Scheda tecnica MPXA6115A, MPXH6115A Series di NXP USA Inc.

«- ‘/RoHS O 'o :9 freescale' Sensors
Freescale reserves the right to change the detail specifications as may be required to permit
improvements in the design of its products.
Freescale Semiconductor Document Number: MPXA6115A
Data Sheet: Technical Data Rev. 7.3, 04/2015
© 2007-2012, 2015 Freescale Semiconductor, Inc. All rights reserved.
MPXxx6115A, 15 to 115 kPa, Absolute,
Integrated Pressure Sensor
The MPXxx6115A series sensor integrates on-chip, bipolar op amp circuitry and
thin film resistor networks to provide a high output signal and temperature
compensation. The small form factor and high reliability of on-chip integration make
the pressure sensor a logical and economical choice for the system designer.
The MPXxx6115A series piezoresistive transducer is a state-of-the-art, monolithic,
signal conditioned, silicon pressure sensor. This sensor combines advanced
micromachining techniques, thin film metallization, and bipolar semiconductor
processing to provide an accurate, high level analog output signal that is
proportional to applied pressure.
Features
Resistant to high humidity and common automotive media
Improved accuracy at high temperature
Available in small and super small outline packages
1.5% maximum error over 0 °C to 85 °C
Ideally suited for microprocessor or microcontroller-based systems
Temperature compensated from -40 °C to +125 °C
Durable Thermoplastic (PPS) Surface Mount Package
Typical applications
Industrial controls
Engine control/manifold absolute pressure (MAP)
Weather station and weather reporting device barometers
MPXA6115A
MPXAZ6115A
MPXH6115A
MPXHZ6115A
Series
Top view
Pinout
1
2
3
45
6
7
8
VS
VOUT
GND
DNC
DNC
DNC
DNC
DNC
Pin 1 identification
chamfered corner
or notch in pin
Small outline packages
Super small outline packages
MPXA6115AC6U/T1
MPXAZ6115AC6T1
Case 98ASB17757C
MPXH6115A6U/T1
MPXHZ6115A6U/T1
Case
98ARH99066A
MPXH6115AC6U/T1
MPXHZ6115AC6U/T1
Case
98ARH99089A
MPXA6115AC7U
Case 98ASB17759C
MPXAZ6115AP/T1
Case 98ASA99303D
MPXA6115A6U/T1
Case 98ASB17756C
MPXA6115A
Sensors
2Freescale Semiconductor, Inc.
Ordering information
Device name Shipping Package # of Ports Pressure type Device
marking
None Single Dual Gauge Differential Absolute
Small outline package (MPXA6115A series)
MPXA6115A6U Rails 98ASB17756C • MPXA6115A
MPXA6115A6T1 Tape and Reel 98ASB17756C MPXA6115A
MPXA6115AC6U Rails 98ASB17757C • MPXA6115A
MPXA6115AC6T1 Tape and Reel 98ASB17757C MPXA6115A
MPXA6115AC7U Rails 98ASB17759C • MPXA6115A
Small outline package (Media resistant gel) (MPXAZ6115A series)
MPXAZ6115AC6T1 Tape and Reel 98ASB17757C MPXAZ6115A
MPXAZ6115AP Trays 98ASA99303D • MPXAZ6115A
MPXAZ6115APT1 Tape and Reel 98ASA99303D MPXAZ6115A
Super small outline package (MPXH6115A series)
MPXH6115A6U Rails 98ARH99066A • MPXH6115A
MPXH6115A6T1 Tape and Reel 98ARH99066A MPXH6115A
MPXH6115AC6U Rails 98ARH99089A • MPXH6115A
MPXH6115AC6T1 Tape and Reel 98ARH99089A MPXH6115A
Small outline package (Media resistant gel) (MPXHZ6115A series)
MPXHZ6115A6U Rails 98ARH99066A • MPXHZ6115A
MPXHZ6115A6T1 Tape and Reel 98ARH99066A MPXHZ6115A
MPXHZ6115AC6U Rails 98ARH99089A • MPXHZ6115A
MPXHZ6115AC6T1 Tape and Reel 98ARH99089A MPXHZ6115A
Related Documentation
The MPXxx6115A device features and operations are described in a variety of reference manuals, user guides, and application
notes. To find the most-current versions of these documents:
1. Go to the Freescale homepage at:
http://www.freescale.com/
2. In the Keyword search box at the top of the page, enter the device number MPXxx6115A.
3. In the Refine Your Result pane on the left, click on the Documentation link.
MPXA6115A
Sensors
Freescale Semiconductor, Inc. 3
Contents
1 General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.2 Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2 Mechanical and Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.1 Maximum ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.2 Operating characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3 On-chip Temperature Compensation and Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
4 Package Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.1 Minimum recommended footprint for small and super small packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.2 Package dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
MPXA6115A
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4Freescale Semiconductor, Inc.
