FUNCTION POWER-ON-RESET VALUE

15:12 0 Reserved for future use; always

reports 0 0000

11:8 REN4:REN1 1 = enable respective remote

channel 4 through 1 conversions 1111

7 LEN 1 = enable local channel

conversion 1

6 OS 1 = start one-shot conversion on

enabled channels 0

5 SD 1 = enables device shutdown 0

4:2 CR2:CR0

Conversion rate control bits;

control conversion rates for all

enabled channels from 16

seconds to continuous

conversion

111

1 BUSY 1 when the ADC is converting

(read-only bit ignores writes) 0

0 Reserved — 0

The Remote Enable four through one (REN4:REN1, bits 11:8) bits enable conversions on the respective remote

channels. The Local Enable (LEN, bit 7) bit enables conversions of the local temperature channel. If all LEN and

REN are set to 1 (default), this enables the ADC to convert the local and all remote temperatures. If the LEN is

set to 0, the local temperature conversion is skipped. Similarly if a REN is set to 0, that remote temperature

conversion channel is skipped. The TMP464 device steps through each enabled channel in a round-robin fashion

in the following order: LOC, REM1, REM2, REM4, LOC, REM1, and so on. All local and remote temperatures are

converted by the internal ADC by default after power up. The configuration register LEN and REN bits can be

configured to save power by reducing the total ADC conversion time for applications that do not require all of the

four remote and local temperature information. Note writing all zeros to REN4:REN1 and LEN has the same

effect as SD = 1 and OS = 0.

The shutdown bit (SD, bit 5) enables or disables the temperature-measurement circuitry. If SD = 0 (default), the

TMP464 device converts continuously at the rate set in the conversion rate register. When SD is set to 1, the

TMP464 device immediately stops the conversion in progress and instantly enters shutdown mode. When SD is

set to 0 again, the TMP464 device resumes continuous conversions starting with the local temperature.

The BUSY bit = 1 if the ADC is making a conversion. This bit is set to 0 if the ADC is not converting.

After the TMP464 device is in shutdown mode, writing a 1 to the one-shot (OS, bit 6) bit starts a single ADC

conversion of all the enabled temperature channels. This write operation starts one conversion and comparison

cycle on either the four remote and one local sensor or any combination of sensors, depending on the LEN and

REN values in the Configuration Register (read address 30h). The TMP464 device returns to shutdown mode

when the cycle is complete. Table 9 details the interaction of the SD, OS, LEN, and REN bits.

Table 9. Conversion Modes

WRITE READ FUNCTION

REN[8:1], LEN OS SD REN[8:1], LEN OS SD

All 0 — — All 0 0 1 Shutdown

At least 1 enabled — 0 Written value 0 0 Continuous conversion

At least 1 enabled 0 1 Written value 0 1 Shutdown

At least 1 enabled 1 1 Written value 1 1 One-shot conversion

l TEXAS INSTRUMENTS NA 7 2088

ADJUST

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1.008 2088

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V V In

q I

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TMP464

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The conversion rate bits control the rate that the conversions occur (CR2:CR0, bits 4:2). The value of CR2:CR0

bits controls the idle time between conversions but not the conversion time itself, which allows the TMP464

device power dissipation to be balanced with the update rate of the temperature register. Table 10 describes the

mapping for CR2:CR0 to the conversion rate or temperature register update rate.

Table 10. Conversion Rate

CR2:CR0 DECIMAL VALUE FREQUENCY (Hz) TIME (s)

000 0 0.0625 16

001 1 0.125 8

010 2 0.25 4

011 3 0.5 2

100 4 1 1

101 5 2 0.5

110 6 4 0.25

111 7 Continuous conversion; depends on number of enabled channels; see

Table 11 (default).

