Scheda tecnica LM2903-Q1 di Texas Instruments

i TEXAS INSTRUMENTS
LM2903-Q1 and LM2903B-Q1 Automotive Dual Comparators
Features
• Qualified for automotive applications
• AEC-Q100 qualified with the following results:
– Device temperature grade 0: –40°C to 150°C
ambient operating temperature range
(LM2903E-Q1)
– Device temperature grade 1: –40°C to 125°C
ambient operating temperature range
– Device HBM ESD classification level H1C
– Device CDM ESD classification level C4B
• Improved 2 kV HBM ESD for "B" device
• Single supply or dual supplies
• Low supply-current independent of
supply voltage 200 uA Typ Per
comparator ("B" Versions)
• Low input bias current 3.5 nA Typ ("B" device)
• Low input offset current 0.5 nA Typ ("B" device)
• Low input offset voltage ±0.37 mV Typ ("B" device)
• Common-mode input voltage range includes
ground
• Differential input voltage range equal to maximum-
rated supply voltage ±36 V
• Output compatible with TTL, MOS, and CMOS
•Functional Safety-Capable
–Documentation available to aid functional safety
system design
Applications
•Automotive
–HEV/EV and power train
–Infotainment and cluster
–Body control module
•Industrial
•Appliances
Description
The LM2903B-Q1 device is the next generation
version of the industry-standard LM2903-Q1
comparator family. This next generation family
provides outstanding value for cost-sensitive
applications, with features including lower offset
voltage, higher supply voltage capability, lower supply
current, lower input bias current, lower propagation
delay, and improved 2kV ESD performance with drop-
in replacement convenience.
All devices consist of two independent voltage
comparators that are designed to operate over a wide
range of voltages. Operation from dual supplies also
is possible as long as the difference between the two
supplies is within 2 V to 36 V, and VCC is at least 1.5
V more positive than the input common-mode voltage.
The outputs can be connected to other open-collector
outputs.
The LM2903-Q1 and LM2903B-Q1 are qualified for
the AEC-Q100 Grade 1 temperature range of -40°C to
+125°C. The LM2903E-Q1 is Qualified for the Grade
0 extended temperature range of -40°C to +150°C.
Device Information (1)
PART NUMBER PACKAGE BODY SIZE (NOM)
LM2903B-Q1
SOIC (8) 4.90 mm × 3.91 mm
TSSOP (8) 3.00 mm × 4.40 mm
VSSOP(8) 3.00 mm x 3.00 mm
WSON (8) 2.00 mm x 2.00 mm
SOT-23 (8) 1.60 mm × 2.90 mm
LM2903-Q1
SOIC (8) 4.90 mm × 3.91 mm
TSSOP (8) 3.00 mm × 4.40 mm
VSSOP(8) 3.00 mm x 3.00 mm
LM2903E-Q1 TSSOP (8) 3.00 mm × 4.40 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
Family Comparison Table
Specification LM2903B-Q1 LM2903-Q1 LM2903-Q1
"A" Devices
LM2903-Q1
"AV" Devices LM2903E-Q1 Units
Specified Supply Votlage 2 to 36 2 to 30 2 to 30 2 to 32 2 to 30 V
Total Supply Current (5 V to VS max) 0.6 to 0.8 1 to 2.5 1 to 2.5 1 to 2.5 1 to 2.5 mA
Temperature Range −40 to 125 −40 to 125 −40 to 125 −40 to 125 -40 to 150 °C
ESD (HBM / CDM) 2k / 1k 1k / 750 1k / 750 1k / 750 1k / 750 V
Offset Voltage (max over temp) ± 4 ± 15 ± 4 ± 4 ± 15 mV
Input Bias Current (typ / max) 3.5 / 25 25 / 250 25 / 250 25 / 250 25 / 250 nA
Response Time (typ) 1 1.3 1.3 1.3 1.3 µsec
www.ti.com
LM2903-Q1, LM2903B-Q1
SLCS141J – MAY 2003 – REVISED NOVEMBER 2020
Copyright © 2020 Texas Instruments Incorporated Submit Document Feedback 1
Product Folder Links: LM2903-Q1 LM2903B-Q1
LM2903-Q1, LM2903B-Q1
SLCS141J – MAY 2003 – REVISED NOVEMBER 2020
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
I TEXAS INSTRUMENTS
Table of Contents
Features...............................................................................1
Applications........................................................................ 1
Description..........................................................................1
1 Revision History.............................................................. 2
2 Pin Configuration and Functions...................................3
2.1 Pin Functions.............................................................. 3
3 Specifications.................................................................. 4
3.1 Absolute Maximum Ratings, LM2903-Q1 and
LM2903E-Q1................................................................. 4
3.2 Absolute Maximum Ratings, LM2903B-Q1.................4
3.3 ESD Ratings, LM2903-Q1 and LM2903E-Q1............. 4
3.4 ESD Ratings, LM2903B-Q1........................................ 4
3.5 Recommended Operating Conditions,
LM2903B-Q1................................................................. 5
3.6 Recommended Operating Conditions, LM2903-Q1....5
3.7 Recommended Operating Conditions,
LM2903E-Q1................................................................. 5
3.8 Thermal Information, LM2903-Q1 and
LM2903E-Q1................................................................. 5
3.9 Thermal Information, LM2903B-Q1............................ 5
3.10 Electrical Characteristics LM2903B - Q1 ................. 6
3.11 Switching Characteristics LM2903B - Q1 .................6
3.12 Electrical Characteristics, LM2903-Q1 and
LM2903E-Q1................................................................. 7
3.13 Switching Characteristics, LM2903-Q1 and
LM2903E-Q1................................................................. 7
3.14 Typical Characteristics, LM2903-Q1 and
LM2903E-Q1 Only.........................................................8
3.15 Typical Characteristics, LM2903B-Q1 Only.............. 9
4 Detailed Description......................................................15
4.1 Overview................................................................... 15
4.2 Functional Block Diagram......................................... 15
4.3 Feature Description...................................................15
4.4 Device Functional Modes..........................................15
5 Application and Implementation.................................. 16
5.1 Application Information............................................. 16
5.2 Typical Application.................................................... 16
6 Power Supply Recommendations................................18
7 Layout.............................................................................18
7.1 Layout Guidelines..................................................... 18
7.2 Layout Example........................................................ 18
8 Device and Documentation Support............................18
8.1 Documentation Support............................................ 18
8.2 Receiving Notification of Documentation Updates....18
8.3 Support Resources................................................... 18
8.4 Trademarks............................................................... 18
8.5 Electrostatic Discharge Caution................................19
8.6 Glossary....................................................................19
9 Mechanical, Packaging, and Orderable Information.. 20
1 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision I (June 2020) to Revision J (November 2020) Page
• Changed LM2903B-Q1 Minimum Recommmended Supply Voltage to 2V throughout the datasheet............... 1
• Added Operating Virtual Temp to Abs Max Table for both versions................................................................... 4
• Updated Supply Voltage vs Supply Current graph for 2V...................................................................................4
Changes from Revision H (January 2020) to Revision I (June 2020) Page
• Added Functional Safety text and links...............................................................................................................1
• Added VSSOP package to Device Info list for "B"..............................................................................................1
• Added DGK to "B" Thermal Table.......................................................................................................................5
• Added text to Apps Overview section for ESD................................................................................................. 15
Changes from Revision G (November 2018) to Revision H (January 2020) Page
• Added LM2903B-Q1 to datasheet...................................................................................................................... 1
• Added Device Information table. ........................................................................................................................1
• Added "B" device graphs ................................................................................................................................... 9
• Changed incorrect input text in Feature Description in Apps Section...............................................................15
Changes from Revision F (May 2018) to Revision G (November 2018) Page
• Changed previous Q1 graphs to match new format .......................................................................................... 8
• Added LM2903E-Q1 specific graphs.................................................................................................................. 8
LM2903-Q1, LM2903B-Q1
SLCS141J – MAY 2003 – REVISED NOVEMBER 2020 www.ti.com
2Submit Document Feedback Copyright © 2020 Texas Instruments Incorporated
Product Folder Links: LM2903-Q1 LM2903B-Q1
{5‘ TEXAS INSTRUMENTS 11]] [Er—r.
