Scheda tecnica BYG20D thru BYG20J di Vishay General Semiconductor - Diodes Division

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BYG20D, BYG20G, BYG20J
www.vishay.com Vishay General Semiconductor
Revision: 21-Feb-2020 1Document Number: 88958
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Ultrafast Avalanche SMD Rectifier
ADDITIONAL RESOURCES
FEATURES
Low profile package
Ideal for automated placement
Glass passivated pellet chip junction
Low reverse current
Soft recovery characteristics
Ultrafast reverse recovery time
Meets MSL level 1, per J-STD-020, LF maximum peak
of 260 °C
AEC-Q101 qualified available
- Automotive ordering code: base P/NHE3 or P/NHM3
Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
TYPICAL APPLICATIONS
For use in high frequency rectification of power supply,
inverters, converters, and freewheeling diodes for
consumer, automotive, and telecommunication.
MECHANICAL DATA
Case: SMA (DO-214AC)
Molding compound meets UL 94 V-0 flammability rating
Base P/N-E3 - RoHS-compliant, commercial grade
Base P/N-M3 - halogen-free, RoHS-compliant, commercial
grade
Base P/NHE3_X - RoHS-compliant and AEC-Q101 qualified
Base P/NHM3_X - halogen-free, RoHS-compliant and
AEC-Q101 qualified
(“_X” denotes revision code e.g. A, B,...)
Terminals: matte tin plated leads, solderable per
J-STD-002 and JESD 22-B102
E3, M3, HE3, HM3 suffix meet JESD 201 class 2 whisker test
Polarity: color band denotes the cathode end
PRIMARY CHARACTERISTICS
IF(AV) 1.5 A
VRRM 200 V, 400 V, 600 V
IFSM 30 A
IR1.0 μA
VF at IF1.4 V
trr 75 ns
ER20 mJ
TJ max. 150 °C
Package SMA (DO-214AC)
Circuit configuration Single
SMA (DO-214AC)
Cathode Anode
3
3
3
D
D
D
3
D
3D Models
Available
MAXIMUM RATINGS (TA = 25 °C unless otherwise noted)
PARAMETER SYMBOL BYG20D BYG20G BYG20J UNIT
Device marking code BYG20D BYG20G BYG20J
Maximum repetitive peak reverse voltage VRRM 200 400 600 V
Average forward current IF(AV) 1.5 A
Peak forward surge current 10 ms single half sine-wave superimposed on
rated load IFSM 30 A
Pulse energy in avalanche mode, non repetitive (inductive load switch off)
I(BR)R = 1 A, TJ = 25 °C ER20 mJ
Operating junction and storage temperature range TJ, TSTG -55 to +150 °C
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BYG20D, BYG20G, BYG20J
www.vishay.com Vishay General Semiconductor
Revision: 21-Feb-2020 2Document Number: 88958
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Note
(1) Pulse test: 300 μs pulse width, 1 % duty cycle
Notes
(1) Mounted on epoxy-glass hard tissue
(2) Mounted on epoxy-glass hard tissue, 50 mm2 35 μm Cu
(3) Mounted on Al-oxide-ceramic (Al2O3), 50 mm2 35 μm Cu
Note
(1) AEC-Q101 qualified
ELECTRICAL CHARACTERISTICS (TA = 25 °C unless otherwise noted)
PARAMETER TEST CONDITIONS SYMBOL BYG20D BYG20G BYG20J UNIT
Maximum instantaneous
forward voltage
IF = 1 A TJ = 25 °C VF (1) 1.3 V
IF = 1.5 A 1.4
Maximum DC reverse current VR = VRRM
TJ = 25 °C IR
1µA
TJ = 100 °C 10
Maximum reverse recovery
time IF = 0.5 A, IR = 1.0 A, Irr = 0.25 A trr 75 ns
THERMAL CHARACTERISTICS (TA = 25 °C unless otherwise noted)
PARAMETER SYMBOL BYG20D BYG20G BYG20J UNIT
Typical thermal resistance, junction to lead, TL = const. RθJL 25 °C/W
Typical thermal resistance, junction to ambient
RθJA (1) 150
°C/WRθJA (2) 125