1 General Description
1.1 Block diagram
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
Figure 1. Fully integrated pressure sensor schematic
1.2 Pinout
Figure 2. Device pinout (top view)
Table 1. Pin functions
Pin Name Function
1 DNC Do not connect to external circuitry or ground. Pin 1 is denoted by chamfered corner.
2V
SVoltage supply
3 GND Ground
4V
OUT Output voltage
5 DNC Do not connect to external circuitry or ground.
6 DNC Do not connect to external circuitry or ground.
7 DNC Do not connect to external circuitry or ground.
8 DNC Do not connect to external circuitry or ground.
VS Pin 2
+5.0 V
GND Pin 3
VOUT Pin 4
MPXxx6115A to ADC
100 nF
51 K
47 pF
1
2
3
45
6
7
8
V
S
V
OUT
GND
DNC
DNC
DNC
DNC
DNC
Pin 1 identification, chamfered corner or notch in pin
MPXA6115A
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Freescale Semiconductor, Inc. 5
2 Mechanical and Electrical Specifications
2.1 Maximum ratings
2.2 Operating characteristics
Table 2. Maximum ratings(1)
1.Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Rating Symbol Value Units
Maximum pressure (P1 > P2) Pmax 400 kPa
Storage temperature Tstg -40° to +125°°C
Operating temperature TA-40° to +125°°C
Output source current @ full-scale output(2)
2.Maximum output current is controlled by effective impedance from VOUT to GND or VOUT to VS in the application circuit.
Io+0.5mAdc
Output sink current @ minimum pressure offset(2) Io--0.5mAdc
Table 3. Operating characteristics (VS = 5.0 Vdc, TA = 25 °C unless otherwise noted, P1 > P2)
Characteristic Symbol Min Typ Max Unit
Pressure range POP 15 115 kPa
Supply voltage(1)
1.Device is ratiometric within this specified excitation range.
VS4.75 5.0 5.25 Vdc
Supply current Io 6.0 10 mAdc
Minimum pressure offset(2) (0 °C to 85° C) @ VS = 5.0 Volts
2.Offset (Voff) is defined as the output voltage at the minimum rated pressure.
Voff 0.133 0.200 0.268 Vdc
Full-scale output(3) (0 °C to 85° C) @ VS = 5.0 Volts
3.Full-scale output (VFSO) is defined as the output voltage at the maximum or full-rated pressure.
VFSO 4.633 4.700 4.768 Vdc
Full-scale span(4) (0 °C to 85° C) @ VS = 5.0 Volts
4.Full-scale span (VFSS) is defined as the algebraic difference between the output voltage at full-rated pressure and the output voltage at the
minimum rated pressure.
VFSS 4.433 4.500 4.568 Vdc
Accuracy(5) (0 °C to 85° C)
5.Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span at
25 °C due to all sources of error including the following:
Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or
maximum rated pressure at 25 °C.
TcSpan: Output deviation over the temperature range of 0 °C to 85 °C, relative to 25 °C.
TcOffset: Output deviation with minimum pressure applied, over the temperature range of 0 °C to 85 °C, relative to 25 °C.
———±1.5 %VFSS
Sensitivity V/P 45.0 — mV/kPa
Response time(6)
6.Response time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a
specified step change in pressure.
tR—1.0—ms
Warm-up time(7)
7.Warm-up time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized.
——20ms
Offset stability(8)
8.Offset stability is the product's output deviation when subjected to 1000 cycles of pulsed pressure, temperature cycling with bias test.
——±0.25 — %VFSS
Ax j W m WL
MPXA6115A
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6Freescale Semiconductor, Inc.
3 On-chip Temperature Compensation and Calibration
Figure 3 illustrates the absolute sensing chip in the basic super small outline chip carrier (case 98ARH99066A).
Figure 4 shows a typical application circuit (output source current operation).