2 Pin Configuration and Functions
1
2
3
4
8
7
6
5
1OUT
1IN−
1IN+
GND
VCC
2OUT
2IN−
2IN+
Figure 2-1. D, DGK, DDF OR PW PACKAGE
Top View
11OUT 8 V+
21IN±7 2OUT
31IN+ 6 2IN±
4GND 5 2IN+
Exposed
Thermal
Die Pad
on
Underside
Connect thermal pad directly to GND pin.
Figure 2-2. DSG Package
8-Pin WSON With Exposed Pad
Top View
2.1 Pin Functions
PIN
I/O DESCRIPTION
NAME
SOIC, VSSOP,
PDIP, SO, DDF and
TSSOP
DSG
1OUT 1 1 Output Output pin of comparator 1
1IN– 2 2 Input Negative input pin of comparator 1
1IN+ 3 3 Input Positive input pin of comparator 1
GND 4 4 — Ground
2IN+ 5 5 Input Positive input pin of comparator 2
2IN- 6 6 Input Negative input pin of comparator 2
2OUT 7 7 Output Output pin of comparator 2
VCC 8 8 — Positive Supply
Thermal
Pad — PAD — Connect directly to GND pin
www.ti.com
LM2903-Q1, LM2903B-Q1
SLCS141J – MAY 2003 – REVISED NOVEMBER 2020
Copyright © 2020 Texas Instruments Incorporated Submit Document Feedback 3
Product Folder Links: LM2903-Q1 LM2903B-Q1
TEXAS INSTRUMENTS
3 Specifications
3.1 Absolute Maximum Ratings, LM2903-Q1 and LM2903E-Q1
over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
VCC Supply voltage(2) 36 V
VCC Supply voltage, LM2903E-Q1 Only(2) 32 V
VID Differential input voltage(3) –36 36 V
VIInput voltage range (either input) −0.3 36 V
VOOutput voltage 36 V
IOOutput current 20 mA
TJOperating virtual-junction temperature 150 °C
TSCG Duration of output short-circuit to ground Unlimited s
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values, except differential voltages, are with respect to GND.
(3) Differential voltages are at IN+ with respect to IN−.
3.2 Absolute Maximum Ratings, LM2903B-Q1
over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Supply voltage: VS = (V+) – (V–) -0.3 38 V
Differential input voltage : VID (2) ±38 V
Input pins (IN+, IN–) -0.3 38 V
Current into input pins (IN+, IN–) -50 mA
Output pin (OUT) -0.3 38 V
Output sink current 25 mA
Operating virtual-junction temperature 150 °C
Output short-circuit duration(3) Unlimited s
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under
Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
(2) Differential voltages are at IN+ with respect to IN-
(3) Short circuits from outputs to V+ can cause excessive heating and eventual destruction.
3.3 ESD Ratings, LM2903-Q1 and LM2903E-Q1
MIN MAX UNIT
Tstg Storage temperature range LM2903-Q1 Only –65 150 °C
V(ESD) Electrostatic discharge Human body model (HBM), per AEC Q100-002(1) -1000 1000 V
Charged device model (CDM), per AEC Q100-011 All pins -750 750
(1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
3.4 ESD Ratings, LM2903B-Q1
MIN MAX UNIT
Tstg Storage temperature range –65 150 °C
V(ESD)
Electrostatic
discharge
Human body model (HBM), per AEC Q100-002(1) -2000 2000 V
Charged device model (CDM), per AEC Q100-011 All pins -1000 1000
(1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
LM2903-Q1, LM2903B-Q1
SLCS141J – MAY 2003 – REVISED NOVEMBER 2020 www.ti.com
4Submit Document Feedback Copyright © 2020 Texas Instruments Incorporated
Product Folder Links: LM2903-Q1 LM2903B-Q1
I TEXAS INSTRUMENTS
3.5 Recommended Operating Conditions, LM2903B-Q1
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Supply voltage: VS = (V+) – (V–) 2 36 V
Ambient temperature, TA, LM2903B –40 125 °C
Input voltage range, VIVR –0.1 (V+) – 2 V
3.6 Recommended Operating Conditions, LM2903-Q1
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VCC (non-V devices) 2 30 V
VCC (V devices) 2 32 V
TJJunction Temperature -40 125 °C
3.7 Recommended Operating Conditions, LM2903E-Q1
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VCC 2 30 V
TJJunction Temperature -40 150 °C
3.8 Thermal Information, LM2903-Q1 and LM2903E-Q1
THERMAL METRIC(1)
LM2903E-Q1 LM2903-Q1
UNIT
PW
(TSSOP)
DGK
(VSSOP)
PW
(TSSOP)
D
(SOIC)
8 PINS 8 PINS 8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 178.9 199.4 186.6 126.0
°C/W
RθJC(top) Junction-to-case (top) thermal resistance 70.7 120.8 79.6 74.2
RθJB Junction-to-board thermal resistance 108.9 90.2 116.5 66.4
ψJT Junction-to-top characterization parameter 11.9 21.5 17.7 25.4
ψJB Junction-to-board characterization parameter 107.3 119.1 114.9 65.9
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
3.9 Thermal Information, LM2903B-Q1
THERMAL METRIC(1)
LM2903B-Q1
UNIT
D
(SOIC)
DGK
(VSSOP)
PW
(TSSOP)
DSG
(WSON)
DDF
(SOT-23)
8 PINS 8 PINS 8 PINS 8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 148.5 193.7 200.6 96.9 197.9
°C/W
RθJC(top) Junction-to-case (top) thermal resistance 90.2 82.9 89.6 119.0 119.2
RθJB Junction-to-board thermal resistance 91.8 115.5 131.3 63.1 115.4
ψJT Junction-to-top characterization parameter 38.5 20.8 22.1 12.4 19.4
ψJB Junction-to-board characterization parameter 91.1 113.9 129.6 63.0 113.7
RθJC(bot) Junction-to-case (bottom) thermal resistance - - - 38.7 -
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
www.ti.com
LM2903-Q1, LM2903B-Q1
SLCS141J – MAY 2003 – REVISED NOVEMBER 2020
Copyright © 2020 Texas Instruments Incorporated Submit Document Feedback 5
Product Folder Links: LM2903-Q1 LM2903B-Q1
TEXAS INSTRUMENTS s o PULLUP CM Vs L L TA
3.10 Electrical Characteristics LM2903B - Q1
VS = 5 V, VCM = (V–) ; TA = 25°C (unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIO Input offset voltage VS = 5 to 36V –2.5 ±0.37 2.5 mV
VS = 5 to 36V, TA = –40°C to +125°C –4 4 mV
VIO
Input offset voltage, DGK
package only
VS = 5 to 36V –3.5 ±0.37 3.5 mV
VS = 5 to 36V, TA = –40°C to +125°C –5 5 mV
IBInput bias current –3.5 –25 nA
TA = –40°C to +125°C –50 nA
IOS Input offset current –10 ±0.5 10 nA
TA = –40°C to +125°C –25 25 nA
VCM Common mode range(1) VS = 3 to 36V (V–) (V+) – 1.5 V
VS = 3 to 36V, TA = –40°C to +125°C (V–) (V+) – 2.0 V
AVD
Large signal differential
voltage amplification
VS = 15V, VO = 1.4V to 11.4V;
RL ≥ 15k to (V+) 50 200 V/mV
VOL
Low level output Voltage
{swing from (V–)}
ISINK ≤ 4mA, VID = -1V 110 400 mV
ISINK ≤ 4mA, VID = -1V
TA = –40°C to +125°C 550 mV
IOH-LKG
High-level output leakage
current
(V+) = VO = 5 V; VID = 1V 0.1 20 nA
(V+) = VO = 36V; VID = 1V 0.3 50 nA
IOL Low level output current VOL = 1.5V; VID = -1V; VS = 5V 6 21 mA
IQ
Quiescent current (all
comparators)
VS = 5 V, no load 400 600 µA
VS = 36 V, no load, TA = –40°C to +125°C 550 800 µA
(1) The voltage at any input should not be allowed to go negative by more than 0.3 V. The upper end of the input voltage range is VCC −
1.5 V for one input, and the other input can exceed the VCC level; the comparator provides a proper output state. Either or both inputs
can go to 36 V without damage.
