Scheda tecnica STPS2L40 di STMicroelectronics

‘ ’ I menugmemed K__H_.A K99“ SMA Flat SMA Flnl Namh g9“ 5MB Flat
Features
• Very small conduction losses
• Negligible switching losses
• Low forward voltage drop
• Surface mount miniature package
• Avalanche rated
•ECOPACK2 component
Applications
• Telecom power supply
• Set-top box power supply
• TV power supply
• Battery charger
Description
Single chip Schottky rectifiers designed for high frequency miniature switched mode
power supplies such as adaptors and on board DC/DC converters.
Packaged in SMB, SMA Flat, SMA Flat Notch and SMB Flat, the STPS2L40 is ideal
for surface mounting and used in low voltage, high frequency inverters, free wheeling
and polarity protection applications.
Product status
STPS2L40
Product summary
Symbol Value
IF(AV) 2 A
VRRM 40 V
T j(max.) 150 °C
VF(typ.) 0.31 V
40 V, 2 A low drop power Schottky rectifier
STPS2L40
Datasheet
DS2146 - Rev 6 - September 2019
For further information contact your local STMicroelectronics sales office.
www.st.com
1Characteristics
Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified)
Symbol Parameter Value Unit
VRRM Repetitive peak reverse voltage 40 V
IF(AV) Average forward current, δ = 0.5, square
wave
SMB TL = 130 °C
2 ASMB Flat TL = 140 °C
SMA Flat, SMA Flat Notch TL = 130 °C
IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 75 A
PARM Repetitive peak avalanche power tp = 10 µs, Tj = 125 °C 158 W
Tstg Storage temperature range -65 to +150 °C
TjMaximum operating junction temperature(1) +150 °C
1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink.
Table 2. Thermal resistance parameter
Symbol Parameter Max. value Unit
Rth(j-l) Junction to lead
SMB 20
°C/W
SMB Flat 10
SMA Flat 20
SMA Flat Notch 20
For more information, please refer to the following application note :
• AN5088 : Rectifiers thermal management, handling and mounting recommendations
Table 3. Static electrical characteristics
Symbol Parameter Test conditions Min. Typ. Max. Unit
IR(1) Reverse leakage current
Tj = 25 °C
VR = 40 V
- 220 µA
Tj = 100 °C - 20 mA
Tj = 125 °C - 38 80 mA
VF(1) Forward voltage drop
Tj = 25 °C
IF = 1 A
- 0.39
V
Tj = 125 °C - 0.25 0.28
Tj = 25 °C
IF = 2 A
- 0.43
Tj = 125 °C - 0.31 0.34
Tj = 25 °C
IF = 4 A
- 0.50
Tj = 125 °C - 0.39 0.45
1. Pulse test: tp = 380 µs, δ < 2%
To evaluate the conduction losses, use the following equation:
P = 0.22 x IF(AV) + 0.06 x IF2(RMS)
STPS2L40
Characteristics
DS2146 - Rev 6 page 2/17
For more information, please refer to the following application notes related to the power losses :
• AN604: Calculation of conduction losses in a power rectifier
• AN4021: Calculation of reverse losses on a power diode
STPS2L40
Characteristics
DS2146 - Rev 6 page 3/17
1.1 Characteristics (curves)
Figure 1. Average forward power dissipation versus
average forward current
0.0
0.2
0.4
0.6
0.8
1.0
1.2
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8
P (W)
F(AV)
I (A)
F(AV)
T
δ=tp/T tp
δ = 1
δ = 0.05
δ = 0.5
δ = 0.1 δ = 0.2
Figure 2. Average forward current versus ambient
temperature (δ = 0.5) SMB
I (A)
F(AV)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
0 25 50 75 100 125 150
SMB
th(j-a th(j-l) )
=R
R
R
Tamb (°C)
=100°C/W
)th(j-a
tp
T
δ=tp/T
Figure 3. Average forward current versus ambient
temperature (δ = 0.5, SMB Flat)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
0 25 50 75 100 125 150
I (A)
F(AV)
SMB Flat
th(j-a th(j-l) )
=R
R
R
Tamb (°C)
=100°C/W
)th(j-a
tp
T
δ=tp/T
Figure 4. Average forward current versus ambient
temperature (δ = 0.5, SMA Flat, SMA Flat Notch)
I (A)
F(AV)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