Figure 5 shows the sensor output signal relative to pressure input. Typical minimum and maximum output curves are shown for
operation over 0 °C to 85 °C temperature range. The output will saturate outside of the rated pressure range.
A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be
transmitted to the silicon diaphragm. The MPXxx6115A series pressure sensor operating characteristics, internal reliability and
qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor
performance and long-term reliability. Contact the factory for information regarding media compatibility in your application.
Figure 3. Cross Sectional Diagram SSOP/SOP (not to scale)
Figure 4. Typical application circuit (output source current operation)
Figure 5. Output vs. absolute pressure
Wire Bond
Stainless
Steel Cap
Thermoplastic
Case
Die Bond
Sealed Vacuum Reference
Fluorosilicone
Gel Die Coat
Lead
Frame
Absolute Element
P1
Die
VS Pin 2
+5.0 V
GND Pin 3
VOUT Pin 4
MPXxx6115A to ADC
100 nF
51 K
47 pF
Output (Volts)
5.0
4.5
4.0
3.5
3.0
Pressure (ref: to sealed vacuum) in kPa
MAX
MIN
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
100
105
2.5
2.0
1.5
1.0
0.5
0
110
Transfer Function:
VOUT = Vs* (.009*P-.095) ± Error
VS = 5.0 Vdc
TEMP = 0 to 85 °C
115
120
TYP
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Figure 6. Transfer function
Figure 7. Temperature error band
Figure 8. Pressure error band
Nominal Transfer Value: VOUT = VS x (0.009 x P - 0.095)
± (Pressure Error x Temp. Factor x 0.009 x VS)
VS = 5.0 ± 0.25 Vdc
Break Points
Temp Multiplier
- 40 °C 3
0 °C to 85 °C 1
125 °C 1.75
Temperature in °C
4.0
3.0
2.0
0.0
1.0
-40 -20 0 20 40 60 14012010080
Temperature error factor
NOTE: The Temperature Multiplier is a linear response from 0 ºC to -40 ºC and from 85 ºC to 125 ºC
Error Limits for Pressure
3.0
2.0
1.0
-1.0
-2.0
-3.0
0.0 20 Pressure (in kPa)
Pressure Error (kPa)
15 to 115 (kPa) ±1.5 (kPa)
40 60 80 100 120
Pressure Error (Max)
MPXA6115A
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8Freescale Semiconductor, Inc.
4 Package Information
4.1 Minimum recommended footprint for small and super small packages
Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor package must be the
correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry,
the packages will self-align when subjected to a solder reflow process. It is always recommended to fabricate boards with a solder
mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts.
Figure 9. SOP Footprint (Case 98ASB17756C)
Figure 10. SSOP Footprint (Case 98ARH99066A and 98ARH99089A)
0.027 TYP 8X
0.69
0.053 TYP 8X
1.35
inch
mm
0.387
9.83
0.150
3.81
0.050
1.27
TYP
t {J—L KETNfL PINTJ‘HUUU“ LDENTLFLER (1/ SEAT‘N PLANE MLLLLMETERS LNCHES NOTES D‘M M‘N MAX M‘N MAX 1 D‘MENS‘ON‘NG AND TOLERANC‘NG PER ASME Y145M 1994 A 10.54 ‘D,79 CAME) 0.425 I r B .0 54 10 79 (1415 0 425 2 CONTROLUNG DLMENSION: LNCH. C 5'35 5-8‘ 0-212 0-250 3, DLMENSLON "A" AND "a" 00 NOT LNCLUDE M0LD 0 0 as 1.07 o 035 0.042 PROTRUSLON G 2 54 BSC 0-100 BSC 4 MAXLMUM MOLD PROTRUSLON 0 ‘5 (0.006) H 0'05 D 25 U 002 0,010 5 ALL VERTLCAL SURFACES 5' TYPLCAL DRAFT J 0 23 0.25 0.009 0.011 ‘ K 1 55 L50 0 061 0,07L M 0- 7' 0' 7' N 1029 1054 0405 DAMS 5 15.01 ‘E 41 0 709 D 725 © '1 IA ‘ 2 v: V L. «. F H LLL-EIMEY” E EC} ‘ MECHANICAL OUTLINE PRLNT VERSLON NOT TO SCALE TITLE: DOCUMENT N0: 98ASBT7755C REV: A 8 LD SENSOR SOP STANDARD. NDNrJEDEC 10 JAN 2013
MPXA6115A
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Freescale Semiconductor, Inc. 9
4.2 Package dimensions
This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ASB17756C.pdf.