3.11 Switching Characteristics LM2903B - Q1
VS = 5V, VO_PULLUP = 5V, VCM = VS/2, CL = 15pF, RL = 5.1k Ohm, TA = 25°C (unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tresponse
Propagation delay time, high-
to-low; TTL input signal (1) TTL input with Vref = 1.4V 300 ns
tresponse
Propagation delay time, high-
to-low; Small scale input signal
(1)
Input overdrive = 5mV, Input step = 100mV 1000 ns
(1) High-to-low and low-to-high refers to the transition at the input.
LM2903-Q1, LM2903B-Q1
SLCS141J – MAY 2003 – REVISED NOVEMBER 2020 www.ti.com
6Submit Document Feedback Copyright © 2020 Texas Instruments Incorporated
Product Folder Links: LM2903-Q1 LM2903B-Q1
TEXAS INSTRUMENTS cc TA
3.12 Electrical Characteristics, LM2903-Q1 and LM2903E-Q1
at specified free-air temperature, VCC = 5 V (unless otherwise noted)
PARAMETER TEST CONDITIONS TA (1) MIN TYP MAX UNIT
VIO Input offset voltage
VO = 1.4 V,
VIC = VIC(min),
VCC = 5 V to MAX(2)
Non-A devices 25°C 2 7
mV
Full range 15
A-suffix devices 25°C 1 2
Full range 4
IIO Input offset current VO = 1.4 V 25°C 5 50 nA
Full range 200
IIB Input bias current VO = 1.4 V 25°C −25 −250 nA
Full range −500
VICR
Common-mode input
voltage range(3)
25°C 0 to VCC−1.5 V
Full range 0 to VCC−2
AVD
Large-signal
differential-voltage
amplification
VCC = 15 V,
VO = 1.4 V to 11.4 V,
RL ≥ 15 kΩ to VCC
25°C 25 100 V/mV
IOH
High-level output
current
VOH = 5 V VID = 1 V 25°C 0.1 50 nA
VOH = VCC MAX(2) Full range 1 µA
VOL
Low-level output
voltage IOL = 4 mA, VID = −1 V 25°C 150 400 mV
Full range 700
IOL
Low-level output
current VOL = 1.5 V, VID = −1 V 25°C 6 mA
ICC Supply current RL = ∞ VCC = 5 V 25°C 0.8 1 mA
VCC = MAX(2) Full range 2.5
(1) Full range (MIN or MAX) for LM2903-Q1 is −40°C to 125°C and −40°C to 150°C for the LM2903E-Q1 . All characteristics are
measured with zero common-mode input voltage, unless otherwise specified.
(2) VCC MAX = 30 V for non-V devices and 32 V for V-suffix devices.
(3) The voltage at either input or common-mode should not be allowed to go negative by more than 0.3 V. The upper end of the common-
mode voltage range is VCC+ − 1.5 V for the inverting input (−), and the non-inverting input (+) can exceed the VCC level; the
comparator provides a proper output state. Either or both inputs can go to 30 V (32V for V-suffix devices) without damage.
3.13 Switching Characteristics, LM2903-Q1 and LM2903E-Q1
VCC = 5 V, TA = 25°C
PARAMETER TEST CONDITIONS TYP UNIT
Response time RL connected to 5 V through 5.1 kΩ, 100-mV input step with 5-mV overdrive 1.3 µs
CL = 15 pF(1) (2) TTL-level input step 0.3
(1) CL includes probe and jig capacitance.
(2) The response time specified is the interval between the input step function and the instant when the output crosses 1.4 V.
www.ti.com
LM2903-Q1, LM2903B-Q1
SLCS141J – MAY 2003 – REVISED NOVEMBER 2020
Copyright © 2020 Texas Instruments Incorporated Submit Document Feedback 7
Product Folder Links: LM2903-Q1 LM2903B-Q1
I TEXAS INSTRUMENTS
3.14 Typical Characteristics, LM2903-Q1 and LM2903E-Q1 Only
VCC (V)
Supply Current (mA)
0 10 20 30 40
0
0.2
0.4
0.6
0.8
1
-40C
0C
25C
85C
125C
Figure 3-1. Supply Current vs. Supply Voltage
VCC (V)
Supply Current (mA)
0 10 20 30 40
0
0.2
0.4
0.6
0.8
1
-40C
25C
125C
150C
Figure 3-2. Supply Current vs. Supply Voltage LM2903E-Q1
Only
VCC (V)
Input Bias Current (nA)
0 10 20 30 40
0
10
20
30
40
50
60
70
lm29
-40C
0C
25C
85C
125C
Figure 3-3. Input Bias Current vs. Supply Voltage
VCC (V)
Input Bias Current (nA)
0 10 20 30 40
0
10
20
30
40
50
60
70
-40C
25C
85C
125C
150C
Figure 3-4. Input Bias Current vs. Supply Voltage LM2903E-Q1
Only
Ouptut Sink Current, IO(mA)
Output Low Voltage, VOL(V)
0.01 0.1 1 10 100
0.001
0.01
0.1
1
10
125C
85C
25C
0C
-40C
Figure 3-5. Output Low Voltage vs. Output Current
Output Sinking Current , IO(mA)
Output Low Voltage, VOL (V)
0.01 0.1 1 10 100
0.001
0.01
0.1
1
10
150C
125C
25C
-40C
Figure 3-6. Output Low Voltage vs. Output Current LM2903E-Q1
Only
LM2903-Q1, LM2903B-Q1
SLCS141J – MAY 2003 – REVISED NOVEMBER 2020 www.ti.com
8Submit Document Feedback Copyright © 2020 Texas Instruments Incorporated
Product Folder Links: LM2903-Q1 LM2903B-Q1
l TEXAS INSTRUMENTS To|a\ sunmy Currem (uA) 550 525 sun 475 A50 425 400 375 35m 325 300 275 250 No \uad‘ output mgn 2 4 s a1D1214161820222A262830323438 Supp‘y Vohage (v) 500 500 500 500 550
3.15 Typical Characteristics, LM2903B-Q1 Only
TA = 25°C, VS = 5 V, RPULLUP = 5.1k, CL = 15 pF, VCM = 0 V, VUNDERDRIVE = 100 mV, VOVERDRIVE = 100 mV unless otherwise
noted.
