Scheda tecnica STPS2H100-Y di STMicroelectronics

‘ ’I monugmemed sum SME \ A sonmrm
Features
AEC-Q101 qualified
PPAP capable
• VRRM guaranteed from -40°C to 175°C
Low leakage current
Avalanche capability specified
ECOPACK2 compliant
Applications
DC/DC converter
Auxiliary power supply
Freewheeling function
Reverse battery polarity protection
Description
This high quality Schottky barrier rectifier device is designed for high frequency
miniature switched mode power supplies such as adaptors or on-board DC/DC
converters for automotive applications.
Packaged in SMB, SMA and SOD128Flat, the STPS2H100-Y provides a high level
of performance in compact and flat packages which can withstand high operating
junction temperature.
Product status link
STPS2H100-Y
Product summary
IF(AV) 2 A
VRRM 100 V
Tj (max.) 175 °C
VF (typ.) 0.60 V
Automotive 100 V - 2 A power Schottky diode
STPS2H100-Y
Datasheet
DS6949 - Rev 2 - February 2021
For further information contact your local STMicroelectronics sales office.
www.st.com
1Characteristics
Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified)
Symbol Parameter Value Unit
VRRM Repetitive peak reverse voltage (Tj = -40°C to + 175°C) 100 V
IF(AV) Average forward current, δ = 0.5 square wave
TL = 135 °C SMB
2 A
TL = 130 °C SMA
TL = 150 °C SOD128Flat
IFSM Surge non repetitive forward current tp = 10 ms sinusoidal SMA, SMB 75
A
SOD128Flat 55
PARM Repetitive peak avalanche power tp = 10 μs, Tj = 125°C 173 W
Tstg Storage temperature range -65 to +175 °C
TjOperating junction temperature range(1) -40 to +175 °C
1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink.
Table 2. Thermal resistance parameter
Symbol Parameter Max. value Unit
Rth(j-l) Junction to lead
SMA 30
°C/WSMB 25
SOD128Flat 16
For more information, please refer to the following application note:
AN5088: Rectifiers thermal management, handling and mounting recommendations
Table 3. Static electrical characteristics
Symbol Parameter Test conditions Min. Typ. Max. Unit
IR(1) Reverse leakage current
Tj = 25 °C
VR = VRRM
- 1 µA
Tj = 125 °C - 0.4 1 mA
VF(2) Forward voltage drop
Tj = 25 °C
IF = 2 A
- 0.79
V
Tj = 125 °C - 0.60 0.65
Tj = 25 °C
IF = 4 A
- 0.88
Tj = 125 °C - 0.69 0.74
1. Pulse test: tp = 5 ms, δ < 2%
2. Pulse test: tp = 380 µs, δ < 2%
To evaluate the conduction losses, use the following equation:
P = 0.56 x IF(AV) + 0.045 x IF2(RMS)
For more information, please refer to the following application notes related to the power losses :
AN604: Calculation of conduction losses in a power rectifier
AN4021: Calculation of reverse losses on a power diode
STPS2H100-Y
Characteristics
DS6949 - Rev 2 page 2/13
1.1 Characteristics (curves)
Figure 1. Average forward current versus lead
temperature (δ = 0.5)
0
1
2
3
4
5
6
7
8
9
0 25 50 75 100 125 150 175
IF(AV)(A)
TL(°C)
T
=tp/T tp
SMA
SOD128Flat
SMB
Figure 2. Relative variation of thermal impedance junction
to ambient versus pulse duration (SMA)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Single pulse
SMA
Z
th(j-a)
/ R
th(j-a)
t
p
(s)
Figure 3. Relative variation of thermal impedance junction
to ambient versus pulse duration (SMB)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Z
th(j-a)
/ R
th(j-a)
t
p
(s)
Single pulse
SMB
Figure 4. Relative variation of thermal impedance junction
to lead versus pulse duration (SOD128Flat)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01
Z
th(j-l)
/ R
th(j-l)
t
p
(s)
Single pulse
SOD128Flat
Figure 5. Reverse leakage current versus reverse voltage
applied (typical values)
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
1.E+04
0 10 20 30 40 50 60 70 80 90 100
VR(V)
IRA)
Tj= 150 °C
Tj= 25 °C
Tj= 100 °C
Tj= 75 °C
Tj= 50 °C
Tj= 125 °C
Figure 6. Junction capacitance versus reverse voltage
applied (typical values)
10
100
1000
1 10 100
C(pF)
F = 1 MHz
Vosc= 30 mVRMS
Tj = 25 °C
VR(V)
STPS2H100-Y
Characteristics (curves)
DS6949 - Rev 2 page 3/13
Figure 7. Forward voltage drop versus forward current
(typical values)
0.1
1.0
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
10.0
VF(V)
IF(A)
Tj= -40 °C
Tj= 125 °C
Tj= 75 °C
Tj= 150 °C
Tj= 25 °C
Figure 8. Normalized avalanche power derating versus
pulse duration (Tj = 125 °C)
P (tp)
P (10 µs)
ARM
ARM
0.001
0.01
0.1
1
1 10 100 1000
t (µs)
p
Figure 9. Thermal resistance junction to ambient versus
copper surface under each lead (SMA, typical values)
0
50
100
150
200
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
SCU(cm²)
Epoxy printed circuit board, copper thickness = 70 µm
Rth(j-a)(°C/W)
SMA
Figure 10. Thermal resistance junction to ambient versus
copper surface under each lead (SMB, typical values)
0
30
60
90
120
150
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
SCU(cm²)
Epoxy printed circuit board, copper thickness = 70 µm
Rth(j-a)(°C/W)
SMB
Figure 11. Thermal resistance junction to ambient versus copper surface under each lead (SOD128Flat,
typical values)
0
30
60
90
120
150
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Rth(j-a)(°C/W)
SOD128flat
SCu(cm²)
Epoxy printed board FR4, copper thickness: 70 μm
STPS2H100-Y
Characteristics (curves)
DS6949 - Rev 2 page 4/13
2Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.