Case 98ASB17756C, Small outline package
MPXA6115A
Sensors
10 Freescale Semiconductor, Inc.
This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ASB17757C.pdf.
Case 98ASB17757C, small outline package
PIN 1 IDENTIFIER
H
SEATING
PLANE
-T-
W
C
M
J
K
V
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A10.540.4250.415 10.79
B10.540.4250.415 10.79
C12.700.5200.500 13.21
D0.960.0420.038 1.07
G0.100 BSC 2.54 BSC
H0.002 0.010 0.05 0.25
J0.009 0.011 0.23 0.28
K0.061 0.071 1.55 1.80
M0˚ 7˚
N0.444 0.448 11.28 11.38
S0.709 0.725 18.01 18.41
V0.245 0.255 6.22 6.48
W0.115 0.125 2.92 3.17
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
S
D
8 PL
G
4
5
8
1
S
B
M
0.25 (0.010) AT
-A-
-B-
N
S
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MPXA6115A
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Freescale Semiconductor, Inc. 11
This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ASB17759C.pdf.
Case 98ASB17759C, small outline package
D
FREESCALE
Q .005 (0,20) IE 2 PLACES 4 TTPS a T ‘ EMA DETATL G $ .004 (0.06) C A B GAGE PLANE T l E E e ax 34104011) SEATTNG PLANE @FREESCALE smcoNnucroR. ch. ALL mm RESERVE) MECHANICAL OUTLINE PRINT VERSION NOT To SCALE TITLE: DOCUMENT ND: SSASAQQBDBD REV: D 8 LD SOP STDE PORT CASE NUMBER: 1359701 13 DEC 2010 STANDARD:NON7JEDEC PAGE 1 UP 2
MPXA6115A
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This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ASA99303D.pdf.
Case 98ASA99303D, Small Outline Package
PAGE 1 OF 2
NOTES: 1, CoNTRoLL1NG D1MENS1ON: 1NcH 2 1NTERPRET 01MENS10N$ AND TOLERANCES PER ASME Y14.5M71994, AD1MENS10NS 00 NOT WCLUDE MOLD FLASH 0R PPROTRUS10NS. MOLD FLASH AND PROTRUS1ONS SHALL NOT EXCEED .005 (0152) PER S1DE. AD1MENS10N DOES NOT 1NCLUDE DAMEAR PROTRUS10N, ALLOWABLE DAMEAR PROTRUS1ON SHALL BE .000 (0,203) MAX1MUM. WCHES M1LL1METERS WCHES M1LL1METERS 01M M1N MAX M1N MAX 01M MW MAX MW MAX A .300 .330 7.52 3.35 o 0‘ 7 0 7 A1 .002 .010 0.05 0,25 7 777 777 777 ,,, b .038 .042 0.95 1,07 7 777 777 777 ,,, D V465 .485 11.81 12.32 7 777 777 777 ,,, E .717 550 15.21 BSC 7 777 777 777 ,,, E1 .465 .485 11.81 12.32 7 7 7 7 7 7 7 ,,, e 100 E80 254 Egg 7 777 777 777 ,,, E .245 255 s 22 5 47 7 777 777 777 ,,, K 120 130 3 05 3 30 7 777 777 777 ,,, L .051 .071 1.55 1,130 7 777 777 777 ,,, M .270 .290 6.86 7,35 7 777 777 777 ,,, N .030 .090 2.03 2,23 7 777 777 777 ,,, R .000 .011 0.23 0,25 7 777 777 777 ,,, T .115 .125 2.92 3.17 7 777 777 777 ,,, Emma” “WWW“ W MECHANICAL OUTLINE PRINT VERSION NOT TO SCALE ALL mews RESERVED TITLE: DOCUMENT No: 00ASA993030 REV: D 8 LD SOP, S1DE PORT CASE NUMBER: 1309701 13 DEC 2010 STANDARD. N0N7JEDEC PAGE 2 UP 2
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Case 98ASA99303D, Small outline package
PAGE 2 OF 2
Hg?“ 3:90 25.004® .300 W .2504” PW 1 \DENT‘F‘ER .298 SQ. .278 SQ. r\/7DETA\L "D" JEJ _ t} SEATWG PLANE “3 F'EEZLL‘”, ”“ ‘ MECHANICAL OUTLINE PRWT VERS‘ON NOT TO SCALE ‘HTLE: 8 LEAD DOCUMENT NO: QEARHBQOSSA REV: H SSOP CASE NUMBER: 1317704 13 APR 2012 STANDARD: NONrJEDEc
MPXA6115A
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14 Freescale Semiconductor, Inc.