Figure 3-7. Total Supply Current vs. Supply Voltage
Input Voltage (V)
Total Supply Current (PA)
-0.5 -0.25 0 0.25 0.5 0.75 1 1.25 1.5 1.75 2
100
140
180
220
260
300
340
380
420
460
500
VS=3V
-40°C
0°C
25°C
85°C
125°C
Figure 3-8. Total Supply Current vs. Input Voltage at 3V
Input Voltage (V)
Total Supply Current (PA)
-0.5 -0.25 0 0.25 0.5 0.75 1 1.25 1.5 1.75 2
100
140
180
220
260
300
340
380
420
460
500
VS=3.3V
-40°C
0°C
25°C
85°C
125°C
Figure 3-9. Total Supply Current vs. Input Voltage at 3.3V
Figure 3-10. Total Supply Current vs. Input Voltage at 5V
Input Voltage (V)
Total Supply Current (PA)
-1 0 1 2 3 4 5 6 7 8 9 10 11
100
140
180
220
260
300
340
380
420
460
500
VS=12V
-40°C
0°C
25°C
85°C
125°C
Figure 3-11. Total Supply Current vs. Input Voltage at 12V
Input Voltage (V)
Total Supply Current (PA)
0 3 6 9 12 15 18 21 24 27 30 33 36
150
190
230
270
310
350
390
430
470
510
550
VS=36V
-40°C
0°C
25°C
85°C
125°C
Figure 3-12. Total Supply Current vs. Input Voltage at 36V
www.ti.com
LM2903-Q1, LM2903B-Q1
SLCS141J – MAY 2003 – REVISED NOVEMBER 2020
Copyright © 2020 Texas Instruments Incorporated Submit Document Feedback 9
Product Folder Links: LM2903-Q1 LM2903B-Q1
TEXAS INSTRUMENTS
3.15 Typical Characteristics, LM2903B-Q1 Only (continued)
TA = 25°C, VS = 5 V, RPULLUP = 5.1k, CL = 15 pF, VCM = 0 V, VUNDERDRIVE = 100 mV, VOVERDRIVE = 100 mV unless otherwise
noted.
Temperature (°C)
Input Offset Voltage (mV)
-40 -25 -10 5 20 35 50 65 80 95 110 125
-2
-1.5
-1
-0.5
0
0.5
1
1.5
2
VS = 3V
63 Channels
Figure 3-13. Input Offset Voltage vs. Temperature at 3V
Temperature (°C)
Input Offset Voltage (mV)
-40 -25 -10 5 20 35 50 65 80 95 110 125
-2
-1.5
-1
-0.5
0
0.5
1
1.5
2
VS = 5V
62 Channels
Figure 3-14. Input Offset Voltage vs. Temperature at 5V
Temperature (°C)
Input Offset Voltage (mV)
-40 -25 -10 5 20 35 50 65 80 95 110 125
-2
-1.5
-1
-0.5
0
0.5
1
1.5
2
VS = 12V
62 Channels
Figure 3-15. Input Offset Voltage vs. Temperature at 12V
Temperature (°C)
Input Offset Voltage (mV)
-40 -25 -10 5 20 35 50 65 80 95 110 125
-2
-1.5
-1
-0.5
0
0.5
1
1.5
2
VS = 36V
62 Channels
Figure 3-16. Input Offset Voltage vs. Temperature at 36
Supply Voltage (V)
Input Offset Voltage (mV)
3 6 9 12 15 18 21 24 27 30 33 36
-2
-1.5
-1
-0.5
0
0.5
1
1.5
2
TA = -40°C
62 Channels
Figure 3-17. Input Offset Voltage vs. Supply Voltage at -40°C
Supply Voltage (V)
Input Offset Voltage (mV)
3 6 9 12 15 18 21 24 27 30 33 36
-2
-1.5
-1
-0.5
0
0.5
1
1.5
2
TA = 25°C
62 Channels
Figure 3-18. Input Offset Voltage vs. Supply Voltage at 25°C
LM2903-Q1, LM2903B-Q1
SLCS141J – MAY 2003 – REVISED NOVEMBER 2020 www.ti.com
10 Submit Document Feedback Copyright © 2020 Texas Instruments Incorporated
Product Folder Links: LM2903-Q1 LM2903B-Q1
TEXAS INSTRUMENTS
3.15 Typical Characteristics, LM2903B-Q1 Only (continued)
TA = 25°C, VS = 5 V, RPULLUP = 5.1k, CL = 15 pF, VCM = 0 V, VUNDERDRIVE = 100 mV, VOVERDRIVE = 100 mV unless otherwise
noted.
Supply Voltage (V)
Input Offset Voltage (mV)
3 6 9 12 15 18 21 24 27 30 33 36
-2
-1.5
-1
-0.5
0
0.5
1
1.5
2
TA = 85°C
62 Channels
Figure 3-19. Input Offset Voltage vs. Supply Voltage at 85°C
Supply Voltage (V)
Input Offset Voltage (mV)
3 6 9 12 15 18 21 24 27 30 33 36
-2
-1.5
-1
-0.5
0
0.5
1
1.5
2
TA = 125qC
62 Channels
Figure 3-20. Input Offset Voltage vs. Supply Voltage at 125°C
Supply Voltage (V)
Input Bias Current (nA)
3 6 9 12 15 18 21 24 27 30 33 36
-5
-4.5
-4
-3.5
-3
-2.5
-2
-1.5
-1
-0.5
0
VCM=0V 125°C
85°C
25°C
0°C
-40°C
Figure 3-21. Input Bias Current vs. Supply Voltage
Input Voltage (V)
Input Bias Current (nA)
-0.5 0 0.5 1 1.5 2 2.5 3 3.5
-5
-4.5
-4
-3.5
-3
-2.5
-2
-1.5
-1
-0.5
0
VS=5V
125°C
85°C
25°C
0°C
-40°C
Figure 3-22. Input Bias Current vs. Input Voltage at 5V
Input Voltage (V)
Input Bias Current (nA)
-0.5 0.5 1.5 2.5 3.5 4.5 5.5 6.5 7.5 8.5 9.5 10.5
-5
-4.5
-4
-3.5
-3
-2.5
-2
-1.5
-1
-0.5
0
VS=12V
125°C
85°C
25°C
0°C
-40°C
Figure 3-23. Input Bias Current vs. Input Voltage at 12V
Input Voltage (V)
Input Bias Current (nA)
0 4 8 12 16 20 24 28 32 36
-5
-4.5
-4
-3.5
-3
-2.5
-2
-1.5
-1
-0.5
0
0.5
1
VS=36V
125°C
85°C
25°C
0°C
-40°C
Figure 3-24. Input Bias Current vs. Input Voltage at 36V
www.ti.com
LM2903-Q1, LM2903B-Q1
SLCS141J – MAY 2003 – REVISED NOVEMBER 2020
Copyright © 2020 Texas Instruments Incorporated Submit Document Feedback 11
Product Folder Links: LM2903-Q1 LM2903B-Q1
I TEXAS INSTRUMENTS mu mu
3.15 Typical Characteristics, LM2903B-Q1 Only (continued)
TA = 25°C, VS = 5 V, RPULLUP = 5.1k, CL = 15 pF, VCM = 0 V, VUNDERDRIVE = 100 mV, VOVERDRIVE = 100 mV unless otherwise
noted.