Table 11. Continuous Conversion Times

NUMBER OF REMOTE CHANNELS ENABLED CONVERSION TIME (ms)

LOCAL DISABLED LOCAL ENABLED

0 0 15.5

1 15.8 31.3

2 31.6 47.1

3 47.4 62.9

4 63.2 78.7

The remaining bits of the configuration register are reserved and must always be set to 0. The POR value for this

7.6.1.8 η-Factor Correction Register

The TMP464 device allows for a different η-factor value to be used for converting remote channel measurements

to temperature for each temperature channel. There are four η-Factor Correction registers assigned: one to each

of the remote input channels (addresses 41h, 49h, 51h, and 59h). Each remote channel uses sequential current

excitation to extract a differential VBE voltage measurement to determine the temperature of the remote

transistor. Equation 1 shows this voltage and temperature.

(1)

The value ηin Equation 1 is a characteristic of the particular transistor used for the remote channel. The POR

value for the TMP464 device is η= 1.008. The value in the η-Factor Correction register can be used to adjust the

effective η-factor, according to Equation 2 and Equation 3.

(2)

(3)

The η-factor correction value must be stored in a two's-complement format, which yields an effective data range

from –128 to +127. The POR value for each register is 0000h, which does not affect register values unless a

different value is written to the register. The resolution of the η-factor register changes linearly as the code

changes and has a range from 0.0004292 to 0.0005476, with an average of 0.0004848.

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Table 12. η-Factor Range

NADJUST ONLY BITS 15 TO 8 IN THE REGISTER ARE SHOWN η

BINARY HEX DECIMAL

0111 1111 7F 127 0.950205

0000 1010 0A 10 1.003195

0000 1000 08 8 1.004153

0000 0110 06 6 1.005112

0000 0100 04 4 1.006073

0000 0010 02 2 1.007035

0000 0001 01 1 1.007517

0000 0000 00 0 1.008

1111 1111 FF –1 1.008483

1111 1110 FE –2 1.008966

1111 1100 FC –4 1.009935

1111 1010 FA –6 1.010905

1111 1000 F8 –8 1.011877

1111 0110 F6 –10 1.012851

1000 0000 80 –128 1.073829

7.6.1.9 Remote Temperature Offset Register

The offset registers allow the TMP464 device to store any system offset compensation value that may result from

precision calibration. The value in these registers is added to the remote temperature results upon every

conversion. Each of the four temperature channels have an independent assigned offset register (addresses 40h,

48h, 50h, and 58h). Combined with the independent η-factor corrections, this function allows for very accurate

system calibration over the entire temperature range for each remote channel. The format of these registers is

the same as the temperature value registers with a range from +127.9375 to –128. Take care to program this

7.6.1.10 THERM Hysteresis Register

The THERM Hysteresis register (address 38h) sets the value of the hysteresis used by the temperature

comparison logic. All temperature reading comparisons have a common hysteresis. Hysteresis prevents

oscillations from occurring on the THERM and THERM2 outputs as the measured temperature approaches the

comparator threshold (see the THERM Functions section). The resolution of the THERM Hysteresis register is

1°C and ranges from 0°C to 255°C.

7.6.1.11 Local and Remote THERM and THERM2 Limit Registers

Each of the four remote and the local temperature channels has associated independent THERM and THERM2

Limit registers. There are five THERM registers (addresses 39h, 42h, 4Ah, 52h, and 5Ah) and five THERM2

registers (addresses 39h, 43h, 4Bh, and 53h), 10 registers in total. The resolution of these registers is 0.5°C and

ranges from +255.5°C to –255°C. See the THERM Functions section for more information.

Setting a THERM limit to 255.5°C disables the THERM limit comparison for that particular channel and disables

the limit flag from being set in the THERM Status register. This prevents the associated channel from activating

the THERM output. THERM2 limits, status, and outputs function similarly.

7.6.1.12 Block Read - Auto Increment Pointer

Block reads can be initiated by setting the pointer register to 80h to 84h. The temperature results are mirrored at

pointer addresses 80h to 84h; temperature results for all the channels can be read with one read transaction.

Setting the pointer register to any address from 80h to 84h signals to the TMP464 device that a block of more

than two bytes must be transmitted before a design stop is issued. In block read mode, the TMP464 device auto

increments the pointer address.