This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ARH99066A.pdf.
Case 98ARH99066A, Super small outline package
PAGE 1 OF 3
.028 18 .048 DETA‘L ”D” © F‘EigL’fohjg;" FE j W ‘ MECHANICAL OUTLINE PHNT VERS‘ON NOT TO SCALE T‘TLEI 8 LEAD DOCUMENT NO: QEARHQBOSGA REV: H CASE NUMBERI1317io4 13 APR 2012 SSOP STANDARD: NONiJEDEC
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Case 98ARH99066A, Super small outline package
PAGE 2 OF 3
NOTES‘ 1. ALL D‘MENS‘ONS \N \NCHES. 2. DTMENSTONTNG AND TDLERANCTNG PER ASME Y14L5M71994. A D‘MENS‘ONS DO NOT \NCLUDE MOLD FLASH OR PROTRUS‘ONS. MOLD FLASH OR PROTRUSTON SHALL NOT EXCEED .006 TNCHES PER STDEL 4. ALL VERT‘CAL SURFACES TO BE 5' MAX‘MUMV A DTMENSTON DOES NOT TNCLLJDE DAMBAR PROTRUSTON. ALLOWABLE DAMBAR PROTRUSTON SHALL BE .008 \NCHES MAX‘MUM m: ‘ MECHANICAL OUTLINE PRTNT VERSTON NOT TO SCALE ‘HTLE: 8 LEAD SSOP CASE NUMBER: 1317704 DOCUMENT NO: QEARHQQOSGA REV: H 13 APR 2012 STANDARD: NONrJEDEC
MPXA6115A
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Case 98ARH99066A, Super small outline package
PAGE 3 OF 3
167 mm 2X QOZCAE I « Q »’ DETAIL E GAGE PLANE GM 033 DETAIL E JDD E250 @nzp, L “FAT?“ , “" ‘ MECHANICAL OUTLINE PRINT VERSION NDT To SCALE TITLE: DOCUMENT NO: 95ARH99059A REV: D 8 LD, PORTED SSOP cAsE NUMBER, 1317A704 25 ocT 2005 STANDARD: NONrJEDEC
MPXA6115A
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Freescale Semiconductor, Inc. 17
This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ARH99089A.pdf.
Case 98ARH99089A, Super small outline package
PAGE 1 OF 2
NOTES T ALL DTMENSTONS TN TNCHES 2 DTNENSTONTNG AND ToLERANcTNc PER ASME Y145M71994 A DTMENSTONS DO NOT TNCLUDE MOLD FLASH 0R PROTRUSTONS MOLD FLASH 0R PROTRUSTON SHALL NOT EXCEED 006 TNCHES PER STDE 4 ALL VERTTCAL SURFACES TO BE 5‘ MAXTMUM. & DTMENSTON DOES NOT TNCLUDE DAMEAR PROTRUS‘ONV ALLOWABLE DAMBAR PROTRUSTDN SHALL BE V005 TNCHES MAXTMUM MECHANICAL OUTLINE PRINT VERSION NOT TO SCALE DOCUMENT No> 95ARH99089A 8 LD, PORTED SSOP CASE NuMBERanAroA REV' D 25 OCT 2005 STANDARD- NDNrJEDEC
MPXA6115A
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Case 98ARH99089A, Super small outline package
PAGE 2 OF 2
MPXA6115A
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5 Revision History
Table 4. Revision history
Revision
number Revision
date Description of changes
7.1 05/2012 Updated Package Drawing 98ARH99066A was Rev. F, updated to Rev. H,
7.2 10/2012 On page 1, changed typical output voltage from 4.8V to 4.7V to match typical output voltage listed on page 3 of
document
7.3 04/2015 Removed obsolete part numbers MPXAZ6115A6U and MPXAZ6115AC6U from data sheet.
Updated format.
freescale'“
Document Number: MPXA6115A
Rev. 7.3
04/2015
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