Output Sinking Current (A)
Output Voltage to GND (V)
10P100P1m 10m 100m
1m
10m
100m
1
10
VS = 3V
125°C
85°C
25°C
0°C
-40°C
Figure 3-25. Output Low Voltage vs. Output Sinking Current at
3V
Output Sinking Current (A)
Output Voltage to GND (V)
10P100P1m 10m 100m
1m
10m
100m
1
10
VS = 5V
125°C
85°C
25°C
0°C
-40°C
Figure 3-26. Output Low Voltage vs. Output Sinking Current at
5V
Output Sinking Current (A)
Output Voltage to GND (V)
10P100P1m 10m 100m
1m
10m
100m
1
10
VS = 12V
125°C
85°C
25°C
0°C
-40°C
Figure 3-27. Output Low Voltage vs. Output Sinking Current at
12V
Output Sinking Current (A)
Output Voltage to GND (V)
10P100P1m 10m 100m
1m
10m
100m
1
10
VS = 36V
125°C
85°C
25°C
0°C
-40°C
Figure 3-28. Output Low Voltage vs.Output Sinking Current at
36V
Temperature (°C)
Output High Leakage to GND (nA)
-40 -25 -10 5 20 35 50 65 80 95 110 125
0.01
0.02
0.05
0.1
0.2
0.5
1
2
5
10
20
50
100
Output set high
VOUT = VS
Figure 3-29. Output High Leakage Current vs.Temperature at 5V
Temperature (°C)
Output High Leakage to GND (nA)
-40 -25 -10 5 20 35 50 65 80 95 110 125
0.01
0.02
0.05
0.1
0.2
0.5
1
2
5
10
20
50
100
Output set high
VOUT = VS
Figure 3-30. Output High Leakage Current vs. Temperature at
36V
LM2903-Q1, LM2903B-Q1
SLCS141J – MAY 2003 – REVISED NOVEMBER 2020 www.ti.com
12 Submit Document Feedback Copyright © 2020 Texas Instruments Incorporated
Product Folder Links: LM2903-Q1 LM2903B-Q1
l TEXAS INSTRUMENTS 1000 1000 1000 1000 quo ‘uou
3.15 Typical Characteristics, LM2903B-Q1 Only (continued)
TA = 25°C, VS = 5 V, RPULLUP = 5.1k, CL = 15 pF, VCM = 0 V, VUNDERDRIVE = 100 mV, VOVERDRIVE = 100 mV unless otherwise
noted.
Input Overdrive (mV)
Propagation Delay, High to Low (ns)
5 10 100 1000
0
100
200
300
400
500
600
700
800
900
1000
VS = 5V
VCM = 0V
CL = 15pF
RP = 5.1k
125°C
85°C
25°C
-40°C
Figure 3-31. High to Low Propagation Delay vs. Input Overdrive
Voltage, 5V
Input Overdrive (mV)
Propagation Delay, Low to High (ns)
5 10 100 1000
0
100
200
300
400
500
600
700
800
900
1000
VS = 5V
VCM = 0V
CL = 15pF
RP = 5.1k
125°C
85°C
25°C
-40°C
Figure 3-32. Low to High Propagation Delay vs. Input Overdrive
Voltage, 5V
Input Overdrive (mV)
Propagation Delay, High to Low (ns)
5 10 100 1000
0
100
200
300
400
500
600
700
800
900
1000
VS = 12V
VCM = 0V
CL = 15pF
RP = 5.1k
125°C
85°C
25°C
-40°C
Figure 3-33. High to Low Propagation Delay vs. Input Overdrive
Voltage, 12V
Input Overdrive (mV)
Propagation Delay, Low to High (ns)
5 10 100 1000
0
100
200
300
400
500
600
700
800
900
1000
VS = 12V
VCM = 0V
CL = 15pF
RP = 5.1k
125°C
85°C
25°C
-40°C
Figure 3-34. Low to High Propagation Delay vs. Input Overdrive
Voltage, 12V
Input Overdrive (mV)
Propagation Delay, High to Low (ns)
5 10 100 1000
0
100
200
300
400
500
600
700
800
900
1000
VS = 36V
VCM = 0V
CL = 15pF
RP = 5.1k
125°C
85°C
25°C
-40°C
Figure 3-35. High to Low Propagation Delay vs. Input Overdrive
Voltage, 36V
Input Overdrive (mV)
Propagation Delay, Low to High (ns)
5 10 100 1000
0
100
200
300
400
500
600
700
800
900
1000
VS = 36V
VCM = 0V
CL = 15pF
RP = 5.1k
125°C
85°C
25°C
-40°C
Figure 3-36. Low to High Propagation Delay vs. Input Overdrive
Voltage, 36V
www.ti.com
LM2903-Q1, LM2903B-Q1
SLCS141J – MAY 2003 – REVISED NOVEMBER 2020
Copyright © 2020 Texas Instruments Incorporated Submit Document Feedback 13
Product Folder Links: LM2903-Q1 LM2903B-Q1
TEXAS INSTRUMENTS
3.15 Typical Characteristics, LM2903B-Q1 Only (continued)
TA = 25°C, VS = 5 V, RPULLUP = 5.1k, CL = 15 pF, VCM = 0 V, VUNDERDRIVE = 100 mV, VOVERDRIVE = 100 mV unless otherwise
noted.
Time (Ps)
Output Voltage (V)
-0.1 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1
-1
0
1
2
3
4
5
6
VREF = VCC/2
20mV Overdrive
5mV
Overdrive
100mV
Overdrive
Figure 3-37. Response Time for Various Overdrives, High-to-
Low Transition
Time (Ps)
Output Voltage (V)
-0.1 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1
-1
0
1
2
3
4
5
6
20mV Overdrive
5mV Overdrive
100mV
Overdrive
VREF = VCC/2
Figure 3-38. Response Time for Various Overdrives, Low-to-
High Transition
LM2903-Q1, LM2903B-Q1
SLCS141J – MAY 2003 – REVISED NOVEMBER 2020 www.ti.com
14 Submit Document Feedback Copyright © 2020 Texas Instruments Incorporated
Product Folder Links: LM2903-Q1 LM2903B-Q1
I TEXAS INSTRUMENTS
4 Detailed Description
4.1 Overview
The LM2903-Q1 family is a dual comparator with the ability to operate up to 36 V on the supply pin. This
standard device has proven ubiquity and versatility across a wide range of applications. This is due to it's very
wide supply voltages range (2 V to 36 V), low Iq and fast response.
This device is AEC-Q100 qualified and can operate over a wide temperature range of –40°C to 125°C (LM2903-
Q1 and LM2903B-Q1) or –40°C to 150°C (LM2903E-Q1).
The open-drain output allows the user to configure the output's logic low voltage (V OL) and can be utilized to
enable the comparator to be used in AND functionality.
The "B" versions add dedicated ESD protections on all the pins for improved ESD performance as well as
improved negative input voltage handling. Please see Application Note SNOAA35 for more information
4.2 Functional Block Diagram
80- Aµ
Current Regulator
80 µA
60 µA10 µA
VCC
10 µA
OUT
GND
IN+
IN−
Epi-FET
Diodes
Resistors
Transistors
COMPONENT COUNT
1
2
2
30
Figure 4-1. Schematic (Each Comparator)
4.3 Feature Description
LM2903-Q1 family consists of a PNP darlington pair input, allowing the device to operate with very high gain and
fast response with minimal input bias current. The input Darlington pair creates a limit on the input common
mode voltage capability, allowing LM2903-Q1 to accurately function from ground to VCC–1.5V differential input.
This is enables much head room for modern day supplies of 3.3 V and 5.0 V.
The output consists of an open drain NPN (pull-down or low side) transistor. The output NPN will sink current
when the negative input voltage is higher than the positive input voltage and the offset voltage. The VOL is
resistive and will scale with the output current. Please see Figure 3-3 in the Section 3.14 section for VOL values
with respect to the output current.