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7.6.1.13 Lock Register

To lock the registers, write 0x5CA6. To unlock the registers, write 0xEB19. When the lock function is enabled,

reading the register yields 0x8000; when unlocked, 0x0000 is transmitted.

7.6.1.14 Manufacturer and Device Identification Plus Revision Registers

The TMP464 device allows the two-wire bus controller to query the device for manufacturer and device

identifications (IDs) to enable software identification of the device at the particular two-wire bus address. The

manufacturer ID is obtained by reading from pointer address FEh; the device ID is obtained from register FFh.

Note that the most significant byte of the Device ID register identifies the TMP464 device revision level. The

TMP464 device reads 0x5449 for the manufacturer code and 0x1468 for the device ID code for the first release.

l TEXAS INSTRUMENTS eeeeeeeeeeeeeeeeeeeeeeee

D3+

D4+

SCL

SDA

THERM

ADD

V+

THERM2

TMP464

D1+

D2+

D-

GND

CDIFF

RS1 RS2

CDIFF

RS1 RS2

CDIFF

RS1 RS2

CDIFF

RS1 RS2

1.7 V to 3.6 V

CBYPASS

RSCL RSDA RT

RT2

Two-Wire

Interface

SMBus / I2C

Compatible

Controller

Overtemperature

Shutdown

Local

Zone 5

Remote

Zone 1

Remote

Zone 2

Remote

Zone 3

Remote

Zone 4

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8 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component

specification, and TI does not warrant its accuracy or completeness. TI’s customers are

responsible for determining suitability of components for their purposes. Customers should

validate and test their design implementation to confirm system functionality.

8.1 Application Information

The TMP464 device requires a transistor connected between the D+ and D– pins for remote temperature

measurement. Tie the D+ pin to D– if the remote channel is not used and only the local temperature is

measured. The SDA, ALERT, and THERM pins (and SCL, if driven by an open-drain output) require pullup

resistors as part of the communication bus. TI recommends a 0.1-µF power-supply decoupling capacitor for local

bypassing. Figure 20 and Figure 21 illustrate the typical configurations for the TMP464 device.

8.2 Typical Application

(1) The diode-connected configuration provides better settling time. The transistor-connected configuration provides

better series resistance cancellation. TI recommends a MMBT3904 or MMBT3906 transistor with an η-factor of 1.008.

(2) RS(optional) is < 1 kΩin most applications. RSis the combined series resistance connected externally to the D+, D–

pins. RSselection depends on the application.

(3) CDIFF (optional) is < 1000 pF in most applications. CDIFF selection depends on the application; see Figure 7.

(4) Unused diode channels must be tied to D– .

Figure 20. TMP464 Basic Connections Using a Discrete Remote Transistor

l TEXAS INSTRUMENTS

Processor, FPGA, or ASIC

TMP464

D+

D-

CDIFF(3)

RS(2)

PNP Transistor-Connected Configuration(1)

PNP Diode-Connected Configuration(1)

Series Resistance

RS(2)

NPN Diode-Connected Configuration(1)

Series Resistance

RS(2)

Integrated PNP Transistor-Connected Configuration(1)

Internal and PCB

Series Resistance

RS(2)

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Typical Application (continued)

Figure 21. TMP464 Remote Transistor Configuration Options

8.2.1 Design Requirements

The TMP464 device is designed to be used with either discrete transistors or substrate transistors built into

processor chips, field programmable gate arrays (FPGAs), and application-specific integrated circuits (ASICs) ;

see Figure 21. Either NPN or PNP transistors can be used, as long as the base-emitter junction is used as the

remote temperature sensor. NPN transistors must be diode-connected. PNP transistors can either be transistor-

or diode-connected (see Figure 21).

Errors in remote temperature sensor readings are typically the consequence of the ideality factor (η-factor) and

current excitation used by the TMP464 device versus the manufacturer-specified operating current for a given

transistor. Some manufacturers specify a high-level and low-level current for the temperature-sensing substrate

transistors. The TMP464 uses 7.5 μA (typical) for ILOW and 120 μA (typical) for IHIGH.