2.1 SMA package information
Epoxy meets UL94, V0
Cooling method : by conduction (C)
Figure 12. SMA package outline
E1
E
D
C
L
A1
A2
b
Table 4. SMA package mechanical data
Ref.
Dimensions
Millimeters Inches (for reference only)
Min. Max. Min. Max.
A1 1.90 2.45 0.074 0.097
A2 0.05 0.20 0.001 0.008
b 1.25 1.65 0.049 0.065
c 0.15 0.40 0.005 0.016
D 2.25 2.90 0.088 0.115
E 4.80 5.35 0.188 0.211
E1 3.95 4.60 0.155 0.182
L 0.75 1.50 0.029 0.060
STPS2H100-Y
Package information
DS6949 - Rev 2 page 5/13
Figure 13. SMA recommended footprint in mm (inches)
2.63
(0.104)
5.43
(0.214)
1.4
1.64
(0.065)
1.4
)550.0()550.0(
STPS2H100-Y
SMA package information
DS6949 - Rev 2 page 6/13
‘1‘ Ti
2.2 SMB package information
Epoxy meets UL94, V0
Lead-free package
Figure 14. SMB package outline
E1
E
D
C
L
A1
A2
b
Table 5. SMB package mechanical data
Ref.
Dimensions
Millimeters Inches (for reference only)
Min. Max. Min. Max.
A1 1.90 2.45 0.074 0.097
A2 0.05 0.20 0.001 0.008
b 1.95 2.20 0.076 0.087
c 0.15 0.40 0.005 0.016
D 3.30 3.95 0.129 0.156
E 5.10 5.60 0.200 0.221
E1 4.05 4.60 0.159 0.182
L 0.75 1.50 0.029 0.060
STPS2H100-Y
SMB package information
DS6949 - Rev 2 page 7/13
Figure 15. SMB recommended footprint
2.60
(0.102)
5.84
(0.230)
1.62
2.18
(0.086)
1.62
)640.0()460.0(
STPS2H100-Y
SMB package information
DS6949 - Rev 2 page 8/13
v L2x I (L1 2x LZ 2x ._)_. u '—b 2x— rLL
2.3 SOD128Flat package information
Lead-free package
Figure 16. SOD128Flat package outline
STPS2H100-Y
SOD128Flat package information
DS6949 - Rev 2 page 9/13
1 w 3 no I 4n (0 055) (0118) (M55) 1 2 In [a 083) fi 7 7 i I
Table 6. SOD128Flat package mechanical data
Ref.
Dimensions
Millimeters Inches
Min. Max. Min. Max.
A0.93 1.03 0.037 0.041
b 1.69 1.81 0.067 0.071
c 0.10 0.22 0.004 0.009
D 2.30 2.50 0.091 0.098
E 4.60 4.80 0.181 0.189
E1 3.70 3.90 0.146 0.154
L 0.55 0.85 0.026 0.033
L1 0.30 typ. 0.012 typ.
L2 0.45 typ. 0.018 typ.
Figure 17. SOD128Flat footprint in mm (inches)
Note: For package and tape orientation, reel and inner box dimensions and tape outline please check TN1173
STPS2H100-Y
SOD128Flat package information
DS6949 - Rev 2 page 10/13
3Ordering information
Table 7. Ordering information
Order code Marking Package Weight Base qty. Delivery mode
STPS2H100AY S21Y SMA 68 mg 5000 Tape and reel
STPS2H100UY G21Y SMB 107 mg 2500 Tape and reel
STPS2H100AFY 2H100Y SOD128Flat 26.4 mg 3000 Tape and reel
STPS2H100-Y
Ordering Information
DS6949 - Rev 2 page 11/13
Revision history
Table 8. Document revision history
Date Version Changes
10-Dec-2010 1 Initial release.
11-Feb-2021 2 Added SOD128Flat package information. Minor text changes.
STPS2H100-Y
DS6949 - Rev 2 page 12/13
IMPORTANT NOTICE – PLEASE READ CAREFULLY
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST
products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST
products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of
Purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service
names are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2021 STMicroelectronics – All rights reserved
STPS2H100-Y
DS6949 - Rev 2 page 13/13