4.4 Device Functional Modes
4.4.1 Voltage Comparison
The LM2903-Q1 family operates solely as a voltage comparator, comparing the differential voltage between the
positive and negative pins and outputting a logic low or high impedance (logic high with pull-up) based on the
input differential polarity.
www.ti.com
LM2903-Q1, LM2903B-Q1
SLCS141J – MAY 2003 – REVISED NOVEMBER 2020
Copyright © 2020 Texas Instruments Incorporated Submit Document Feedback 15
Product Folder Links: LM2903-Q1 LM2903B-Q1
I TEXAS INSTRUMENTS
5 Application and Implementation
Note
Information in the following applications sections is not part of the TI component specification, and TI
does not warrant its accuracy or completeness. TI’s customers are responsible for determining
suitability of components for their purposes. Customers should validate and test their design
implementation to confirm system functionality.
5.1 Application Information
LM2903-Q1 will typically be used to compare a single signal to a reference or two signals against each other.
Many users take advantage of the open drain output to drive the comparison logic output to a logic voltage level
to an MCU or logic device. The wide supply range and high voltage capability makes LM2903Q1 optimal for level
shifting to a higher or lower voltage.
5.2 Typical Application
+
½ LM2903
VLOGIC
VSUP
Vref
Vin +
½ LM2903
Vin-
Vin+
Rpullup Rpullup
VLOGIC
VSUP
CLCL
Figure 5-1. Single-ended and Differential Comparator Configurations
5.2.1 Design Requirements
For this design example, use the parameters listed in Table 5-1 as the input parameters.
Table 5-1. Design Parameters
DESIGN PARAMETER EXAMPLE VALUE
Input Voltage Range 0 V to Vsup-1.5 V
Supply Voltage 2 V to 36 V
Logic Supply Voltage 2 V to 36 V
Output Current (RPULLUP) 1 µA to 20 mA
Input Overdrive Voltage 100 mV
Reference Voltage 2.5 V
Load Capacitance (CL) 15 pF
5.2.2 Detailed Design Procedure
When using LM2903-Q1 family in a general comparator application, determine the following:
• Input Voltage Range
• Minimum Overdrive Voltage
• Output and Drive Current
• Response Time
5.2.2.1 Input Voltage Range
When choosing the input voltage range, the input common mode voltage range (V ICR) must be taken in to
account. If temperature operation is above or below 25°C the VICR can range from 0 V to VCC– 2.0 V. This limits
the input voltage range to as high as VCC– 2.0 V and as low as 0 V. Operation outside of this range can yield
incorrect comparisons.
LM2903-Q1, LM2903B-Q1
SLCS141J – MAY 2003 – REVISED NOVEMBER 2020 www.ti.com
16 Submit Document Feedback Copyright © 2020 Texas Instruments Incorporated
Product Folder Links: LM2903-Q1 LM2903B-Q1
I TEXAS INSTRUMENTS
Below is a list of input voltage situation and their outcomes:
1. When both IN- and IN+ are both within the common mode range:
a. If IN- is higher than IN+ and the offset voltage, the output is low and the output transistor is sinking current
b. If IN- is lower than IN+ and the offset voltage, the output is high impedance and the output transistor is not
conducting
2. When IN- is higher than common mode and IN+ is within common mode, the output is low and the output
transistor is sinking current
3. When IN+ is higher than common mode and IN- is within common mode, the output is high impedance and
the output transistor is not conducting
4. When IN- and IN+ are both higher than common mode, the output is low and the output transistor is sinking
current
5.2.2.2 Minimum Overdrive Voltage
Overdrive Voltage is the differential voltage produced between the positive and negative inputs of the
comparator over the offset voltage (VIO). In order to make an accurate comparison the Overdrive Voltage (VOD)
should be higher than the input offset voltage (VIO). Overdrive voltage can also determine the response time of
the comparator, with the response time decreasing with increasing overdrive. Figure 5-2 and Figure 5-3 show
positive and negative response times with respect to overdrive voltage.
5.2.2.3 Output and Drive Current
Output current is determined by the load/pull-up resistance and logic/pull-up voltage. The output current will
produce a output low voltage (VOL) from the comparator. In which VOL is proportional to the output current. Use
Figure 3-5 to determine VOL based on the output current.
The output current can also effect the transient response. More will be explained in the next section.
5.2.2.4 Response Time
The transient response can be determined by the load capacitance (CL), load/pull-up resistance (RPULLUP) and
equivalent collector-emitter resistance (RCE).
• The positive response time (τp) is approximately τP ~ RPULLUP × CL
• The negative response time (τN) is approximately τN ~ RCE × CL
– RCE can be determine by taking the slope of Figure 3-5 in it's linear region at the desired temperature, or
by dividing the VOL by Iout
5.2.3 Application Curves
The following curves were generated with 5 V on VCC and VLogic, RPULLUP = 5.1 kΩ, and 50 pF scope probe.
±1
0
1
2
3
4
5
6
-0.25 0.25 0.75 1.25 1.75 2.25
Output Voltage, Vo(V)
Time (usec)
5mV OD
20mV OD
100mV OD
C004
Figure 5-2. Response Time for Various Overdrives
(Positive Transition)
±1
0
1
2
3
4
5
6
±0.25 0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00
Output Voltage (Vo)
Time (usec)
5mV OD
20mV OD
100mV OD
C006
Figure 5-3. Response Time for Various Overdrives
(Negative Transition)
www.ti.com
LM2903-Q1, LM2903B-Q1
SLCS141J – MAY 2003 – REVISED NOVEMBER 2020
Copyright © 2020 Texas Instruments Incorporated Submit Document Feedback 17
Product Folder Links: LM2903-Q1 LM2903B-Q1
I TEXAS INSTRUMENTS
6 Power Supply Recommendations
For fast response and comparison applications with noisy or AC inputs, it is recommended to use a bypass
capacitor on the supply pin to reject any variation on the supply voltage. This variation can eat into the
comparator's input common mode range and create an inaccurate comparison.
7 Layout
7.1 Layout Guidelines
For accurate comparator applications without hysteresis it is important maintain a stable power supply with
minimized noise and glitches, which can affect the high level input common mode voltage range. In order to
achieve this, it is best to add a bypass capacitor between the supply voltage and ground. This should be
implemented on the positive power supply and negative supply (if available). If a negative supply is not being
used, do not put a capacitor between the IC's GND pin and system ground.