0 25 50 75 100 125 150
th(j-a th(j-l) )
=R
R
R
Tamb (°C)
=200°C/W
)th(j-a
tp
T
δ=tp/T
SMA Flat
SMA Flat Notch
STPS2L40
Characteristics (curves)
DS2146 - Rev 6 page 4/17
Figure 5. Normalized avalanche power derating versus
pulse duration (Tj = 125 °C)
P (tp)
P (10 µs)
ARM
ARM
0.001
0.01
0.1
1
1 10 100 1000
t (µs)
p
Figure 6. Relative variation of thermal impedance junction
to ambient versus pulse duration (SMB)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Z / R
th(j-a) th(j-a)
Single pulse
SMB
t (s)
p
Figure 7. Relative variation of thermal impedance junction
to lead versus pulse duration (SMB flat)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01
Z / R
th(j-l) th(j-l)
Single pulse
SMB Flat
t (s)
p
Figure 8. Relative variation of thermal impedance junction
to ambient versus pulse duration (SMA Flat)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Z / R
th(j-a) th(j-a)
Single pulse
t (s)
p
SMA Flat / SMA Flat Notch
Figure 9. Reverse leakage current versus reverse voltage
applied (typical values)
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
0 5 10 15 20 25 30 35 40
I (mA)
R
VR(V)
Tj = 25 °C
Tj = 125 °C
Figure 10. Junction capacitance versus reverse voltage
applied (typical values)
10
100
1000
1 10 100
C(pF)
V (V)
R
F=1MHz
V =30mV
T =25°C
OSC RMS
j
STPS2L40
Characteristics (curves)
DS2146 - Rev 6 page 5/17
Figure 11. Forward voltage drop versus forward current
(high level)
0.1
1.0
10.0
0.0 0.1 0.4 0.5 0.6 0.7
0.2 0.3
Tj=25°C
(maximum values)
Tj=125°C
(Maximum values)
Tj=125°C
(maximum values)
Tj=125°CTj=125°C
(typical values)
IF(A)
VF(V)
Figure 12. Forward voltage drop versus forward current
(low level)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0.0 0.1 0.2 0.3 0.4 0.5 0.6
Tj=25°C
(maximum values)
Tj=125°C
(Maximum values)
Tj=125°C
(maximum values)
Tj=125°CTj=125°C
(typical values)
IF(A)
VF(V)
Figure 13. Thermal resistance junction to ambient versus
copper surface under each lead (SMB)
0
50
100
150
200
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
R (°C/W)
th(j-a)
SMB
S(Cu)(cm²)
Epoxy p ri nted ci rcui t board FR4, coppe r t hick ness: 35 µm
Figure 14. Thermal resistance junction to ambient versus
copper surface under each lead (SMB flat)
0
50
100
150
200
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
SCu(cm²)
Rth(j-a) (°C/W)
SMB flat
Epoxy printed circuit board FR4, eCu = 35 µm
Figure 15. Thermal resistance junction to ambient versus copper surface under each lead (SMA Flat, SMA
Flat Notch)
0
50
100
150
200
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
R (°C/W)
th(j-a)
S(Cu)(cm²)
Epoxy printed circuit board FR4, copper thic kness: 35 µm
SMA Flat Notch
SMA Flat
STPS2L40
Characteristics (curves)
DS2146 - Rev 6 page 6/17
2Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.
2.1 SMB package information
• Epoxy meets UL94, V0
• Lead-free package
Figure 16. SMB package outline
E1
E
D
C
L
A1
A2
b
STPS2L40
Package information
DS2146 - Rev 6 page 7/17
Table 4. SMB package mechanical data
Ref.
Dimensions
Millimeters Inches (for reference only)
Min. Max. Min. Max.
A1 1.90 2.45 0.074 0.097
A2 0.05 0.20 0.001 0.008
b 1.95 2.20 0.076 0.087
c 0.15 0.40 0.005 0.016
D 3.30 3.95 0.129 0.156
E 5.10 5.60 0.200 0.221
E1 4.05 4.60 0.159 0.182
L 0.75 1.50 0.029 0.060
Figure 17. SMB recommended footprint
2.60
(0.102)
5.84
(0.230)
1.62
2.18
(0.086)
1.62
)640.0()460.0(
STPS2L40
SMB package information
DS2146 - Rev 6 page 8/17
‘ ‘x “ tri‘ L J L; id 4
2.2 SMB Flat package information
• Epoxy meets UL94, V0
• Lead-free package
Figure 18. SMB Flat package outline
D
A
L 2x
L2 2 x
L1 2 x
EE1
b
c
Table 5. SMB Flat mechanical data
Ref.