The ideality factor (η-factor) is a measured characteristic of a remote temperature sensor diode as compared to

an ideal diode. The TMP464 allows for different η-factor values; see the η-Factor Correction Register section.

The η-factor for the TMP464 device is trimmed to 1.008. For transistors that have an ideality factor that does not

match the TMP464 device, Equation 4 can be used to calculate the temperature error.

NOTE

For Equation 4 to be used correctly, the actual temperature (°C) must be converted to

Kelvin (K).

l TEXAS INSTRUMENTS TERR

Average Conversion Current = (Local Conversion Time) × (Conversions Per Second) × (Local Active IQ ) +

(Remote Conversion Time) × (Conversions Per Second) × (Remote Active IQ) × (Number of Active Channels +

(Standby Mode) × [1 ± ((Local Conversion Time) + (Remote Conversion Time) × (Number of Active

Channels)) × (Conversions Per Second)]

 

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ERR

1 004 1 008

T = 273 15 100 C

1 008

T 1 48 C

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T 273.15 T C

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K 

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u 

¨ ¸

TMP464

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Product Folder Links: TMP464

Typical Application (continued)

where

• TERR = error in the TMP464 device because η≠1.008

•η= ideality factor of the remote temperature sensor

• T(°C) = actual temperature, and (4)

In Equation 4, the degree of delta is the same for °C and K.

For η= 1.004 and T(°C) = 100°C:

(5)

If a discrete transistor is used as the remote temperature sensor with the TMP464 device, then select the

transistor according to the following criteria for best accuracy:

• Base-emitter voltage is > 0.25 V at 7.5 μA, at the highest-sensed temperature.

• Base-emitter voltage is < 0.95 V at 120 μA, at the lowest-sensed temperature.

• Base resistance is < 100 Ω.

• Tight control of VBE characteristics indicated by small variations in hFE (50 to 150).

Based on these criteria, TI recommends using a MMBT3904 (NPN) or a MMBT3906 (PNP) transistor.

8.2.2 Detailed Design Procedure

The local temperature sensor inside the TMP464 is influenced by the ambient air around the device but mainly

monitors the PCB temperature that it is mounted to. The thermal time constant for the TMP464 device is

approximately two seconds. This constant implies that if the ambient air changes quickly by 100°C, then the

TMP464 device takes approximately 10 seconds (that is, five thermal time constants) to settle to within 1°C of

the final value. In most applications, the TMP464 package is in electrical (and therefore thermal) contact with the

printed-circuit board (PCB), and subjected to forced airflow. The accuracy of the measured temperature directly

depends on how accurately the PCB and forced airflow temperatures represent the temperature that the TMP464

device is measuring. Additionally, the internal power dissipation of the TMP464 device can cause the

temperature to rise above the ambient or PCB temperature. The internal power is negligible because of the small

current drawn by the TMP464 device. Equation 6 can be used to calculate the average conversion current for

power dissipation and self-heating based on the number of conversions per second and temperature sensor

channel enabled. Equation 7 shows an example with local and all remote sensor channels enabled and

conversion rate of 1 conversion per second; see the Electrical Characteristics table for typical values required for

these calculations. For a 3.3-V supply and a conversion rate of 1 conversion per second, the TMP464 device

dissipates 0.143 mW (PDIQ = 3.3 V × 43 μA) when both the remote and local channels are enabled.

(6)

(7)

l TEXAS INSTRUMENTS mm

Time (s)

Percent of Final Value

-2 0 2 4 6 8 10 12 14 16 18

10%

20%

30%

40%

50%

60%

70%

80%

90%

100%

110%

Average Conversion Current (16 ms) ( ) (240 A)

sec

(16 ms) ( ) (200 A) (4)

sec

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sec

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TMP464

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Typical Application (continued)

(8)

The temperature measurement accuracy of the TMP464 device depends on the remote and local temperature

sensor being at the same temperature as the monitored system point. If the temperature sensor is not in good

thermal contact with the part of the monitored system, then there is a delay between the sensor response and

the system changing temperature. This delay is usually not a concern for remote temperature-sensing

applications that use a substrate transistor (or a small, SOT-23 transistor) placed close to the monitored device.