7.2 Layout Example
1OUT 1
1INí 2
1IN+ 3
GND 4
8 VCC
7 2OUT
6 2INí
5 2IN+
0.1PF
Ground
Bypass
Capacitor
Negative Supply or Ground
Positive Supply
0.1PF
Ground
Only needed
for dual power
supplies
Figure 7-1. LM2903Q1 Layout Example
8 Device and Documentation Support
8.1 Documentation Support
8.1.1 Related Documentation
LM2903B-Q1 Functional Safety FIT Rate, FMD and Pin FMA - SLCA005
Application Design Guidelines for LM339, LM393, TL331 Family Comparators - SNOAA35
Analog Engineers Circuit Cookbook: Amplifiers (See Comparators section) - SLYY137
8.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
8.3 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
8.4 Trademarks
TI E2E™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
LM2903-Q1, LM2903B-Q1
SLCS141J – MAY 2003 – REVISED NOVEMBER 2020 www.ti.com
18 Submit Document Feedback Copyright © 2020 Texas Instruments Incorporated
Product Folder Links: LM2903-Q1 LM2903B-Q1
I TEXAS INSTRUMENTS Am
8.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
8.6 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.
www.ti.com
LM2903-Q1, LM2903B-Q1
SLCS141J – MAY 2003 – REVISED NOVEMBER 2020
Copyright © 2020 Texas Instruments Incorporated Submit Document Feedback 19
Product Folder Links: LM2903-Q1 LM2903B-Q1
I TEXAS INSTRUMENTS
9 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
LM2903-Q1, LM2903B-Q1
SLCS141J – MAY 2003 – REVISED NOVEMBER 2020 www.ti.com
20 Submit Document Feedback Copyright © 2020 Texas Instruments Incorporated
Product Folder Links: LM2903-Q1 LM2903B-Q1
I TEXAS INSTRUMENTS Samples Samples Samples Samples Samples Samples Samples Samples Samples Samples Samples Samples Samples Samples Samples Samples Samples Samples Samples
PACKAGE OPTION ADDENDUM
www.ti.com 7-Oct-2021
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM2903AVQDRG4Q1 ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 2903AVQ
LM2903AVQDRQ1 ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 2903AVQ
LM2903AVQPWRG4Q1 ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 2903AVQ
LM2903AVQPWRQ1 ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 2903AVQ
LM2903BQDDFRQ1 ACTIVE SOT-23-THIN DDF 8 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 903BQ
LM2903BQDGKRQ1 ACTIVE VSSOP DGK 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 03BQ
LM2903BQDRQ1 ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 2903BQ
LM2903BQPWRQ1 ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 2903BQ
LM2903BWDSGRQ1 PREVIEW WSON DSG 8 3000 RoHS & Green SN Level-2-260C-1 YEAR -40 to 125 3BWQ
LM2903EPWRQ1 ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 150 2903Q0
LM2903QDGKRQ1 ACTIVE VSSOP DGK 8 2500 RoHS & Green NIPDAUAG Level-2-260C-1 YEAR -40 to 125 KACQ
LM2903QDRG4Q1 ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 2903Q1
LM2903QDRQ1 ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 2903Q1
LM2903QPWRG4Q1 ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 2903Q1
LM2903QPWRQ1 ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 2903Q1
LM2903VQDRG4Q1 ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 2903VQ1
LM2903VQDRQ1 ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 2903VQ1
LM2903VQPWRG4Q1 ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 2903VQ
LM2903VQPWRQ1 ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 2903VQ
PLM2903BWDSGRQ1 ACTIVE WSON DSG 8 3000 TBD Call TI Call TI -40 to 125
I TEXAS INSTRUMENTS
PACKAGE OPTION ADDENDUM
www.ti.com 7-Oct-2021
Addendum-Page 2
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF LM2903-Q1, LM2903B-Q1 :
•Catalog : LM2903, LM2903B
NOTE: Qualified Version Definitions:
•Catalog - TI's standard catalog product
l TEXAS INSTRUMENTS REEL DIMENSIONS TAPE DIMENSIONS 7 “K0 '«Pt» Reel Dlameter A0 Dimension designed to accommodate the component Width ED Dimension designed to accommodate the component tengtn K0 Dimension designed to accommodate the component thickness 7 w Overau Width onhe carrier tape i P1 Pitch between successive cawty centers f T Reel Width (W1) QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE C) O O D O O D O SprocketHotes ,,,,,,,,,,, ‘ User DtreCIIDn 0' Feed Pockel Quadrams
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM2903AVQDRQ1 SOIC D 8 2500 330.0 12.5 6.4 5.2 2.1 8.0 12.0 Q1
LM2903AVQPWRG4Q1 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM2903AVQPWRQ1 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM2903BQDDFRQ1 SOT-
23-THIN DDF 8 3000 180.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LM2903BQDGKRQ1 VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM2903BQDRQ1 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM2903BQPWRQ1 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM2903EPWRQ1 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM2903QDGKRQ1 VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM2903QPWRG4Q1 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM2903QPWRQ1 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM2903VQPWRG4Q1 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM2903VQPWRQ1 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 23-Jul-2021
Pack Materials-Page 1
l TEXAS INSTRUMENTS TAPE AND REEL BOX DIMENSIONS
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM2903AVQDRQ1 SOIC D 8 2500 340.5 336.1 25.0
LM2903AVQPWRG4Q1 TSSOP PW 8 2000 367.0 367.0 35.0
LM2903AVQPWRQ1 TSSOP PW 8 2000 853.0 449.0 35.0
LM2903BQDDFRQ1 SOT-23-THIN DDF 8 3000 210.0 185.0 35.0
LM2903BQDGKRQ1 VSSOP DGK 8 2500 366.0 364.0 50.0
LM2903BQDRQ1 SOIC D 8 2500 340.5 336.1 25.0
LM2903BQPWRQ1 TSSOP PW 8 2000 853.0 449.0 35.0
LM2903EPWRQ1 TSSOP PW 8 2000 853.0 449.0 35.0
LM2903QDGKRQ1 VSSOP DGK 8 2500 366.0 364.0 50.0
LM2903QPWRG4Q1 TSSOP PW 8 2000 853.0 449.0 35.0
LM2903QPWRQ1 TSSOP PW 8 2000 853.0 449.0 35.0
LM2903VQPWRG4Q1 TSSOP PW 8 2000 367.0 367.0 35.0
LM2903VQPWRQ1 TSSOP PW 8 2000 853.0 449.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 23-Jul-2021
Pack Materials-Page 2
DDF0008A / —— \ JI- \ /~x
www.ti.com
PACKAGE OUTLINE
C
TYP
2.95
2.65
1.1 MAX
6X 0.65
8X 0.4
0.2
2X
1.95
TYP
0.20
0.08
0 - 8 0.1
0.0
0.25
GAGE PLANE
0.6
0.3
A
NOTE 3
2.95
2.85
B1.65
1.55
4222047/B 11/2015
SOT-23 - 1.1 mm max heightDDF0008A
PLASTIC SMALL OUTLINE
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
18
0.1 C A B
5
4
PIN 1 ID
AREA
SEATING PLANE
0.1 C
SEE DETAIL A
DETAIL A
TYPICAL
SCALE 4.000
DDF0008A
www.ti.com
EXAMPLE BOARD LAYOUT
(2.6)
8X (1.05)
8X (0.45)
6X (0.65)
(R )
TYP
0.05
4222047/B 11/2015
SOT-23 - 1.1 mm max heightDDF0008A
PLASTIC SMALL OUTLINE
SYMM
SYMM
LAND PATTERN EXAMPLE
SCALE:15X
1
45
8
NOTES: (continued)
4. Publication IPC-7351 may have alternate designs.
5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
DDF0008A
www.ti.com
EXAMPLE STENCIL DESIGN
(2.6)
6X (0.65)
8X (0.45)
8X (1.05)
(R ) TYP0.05
4222047/B 11/2015
SOT-23 - 1.1 mm max heightDDF0008A
PLASTIC SMALL OUTLINE
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
7. Board assembly site may have different recommendations for stencil design.
SYMM
SYMM
1
45
8
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:15X
‘J
www.ti.com
PACKAGE OUTLINE
C
.228-.244 TYP
[5.80-6.19]
.069 MAX
[1.75]
6X .050
[1.27]
8X .012-.020
[0.31-0.51]
2X
.150
[3.81]
.005-.010 TYP
[0.13-0.25]
0 - 8 .004-.010
[0.11-0.25]
.010
[0.25]
.016-.050
[0.41-1.27]
4X (0 -15 )
A
.189-.197
[4.81-5.00]
NOTE 3
B .150-.157
[3.81-3.98]
NOTE 4
4X (0 -15 )
(.041)
[1.04]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES:
1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.
Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed .006 [0.15] per side.
4. This dimension does not include interlead flash.
5. Reference JEDEC registration MS-012, variation AA.
18
.010 [0.25] C A B
5
4
PIN 1 ID AREA
SEATING PLANE
.004 [0.1] C
SEE DETAIL A
DETAIL A
TYPICAL
SCALE 2.800
Yl“‘+
www.ti.com
EXAMPLE BOARD LAYOUT
.0028 MAX
[0.07]
ALL AROUND
.0028 MIN
[0.07]
ALL AROUND
(.213)
[5.4]
6X (.050 )
[1.27]
8X (.061 )
[1.55]
8X (.024)
[0.6]
(R.002 ) TYP
[0.05]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
METAL SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
EXPOSED
METAL
OPENING
SOLDER MASK METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
EXPOSED
METAL
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:8X
SYMM
1
45
8
SEE
DETAILS
SYMM
www.ti.com
EXAMPLE STENCIL DESIGN
8X (.061 )
[1.55]
8X (.024)
[0.6]
6X (.050 )
[1.27] (.213)
[5.4]
(R.002 ) TYP
[0.05]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON .005 INCH [0.125 MM] THICK STENCIL
SCALE:8X
SYMM
SYMM
1
45
8
MECHANICAL DATA DGK (S—PDSO—GS) PLASTIC SMALL—OUTLINE PACKAGE m1 WW“: {[0 VAX % j 3,010 I 4073329/E 05/06 NO'ES' A AH imec' dimensmrs c'e m m'hmeiers 5 Th: drawing is enmec: :e change within: nciice. Body icnqth Coos mi mciucc maid Hash, protrusions or we tms Mom 'iush, aromons, ov qaw burrs shaH m exceed 015 per end b Budy mm does not wcude inierieud flasi‘ inieriead ‘iush s'mii 'mi exceed 050 pe' we : FuHs wiUHn JEDEC M0487 quulion AA, except 'vievieud ricer INSTRUMENTS w. (i. com
LAND PATTERN DATA DGK (37PD30708) PLASTIC SMALL OUTLINE PACKAGE Exampie Board Layout Exampie stencii Openings Based on a stencii thickness of .127mm L005inch), (See Nate 0) (,0 65) TYP ‘ Li 5 LLLLL L, pm ,,,,, PKG PKG "\ i i 4 — ----- i — ----- i D DU D i i ’ PKG PKG Q G . / Exampie , Non Soldermusk Defined Pad i , , —\ L A ~/ ‘\ Example \ Spider Musk Opening / +1 1‘(0,45) ‘ (See Note E) t 1 (1,45) < ‘="" \pud="" geometry="" ’="" (see="" note="" c)="" \="" +ii¢="" (0,05)="" \="" ah="" around="" «="" ,="" \="" e="" ’="" i="" ‘\-=""> muss/A 11/13 NOTES: A. Ali iinear dimensions are in miilimeters. a. This drawing is subject ta change without natiee, C, Publication |PCi7351 is recommended ior alternate designsu a. Laser cutting apertures with trapezoidui walls and aisa rounding corners w‘iH ofler eetter paste veiease. Customers snouid Contact their board ussembiy site for stencii design recommendations. Rater tn IFS—7525 for other slenci'i recummendutions. Customers should Contact their tmurd fabrication site for solder musk tolerances between and around signal pads. .r'I {I TEXAS INSTRUMENTS www.li.com
www.ti.com
GENERIC PACKAGE VIEW
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
WSON - 0.8 mm max heightDSG 8
PLASTIC SMALL OUTLINE - NO LEAD
2 x 2, 0.5 mm pitch
4224783/A
W
A
A
www.ti.com
PACKAGE OUTLINE
C
8X 0.3
0.2
1.6 0.1
2X
1.5
0.9 0.1
6X 0.5
8X 0.4
0.2
0.05
0.00
0.8 MAX
A2.1
1.9 B
2.1
1.9
0.3
0.2
0.4
0.2
(0.2) TYP
0.1 MIN
(0.05)
WSON - 0.8 mm max heightDSG0008B
PLASTIC SMALL OUTLINE - NO LEAD
4222124/E 05/2020
PIN 1 INDEX AREA
SEATING PLANE
0.08 C
1
45
8
PIN 1 ID 0.1 C A B
0.05 C
THERMAL PAD
EXPOSED
9
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
SCALE 5.500
SCALE 30.000
SECTION A-A
SECTION A-A
TYPICAL
ALTERNATIVE TERMINAL SHAPE
TYPICAL
www.ti.com
EXAMPLE BOARD LAYOUT
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
8X (0.25)
(1.6)
(1.9)
6X (0.5)
(0.9) ( 0.2) VIA
TYP
(0.55)
8X (0.5)
(R0.05) TYP
WSON - 0.8 mm max heightDSG0008B
PLASTIC SMALL OUTLINE - NO LEAD
4222124/E 05/2020
SYMM
1
45
8
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:20X
SYMM 9
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
SOLDER MASK
OPENING
SOLDER MASK
METAL UNDER
SOLDER MASK
DEFINED
EXPOSED
METAL
METAL
SOLDER MASK
OPENING
SOLDER MASK DETAILS
NON SOLDER MASK
DEFINED
(PREFERRED)
EXPOSED
METAL
www.ti.com
EXAMPLE STENCIL DESIGN
(R0.05) TYP
8X (0.25)
8X (0.5)
(0.9)
(0.7)
(1.9)
(0.45)
6X (0.5)
WSON - 0.8 mm max heightDSG0008B
PLASTIC SMALL OUTLINE - NO LEAD
4222124/E 05/2020
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD 9:
87% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
SCALE:25X
SYMM
1
45
8
METAL
SYMM 9
PW0008A '
www.ti.com
PACKAGE OUTLINE
C
TYP
6.6
6.2
1.2 MAX
6X 0.65
8X 0.30
0.19
2X
1.95
0.15
0.05
(0.15) TYP
0 - 8
0.25
GAGE PLANE
0.75
0.50
A
NOTE 3
3.1
2.9
B
NOTE 4
4.5
4.3
4221848/A 02/2015
TSSOP - 1.2 mm max heightPW0008A
SMALL OUTLINE PACKAGE
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153, variation AA.
18
0.1 C A B
5
4
PIN 1 ID
AREA
SEATING PLANE
0.1 C
SEE DETAIL A
DETAIL A
TYPICAL
SCALE 2.800
PW0008A
www.ti.com
EXAMPLE BOARD LAYOUT
(5.8)
0.05 MAX
ALL AROUND 0.05 MIN
ALL AROUND
8X (1.5)
8X (0.45)
6X (0.65)
(R )
TYP
0.05
4221848/A 02/2015
TSSOP - 1.2 mm max heightPW0008A
SMALL OUTLINE PACKAGE
SYMM
SYMM
LAND PATTERN EXAMPLE
SCALE:10X
1
45
8
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
NOT TO SCALE
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
PW0008A
www.ti.com
EXAMPLE STENCIL DESIGN
(5.8)
6X (0.65)
8X (0.45)
8X (1.5)
(R ) TYP0.05
4221848/A 02/2015
TSSOP - 1.2 mm max heightPW0008A
SMALL OUTLINE PACKAGE
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
SYMM
SYMM
1
45
8
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:10X
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, regulatory or other requirements.
These resources are subject to change without notice. TI grants you permission to use these resources only for development of an
application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license
is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you
will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these
resources.
TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on ti.com or provided in conjunction with
such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for
TI products.
TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2021, Texas Instruments Incorporated