Dimensions
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 0.90 1.10 0.035 0.044
b 1.95 2.20 0.076 0.087
c 0.15 0.40 0.005 0.016
D 3.30 3.95 0.129 0.156
E 5.10 5.60 0.200 0.221
E1 4.05 4.60 0.159 0.182
L 0.75 1.50 0.029 0.060
L1 0.40 0.016
L2 0.60 0.024
STPS2L40
SMB Flat package information
DS2146 - Rev 6 page 9/17
Figure 19. Footprint recommendations, dimensions in mm (inches)
5.84
(0.230)
1.20
(0.047)
3.44
(0.136)
1.20
(0.047)
2.07
(0.082)
millimeters
(inches)
STPS2L40
SMB Flat package information
DS2146 - Rev 6 page 10/17
2.3 SMA Flat package information
• Epoxy meets UL94, V0
• Lead-free package
Figure 20. SMA Flat package outline
D
A
L 2x
L
L2 2 x
L1 2 x
EE1
b
c
2 x
Table 6. SMA Flat package mechanical data
Ref.
Dimensions
Millimeters Inches (for reference only)
Min. Typ. Max. Min. Typ. Max.
A 0.90 1.10 0.035 0.044
b 1.25 1.65 0.049 0.065
c 0.15 0.40 0.005 0.016
D 2.25 2.95 0.088 0.117
E 4.80 5.60 0.188 0.221
E1 3.95 4.60 0.155 0.182
L 0.75 1.50 0.029 0.060
L1 0.50 0.020
L2 0.50 0.020
STPS2L40
SMA Flat package information
DS2146 - Rev 6 page 11/17
Figure 21. SMA Flat recommended footprint in mm (inches)
1.20
(0.047)
1.20
(0.047)
3.12
(0.123)
5.52
(0.217)
1.52
(0.060)
millimeter s
(inches)
STPS2L40
SMA Flat package information
DS2146 - Rev 6 page 12/17
2.4 SMA Flat Notch package information
• Epoxy meets UL94, V0
• Cooling method: by conduction (C)
• Band indicates cathode
Figure 22. SMA Flat Notch package outline
Table 7. SMA Flat Notch package mechanical data
Ref.
Dimensions
Millimeters Inches (for reference only)
Min. Typ. Max. Min. Typ. Max.
A1 0.90 1.10 0.035 0.044
A1 0.05 0.002
b 1.25 1.65 0.049 0.065
C 0.15 0.40 0.005 0.016
D 2.25 2.90 0.088 0.115
E 5.00 5.35 0.196 0.211
E1 3.95 4.60 0.155 0.182
G 2.00 0.079
G1 0.85 0.033
L 0.75 1.20 0.029
L1 0.45 0.018
L2 0.45 0.018
L3 0.05 0.002
V 8° 8°
V1 8° 8°
STPS2L40
SMA Flat Notch package information
DS2146 - Rev 6 page 13/17
Figure 23. SMA Flat Notch recommended footprint in mm (inches)
3.12
(0.123)
5.52
(0.217)
1.20
1.52
(0.060)
1.20
)470.0().0470(
STPS2L40
SMA Flat Notch package information
DS2146 - Rev 6 page 14/17
3Ordering information
Table 8. Ordering information
Order code Marking Package Weight Base qty. Delivery mode
STPS2L40U GD4 SMB 0.107 g 2500 Tape and reel
STPS2L40UF FGD4 SMB Flat 0.050 g 5000 Tape and reel
STPS2L40AF F2L4 SMA Flat 0.035 g 10 000 Tape and reel
STPS2L40AFN A24 SMA Flat Notch 0.039 g 10 000 Tape and reel
STPS2L40
Ordering Information
DS2146 - Rev 6 page 15/17
Revision history
Table 9. Document revision history
Date Version Changes
Jul-2003 2A Last update.
31-Jan-2007 3 Reformatted to current standard. Added ECOPACK statement. Added SMBflat package.
18-Sep-2008 4 Reformatted to current standard. Updated ECOPACK statement. Added SMAflat package.
04-Dec-2018 5 Updated Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified) and
Figure 5. Normalized avalanche power derating versus pulse duration (Tj = 125 °C).
27-Sep-2019 6 Added Section 2.4 SMA Flat Notch package information.
STPS2L40
DS2146 - Rev 6 page 16/17
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STPS2L40
DS2146 - Rev 6 page 17/17