NXP Semiconductors

LPC1850 30 Cortex-M3 MCU

NXP's ARM Cortex-M3 based microcontrollers for embedded applications

Image of NXP Semiconductor's LPC1850/30 Cortex™-M3 MCUNXP's LPC1850 / 30 are ARM Cortex-M3 based microcontrollers for embedded applications. The ARM Cortex-M3 is a next generation core that offers system enhancements such as low power consumption, enhanced debug features, and a high level of support block integration.

The LPC1850 / 30 operate at CPU frequencies of up to 150 MHz. The ARM Cortex-M3 CPU incorporates a 3-stage pipeline and uses Harvard architecture with separate local instruction and data buses as well as a third bus for peripherals. The ARM Cortex-M3 CPU also includes an internal prefetch unit that supports speculative branching.

Features
  • ARM Cortex-M3 processor, running at frequencies of up to 150 MHz
  • ARM Cortex-M3 built-in memory protection unit (MPU) supporting eight regions
  • ARM Cortex-M3 built-in nested vectored interrupt controller (NVIC)
  • Non-maskable interrupt (NMI) input
  • JTAG and serial wire debug
  • ETM and ETB support
  • System tick timer
  • 200 kB SRAM for code and data use
  • 32 kB ROM containing boot code and on-chip software drivers
  • Crystal oscillator with an operating range of 1 MHz to 25 MHz
  • 12 MHz internal RC oscillator trimmed to 1% accuracy
  • Ultra-low power RTC crystal oscillator
  • Clock output
  • Two PLLs allow CPU operation up to the maximum CPU rate
  • Quad SPI Flash interface with four lanes and data rates of up to 40 MB/s
  • 10 / 100T Ethernet MAC with RMII and MII interfaces and DMA support
  • One high-speed USB 2.0 host / device / OTG interface with DMA
  • One high-speed USB 2.0 host / device interface with DMA support

Cortec MCU

ImmagineCodice produttoreDescrizioneQuantità disponibilePrezzo
IC MCU 32BIT ROMLESS 256LBGALPC1830FET256,551IC MCU 32BIT ROMLESS 256LBGA0 - ImmediatamenteSee Page for PricingVedi i dettagli
IC MCU 32BIT ROMLESS 256LBGALPC1850FET256,551IC MCU 32BIT ROMLESS 256LBGA12893 - Immediatamente$9.66Vedi i dettagli
Data di pubblicazione: 2011-06-22

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