TS1 Series Single-Pole Connectors
Data di pubblicazione: 2026-04-24
Amphenol Industrial Operations/ATZ TS1 series single-pole connectors are designed to handle the high-voltage and high-current demands of modern electrified platform.
The HellermannTyton BundleTag is a one-piece, adhesive-backed label that displays critical tracking data and bar codes.
Broadband EMI Split/Snap-On Ferrite Cable Cores
Data di pubblicazione: 2026-04-24
Laird - Performance Materials 28A series broadband EMI split and snap‑on ferrite cable cores offer effective common‑mode noise suppression for cables and wire assemblies.
NEMA 5-15P to C13 Power Cord Family
Data di pubblicazione: 2026-04-24
The GlobTek NEMA 5-15P to C13 power cord family covers multiple SKUs with triple regional approval for North America (cULus), Japan (PSE), and Taiwan (BSMI).
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Software di progettazione LabVIEW
Data di aggiornamento: 2026-04-24
LabVIEW di NI è un ambiente di programmazione grafica che fornisce acceleratori di produttività unici per lo sviluppo di sistemi di test.
Aerial Support Tie Spacers
Data di pubblicazione: 2026-04-24
HellermannTyton aerial support tie spacers increase separation between aerial cables, such as where fiber optic cables enter aerial splice enclosures.
4 Series NDIR Hydrocarbon Gas Sensor
Data di pubblicazione: 2026-04-24
Honeywell Sensing and Productivity Solutions sensors are designed for industrial safety, gas detection, emissions analysis/monitoring, and other relevant gas sensing applications.
PCIe® Gen 6 Mini Cool Edge 0.60 mm Card Edge Connectors
Data di pubblicazione: 2026-04-24
The Amphenol Communications Solutions PCIe® Gen 6 connector meets EDSFF E1/E3, SFF-A-1002, OCP NIC 3.0, GEN Z, and PCIe® enclosure compatible form factor (PECFF) specifications.
Conductonaut 1g Liquid Metal Thermal Compound
Data di pubblicazione: 2026-04-24
Conductonaut 1g is a liquid metal thermal compound from Thermal Grizzly that is designed for high-efficiency applications.
The Micro Commercial Co 100 V dual N- and P-Channel MOSFET in DFN3333-D package are designed for compact power applications.
The MCC SICWT40120G6M SiC Schottky diode is optimized for demanding power systems requiring reliable operation under extreme conditions.
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Connettori circolari serie ecomate® Plastic
Data di aggiornamento: 2026-04-23
I connettori circolari serie ecomate® Plastic di Amphenol Sine Systems presentano dimensioni ridotte e una progettazione robusta che li rende ideali per applicazioni industriali.
Rugged Inline USB Type-C Panel-Mount Socket System with Screw-Lock Retention
Data di pubblicazione: 2026-04-23
GlobTek inline USB-C socket system with dual-screw retention ensures reliable panel-mounted connectivity for industrial and mobile applications.
Il nastro Extreme Sealing Tape+ di 3M™ è sufficientemente robusto per resistere a sole, pioggia, neve e temperature estreme, nonché ai lavaggi ad alta pressione.
IHLL Series Commercial and IHLP Series Automotive Power Inductors
Data di pubblicazione: 2026-04-23
Vishay Intertechnology IHLL commercial and IHLP automotive power inductors come in 2.0 mm x 1.6 mm x 1.2 mm 0806 and 3.2 mm x 2.5 mm x 1.2 mm 1210 case sizes.
Duronaut 2g Thermal Paste
Data di pubblicazione: 2026-04-22
Thermal Grizzly Duronaut 2 g thermal paste is safe to use on all electronic components, preventing any risk of short circuits during application.
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Kit di sviluppo per microfoni
Data di aggiornamento: 2026-04-22
I kit di sviluppo per microfoni di CUI Devices sono composti ciascuno da quattro circuiti di valutazione rimovibili.
Automotive High Clearance/Creepage Distance Isolation Power Transformer - HCTSM1x Series
Data di pubblicazione: 2026-04-22
Bourns Magnetics Product Line Models HCTSM100308BAL, HCTSM110102HAL, and HCTSM110304HAL are high clearance/creepage distance isolation power transformers.
XRCGB Crystal Units
Data di pubblicazione: 2026-04-22
Murata XRCGB series supports wireless communications (Wi-Fi, BLE, NFC, Zigbee), wired interfaces (Ethernet, USB), and a wide array of electronic products.
TMS320C64 C64x Fixed Point DSP
Data di pubblicazione: 2026-04-22
Texas Instruments C64x+™ devices are upward code-compatible from previous devices that are part of the C6000™ DSP platform.