8.2.3 Application Curve

Figure 22 shows the typical step response to submerging a TMP464 device (initially at 25°C) in an oil bath with a

temperature of 100°C and logging the local temperature readings.

Figure 22. TMP464 Temperature Step Response of Local Sensor

9 Power Supply Recommendations

The TMP464 device operates with a power-supply range from 1.7 V to 3.6 V. The device is optimized for

operation at a 1.8-V supply, but can measure temperature accurately in the full supply range.

TI recommends a power-supply bypass capacitor. Place this capacitor as close as possible to the supply and

ground pins of the device. A typical value for this supply bypass capacitor is 0.1 μF. Applications with noisy or

high-impedance power supplies may require additional decoupling capacitors to reject power-supply noise.

l TEXAS INSTRUMENTS

V+

D+

D-

GND

Ground or V+ layer

on bottom and top,

if possible.

TMP464

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10 Layout

10.1 Layout Guidelines

Remote temperature sensing on the TMP464 device measures very small voltages using very low currents;

therefore, noise at the device inputs must be minimized. Most applications using the TMP464 device have high

digital content, with several clocks and a multitude of logic-level transitions that create a noisy environment.

Layout must adhere to the following guidelines:

1. Place the TMP464 device as close to the remote junction sensor as possible.

2. Route the D+ and D– traces next to each other and shield them from adjacent signals through the use of

ground guard traces, as shown in Figure 23. If a multilayer PCB is used, bury these traces between the

ground or V+ planes to shield them from extrinsic noise sources. TI recommends 5-mil (0.127 mm) PCB

traces.

3. Minimize additional thermocouple junctions caused by copper-to-solder connections. If these junctions are

used, make the same number and approximate locations of copper-to-solder connections in both the D+ and

D– connections to cancel any thermocouple effects.

4. Use a 0.1-μF local bypass capacitor directly between the V+ and GND of the TMP464. For optimum

measurement performance, minimize filter capacitance between D+ and D– to 1000 pF or less. This

capacitance includes any cable capacitance between the remote temperature sensor and the TMP464.

5. If the connection between the remote temperature sensor and the TMP464 is wired and is less than eight

inches (20.32 cm) long, use a twisted-wire pair connection. For lengths greater than eight inches, use a

twisted, shielded pair with the shield grounded as close to the TMP464 device as possible. Leave the remote

sensor connection end of the shield wire open to avoid ground loops and 60-Hz pickup.

6. Thoroughly clean and remove all flux residue in and around the pins of the TMP464 device to avoid

temperature offset readings as a result of leakage paths between D+ and GND, or between D+ and V+.

NOTE: Use a minimum of 5-mil (0.127 mm) traces with 5-mil spacing.

Figure 23. Suggested PCB Layer Cross-Section

‘5‘ TEXAS INSTRUMENTS

1 nF

1 nF 1 nF

VIA to Power or Ground Plane

VIA to Internal Layer

Exposed

Thermal Pad

NC NC V+ SCL

SDA

THERM2

THERM

ADD

GND

D-D1+D2+

D3+

D4+

15 14 13

765

0.1 F

TMP464

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10.2 Layout Example

Figure 24. TMP464 Layout Example

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11 Device and Documentation Support

11.1 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper

right corner, click on Alert me to register and receive a weekly digest of any product information that has

changed. For change details, review the revision history included in any revised document.

11.2 Community Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do

not necessarily reflect TI's views; see TI's Terms of Use.

11.3 Trademarks

E2E is a trademark of Texas Instruments.

SMBus is a trademark of Intel Corporation.

All other trademarks are the property of their respective owners.

