MaxiGrip Board Rework

maxiGRIP™ and Board Rework Costs

Advanced Thermal Solutions Inc

This tutorial discusses use of the latest technology to attach heat sinks to BGA devices that minimizes potential damage to either the component or the PCB itself during the rework process.

Related Parts

ImmagineCodice produttoreDescrizioneMetodo di attaccoFormaQuantità disponibilePrezzoVedi i dettagli
HEAT SINK 27MM X 27MM X 12.5MMATS-52270G-C1-R0HEAT SINK 27MM X 27MM X 12.5MMNastro termoadesivo (incluso)Quadrato, alette angolate100 - Immediatamente$9.24Vedi i dettagli
HEAT SINK 25MM X 25MM X 14.5MMATS-51250K-C1-R0HEAT SINK 25MM X 25MM X 14.5MMMorsetto, materiale termicoQuadrato, alette angolate0 - Immediatamente$10.00Vedi i dettagli
HEAT SINK 33MM X 33MM X 7.5MMATS-52330B-C1-R0HEAT SINK 33MM X 33MM X 7.5MMNastro termoadesivo (incluso)Quadrato, alette angolate187 - Immediatamente$8.21Vedi i dettagli
HEAT SINK 27MM X 27MM X 14.5MMATS-53270K-C1-R0HEAT SINK 27MM X 27MM X 14.5MMMorsetto, materiale termicoQuadrato, alette615 - Immediatamente$9.99Vedi i dettagli
HEAT SINK 25MM X 25MM X 12.5MMATS-50250G-C1-R0HEAT SINK 25MM X 25MM X 12.5MMMorsetto, materiale termicoQuadrato, alette angolate975 - Immediatamente$12.24Vedi i dettagli
HEAT SINK 23MM X 23MM X 12.5MMATS-50230G-C1-R0HEAT SINK 23MM X 23MM X 12.5MMMorsetto, materiale termicoQuadrato, alette angolate65 - Immediatamente$12.09Vedi i dettagli
HEAT SINK 19MM X 19MM X 12.5MMATS-50190G-C1-R0HEAT SINK 19MM X 19MM X 12.5MMMorsetto, materiale termicoQuadrato, alette angolate32 - Immediatamente$11.90Vedi i dettagli
HEAT SINK 21MM X 21MM X 12.5MMATS-50210G-C1-R0HEAT SINK 21MM X 21MM X 12.5MMMorsetto, materiale termicoQuadrato, alette angolate100 - Immediatamente$11.98Vedi i dettagli
HEAT SINK 19MM X 19MM X 9MMATS-56001-C1-R0HEAT SINK 19MM X 19MM X 9MMNastro termoadesivo (incluso)Quadrato, alette angolate1918 - Immediatamente$6.24Vedi i dettagli
PTM Published on: 2011-10-13

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Soluzioni di attacco per dissipatori di calore Gli attacchi per dissipatore di calore di Advanced Thermal Solutions offrono agli ingegneri più opzioni per il fissaggio meccanico di quasi tutti i dissipatori di calore alle PCB.
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Feasibility Study of an LED-Based Lighting System Using Analytical Modeling A study of the heat loads for an outdoor LED-based lighting system using analytical modeling to determine the feasibility of the design with solar heat load.
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Related Product Training Modules

Introduction to Heat Sinks This module will review the use of heat sinks, including how a heat sink works, the factors that impact heat sink thermal performance, common heat sink materials, and thermal interface materials.
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