RθJA (3) 100
ORDERING INFORMATION (Example)
PREFERRED P/N UNIT WEIGHT (g) PREFERRED PACKAGE CODE BASE QUANTITY DELIVERY MODE
BYG20J-E3/TR 0.064 TR 1800 7" diameter plastic tape and reel
BYG20J-E3/TR3 0.064 TR3 7500 13" diameter plastic tape and reel
BYG20JHE3_A/H (1) 0.064 H 1800 7" diameter plastic tape and reel
BYG20JHE3_A/I (1) 0.064 I 7500 13" diameter plastic tape and reel
BYG20J-M3/TR 0.064 TR 1800 7" diameter plastic tape and reel
BYG20J-M3/TR3 0.064 TR3 7500 13" diameter plastic tape and reel
BYG20JHM3_A/H (1) 0.064 H 1800 7" diameter plastic tape and reel
BYG20JHM3_A/I (1) 0.064 I 7500 13" diameter plastic tape and reel
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BYG20D, BYG20G, BYG20J
www.vishay.com Vishay General Semiconductor
Revision: 21-Feb-2020 3Document Number: 88958
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
RATINGS AND CHARACTERISTICS CURVES (TA = 25 °C unless otherwise noted)
Fig. 1 - Forward Current vs. Forward Voltage
Fig. 2 - Max. Average Forward Current vs. Ambient Temperature
Fig. 3 - Reverse Current vs. Junction Temperature
Fig. 4 - Max. Reverse Power Dissipation vs. Junction Temperature
Fig. 5 - Diode Capacitance vs. Reverse Voltage
Fig. 6 - Reverse Recovery Time vs. Forward Current
10
100
1000
10000
0.001
0.01
0.1
1
10
0 0.5 1.0 1.5 2.0 2.5 3.0
Axis Title
1st line
2nd line
2nd line
Instantaneous Forward Current (A)
Instantaneous Forward Voltage (V)
TJ= -40 °C
TJ= 25 °C
TJ= 150 °C
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
100806040200 120 140 160
Ambient Temperature (°C)
Average Forward Current (A)
V
R
= V
RRM
Half Sine-Wave
R
θJA
25 K/W
R
θJA
125 K/W
R
θJA
150 K/W
1
10
100
25 50 75 100 125 150
Reverse Current (µA)
Junction Temperature (°C)
V
R
= V
RRM
P
R
- Limit
at 100 % V
R
0
10
20
30
40
70
25 50 75 100 125 150
Reverse Power Dissipation (mW)
Junction Temperature (°C)
V
R
= V
RRM
P
R
- Limit
at 80 % V
R
50
60
0
5
10
15
20
25
30
0.1 1 10 100
f = 1 MHz
Reverse Voltage (V)
Diode Capacitance (pF)
0 0.2 0.4 0.6 0.8
0
100
200
300
400
600
1.0
500
IR = 0.5 A, iR = 0.125 A
Reverse Recovery Time (ns)
Forward Current (A)
TA = 125 °C
TA = 100 °C
TA = 75 °C
TA = 25 °C
TA = 50 °C
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BYG20D, BYG20G, BYG20J
www.vishay.com Vishay General Semiconductor
Revision: 21-Feb-2020 4Document Number: 88958
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Fig. 7 - Reverse Recovery Charge vs. Forward Current Fig. 8 - Thermal Response
PACKAGE OUTLINE DIMENSIONS in inches (millimeters)
0
50
100
150
200
0 0.2 0.4 0.6 0.81.0
Reverse Recovery Charge (nC)
Forward Current (A)
I
R
= 0.5 A, i
R
= 0.125 A
T
A
= 125 °C
T
A
= 100 °C
T
A
= 75 °C
T
A
= 25 °C
T
A
= 50 °C
1
10
100
1000
Thermal Resistance for Pulse Cond. (K/W)
Pulse Length (s)
10-5 10-4 10-3 10-2 10-1 100101102
Single Pulse
125 K/W DC
t
p
/T = 0.5
t
p
/T = 0.2
t
p
/T = 0.1
t
p
/T = 0.02
t
p
/T = 0.05
t
p
/T = 0.01
0.008 (0.203)
0.194 (4.93)
0.208 (5.28)
0.157 (3.99)
0.177 (4.50)
0.100 (2.54)
0.110 (2.79)
0.078 (1.98)
0.090 (2.29)
0.006 (0.152)
0.012 (0.305)
0.049 (1.25)
0.065 (1.65)
Cathode Band
0 (0)
SMA (DO-214AC)
Mounting Pad Layout
0.074 (1.88)
MAX.
0.208 (5.28)
REF.
0.066 (1.68)
MIN.
0.060 (1.52)
MIN.
0.030 (0.76)
0.060 (1.52)
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