11.4 Electrostatic Discharge Caution

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

11.5 Glossary

SLYZ022 —TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

I TEXAS INSTRUMENTS Samples Samples

PACKAGE OPTION ADDENDUM

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Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead finish/

Ball material

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

TMP464AIRGTR ACTIVE VQFN RGT 16 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 T464

TMP464AIRGTT ACTIVE VQFN RGT 16 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 T464

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

I TEXAS INSTRUMENTS

PACKAGE OPTION ADDENDUM

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Addendum-Page 2

I TEXAS INSTRUMENTS REEL DIMENSIONS TAPE DIMENSIONS 7 “K0 '«m» Reel Diame|er AD Dimension deswgned to accommodate the componem wwdlh E0 Dimension desxgned to accommodate the componenl \ength KO Dimenslun deswgned to accommodate the componem thickness 7 w OveraH wwdm loe earner cape i p1 Pitch between successwe cavuy cemers f T Reel Width (W1) QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE O O O D O O D O Sprockemoles ,,,,,,,,,,, ‘ User Direcllon 0' Feed Pockel Quadrams

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

TMP464AIRGTR VQFN RGT 16 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2

TMP464AIRGTT VQFN RGT 16 250 180.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2

PACKAGE MATERIALS INFORMATION

www.ti.com 16-Oct-2019

Pack Materials-Page 1

I TEXAS INSTRUMENTS TAPE AND REEL BOX DIMENSIONS

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

TMP464AIRGTR VQFN RGT 16 3000 367.0 367.0 35.0

TMP464AIRGTT VQFN RGT 16 250 210.0 185.0 35.0

PACKAGE MATERIALS INFORMATION

www.ti.com 16-Oct-2019

Pack Materials-Page 2

GENERIC PACKAGE VIEW RGT 16 VQFN - 1 mm max heigm PLASTIC QUAD FLATPACKV N0 LEAD Images above are jusl a represenlalion of the package family, aclual package may vary Refel lo the product dala sheel for package details. 4203495” I TEXAS INSTRI IMFNTS

www.ti.com

PACKAGE OUTLINE

16X 0.30

0.18

1.68 0.07

16X 0.5

0.3

1.0

0.8

(0.2) TYP

0.05

0.00

12X 0.5

1.5

A3.1

2.9 B

3.1

2.9

VQFN - 1 mm max heightRGT0016C

PLASTIC QUAD FLATPACK - NO LEAD

4222419/C 04/2021

PIN 1 INDEX AREA

0.08

SEATING PLANE

16 13

(OPTIONAL)

PIN 1 ID 0.1 C A B

0.05

EXPOSED

THERMAL PAD

SYMM

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

SCALE 3.600

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EXAMPLE BOARD LAYOUT

0.07 MIN

ALL AROUND

0.07 MAX

ALL AROUND

16X (0.24)

16X (0.6)

( 0.2) TYP

VIA

12X (0.5)

(2.8)

(0.58)

TYP

( 1.68)

(R0.05)

ALL PAD CORNERS (0.58) TYP

VQFN - 1 mm max heightRGT0016C

PLASTIC QUAD FLATPACK - NO LEAD

4222419/C 04/2021

SYMM

LAND PATTERN EXAMPLE

SCALE:20X

NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

number SLUA271 (www.ti.com/lit/slua271).

5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown

on this view. It is recommended that vias under paste be filled, plugged or tented.

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

DEFINED

METAL

SOLDER MASK

OPENING

SOLDER MASK DETAILS

NON SOLDER MASK

DEFINED

(PREFERRED)

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EXAMPLE STENCIL DESIGN

16X (0.6)

16X (0.24)

12X (0.5)

(2.8)

( 1.55)

(R0.05) TYP

VQFN - 1 mm max heightRGT0016C

PLASTIC QUAD FLATPACK - NO LEAD

4222419/C 04/2021

NOTES: (continued)

6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

SYMM

ALL AROUND

METAL

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

EXPOSED PAD 17:

85% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE

SCALE:25X

SYMM

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AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY

IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD

PARTY INTELLECTUAL PROPERTY RIGHTS.

These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate

TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable

standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you

permission to use these resources only for development of an application that uses the TI products described in the resource. Other

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applicable warranties or warranty disclaimers for TI products.IMPORTANT NOTICE

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

Scheda tecnica TMP464 di Texas Instruments

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